CN104251792B - The detection method secretly split inside patch capacitor - Google Patents
The detection method secretly split inside patch capacitor Download PDFInfo
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- CN104251792B CN104251792B CN201410408968.8A CN201410408968A CN104251792B CN 104251792 B CN104251792 B CN 104251792B CN 201410408968 A CN201410408968 A CN 201410408968A CN 104251792 B CN104251792 B CN 104251792B
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- patch capacitor
- abradant surface
- abrasive sheet
- detection method
- secretly
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- 239000003990 capacitor Substances 0.000 title claims abstract description 66
- 238000001514 detection method Methods 0.000 title claims abstract description 24
- 244000137852 Petrea volubilis Species 0.000 claims abstract description 16
- 238000000227 grinding Methods 0.000 claims description 17
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 235000013312 flour Nutrition 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 4
- 230000006378 damage Effects 0.000 abstract description 3
- 238000004458 analytical method Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000007766 curtain coating Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000006101 laboratory sample Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Abstract
The detection method secretly split inside a kind of patch capacitor, comprises the following steps: S1, choose any three sides of patch capacitor as the first abradant surface, the second abradant surface and the 3rd abradant surface；S2, the side relative with the first abradant surface of patch capacitor is pasted and fixed on abrasive sheet, grinds the first abradant surface with sand paper, then observe whether the first abradant surface occurs secretly splitting with magnifier；S3, the side relative with the second abradant surface of patch capacitor is pasted and fixed on abrasive sheet, grinds the second abradant surface with sand paper, then observe whether the second abradant surface occurs secretly splitting with magnifier；S4, the side relative with the 3rd abradant surface of patch capacitor is pasted and fixed on abrasive sheet, grinds the 3rd abradant surface with sand paper, then observe whether the 3rd abradant surface occurs secretly splitting with magnifier.Whether the detection method secretly split inside the patch capacitor of the present invention, can occur secretly splitting inside Rapid identification patch capacitor, and experimental period is short；And patch capacitor body is not resulted in destruction.
Description
Technical field
The present invention relates to detection method, particularly relate to the detection method secretly split inside a kind of patch capacitor.
Background technology
" patch capacitor " i.e. " multilayer sheet type ceramic condenser ", is that ceramic size is made multiple by curtain coating mode
The thickness ceramic dielectric films less than 10 microns, electrode in then printing on dielectric film, be superimposed heat
Pressure, forms several capacitors in parallel, the indivisible overall chip of the most once sintered one-tenth one.
In recent years, production process after sale and is repeatedly fed back the problem that flaky electric capacity occurs that capacitance is less than normal, pass through
Inventor analyzes discovery, and capacitance basic reason less than normal is that patch capacitor occurs internal to cause flaky electric capacity to occur
Secretly split.
In prior art, whether general employing imbedding method is analyzed to exist inside electric capacity and is secretly split, and will inlay by electric capacity
It is ground in resin, then observes whether to exist inside electric capacity and secretly split.The method is difficult to find paster electricity
Hold and whether occur secretly splitting, because four sides that patch capacitor is in addition to two end faces on length direction all have
It is likely to occur and secretly splits, and, experimental period is longer, and laboratory sample is difficult to retain.
Summary of the invention
For above-mentioned prior art present situation, the technical problem to be solved is, it is provided that a kind of paster
The detection method secretly split inside electric capacity, it can quickly judge whether occur secretly splitting inside patch capacitor, test
Cycle is short, and can be with retention fault electric capacity, it is simple to follow-up further analysis.
