CN104278233A - Evaporation mask - Google Patents
Evaporation mask Download PDFInfo
- Publication number
- CN104278233A CN104278233A CN201410598749.0A CN201410598749A CN104278233A CN 104278233 A CN104278233 A CN 104278233A CN 201410598749 A CN201410598749 A CN 201410598749A CN 104278233 A CN104278233 A CN 104278233A
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- Prior art keywords
- perforation
- noumenon
- evaporation
- superimposed
- superimposed district
- Prior art date
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- 238000001704 evaporation Methods 0.000 title claims abstract description 78
- 230000008020 evaporation Effects 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000007740 vapor deposition Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 16
- 239000007788 liquid Substances 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 11
- 238000000151 deposition Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000006210 lotion Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000817702 Acetabula Species 0.000 description 1
- 241000278713 Theora Species 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
An evaporation mask for use in an evaporation process with an evaporation source includes a first body and a second body. The first body is provided with a first overlapping area, and a plurality of first through holes are formed in the first overlapping area. The second body extends in a direction different from that of the first body and is provided with a second overlapping area. The second laminating area is provided with a plurality of second through holes. The first overlapping area and the second overlapping area are overlapped, and the projection range of the first perforation on the second overlapping area is outside the range of the second perforation.
Description
Technical field
The invention relates to a kind of evaporation coating device; Specifically, the invention relates to a kind of evaporation shielding used in indicating meter processing procedure.
Background technology
Organic electric exciting light-emitting diode (Organic Light Emitting Diode) or title organic light emitting display, be called for short OLED, there is ultra-thin, high brightness, high-luminous-efficiency, high speed of response, wide viewing angle, luminous and separately do not need the characteristics such as backlight.OLED has the organic layer be arranged between negative electrode and positive electrode.Utilize the characteristic of organic materials, energy disengages with the form of light wave by OLED.In brief, OLED has organic luminous layer.Kind and the combination of organic materials also can be changed, and produce each the OLED do not shared the same light.
In the processing procedure of OLED, for example, can the mode film forming such as gas or liquid deposition, coating or plating, wherein organic film can the vacuum evaporation collocation shielding mode that is defined as diaphragm area be formed.As shown in figs. 1 a to 1 c, existing shielding 90 is set up into by top lamellar body 820 and bottom lamellar body 810; Top lamellar body 820 and bottom lamellar body 810 can be set up on framework 900 again.Top lamellar body 820 and bottom lamellar body 810 also enclose and form film-forming region M on base material S.Wherein, often complete evaporation processing procedure, shielding 90 is through clean (to be such as soaked in liquid, spray liquid and/or clean with cleaning equipment) with except the deposition material of attachment removal on it, and drying is in order to the use of next evaporation.But the top lamellar body 820 mutually set up and bottom lamellar body 810 are separate parts after all, if not in addition gluing or welding between the two, then still can there is small gap g in the part A that top lamellar body 820 and bottom lamellar body 810 are stacked.When carrying out shielding 90 clean, although liquid may flow into gap g, the big area of the narrow and small and lap of gap g is difficult to guarantee that liquid fully can clean the part A of this overlap; Moreover, flow into the liquid in the g of gap and the material that may carry thereof also difficulty guarantee by gap g, and self-shielding 90 removes (namely residuing in gap g, shielding 90) after cleaning.Therefore, the part A that is stacked of top lamellar body 820 and bottom lamellar body 810 and gap g thereof still has film forming material to remain too much misgivings after the cleaning; In addition, the composition of liquid also may residue in shielding 90.Those residual one side may become pollutent, reduce shielding 90 life-span, and then may disengage when being used in evaporation processing procedure on the other hand, affect processing procedure quality, therefore product yield is affected.
Summary of the invention
The object of the present invention is to provide a kind of evaporation to shield, there is the advantage of easy cleaning.
Another object of the present invention is to provide a kind of evaporation to shield, rate of utilization is high and assist the yield improving evaporation finished product.
Evaporation shielding of the present invention has in the evaporation processing procedure of vapor deposition source for being used in, and comprises the first noumenon and the second body.The first noumenon has the first superimposed district, the first superimposed district is formed with multiple first perforation.Second body and the first noumenon different directions extend, and have the second superimposed district.Second superimposed district is formed with multiple second perforation.First superimposed district and the second superimposed district superimposed, and the first drop shadow spread of perforation in the second superimposed district is all outside biperforate scope.
