CN104302102A - Infrared focal plane sensor non-packaging application method - Google Patents
Infrared focal plane sensor non-packaging application method Download PDFInfo
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- CN104302102A CN104302102A CN201410508472.8A CN201410508472A CN104302102A CN 104302102 A CN104302102 A CN 104302102A CN 201410508472 A CN201410508472 A CN 201410508472A CN 104302102 A CN104302102 A CN 104302102A
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- sensor
- application method
- focal plane
- infrared
- infrared focal
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Abstract
The invention discloses an infrared focal plane sensor non-packaging application method which comprises the following steps that a sensor reading circuit is arranged on an infrared focal plane sensor, and the sensor reading circuit completes primary processing of sensor signals and is connected with a plurality of signal output points, and the signal output points are connected with a golden finger on a printed circuit board through golden wires. According to the infrared focal plane sensor non-packaging application method, the designing process of the infrared focal plane sensor can be simplified, and processing time is shortened.
Description
Technical field
The invention belongs to micro-nano technology and electronic technology field, relate to a kind of infrared focus plane transducer without package application method.
Background technology
Non-refrigerating infrared focal plane transducer due to its non-brake method, with low cost, to advantages such as infrared wavelength non-selectivities, occupy very important position at infrared acquisition and infrared imaging field.Infrared focal plane device is based upon in the technical foundation such as material, detector array, microelectronics, interconnection and encapsulation.Infra-red material and reading circuit are interconnected and form transducer probe unit, generally outside transducer, add metal-packaged shell and infrared window.The confined space that package casing and infrared window are formed can provide stable operational environment for infrared sensor.Further, reading circuit, together with package casing pin interconnection, is drawn sensor signal by package casing, so that the connection of transducer and circuit board.
Summary of the invention
In order to solve the problem of design process flow complexity in existing infrared focus plane sensor technology, simplify infrared focus plane sensor process, the present invention proposes a kind of infrared focus plane transducer without package application method.
A kind of infrared focus plane transducer, without package application method, comprises the following steps:
Be equipped with sensor readout circuit at infrared focus plane covers disposed on sensor, this sensor readout circuit completes the primary treatment of sensor signal and is connected with multiple signal output point;
Described signal output point is connected with the golden finger on printed circuit board by gold thread.
In technique scheme, the VDD-to-VSS line on printed circuit board can be connected with sensor readout circuit by described golden finger; Sensor signal can be transferred on printed circuit board and do subsequent treatment.
The present invention has following beneficial effect:
Infrared focus plane transducer of the present invention can simplify the design process flow of focal plane infrared sensor without package application method, shorten the process time.
Infrared focus plane transducer of the present invention designs and produces in process without package application method at infrared sensor, saves this technical process of encapsulation, the direct and circuit board interconnect the reading circuit of transducer, thus has simplified technological process.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Fig. 1 is encapsulated sensor schematic diagram.
Fig. 2 is sensor construction figure.
Fig. 3 is PCB golden finger design drawing.
Fig. 4 is that transducer is connected without encapsulating with golden finger on PCB.
Embodiment
Invention thought of the present invention is: infrared focus plane transducer of the present invention, without package application method, utilizes Bonding technology to be directly connected with PCB by gold thread; Simplify the design process flow of focal plane infrared sensor, shorten the process time.
Infrared focus plane transducer of the present invention is implemented as follows without package application method:
One, printed circuit edge connector: design the golden finger corresponding with transducer PAD, design golden finger should meet corresponding electric requirement, and shape and size should match with transducer PAD, so that when sensor readout circuit PAD is connected with gold thread with golden finger, gold thread can with certain radian stable support own wt.And do not produce the interference of signal between each gold thread.
Two, transducer and circuit board interconnect: transducer and circuit board interconnect are exactly that sensor readout circuit PAD is connected with the golden finger on printed circuit board by gold thread.Its technique is called bonding technology, is completed by special machine.
Below in conjunction with accompanying drawing, the present invention is described in detail.