In order to solve above-mentioned technical problem, the detection side secretly split inside a kind of patch capacitor provided by the present invention
Method, described patch capacitor includes cuboid electric capacity body and is arranged on described electric capacity body length direction
The termination electrode at two ends, described detection method comprises the following steps:
S1, any three sides in addition to two end faces on length direction choosing described patch capacitor are divided
Not as the first abradant surface, the second abradant surface and the 3rd abradant surface；
S2, the side relative with described first abradant surface of described patch capacitor is pasted and fixed on abrasive sheet,
Described first abradant surface is ground along the direction being parallel to described first abradant surface, until grinding away described with sand paper
Expose described electric capacity body after termination electrode, then observe whether described first abradant surface occurs secretly splitting with magnifier；
S3, described patch capacitor is taken off from described abrasive sheet, grinding described patch capacitor with described second
The side that flour milling is relative is pasted and fixed on abrasive sheet, with sand paper along the direction being parallel to described second abradant surface
Grind described second abradant surface, until exposing described electric capacity body after grinding away described termination electrode, then with putting
Whether the second abradant surface described in big sem observation occurs secretly splitting；And
S4, described patch capacitor is taken off from described abrasive sheet, grinding described patch capacitor with the described 3rd
The side that flour milling is relative is pasted and fixed on abrasive sheet, with sand paper along the direction being parallel to described 3rd abradant surface
Grind described 3rd abradant surface, until exposing described electric capacity body after grinding away described termination electrode, then with putting
Whether the 3rd abradant surface described in big sem observation occurs secretly splitting.
Wherein in an embodiment, fixed by double faced adhesive tape between described patch capacitor and described abrasive sheet.
Wherein in an embodiment, the granularity of described sand paper is 4000～5000 μm.
Wherein in an embodiment, described abrasive sheet is rectangle, described abrasive sheet a length of 130～
150mm, width is 40～50mm.
Wherein in an embodiment, described abrasive sheet is pcb board material.
Wherein in an embodiment, the multiple of described magnifier is 200 times.
The detection method secretly split inside the patch capacitor of the present invention, eliminates time that metallographic inlays and one side grinds
Mill drawback, can whether occur secretly splitting inside Rapid identification patch capacitor, experimental period is short, reach quickly to
Setting analysis conclusion, instructs the effect of rectification；And, patch capacitor body is not resulted in destruction, Ke Yibao
Stay fault capacitance, it is simple to follow-up further analysis.
Additional technical feature of the present invention is had the advantage that will enter in this specification detailed description of the invention part
Row explanation.
Accompanying drawing explanation
Fig. 1 is the structural representation of the patch capacitor in the embodiment of the present invention；
Fig. 2 is the flow chart of the detection method secretly split inside the patch capacitor in the embodiment of the present invention；
Fig. 3 is the structural representation of the abrasive sheet in the embodiment of the present invention；
Fig. 4 is the view of the patch capacitor after grinding.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments the present invention is described in detail.It should be noted that not
In the case of conflict, the feature in following embodiment and embodiment can be mutually combined.
" patch capacitor " i.e. " multilayer sheet type ceramic condenser ", is that ceramic size is made multiple by curtain coating mode
The thickness ceramic dielectric films less than 10 microns, electrode in then printing on dielectric film, be superimposed heat
Pressure, forms several capacitors in parallel, the indivisible overall chip of the most once sintered one-tenth one.
Fig. 1 show the perspective view of patch capacitor, and described patch capacitor 10 includes that cuboid electric capacity is originally
Body 12 and the termination electrode 14 at two ends being arranged on described electric capacity body 12 length direction.
The present inventor, by the analysis to patch capacitor 10 structure and material, develops a kind of quickly inspection
Survey the internal detection method secretly split of patch capacitor 10, as in figure 2 it is shown, this detection method comprises the following steps:
Step S1, choose any three in addition to two end faces on length direction of described patch capacitor 10
Side is respectively as the first abradant surface, the second abradant surface and the 3rd abradant surface.Owing to patch capacitor 10 is stratiform
Structure, if any three sides in addition to two end faces on length direction of patch capacitor 10 are the darkest
Split, then can determine whether that whole patch capacitor 10 is not exist secretly to split, so can shorten experimental period.
Step S2, the side relative with described first abradant surface of described patch capacitor 10 is pasted and fixed on and grinds
On nog plate 20 (structure of abrasive sheet is shown in Fig. 3), grind along the direction being parallel to described first abradant surface with sand paper
Grinding described first abradant surface, until exposing described electric capacity body 12 after grinding away described termination electrode 14, then using
Magnifier observes whether described first abradant surface occurs secretly splitting (see Fig. 4).