The first noumenon of evaporation shielding of the present invention and the second body are mutually folded and are established.When the first noumenon and the second body mutually folded establish time, overlapping part is formed porose because the first perforation and the second perforation.
The first noumenon of evaporation shielding of the present invention and the second body are formed with the first perforation and second respectively and bore a hole, and the first noumenon and the second body are mutually folded establishes, wherein the first noumenon and the second body are mutually folded establishes Shi Yiqi to be formed with the first perforation and biperforate part to be stacked and to fold and establish.First drop shadow spread of perforation on the second body is outside biperforate scope.
Accompanying drawing explanation
Figure 1A is depicted as the exploded view of prior art shielding;
Vertical view and the side-view of prior art shielding is respectively shown in Figure 1B and 1C;
Fig. 2 A ~ 2B is depicted as the exploded view of the embodiment of evaporation of the present invention shielding;
Stereographic map and the vertical view of the embodiment of evaporation of the present invention shielding is respectively shown in Fig. 3 A and 3B;
Fig. 3 C is depicted as the sectional view of Fig. 3 A ~ 3B illustrated embodiment;
Figure 4 shows that liquid is in the schematic diagram of evaporation shielding flowing of the present invention;
Fig. 5 ~ 7 and 8A ~ 8B are depicted as the schematic diagram that evaporation of the present invention shields other embodiment;
Fig. 9 A ~ 9B is depicted as the schematic diagram that the present invention shows the example of evaporation shielding;
Figure 10 shows that evaporation of the present invention shields the exploded view of other embodiment; And
Figure 11 shows that the schematic diagram of example embodiment illustrated in fig. 10.
[the present invention]
10,10n evaporation shielding
100,100a, 100b, 100c the first noumenon
110 the first noumenons
120 perforates
150 first superimposed districts
180 first perforation
200,200a, 200b, 200c second body
220 second bodies
250 second superimposed districts
280 second perforation
500 frameworks
510 brace tables
520 frame bodies
G gap
D aperture
D distance
S substrate
C vapor deposition source
[known]
810 top lamellar bodies
820 bottom lamellar bodies
900 frameworks
90 shieldings
M film-forming region
The part that A is stacked
G gap
Embodiment
The invention provides the shielding of a kind of evaporation, having in the evaporation processing procedure of a vapor deposition source for being used in.Through evaporation processing procedure, for example, rete can be formed in substrate surface.Preferably, evaporation shielding of the present invention can at organic light emitting display (Organic Light Emitting Display, OLED, or claim organic electric exciting light-emitting diode (Organic Light Emitting Display)) film forming/evaporation processing procedure in, for forming organic luminous layer on the specific region of base material.The selection of this specific region can be such as the display space of display panel or the region of formation pixel.Vapor deposition source disengages deposition material towards substrate, the organic molecule of such as vaporizing, and deposition material shields through evaporation with the organic luminous layer forming patterning or localized area on base material.
Often complete evaporation processing procedure, evaporation shielding is through clean (cleaning with such as cleaning equipment) with except the deposition material of attachment removal on it, and drying is in order to the use of next evaporation.Itself structure of evaporation of the present invention shielding mat then obtains better clean achievement.
Embodiment as shown in Figure 2 A, evaporation shielding 10 comprises the first noumenon 100 and the second body 200, and wherein the first noumenon 100 has the first superimposed district 150, second body 200 and has the second superimposed district 250.First superimposed district 150 is formed in multiple first perforation the 180, second superimposed district 250 and is formed with multiple second perforation 280.In this preferred embodiment, the first noumenon 100 is specially the body with two different bearing of trends of tool from the second body 200, and is preferably strip tinsel.Those tinsels are formed with multiple first perforation 180 or multiple second perforation 280.Therefore, the first superimposed district 150 or be formed with the region of those the first perforation 180 on can be considered as the first noumenon 100 tinsel, the second 250, superimposed district can be considered the region tinsel as the second body 200 being formed with those the second perforation 280.Multiple first perforation 180 or multiple second perforation 280 better integrated distribution are on the first noumenon 100 or the second body 200; Wherein can integrated distribution one or more region and form one or more superimposed district 250 of the first superimposed district 150 or the second on the first noumenon 100 or the second body 200.When the first noumenon 100 and the second body 200 combined, at least one second superimposed district 250 that the first noumenon 100 has at least one first superimposed district 150 and the second body 200 is superimposed with each other.
