CN104275552A - Application for removing plastic package film of integrated circuit through laser - Google Patents
Application for removing plastic package film of integrated circuit through laser Download PDFInfo
- Publication number
- CN104275552A CN104275552A CN201310288531.0A CN201310288531A CN104275552A CN 104275552 A CN104275552 A CN 104275552A CN 201310288531 A CN201310288531 A CN 201310288531A CN 104275552 A CN104275552 A CN 104275552A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- laser instrument
- laser
- plastic packaging
- packaging film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses the application for removing a plastic package film of an integrated circuit through a laser. The emitted light of the laser is infrared light with the wavelength of 1064 nm. A previous method for ablating a plastic package film through aqua regia is replaced by the method for ablating the plastic package film on the integrated circuit through the laser, the working efficiency is promoted, and damage to the environment and people by aqua regia is avoided.
Description
Technical field
The invention belongs to integrated circuit fields, be specifically related to the purposes that integrated circuit plastic packaging film removed by laser instrument.
Background technology
For super large-scale integration (IC) product, usually need in process of production to check that wafer and pin connect the quality of gold thread, to control effectively to technical process aborning, in other words IC plastic packaging film good for plastic packaging to be removed, expose wafer wherein and line, check in whole encapsulation process whether bad impact is created on its connection quality.Current most semiconductor assembly and test manufacturer makes chemically to carry out out cap and goes north inspection, its way is heated by chloroazotic acid, its point is taken off by the plastic sealed mould then dripping to IC, wafer on IC and line are exposed, this method all can cause very major injury to testing staff and environment, and inefficiency, misoperation also can cause serious personal injury.
Summary of the invention
The object of this invention is to provide one and can efficiently remove IC plastic packaging film, and the method for the injury to human body and environment can be avoided.
For achieving the above object, the present invention adopts following technical scheme:
The purposes of integrated circuit plastic packaging film removed by laser instrument, and wherein laser instrument utilizing emitted light is infrared light, make use of plastic packaging film to infrared Absorption rate high and silicon materials and the low characteristic of metal pair infrared Absorption rate.
As the further optimization of such scheme, the wavelength of its mid-infrared light is 1064 nm.
As the further optimization of such scheme, wherein laser focused camera lens is 1.45 ~ 1.55 mm to the distance of workbench.
As the further optimization of such scheme, wherein laser focused camera lens is 1. 5 mm to the distance of workbench.
As the further optimization of such scheme, wherein the amasthenic lens of laser instrument is removable in the horizontal direction.
As the further optimization of such scheme, wherein the amasthenic lens moving range of laser instrument is the square in same level, and the described square length of side is 160 mm.
As the further optimization of such scheme, wherein laser instrument and workbench thereof are closed in a totally-enclosed case, fully sheathed case top is provided with an exhausting system, the Zone Full of laser work is included in wherein with totally enclosed case, additional a set of exhausting system, the cigarette produce ablation and ash are extracted out from casing, enter the exhausting system of factory again, would not damage like this to human and environment after filter.
Beneficial effect main manifestations of the present invention is: by the method for chloroazotic acid ablation plastic packaging film before replacing with the plastic packaging film on laser ablation integrated circuit, operating efficiency is improved, and avoids the injury of chloroazotic acid to environment and human body.
Accompanying drawing explanation
Laser instrument in Fig. 1 the present invention.
Wherein, 1 is integrated circuit, and 2 is workbench, and 3 is laser beams, and 4 is amasthenic lens, and 5 is infrared lasers, and 6 is laser galvanometers, and 7 is fully sheathed cases, and 8 is exhausting systems.
Detailed description of the invention
Below in conjunction with accompanying drawing and preferred embodiment, the invention will be further described.
As shown in Figure 1, the purposes of integrated circuit plastic packaging film removed by laser instrument of the present invention, make use of plastic packaging film high to infrared Absorption rate, and silicon materials and the low characteristic of metal pair infrared Absorption rate, wherein laser instrument 5 utilizing emitted light is infrared light, and the wavelength of infrared light is 1064 nm, laser focused camera lens 4 is 1. 5 mm to the distance of workbench 2, the amasthenic lens 4 of laser instrument is removable in the horizontal direction, and moving range is the square in same level, and the described square length of side is 160 mm.
Concrete workflow is as follows:
By the position needing the IC 1 removing surperficial plastic packaging to be placed on about 1.5 mm of distance Laser Focusing camera lens 4, laser beam 3 is allowed to move around on IC1 plastic packaging film according to the figure of program setting, by removing the process of plastic packaging film to the ablation of plastic packaging film;
Be included in wherein with totally-enclosed case 7 by the Zone Full that laser beam 3 works, the cigarette that ablation produces by additional a set of exhausting system 8 and ash are got rid of from casing, enter the exhausting system of factory again, would not damage like this to human and environment after filter.