As shown in Figure 1, general infrared focus plane transducer all adds package casing and window outside transducer, by pin, signal extraction is connected with PCB.Sensor construction figure as shown in Figure 2, in its reading circuit, PAD metal solder joint can be drawn signal.Be illustrated in figure 3 the golden finger design drawing on PCB, first golden finger design must meet PCB design requirement, need match in addition during golden finger design with PAD structure in sensor size and transducer.Transducer and PCB connection layout as shown in Figure 4, the golden finger that transducer and PCB design utilizes Bonding technology to couple together by gold thread.Such transducer just couples together at electrical properties with PCB, and sensor signal is transferred to PCB and carries out signal transacting and finally form video image.This form be directly connected with PCB without encapsulated sensor, simplifies system design flow, saves design time.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (2)
1. infrared focus plane transducer is without a package application method, it is characterized in that, comprises the following steps:
Sensor readout circuit is equipped with, the primary treatment of this sensor readout circuit settling signal and be connected with multiple signal output point at infrared focus plane covers disposed on sensor;
Described signal output point is connected with the golden finger on printed circuit board by gold thread.
2. infrared focus plane transducer according to claim 1 is without package application method, it is characterized in that, the VDD-to-VSS line on printed circuit board can be connected with sensor readout circuit by described golden finger; Sensor signal can be transferred on printed circuit board and do subsequent treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410508472.8A CN104302102A (en) | 2014-09-26 | 2014-09-26 | Infrared focal plane sensor non-packaging application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410508472.8A CN104302102A (en) | 2014-09-26 | 2014-09-26 | Infrared focal plane sensor non-packaging application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104302102A true CN104302102A (en) | 2015-01-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410508472.8A Pending CN104302102A (en) | 2014-09-26 | 2014-09-26 | Infrared focal plane sensor non-packaging application method |
Country Status (1)
| Country | Link |
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| CN (1) | CN104302102A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101626027A (en) * | 2008-07-10 | 2010-01-13 | 采钰科技股份有限公司 | Electronic device package with electromagnetic compatibility (emc) coating thereon |
| CN101976659A (en) * | 2010-09-03 | 2011-02-16 | 中兴通讯股份有限公司 | Outer package-free crystal device and manufacturing method thereof |
| CN201781683U (en) * | 2010-07-19 | 2011-03-30 | 廖明忠 | Circuit board for binding bare chip of sensor |
| CN202601616U (en) * | 2012-05-31 | 2012-12-12 | 苏州晶方半导体科技股份有限公司 | Infrared sensor packaging structure |
| CN102892064A (en) * | 2012-10-30 | 2013-01-23 | 无锡芯奥微传感技术有限公司 | Electroacoustic sensor packaging structure for microcomputer |
| CN103108143A (en) * | 2011-11-14 | 2013-05-15 | 全视科技有限公司 | Image sensor system shared terminal for transmitting image data and control signal |
| CN103824835A (en) * | 2012-09-28 | 2014-05-28 | 意法半导体(马耳他)有限公司 | Surface mount package for semiconductor integrated device, related assembly and manufacturing process |
| CN104024722A (en) * | 2012-01-03 | 2014-09-03 | 皇家飞利浦有限公司 | A lighting assembly, a light source and a luminaire |
-
2014
- 2014-09-26 CN CN201410508472.8A patent/CN104302102A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626027A (en) * | 2008-07-10 | 2010-01-13 | 采钰科技股份有限公司 | Electronic device package with electromagnetic compatibility (emc) coating thereon |
| CN201781683U (en) * | 2010-07-19 | 2011-03-30 | 廖明忠 | Circuit board for binding bare chip of sensor |
| CN101976659A (en) * | 2010-09-03 | 2011-02-16 | 中兴通讯股份有限公司 | Outer package-free crystal device and manufacturing method thereof |
| CN103108143A (en) * | 2011-11-14 | 2013-05-15 | 全视科技有限公司 | Image sensor system shared terminal for transmitting image data and control signal |
| CN104024722A (en) * | 2012-01-03 | 2014-09-03 | 皇家飞利浦有限公司 | A lighting assembly, a light source and a luminaire |
| CN202601616U (en) * | 2012-05-31 | 2012-12-12 | 苏州晶方半导体科技股份有限公司 | Infrared sensor packaging structure |
| CN103824835A (en) * | 2012-09-28 | 2014-05-28 | 意法半导体(马耳他)有限公司 | Surface mount package for semiconductor integrated device, related assembly and manufacturing process |
| CN102892064A (en) * | 2012-10-30 | 2013-01-23 | 无锡芯奥微传感技术有限公司 | Electroacoustic sensor packaging structure for microcomputer |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150121 |
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| WD01 | Invention patent application deemed withdrawn after publication |