CN107645879A - A kind of ceramic electronic components and preparation method thereof - Google Patents
A kind of ceramic electronic components and preparation method thereof Download PDFInfo
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- CN107645879A CN107645879A CN201710767744.XA CN201710767744A CN107645879A CN 107645879 A CN107645879 A CN 107645879A CN 201710767744 A CN201710767744 A CN 201710767744A CN 107645879 A CN107645879 A CN 107645879A
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Abstract
The present invention relates to a kind of ceramic electronic components and preparation method thereof, belong to field of electrical components.The ceramic electronic components of the present invention include ceramic body, the ceramic body is cuboid, seamed edge on two length directions of the same side of the ceramic body is respectively provided with the first fillet, and the seamed edge on the two other length direction of the ceramic body is right-angle side or is respectively provided with the second fillet；The fillet angle of first fillet and second fillet differs.The present invention sets the round seamed edge of different angle, so easily distinguishes each side of generous similar ceramic electronic components, improves the efficiency of inspection and analysis sample.
Description
Technical field
The present invention relates to a kind of ceramic electronic components and preparation method thereof, belong to field of electrical components.
Background technology
When ceramic electronic components are designed to width and thickness is close to when being difficult to from the degree that outward appearance is differentiated, it is carried out
When metallographic cuts open piece analysis, the problem of being difficult to each side of ceramic body so as to which required sightingpiston can not be obtained exactly be present,
Especially for the sample for having enclosed termination electrode, by two end faces of electrode in exposure are covered by termination electrode, to identify
The each side of ceramic body is more difficult.
Furthermore when by ceramic electronic components tape package, also because failing to identify each side of ceramic body, cause to make pottery
Porcelain electronic unit is with different orientation positions by braid, and as a result client is in use, electrode runs parallel within some ceramic electronic components
Be mounted in the mode of wiring board on wiring board, some ceramic electronic components then within electrode perpendicular to wiring board mode quilt
Attachment in the circuit board, causes the performance of ceramic electronic components inconsistent.
The content of the invention
A kind of each side is provided and easily known it is an object of the invention to overcome above-mentioned the deficiencies in the prior art part
Other ceramic electronic components.
Corresponding to this, present invention also offers the preparation method of above-mentioned ceramic electronic components.
To achieve the above object, the technical scheme taken of the present invention is:A kind of ceramic electronic components, it includes ceramic body,
The ceramic body is cuboid, and it includes mutually opposing first side and second side, the 3rd mutually opposing side and
Four sides and mutually opposing first end face and second end face；The first side and second side and the thickness of the ceramic body
Degree direction is perpendicular, and the 3rd side and the 4th side and the width of the ceramic body are perpendicular, the first end face
It is perpendicular with second end face and the length direction of the ceramic body；Two length directions positioned at the same side of the ceramic body
On seamed edge be respectively provided with the first fillet, the seamed edge on the two other length direction of the ceramic body is right-angle side or had
There is the second fillet；The fillet angle of first fillet and second fillet differs.
The ceramic electronic components of the present invention, there is provided the round seamed edge of different angle, accordingly even when ceramic electronic components
Width and thickness be close to be difficult to from outward appearance differentiate degree, each side of ceramic electronic components is also easily identified.It is right
When ceramic electronic components progress metallographic cuts open piece analysis, required sightingpiston can be identified exactly using light microscope.And will pottery
During porcelain electronic unit tape package, it can be identified using optically screening machine and screen out the inconsistent ceramic electrical sub-portion of positioning orientating
Part, ensure ceramic electronic components with unified orientation positions by braid.
Further, when the seamed edge on the two other length direction of the ceramic body is right-angle side, first circle
The sine value at angle is not less than 0.5；It is described when seamed edge on the two other length direction of the ceramic body is respectively provided with the second fillet
The absolute value of the difference of the sine value of the sine value of first fillet and second fillet is not less than 0.5.Angle so can be made not
The angle of two fillets of identical differs greatly, and is easier each side identified.
Further, first fillet is identical with the radius of second fillet.
Further, the ceramic body is arranged viscous and sintering by layered product and obtained, and the layered product includes ceramic substrate, is located at
The starch film of ceramic base plate surface and the protecting cover located at starch film surface.
Further, the ceramic electronic components also include two termination electrodes, and the termination electrode is respectively arranged on described first
On end face and second end face.