On the other hand, first perforation 180 or second perforation 280 perforation size or claim port area.The sum total of the port area of multiple first perforation 180 or the second perforation 280, or be called total port area.Perforation size, quantity, even shape can determine total port area.
As shown in Figure 3A, the first noumenon 100 of mutually combination in evaporation shielding 10 and the second body 200 is better extends towards different directions, and goodly enclose formation one geometric ranges.For example, three respectively can form triangular framing towards the first noumenon 100 of different directions extension and the second body 200 and surround trilateral scope; Or two spaced and the first noumenon 100 extended in the same direction is spaced with two and the second body 200 that vertical the first noumenon 100 extends forms rectangular frame and surrounds rectangular extent; Or two spaced and the first noumenon 100 extended in the same direction is spaced with three and the second body 200 that vertical the first noumenon 100 extends forms T-shaped framework and surrounds two rectangular extent, as shown in Figure 3A.When carrying out evaporation, the part that base material is exposed is suitable with scope that framework surrounds; In other words, this framework defines the film-forming region of base material and plates material in this.As shown in Figure 3A, when the first noumenon 100 and the second body 200 combined, the first superimposed district 150 and the second superimposed district 250 is better is superimposed with each other.Now, the first noumenon 100 and the second body 200 folded establish and the first superimposed district 150 and the second superimposed district 250 superimposed time, first perforation 180 drops on the scope outside the second perforation 280 when being projected on the second superimposed district 250, drop on the scope outside the first perforation 180 when the second perforation 280 is projected on the first superimposed district 150.In other words, in the part (i.e. superimposed district 150/250) be stacked of the first noumenon 100 and the second body 200, first perforation 180 and second bore a hole 280 distribution can offset one from another, so that first bore a hole and 180 and second bore a hole and 280 can not to be directly communicated with when the first superimposed district 150 is overlapping with the second superimposed district 250, therefore the first perforation 180 and second is bored a hole, 280 two opposite sides not making this part be stacked therefore have because of the first noumenon 100 or the second blocking of body 200 to bore a hole to run through superimposed district 150/250 are surperficial.
For Fig. 2 B and Fig. 3 A ~ 3C illustrated embodiment, spaced multiple first perforation 180 can be formed in the first superimposed district 150 of the first noumenon 100, second superimposed district 250 of the second body 200 also forms spaced multiple second perforation 280, and these second perforation 280 first are bored a hole with these and 180 to be misplaced.The degree staggered is preferably the aperture being greater than the first perforation 180 or the second perforation 280.Illustrate shown in Fig. 3 C, adjacent perforated, as adjacent first the perforation 180 and second 280 distance D staggered that bore a hole are greater than the first perforation 180 or second and bore a hole 280 aperture d; Its middle distance D is also equivalent to the first perforation 180 (or second perforation 280) and bores a hole the distance of 280 (or first bores a hole 180) with these first 180 (or second bore a hole 280) immediate second of boring a hole.This distance is equivalent to again the length of such as the first perforation 180 centers to adjacent second perforation 280 centers, or is equivalent to the length of the first perforation 180 right side boundary to adjacent second perforation 280 right side boundary.Furthermore, those first perforation 180 and second are bored a hole and 280 to be misplaced in the region 150/250 overlapped to form by the first superimposed district 150 and the second superimposed district 250, and the first perforation 180 drops between adjacent 2 second perforation 280 in the drop shadow spread in the second superimposed district 250, the second perforation 280 then drops between adjacent 2 first perforation 180 in the drop shadow spread in the first superimposed district 150.Moreover, be greater than aperture d by the distance D making to stagger, first perforation 180 the drop shadow spread and second in the second superimposed district 250 bore a hole 280 scope better not overlapping.As Fig. 3 B and according to A-A hatching line sectional view 3C shown in, when overlooking evaporation shielding 10, such as overlook the second body 200 evaporation be relatively positioned at above the first noumenon 100 when shielding 10, the second perforation 280 in the second superimposed district 250 can be seen, and see the first noumenon 100 of inferior portion through the second perforation 280.The first noumenon 100 part has the first perforation 180 from the both sides of the part that the second perforation 280 is exposed; First perforation 180 is hidden (being represented by dotted lines in Fig. 3 B enlarged view) by the second body 200.Otherwise, when looking up screening evaporation and shielding 10, the first perforation 180 in the first superimposed district 150 can be seen, and see the second body 200 of upper section through the first perforation 180.