Step S3, described patch capacitor 10 is taken off from described abrasive sheet 20, by described patch capacitor 10
The side relative with described second abradant surface is pasted and fixed on abrasive sheet 20, with sand paper along being parallel to described the
Described second abradant surface is ground in the direction of two abradant surfaces, until exposing described electricity after grinding away described termination electrode 14
Hold body 12, then observe whether described second abradant surface occurs secretly splitting with magnifier.Paster in this step
The fixing means of electric capacity 10 is identical with step S2.
Step S4, described patch capacitor 10 is taken off from described abrasive sheet 20, by described patch capacitor 10
The side relative with described 3rd abradant surface is pasted and fixed on abrasive sheet 20, with sand paper along being parallel to described the
Described 3rd abradant surface is ground in the direction of three abradant surfaces, until exposing described electricity after grinding away described termination electrode 14
Hold body 12, then observe whether described 3rd abradant surface occurs secretly splitting with magnifier.Paster in this step
The fixing means of electric capacity 10 is identical with step S2.If the first abradant surface, the second abradant surface and the 3rd grind
Face is the most secretly split, then may determine that described patch capacitor 10 the most secretly splits.
Preferably, fixed by double faced adhesive tape between described patch capacitor 10 and described abrasive sheet 20, specifically grasp
Make method as follows: on off-the-shelf abrasive sheet 20, stick double faced adhesive tape, more laterally put by patch capacitor 10
Put on double faced adhesive tape, depress gently, patch capacitor 10 can be fixed.
Preferably, the granularity of described sand paper is preferably 4000～5000 μm, the granularity of sand paper in this range,
May insure that the smooth-sided compression candles after grinding, itself secretly will not be split generation and interfere.
Preferably, described abrasive sheet 20 is rectangle (as shown in Figure 3), length a of described abrasive sheet 20
Being 130～150mm, width b is 40～50mm.Further, described abrasive sheet 20 is pcb board material.
To sum up, the detection method secretly split inside the patch capacitor of the embodiment of the present invention, have the advantages that
1, this detection method eliminates time and the drawback of one side grinding that metallographic is inlayed, can Rapid identification paster
Whether occur inside electric capacity secretly splitting, reach, quickly to setting analysis conclusion, to instruct the effect of rectification；
2, this detection method does not results in destruction to patch capacitor body, can be with retention fault electric capacity, it is simple to after
Continuous analysis further；
3, the experimental article that this detection method is used is conventional articles for use, is conveniently easy to get, low cost.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and
Improving, these broadly fall into protection scope of the present invention.
Claims (6)
1. the detection method secretly split inside patch capacitor, described patch capacitor includes that cuboid electric capacity is originally
Body and the termination electrode at two ends being arranged on described electric capacity body length direction, it is characterised in that described detection
Method comprises the following steps:
S1, any three sides in addition to two end faces on length direction choosing described patch capacitor are divided
Not as the first abradant surface, the second abradant surface and the 3rd abradant surface；
S2, the side relative with described first abradant surface of described patch capacitor is pasted and fixed on abrasive sheet,
Described first abradant surface is ground along the direction being parallel to described first abradant surface, until grinding away described with sand paper
Expose described electric capacity body after termination electrode, then observe whether described first abradant surface occurs secretly splitting with magnifier；
S3, described patch capacitor is taken off from described abrasive sheet, grinding described patch capacitor with described second
The side that flour milling is relative is pasted and fixed on abrasive sheet, with sand paper along the direction being parallel to described second abradant surface
Grind described second abradant surface, until exposing described electric capacity body after grinding away described termination electrode, then with putting
Whether the second abradant surface described in big sem observation occurs secretly splitting；And
S4, described patch capacitor is taken off from described abrasive sheet, grinding described patch capacitor with the described 3rd
The side that flour milling is relative is pasted and fixed on abrasive sheet, with sand paper along the direction being parallel to described 3rd abradant surface
Grind described 3rd abradant surface, until exposing described electric capacity body after grinding away described termination electrode, then with putting
Whether the 3rd abradant surface described in big sem observation occurs secretly splitting.
The detection method secretly split inside patch capacitor the most according to claim 1, it is characterised in that institute
State and fixed by double faced adhesive tape between patch capacitor and described abrasive sheet.