Further, the ceramic electronic components also include interior electrode, the interior electrode in the ceramic body and with
The first side and second side are parallel to each other, and gap is respectively formed between the interior electrode and the 3rd side and the 4th side；
Dielectric layer is provided between the interior electrode.Electrode in setting, the capacitance of ceramic electronic components can be conveniently adjusted, also favorably
In the ceramic electronic components for preparing high power capacity.
Further, the interior electrode is made up of electrode in multiple first and multiple the second inner electrodes, electric in described first
Pole and the second inner electrode are arranged alternately in the ceramic body, and electrode has in the first end face in described first draws side simultaneously
And gap is formed with the second end face, the second inner electrode has in the second end face draws side and with described first
End face forms gap.
Present invention also offers a kind of preparation method of ceramic electronic components, it comprises the following steps：
(1) it is laminated starch film on ceramic substrate and protecting cover obtains multilayer board；
(2) multilayer board is fixed after pressing on stainless steel and cut, obtain layered product；
(3) by layered product chamfer grinding；
(4) row is carried out to the layered product after chamfer grinding to glue and sinter, and obtains ceramic body；
(5) termination electrode is enclosed in the first end face and second end face of ceramic body respectively, obtains ceramic electronic components.
Further, in the step (1), a starch film is laminated on the surface of ceramic substrate, then it is remote in starch film
The superficial layer stack guard lid of ceramic substrate, obtains multilayer board；Or fold a starch in relative two surface layers of ceramic substrate
Film, then a mutually different protecting cover of thickness is folded in two surface layers of the starch film away from ceramic substrate respectively, it is laminated
Substrate.
Compared with prior art, beneficial effects of the present invention are：Round seamed edge of the invention by setting different angle,
Accordingly even when the width and thickness of ceramic electronic components be close to be difficult to from outward appearance differentiate degree, ceramic electronic components it is each
Side is also easily identified, and improves the efficiency examined and analyze sample.When cuing open piece analysis to ceramic electronic components progress metallographic,
Required sightingpiston can be identified exactly using light microscope.And during by ceramic electronic components tape package, sieved using optics
Select machine to identify and screen out the inconsistent ceramic electronic components of positioning orientating, ensure that ceramic electronic components are determined with unified orientation
Position is by braid.
Brief description of the drawings
Fig. 1 is the outside drawing of the ceramic electronic components of the embodiment of the present invention 1；
Fig. 2 is the dimensional structure diagram of the ceramic electronic components of the embodiment of the present invention 1；
Fig. 3 is the profile that Fig. 1 ceramic electronic components are observed along I-I direction；
Fig. 4 is the structural representation before the layered product chamfer grinding of the embodiment of the present invention 1；
Fig. 5 is the structural representation after the layered product chamfer grinding of the embodiment of the present invention 1；
Fig. 6 is the profile of the ceramic electronic components of the embodiment of the present invention 3；
Fig. 7 is the profile of the ceramic electronic components of the embodiment of the present invention 4.
In figure, 1 is first side, and 2 be second side, and 3 be the 3rd side, and 4 be the 4th side, and 5 be first end face, and 6 are
Second end face, 10 be ceramic body, and 11 be the first seamed edge, and 12 be the second seamed edge, and 13 be the 3rd seamed edge, and 14 be the 4th seamed edge, and 21 are
First termination electrode, 22 be the second termination electrode, and 101 be electrode in first, and 102 be the second inner electrode, and 50 be ceramic substrate, and 60 be shallow lake
Powder film, 70 be protecting cover.
Embodiment
For the object, technical solutions and advantages of the present invention are better described, below in conjunction with the drawings and specific embodiments pair
The present invention is described further.