By reference to the accompanying drawings the preferred embodiment for the present invention is explained in detail above, but the invention is not restricted to above-mentioned embodiment, in the ken that those of ordinary skill in the art possess, can also make a variety of changes under the prerequisite not departing from present inventive concept.
Do not depart from the spirit and scope of the present invention and can make other changes many and remodeling.Should be appreciated that and the invention is not restricted to specific embodiment, scope of the present invention is defined by the following claims.
Claims (7)
1. the purposes of integrated circuit plastic packaging film removed by laser instrument, and wherein laser instrument utilizing emitted light is infrared light.
2. the purposes of integrated circuit plastic packaging film removed by laser instrument according to claim 1, and the wavelength of its mid-infrared light is 1064 nm.
3. the purposes of integrated circuit plastic packaging film removed by laser instrument according to claim 1 and 2, and wherein laser focused camera lens is 1.45 ~ 1.55 mm to the distance of workbench.
4. the purposes of integrated circuit plastic packaging film removed by laser instrument according to claim 3, and wherein laser focused camera lens is 1. 5 mm to the distance of workbench.
5. the purposes of integrated circuit plastic packaging film removed by laser instrument according to claim 3, and wherein the amasthenic lens of laser instrument is removable in the horizontal direction.
6. the purposes of integrated circuit plastic packaging film removed by laser instrument according to claim 5, and wherein the amasthenic lens moving range of laser instrument is the square in same level, and the described square length of side is 160 mm.
7. the purposes of integrated circuit plastic packaging film removed by laser instrument according to claim 1, and wherein laser instrument and workbench thereof are closed in a totally enclosed case, and upper box part is provided with an exhausting system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310288531.0A CN104275552A (en) | 2013-07-10 | 2013-07-10 | Application for removing plastic package film of integrated circuit through laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310288531.0A CN104275552A (en) | 2013-07-10 | 2013-07-10 | Application for removing plastic package film of integrated circuit through laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104275552A true CN104275552A (en) | 2015-01-14 |
Family
ID=52251157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310288531.0A Pending CN104275552A (en) | 2013-07-10 | 2013-07-10 | Application for removing plastic package film of integrated circuit through laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104275552A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1117503B1 (en) * | 1998-09-30 | 2003-11-26 | Lasertec GmbH | Method and device for removing material from a surface of a work piece |
| CN2670138Y (en) * | 2003-12-12 | 2005-01-12 | 梁伟 | Multifunctional laser engraving and cutting apparatus with vibrating lens |
| CN1836314A (en) * | 2003-07-15 | 2006-09-20 | 控制系统化公司 | Failure analysis methods and systems |
| US20060243712A1 (en) * | 2003-09-12 | 2006-11-02 | International Business Machines Corporation | Method and apparatus for repair of reflective photomasks |
| CN101829848A (en) * | 2010-01-29 | 2010-09-15 | 东莞宏威数码机械有限公司 | Laser recticle dedusting plant and dedusting method |
| CN102714194A (en) * | 2009-10-16 | 2012-10-03 | 控制激光公司 | Method and system for exposing delicate structures of a device encapsulated in a mold compound |
| CN102814590A (en) * | 2012-07-21 | 2012-12-12 | 北京工业大学 | Method for removing adhesive on bottom plate of orthodontic bracket by laser |
-
2013
- 2013-07-10 CN CN201310288531.0A patent/CN104275552A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1117503B1 (en) * | 1998-09-30 | 2003-11-26 | Lasertec GmbH | Method and device for removing material from a surface of a work piece |
| CN1836314A (en) * | 2003-07-15 | 2006-09-20 | 控制系统化公司 | Failure analysis methods and systems |
| US20060243712A1 (en) * | 2003-09-12 | 2006-11-02 | International Business Machines Corporation | Method and apparatus for repair of reflective photomasks |
| CN2670138Y (en) * | 2003-12-12 | 2005-01-12 | 梁伟 | Multifunctional laser engraving and cutting apparatus with vibrating lens |
| CN102714194A (en) * | 2009-10-16 | 2012-10-03 | 控制激光公司 | Method and system for exposing delicate structures of a device encapsulated in a mold compound |
| CN101829848A (en) * | 2010-01-29 | 2010-09-15 | 东莞宏威数码机械有限公司 | Laser recticle dedusting plant and dedusting method |
| CN102814590A (en) * | 2012-07-21 | 2012-12-12 | 北京工业大学 | Method for removing adhesive on bottom plate of orthodontic bracket by laser |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150114 |