For Fig. 2 B and Fig. 3 A ~ 3C illustrated embodiment.In the stage of design evaporation shielding 10, the region 150/250 of known first superimposed district of superimposed district 250 or the first of superimposed district 150, second and the second superimposed area overlapping is roughly square.Now, during design, also can divide 25 square region in this overlapping region, as shown in Figure 2 B, and be staggered to form the first perforation 180 and the second perforation 280 in the first superimposed district 150 and the second superimposed district 250 according to those square region.Such as form the second perforation 280 in the square region (the 1st, the 3rd, the 5th lattice as the second superimposed district 250 first row or the first row) of odd number, and form the first perforation 180 in the square region (the 2nd and the 4th lattice as first row in the first superimposed district 150 or the first row) of even number, use and the first perforation 180 and the second perforation 280 are interspersed in the region 150/250 of the first superimposed district and the second superimposed area overlapping; First row or the first row in the first row in wherein said first superimposed district 150 or the first row and the second superimposed district 250 are corresponding, when the first noumenon 100 and the second body 200 combined, and this first superimposed district 150 is when being superimposed with each other with this second superimposed district 250, the first row (or the first row) in the first superimposed district 150 is positioned at above or below the first row (or the first row) in the second superimposed district 250 relatively.In other words, except being arranged on marginal position, other each first perforation 180 (or saying the drop shadow spread of the first perforation 180 in the second superimposed district) by multiple second perforation 280 institute around; Vice versa.
Further, the folded the first noumenon established and the second body are formed with clearance G between the first superimposed district 150 and the second superimposed district 250.For Fig. 2 B and 3A ~ 3B illustrated embodiment.When clearance G can be storehouse between the first noumenon 100 and the second body 200, naturally do not produce as gluing or welding, and be preferably small gap.Clearance G is also communicated with the first perforation 180 and the second perforation 280.So, when the surface of the first noumenon 100 or the second body 200 has liquid to exist, liquid may infiltrate the first perforation 180 or the second perforation 280 and arrive at opposite side due to capillarity by clearance G, that is flow to the second body 200 and the second perforation 280 by the first noumenon 100, or flow to the first noumenon 100 and the first perforation 180 by the second body 200.In other words, itself structure of the evaporation of the present embodiment shielding mat, as the first noumenon 100 and the second body 200, impels liquid in the circulation of the first noumenon 100 and the second body 200 lap and distribution.As shown in Figure 4, when liquid is lotion, the evaporation of the present embodiment shields structure by this, and lotion can be circulated to the first noumenon 100 and the second body 200 lap and reach better clean achievement, and allow lotion discharge from the first perforation 180/ second perforation 280 by the configuration of the first perforation 180 and the second perforation 280, residue in clearance G to avoid lotion.After the cleaning, evaporation shielding of the present invention also can have shorter time of drying because of the permeability of overlapping region, therefore the rate of utilization of evaporation shielding improves.