The detection method secretly split inside patch capacitor the most according to claim 1, it is characterised in that institute
The granularity stating sand paper is 4000～5000 μm.
The detection method secretly split inside patch capacitor the most according to claim 1, it is characterised in that institute
Stating abrasive sheet to be rectangle, a length of the 130 of described abrasive sheet～150mm, width is 40～50mm.
The detection method secretly split inside patch capacitor the most according to claim 1, it is characterised in that institute
Stating abrasive sheet is pcb board material.
The detection method secretly split inside patch capacitor the most according to claim 1, it is characterised in that institute
The multiple stating magnifier is 200 times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410408968.8A CN104251792B (en) | 2014-08-19 | The detection method secretly split inside patch capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410408968.8A CN104251792B (en) | 2014-08-19 | The detection method secretly split inside patch capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104251792A CN104251792A (en) | 2014-12-31 |
| CN104251792B true CN104251792B (en) | 2017-01-04 |
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|---|---|---|---|---|
| US7352176B1 (en) * | 2006-08-10 | 2008-04-01 | Sandia Corporation | Rotating concave eddy current probe |
| CN201844980U (en) * | 2010-08-31 | 2011-05-25 | 常州视觉龙机电设备有限公司 | Automatic detection system of solar silicon wafer |
| CN102680483A (en) * | 2012-05-31 | 2012-09-19 | 苏州晟成新能源科技有限公司 | Hidden crack defect tester |
| CN103308355A (en) * | 2012-11-12 | 2013-09-18 | 西安航空动力股份有限公司 | Metallographic test sample preparation method of aluminum-based ceramic mould core and silicon-based ceramic mould core |
| CN203337560U (en) * | 2013-06-18 | 2013-12-11 | 韩华新能源（启东）有限公司 | Detection and sorting device for sub-fissures of crystalline silicon wafer of solar cell |
| CN203455287U (en) * | 2013-09-17 | 2014-02-26 | 嘉兴市新纪元钢管制造有限公司 | Manual inspection device for outer surface defect of pipe material |
| CN203587516U (en) * | 2013-11-12 | 2014-05-07 | 上海太阳能工程技术研究中心有限公司 | Infrared defect detection device of IBC (Interdigitated Back Contact) solar battery |
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7352176B1 (en) * | 2006-08-10 | 2008-04-01 | Sandia Corporation | Rotating concave eddy current probe |
| CN201844980U (en) * | 2010-08-31 | 2011-05-25 | 常州视觉龙机电设备有限公司 | Automatic detection system of solar silicon wafer |
| CN102680483A (en) * | 2012-05-31 | 2012-09-19 | 苏州晟成新能源科技有限公司 | Hidden crack defect tester |
| CN103308355A (en) * | 2012-11-12 | 2013-09-18 | 西安航空动力股份有限公司 | Metallographic test sample preparation method of aluminum-based ceramic mould core and silicon-based ceramic mould core |
| CN203337560U (en) * | 2013-06-18 | 2013-12-11 | 韩华新能源（启东）有限公司 | Detection and sorting device for sub-fissures of crystalline silicon wafer of solar cell |
| CN203455287U (en) * | 2013-09-17 | 2014-02-26 | 嘉兴市新纪元钢管制造有限公司 | Manual inspection device for outer surface defect of pipe material |
| CN203587516U (en) * | 2013-11-12 | 2014-05-07 | 上海太阳能工程技术研究中心有限公司 | Infrared defect detection device of IBC (Interdigitated Back Contact) solar battery |
Non-Patent Citations (1)
| Title |
|---|
| 贴片电容器失效分析;汪洋 等;《电子元件与材料》;20081130;第27卷(第11期);第74-76页 * |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 519000 Guangdong city of Zhuhai Province Qianshan Applicant after: GREE ELECTRIC APPLIANCES Inc. OF ZHUHAI Applicant after: GREE ELECTRIC(HEFEI) Co.,Ltd. Address before: 230000 Anhui city of Hefei province high tech Zone Parkinson weir Science Park Road No. 208. Applicant before: GREE ELECTRIC(HEFEI) Co.,Ltd. Applicant before: GREE ELECTRIC APPLIANCES Inc. OF ZHUHAI |
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| GR01 | Patent grant |