Embodiment 1
As shown in Figure 1, Figure 2 and Figure 3, a kind of ceramic electronic components of the embodiment of the present invention, it includes ceramic body 10, ceramics
Body 10 is cuboid, and it includes mutually opposing first side 1 and second side 2, mutually opposing the 3rd side 3 and the 4th side
Face 4 and mutually opposing first end face 5 and second end face 6；First side 1 and second side 2 and the thickness side of ceramic body 10
To perpendicular, the 3rd side 3 and the 4th side 4 and the width of ceramic body 10 are perpendicular, first end face 5 and second end face 6
It is perpendicular with the length direction of ceramic body 10；The seamed edge of first side 1 and the intersection of the 3rd side 3 is the first seamed edge 11, first
The seamed edge of side 1 and the intersection of the 4th side 4 is the second seamed edge 12, and the seamed edge of second side 2 and the intersection of the 3rd side 3 is the
The seamed edge of three seamed edges 13, second side 2 and the intersection of the 4th side 4 is the 4th seamed edge 14；First seamed edge 11 and the second seamed edge 12
The first fillet is respectively provided with, the 3rd seamed edge 13 and the 4th seamed edge 14 are respectively provided with the second fillet, first fillet and the second fillet
Fillet angle differs.
In above-mentioned ceramic electronic components, the fillet angle of the first fillet and the second fillet is more than 0 ° and no more than 90 °.This reality
The ceramic electronic components for applying example are provided with the round seamed edge of different angle, accordingly even when the width and thickness of ceramic electronic components
The degree for being difficult to differentiate from outward appearance is close to, each side of ceramic electronic components is also easily identified.To ceramic electronic components
When progress metallographic cuts open piece analysis, required sightingpiston can be identified exactly using light microscope.And ceramic electronic components are compiled
During band packaging, it can be identified using optically screening machine and screen out the inconsistent ceramic electronic components of positioning orientating, ensure ceramic electrical
Subassembly is with unified orientation positions by braid.
Further, the fillet angle of first fillet is A, and the fillet angle of the second fillet is B；A ＜ B, and sin
(B)-sin(A)≥0.5.Differing greatly for the angle for two fillets that can so make to differ, makes each side be easier quilt
Identification.
Further, first fillet is identical with the radius of second fillet.That is, the first seamed edge 11, the second seamed edge
12nd, the 3rd seamed edge 13 and the 4th seamed edge 14 are respectively provided with radius identical fillet.
Further, ceramic body 10 is arranged viscous and sintering by layered product and obtained, and as shown in Figure 4 and Figure 5, layered product includes ceramics
Substrate 50, the starch film 60 located at the surface of ceramic substrate 50 and the protecting cover 70 located at the surface of starch film 60.
Further, ceramic electronic components also include two termination electrodes, respectively the first termination electrode 21 and the second termination electrode
22, the first termination electrode 21 is in first end face 5, and the second termination electrode 22 is in second end face 6.Preferably, the first termination electrode
21 also extend a distance into the bending of first side 1, second side 2, the 3rd side 3 and the 4th side 4 respectively, the second termination electrode
22 also extend a distance into the bending of first side 1, second side 2, the 3rd side 3 and the 4th side 4 respectively.So it is easy to handle
Ceramic electronic components are welded on wiring board, and the connection of ceramic electronic components and wiring board is relatively more firm.First termination electrode
21 and second between termination electrode 22 formed with gap so as to mutually insulated.
The preparation method of the ceramic electronic components of the present embodiment, comprises the following steps：
Step 1, prepare starch film.
In the present embodiment, starch, first adhesive and the first solvent are well mixed and obtain starch size, with starch slurry
Expect to prepare starch film for raw material.
Preferably, starch, first adhesive and the first solvent are well mixed by the way of ball milling and obtain starch size.
Further, the time of ball milling is 3 hours~4 hours.
Preferably, the mass ratio of starch, first adhesive and the first solvent is 10：2.5~3：10~15.
Preferably, starch is cornstarch.
Preferably, first adhesive is selected from least one of acrylic resin and polyvinyl butyral resin.
Preferably, the first solvent is that mass ratio is 1：1~1.25：1 toluene and the mixed solvent of absolute ethyl alcohol.
Preferably, starch size also includes plasticizer, and in one embodiment, plasticizer is dioctyl phthalate
(DOP).Further, the mass ratio of plasticizer and starch is 1：20~1：10.
Preferably, starch size is cast to form starch film using the tape casting.
Preferably, the thickness of starch film is 90 μm~130 μm.
Step 2, prepare ceramic membrane.
In the present embodiment, ceramic slurry is obtained after ceramic powder, second adhesive, the second solvent being well mixed, with pottery
Porcelain slurry is that ceramic membrane is prepared in raw material.