In other embodiments, the first perforation 180 or the second perforation 280 can be other shape as rectangle, circle.The selection of perforation shape can its efficiency be shaped determine, such as, form circular perforations more convenient, then selection circle is the shape of the first perforation 180 and/or the second perforation 280.Moreover (always) port area of the first perforation 180 or the second perforation 280 can change.As shown in Figure 5, the first noumenon 100a and the second body 200a misplace and form the first perforation 180a and second perforation 280a of rectangle, and the port area of the first perforation 180a or second perforation 280a also has difference because of its shape and distribution mode with previous embodiment.As shown in Figure 6, the first noumenon 100b and the second body 200b is staggered to form circular first perforation 180b and second perforation 280b, and the port area of the first perforation 180b or second perforation 280b also has difference because of its shape and distribution mode with previous embodiment.Compared to Fig. 5 ~ 7 illustrated embodiment, in Fig. 3 B ~ 3C illustrated embodiment, first perforation 180/ second perforation 280 has larger port area, and the hole in superimposed district 150/250 (being formed by the first perforation and the second perforation) also forms larger total port area.In embodiments of the present invention, the long * of the opening of Fig. 3 B ~ 3C is wide can be such as 5 unit * 5 units.On the contrary, compared to Fig. 3 B ~ 3C illustrated embodiment, in the illustrated embodiment of Fig. 5 ~ 7 (sectional view of Fig. 5 and 6 can simultaneously with reference to Fig. 7), the first perforation 180a/ second 280a and first perforation 180b/ second 280b that bores a hole that bores a hole has less port area in the first superimposed district 250 of superimposed district 150/ second compared to first of Fig. 3 B ~ 3C the perforation 180/ second perforation 280; Moreover, the hole (being formed by the first perforation and the second perforation) of overlapping part 150/250 forms less total port area, and wherein the long * of the opening of Fig. 5 ~ 7 is wide can be such as 6 unit * 4 units.Generally speaking, total port area of overlapping part 150/250 is larger, then the area that in overlapping part 150/250, essence has the first noumenon part and the second body part to be stacked is less; In addition, large total port area and the little area be stacked reflect good permeability (if liquid is in part 150/250 permeability preferably of overlap) in principle.Preferably, total port area of the first perforation 180 and total port area sum of the second perforation 280 are less than 90% of the first superimposed district 180 area or the second superimposed district 250 area.
In other embodiments, the first perforation can be different from the biperforate out of the ordinary or total port area.As shown in Fig. 8 A ~ 8B, the port area of the first perforation 180c is less than the port area of the second perforation 280c.The distance of position relationship as the first noumenon and the second body and vapor deposition source that wherein the first perforation and/or biperforate size or (always) port area can shield between 10 and vapor deposition source according to evaporation designs, and/or the cleaning model of the cleaning way that shields of evaporation and/or cleaning equipment designs.For example, the first noumenon 100 facing vapor deposition source C is made to have size or (always) port area of the first less perforation 180, be preferably size or (always) port area that the size of the first perforation 180c or (always) port area are less than the second perforation 280c, be attached in the process of evaporation on the substrate that the second body is more even attached to for evaporation to reduce deposition material.Though the first noumenon 100 is plotted in below by Fig. 8 A ~ 8B, so this does not limit the actual position of the first noumenon 100.
The first noumenon of the present invention and the second body is better is connected with a strut member.As shown in Fig. 9 A ~ 9B, the first noumenon 100 and the second body 200 can be arranged at strut member, and fix its bearing of trend by this and enclose the geometric ranges of formation, wherein strut member is preferably framework 500.Framework 500 also can be arranged for base material such as the glass substrate S for evaporation.
As Fig. 9 A ~ 9B illustrated embodiment, two the first noumenons 100 extend in parallel on y-axis direction, and three the second bodies 200 extend in parallel on x-axis direction.Two the first noumenons 100 are different from three the second positions of body 200 in z-axis.For example, the second body 200 is positioned on the first noumenon 100, and each second body 200 is established with two, below the first noumenon 100 is folded.Each the first noumenon 100 also has three the first superimposed districts 150 and is superimposed on the second respective superimposed district 250 of three the second bodies 200 respectively.Another the first noumenon 100 is also like this.Therefore, those the first noumenons 100 and the second body 200 form class T-shaped framework, and enclose formation two rectangular extent.
Moreover the first noumenon 100, second body 200 and framework 500 more upwards sequentially combine in z-axis, but not as limit, the such as order interchangeable of the first noumenon 100 and the second body 200.Three's relative position in space when the first noumenon 100, second body 200 and the upper and lower relation of framework 500 in illustrating do not limit actually operating.In this embodiment, framework 500 is passed through the ora terminalis of the first noumenon 100 and the second body 200, and the first noumenon 100 or the second body 200 are connected to the relative both sides of framework 500 with opposite end.Moreover the mode that the first noumenon 100 and the second body 200 can weld the weldering of thunderous exit point is fixedly arranged on framework 500.In addition, framework 500 can have brace table (not shown).Substrate S is arranged on brace table.Preferably, substrate S is for the better brace table dorsad of one side of evaporation, and wherein the first noumenon 100 and the second body 200 are combined in framework 500 towards substrate 500 for the one side of evaporation, and cover substrate S; In other words, substrate 500 is located between the first noumenon 100 and the second body 200 (or call evaporation shield) and framework 500.Now, the ontology definition away from brace table 510 in the first noumenon and the second body is comparatively close to the body of vapor deposition source, and such as the first noumenon 100 is the body close to vapor deposition source; When carrying out evaporation, the one side towards vapor deposition source of the first noumenon 100 and the second body 200 are towards vapor deposition source and the part be not stacked with the first noumenon 100, and the part of namely not covered directly receives deposition material.
For example, substrate S can be glass substrate.Glass substrate is arranged between framework 500 and the first noumenon 100 and the second body 200 (or call evaporation shield), and two rectangular extent having class T-shaped framework to enclose formation define its film-forming region.Each rectangular extent, namely the size of film-forming region can be the size of the 1850mm*1500mm of such as 65 inch panels.When evaporation completes, the finished product of G6 size will there be two rectangle retes if any machine rete.
In other embodiments, substrate S can by such as Acetabula device, and in deposited chamber, the non-evaporation face through substrate S is fixed in evaporation shielding top.Vapor deposition source is usually located at evaporation shielding below, and carries out evaporation towards the direction of evaporation shielding and substrate S.Substrate S is close in evaporation shielding also not necessarily; In other words, evaporation shielding can and substrate S interval arrange.Itself structure of evaporation of the present invention shielding mat can obtain good clean achievement at short notice, therefore can drop into rapidly evaporation processing procedure again and assist to improve finished product yield.
Figure 10 shows that another embodiment that evaporation of the present invention shields.Evaporation shielding 10n also comprises the first noumenon 110 and the second body 220, and wherein the first noumenon 110 has the first superimposed district 150, second body 220 and has the second superimposed district 250.First superimposed district 150 is formed in multiple first perforation the 180, second superimposed district 250 and is formed with multiple second perforation 280.In addition, the part of the first noumenon 110 outside the first superimposed district 150 is formed with perforate 120 further, provides and is defined as diaphragm area.In the embodiment shown in fig. 10, the first noumenon 110 is formed with multiple perforate 120, and wherein those perforates 120 can such as with necessarily regularly arranged and occupy the first noumenon 110 1 region.Moreover the size of those perforates 120 can be equivalent to pixel size, and with matrix arrangement.As shown in Figure 10, region the first noumenon 110 being formed multiple perforate 120 forms a fenestral fabric.Therefore, the structure that the use of the first noumenon 110 is defined as diaphragm area because of it, the first noumenon 110 provides a kind of mode of evaporation, and base material forms the organic layer corresponding with pixel.
On the other hand, the second body 220 can have multiple second superimposed district 250.As shown in Figure 10, those second superimposed districts 250 arrange along the bearing of trend of the second body 220; Or, be that the second body 220 has a superimposed district 250 ' extended along its bearing of trend.
About the use of the first noumenon 110 and the second body 220, example as shown in Figure 10 ~ 11, multiple the first noumenon 110 extends in parallel in y-axis upwards, and along x-axis to side by side.On the first noumenon 110, therefore the first superimposed district 150 of nearly two ends and centre roughly aligns, and is formed in this direction side by side, i.e. the superimposed district 150 ' that upwards extends of x-axis.On the other hand, the second body 220 has the superimposed district 250 ' upwards extended in x-axis.Multiple the first noumenons 110 side by side can be stacked at the second body 220, and superimposed district 150 ' and superimposed district 250 ' are superimposed with each other, and superimposed district 150 '/250 ' has hole by this.As mentioned above, this is impel liquid in the circulation of the lap of the first noumenon 110 and the second body 220 itself and distribution.When liquid is lotion, evaporation of the present invention shields structure by this and obtains better clean achievement.After the cleaning, evaporation shielding of the present invention can have shorter time of drying because of the permeability of overlapping region, therefore the usability of evaporation shielding improves.
The present invention is described by above-mentioned related embodiment, but above-described embodiment is only enforcement example of the present invention.Must it is noted that the embodiment disclosed limit the scope of the invention.On the contrary, be contained in the spirit of right and the amendment of scope and equalization to arrange and be all included within the scope of the present invention.
Claims (6)
1. an evaporation shielding, having in the evaporation processing procedure of a vapor deposition source for being used in, it is characterized in that, comprise:
One the first noumenon, has one first superimposed district; Wherein, this first superimposed district is formed with multiple first perforation; And
One second body, extends with this first noumenon different directions, and has one second superimposed district; Wherein, this second superimposed district is formed with multiple second perforation;
Wherein, this first superimposed district and this second superimposed district superimposed, and this drop shadow spread in this second superimposed district of the first perforation is all outside this biperforate scope.