Preferably, ceramic powder, second adhesive, the second solvent are well mixed by the way of ball milling and obtain ceramic slurry
Material.Further, the time of ball milling is 12 hours~16 hours.
Preferably, ceramic powder, second adhesive, the mass ratio of the second solvent are 10：3~5：4~9.
Ceramic powder can be barium titanate powder, zirconic acid calcium powder, magnesium titanate powder etc., but not limited to this.
Further, second adhesive is polyvinyl butyral resin, and the second solvent is that mass ratio is 1:1~2:1 toluene
With the mixed solvent of ethanol.
Preferably, ceramic slurry is cast to form ceramic membrane using the tape casting.
Preferably, the thickness of ceramic membrane is 1 μm~60 μm.
Step 3, ceramic film poststack obtained into ceramic substrate and protecting cover.
Multiple ceramic membranes are laminated by predetermined quantity respectively, obtain ceramic substrate and protecting cover.
In general, the ceramic membrane quantity used in multilayer ceramic substrate can be 4~500.It is laminated the pottery used in protecting cover
Porcelain film quantity can be 1~40.The ceramic membrane used in ceramic membrane and multilayer ceramic substrate used in stacking protecting cover can be adopted
It is prepared with identical or different ceramic material, but it is preferable that ceramic membrane and multilayer ceramic substrate institute used in stacking protecting cover
Ceramic membrane is prepared using same ceramic material.The thickness of protecting cover and the thickness of ceramic substrate differ, it is preferred that shield
The thickness of lid is less than the thickness of ceramic substrate, it is further preferred that the thickness of protecting cover is no more than the 20% of ceramic substrate.
Step 4, stacking starch film and protecting cover obtain multilayer board on ceramic substrate.
In present embodiment, a starch film is laminated in the side of ceramic substrate, then in starch film away from ceramic substrate
Side is laminated a protecting cover, obtains multilayer board.In other implementations, respectively it is laminated one in the opposite sides of ceramic substrate
Individual starch film, then a protecting cover is respectively laminated two sides of the starch film away from ceramic substrate respectively, multilayer board is obtained, and
The thickness of two protecting covers differs.
Step 5, cut after multilayer board is fixed into pressing on stainless steel, obtain layered product.
Multilayer board is fixed and pressed on stainless steel with isostatic pressing method, each layer ceramic membrane in multilayer board is closely glued
Connect；Then multilayer board is cut in length and breadth by preliminary dimension, multilayer board is cut to the layered product of multiple independent cuboid shapes,
Layered product is separated from stainless steel plate again.Layered product is as shown in figure 4, including ceramic substrate 50, located at ceramic substrate 50
The starch film 60 on surface and the protecting cover 70 located at the surface of starch film 60.
When the thickness of protecting cover is less than the thickness of ceramic substrate, the thickness of multilayer board is smaller, and multilayer board cutting is compared
Easily, and material is saved.
Step 6, by layered product chamfer grinding.
Using planetary mills or the method for barreling by layered product chamfer grinding, so that the corner of layered product becomes more round and smooth,
Chamfer grinding can use one or more of be used as among alumina balls, starch, running water to grind medium.After chamfer grinding
Layered product is as shown in Figure 5.Because the material of protecting cover and the material of ceramic substrate are identical, and four on the length direction of layered product
Individual seamed edge is ground by degree equalization, so the fillet angle and radius of corner of four on the length direction of layered product seamed edge
It is identical.But because the side of ceramic substrate is completely covered by starch film and protecting cover, therefore the length direction of ceramic substrate
On four seamed edges it is variant by the degree ground, so as to they fillet angle it is variant, i.e., wherein connect with starch film
The fillet angle of two tactile seamed edges is less than the fillet angle of two seamed edges away from starch film.In other implementations,
The both sides of ceramic substrate are completely covered by starch film and protecting cover respectively, and the thickness of two protecting covers differs, therefore ceramics
Four seamed edges on the length direction of substrate it is variant by the degree ground, it is variant so as to their fillet angle.
It is appreciated that the degree by adjusting chamfer grinding, can easily make four on the length direction of ceramic substrate
Individual seamed edge obtains different radiuss of corner；By adjusting the thickness of protecting cover, the length direction of ceramic substrate can be easily adjusted
On four seamed edges fillet angle.
Step 7, the layered product after chamfer grinding is carried out to arrange viscous and sintering, obtain ceramic body.
Layered product after chamfer grinding arrange in viscous and sintering operation, arranging viscous detailed process is：In air atmosphere
Under enclosing, the layered product after chamfer grinding is heated to 260 DEG C~450 DEG C and is incubated 2 hours~4 hours to exclude adhesive；Or
Layered product after chamfer grinding is heated to 400 DEG C~600 DEG C and is incubated 3 hours~6 hours by person under protective gas atmosphere
To exclude adhesive.
Protective gas can be nitrogen, argon gas or helium.
Layered product after chamfer grinding arrange in viscous and sintering operation, the detailed process of sintering is：In air atmosphere
Under enclosing or under reducibility gas atmosphere, the layered product arranged after gluing is heated to 900 DEG C~1320 DEG C and insulation 1 hour~4
Hour is sintered, and ceramic body is obtained after the completion of sintering.Wherein, ceramic membrane is sintered is formed as ceramic dielectric.
Reducibility gas can be the mixed gas of nitrogen and hydrogen, wherein, the volume ratio of hydrogen and nitrogen is 0.1~3：
100。
After sintering, ceramic substrate is formed as ceramic body, and protecting cover is formed as ceramics, and starch film is ashed and served and prevents from making pottery
Porcelain body and ceramics adhesion every viscous effect.Because the thickness of ceramics and the thickness of ceramic body differ, and the quality of ceramics with
The quality of ceramic body also differs, using ceramic body and the thickness difference or of poor quality of ceramics, can easily by ceramic body and
Ceramics separates.
The ceramic membrane used in ceramic membrane and multilayer ceramic substrate used in stacking protecting cover is prepared into using same ceramic material
Then, the chip of protecting cover during layered product chamfer grinding will not be polluted to the ceramic body after sintering.
Step 8, two termination electrodes are enclosed in the first end face and second end face of ceramic body respectively, obtain ceramic electrical sub-portion
Part.
Respectively in the first end face and second end face coated copper metal paste of ceramic body, silver metal slurry or silver palladium alloy gold
Belong to slurry, the then sintered copper metal paste under protective gas atmosphere, or sinter under air atmosphere silver metal slurry or
Silver palladium alloy metal paste, sintering temperature can be 700 DEG C~900 DEG C, and soaking time can be 10 minutes~12 minutes, sintering
Two termination electrodes of the first end face for being adhering closely to ceramic body respectively and second end face are formed afterwards, obtain ceramic electronic components.
Protective gas can be nitrogen, argon gas or helium.
The preparation method of above-mentioned ceramic electronic components, technique is simple, is adapted to large-scale production.
It should be noted that the order of step 1 and step 2 can be exchanged, can also synchronously perform.Certainly, in others
In embodiment, starch film and ceramic membrane can also outsourcing, then step 1 and step 2 can be omitted.
Embodiment 2
A kind of ceramic electronic components of the embodiment of the present invention, it is differed only in the ceramic electronic components of embodiment 1：This
In embodiment, the 3rd seamed edge 13 and the 4th seamed edge 14 are right-angle side.
Further, the sine value of first fillet is not less than 0.5.
The preparation method of the ceramic electronic components of the present embodiment is the same as embodiment 1.
Embodiment 3
As shown in fig. 6, a kind of ceramic electronic components of the embodiment of the present invention, its area with the ceramic electronic components of embodiment 1
It is not only that：In the present embodiment, the fillet angle of first fillet is A, and the fillet angle of the second fillet is B；A ＞ B, and
sin(A)-sin(B)≥0.5。
The preparation method of the ceramic electronic components of the present embodiment is the same as embodiment 1.
Embodiment 4
As shown in fig. 7, a kind of ceramic electronic components of the embodiment of the present invention, its area with the ceramic electronic components of embodiment 1
It is not only that：In the present embodiment, ceramic electronic components also include interior electrode, and interior electrode is located in ceramic body 10 and and first side
1 and second side 2 be parallel to each other, be respectively formed gap between interior electrode and the 3rd side 3 and the 4th side 4；The interior electrode it
Between be provided with dielectric layer.Dielectric layer is set between interior electrode, so as to which interior electrode is spaced.
Preferably, dielectric layer is made up of ceramic dielectric.