2. evaporation shielding as claimed in claim 1, is characterized in that, this first perforation drop shadow spread in this second superimposed district is sandwiched between adjacent two these second perforation.
3. evaporation shielding as claimed in claim 1, it is characterized in that, this first superimposed district and this second superimposed interval accompany a gap, and this gap is communicated with this first perforation and this second perforation respectively.
4. evaporation shielding as claimed in claim 1, is characterized in that, in this first perforation and this second perforation, at least one be circle.
5. evaporation shielding as claimed in claim 1, is characterized in that, comparatively this second body is close to this vapor deposition source for this first noumenon, and the port area of this first perforation is less than this biperforate port area.
6. evaporation shielding as claimed in claim 1, is characterized in that, total port area of those the first perforation and the totalling of those biperforate total port areas are less than 90% of this first superimposed district area.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103127814 | 2014-08-13 | ||
| TW103127814A TWI576445B (en) | 2014-08-13 | 2014-08-13 | Mask for evaporation deposition process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104278233A true CN104278233A (en) | 2015-01-14 |
| CN104278233B CN104278233B (en) | 2017-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410598749.0A Active CN104278233B (en) | 2014-08-13 | 2014-10-30 | Evaporation mask |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5917731B2 (en) |
| KR (1) | KR101622483B1 (en) |
| CN (1) | CN104278233B (en) |
| TW (1) | TWI576445B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111279012B (en) * | 2017-10-31 | 2022-03-22 | 夏普株式会社 | Method for manufacturing vapor deposition mask and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10212567A (en) * | 1997-01-30 | 1998-08-11 | Internatl Business Mach Corp <Ibm> | Corrosion resistant molybdenum mask |
| CN101440476A (en) * | 2007-11-23 | 2009-05-27 | 三星移动显示器株式会社 | Mask assembly for thin film vapor deposition of flat panel display |
| CN202989271U (en) * | 2012-12-10 | 2013-06-12 | 昆山允升吉光电科技有限公司 | Auxiliary jig for manufacturing mask plate for large-area evaporation |
| CN103898442A (en) * | 2014-03-13 | 2014-07-02 | 昆山允升吉光电科技有限公司 | Matched mask plates and vapor deposition method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4149771B2 (en) * | 2002-09-20 | 2008-09-17 | 株式会社アルバック | Method for producing laminated organic thin film |
| TW200611987A (en) * | 2004-10-01 | 2006-04-16 | Onano Ind Corp | Evaporation mask |
| JP2010090415A (en) * | 2008-10-06 | 2010-04-22 | Seiko Epson Corp | Deposition mask |
| KR101030030B1 (en) * | 2009-12-11 | 2011-04-20 | 삼성모바일디스플레이주식회사 | Mask assembly |
-
2014
- 2014-08-13 TW TW103127814A patent/TWI576445B/en active
- 2014-10-30 CN CN201410598749.0A patent/CN104278233B/en active Active
- 2014-11-28 KR KR1020140168141A patent/KR101622483B1/en active IP Right Grant
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2015
- 2015-01-30 JP JP2015017207A patent/JP5917731B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10212567A (en) * | 1997-01-30 | 1998-08-11 | Internatl Business Mach Corp <Ibm> | Corrosion resistant molybdenum mask |
| CN101440476A (en) * | 2007-11-23 | 2009-05-27 | 三星移动显示器株式会社 | Mask assembly for thin film vapor deposition of flat panel display |
| CN202989271U (en) * | 2012-12-10 | 2013-06-12 | 昆山允升吉光电科技有限公司 | Auxiliary jig for manufacturing mask plate for large-area evaporation |
| CN103898442A (en) * | 2014-03-13 | 2014-07-02 | 昆山允升吉光电科技有限公司 | Matched mask plates and vapor deposition method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5917731B2 (en) | 2016-05-18 |
| KR101622483B1 (en) | 2016-05-18 |
| CN104278233B (en) | 2017-04-12 |
| TWI576445B (en) | 2017-04-01 |
| JP2016041848A (en) | 2016-03-31 |
| KR20160020332A (en) | 2016-02-23 |
| TW201606103A (en) | 2016-02-16 |
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