Preferably, the interior electrode is made up of electrode 101 in multiple first and multiple the second inner electrodes 102, electric in first
Pole 101 and the second inner electrode 102 are arranged alternately in ceramic body 10, and electrode 101 has in first end face 5 in first draws side simultaneously
And gap is formed with second end face 6, the second inner electrode 102 has in second end face 6 draws side and between the formation of first end face 5
Gap.
First termination electrode 21 covers first end face 5, the second termination electrode 22 covering second end face 6, so as to the first termination electrode 21
With first in electrode 101 connect, the second termination electrode 22 and the second inner electrode 102 connect, and form multiple electric capacity structure in parallel, adjust
Save the quantity of electrode 101 and the second inner electrode 102 in first, the right opposite in first between electrode 101 and the second inner electrode 102
Spacing in product and first between electrode 101 and the second inner electrode 102, the electric capacity of ceramic electronic components can be conveniently adjusted
Amount, it is also beneficial to prepare the ceramic electronic components of high power capacity.
It is appreciated that in order that ceramic electronic components meet different characteristic requirements, electricity in electrode 101 and second in first
The quantity of pole 102 is not particularly limited, and can there was only electrode 101 in first in ceramic body 10, can also be only in ceramic body sheet 10
There is the second inner electrode 102；Electrode 101 and the second inner electrode 102 can not be drawn in any surface of ceramic body 10 in first.
The preparation method of the ceramic electronic components of the present embodiment, itself and the preparation method of the ceramic electronic components of embodiment 1
Difference part is：The step of electrode pattern in being formed on ceramic membrane need to be increased before step 3.The step is specially：Will
Metal paste is printed on the ceramic membrane that step 2 obtains electrode pattern in formation, obtains being printed with interior electrode pattern after drying
Ceramic membrane, interior electrode pattern form electrode and the second inner electrode in first after step 5 is sintered.
Metal in metal paste can be nickel, copper, monel, silver, palladium or silver palladium alloy, but not limited to this.Printing
Select silk-screen printing technique.
In the present embodiment, step 3 is different from embodiment 1, and difference is：It is printed with by predetermined quantity by multiple
The ceramic membrane stacking of interior electrode pattern, obtains ceramic substrate.Step 3 can also be printed with interior electricity by multiple by predetermined quantity
The ceramic membrane stacking of pole figure case, obtains lamination unit, is then laminated multiple ceramics respectively on two relative surfaces of lamination unit
Film is covered each by two protective layers of two relative sides of lamination unit to be formed, and forms protective layer, lamination unit and protection
The structure that layer stacks gradually, obtains ceramic substrate.Protective layer can improve the moisture protection and reliability of ceramic electronic components.Protect
Sheath is that 1~30 ceramic membranes are laminated to obtain.
In the present embodiment, row is carried out in step 7 to the layered product after chamfer grinding to glue and sinter, in first
The metal material of electrode and the second inner electrode selects suitable atmosphere.It is if for example, electric in electrode and second in first
The metal material of pole is nickel, copper or monel, then can use protective gas atmosphere.Also, in step 7, as needed,
After sintering can be by ceramic body grinding and polishing, so that the surface smoother of ceramic body and cleaning, and make electrode in first
It is connected respectively with the first termination electrode and the second termination electrode with the second inner electrode more fully firmly.Planetary mills or rolling can be used
Ceramic body grinding and polishing can be used alumina balls, quartz sand, alumina powder, carborundum powder, running water by the method for mill
Among it is one or more of as grinding media.
Technical scheme can be applied in ceramics such as chip ceramic capacitor, chip inductor, type piezoresistors
Electronic unit.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than the present invention is protected
The limitation of scope is protected, although being explained in detail with reference to preferred embodiment to the present invention, one of ordinary skill in the art should
Understand, technical scheme can be modified or equivalent substitution, without departing from the essence of technical solution of the present invention
And scope.
Claims (9)
- A kind of 1. ceramic electronic components, it is characterised in that：Including ceramic body, the ceramic body is cuboid, and it includes mutually right First side and second side, the 3rd mutually opposing side and the 4th side put and mutually opposing first end face and Biend；The first side and second side and the thickness direction of the ceramic body are perpendicular, the 3rd side and the 4th Side and the width of the ceramic body are perpendicular, the first end face and second end face and the length direction of the ceramic body It is perpendicular；Seamed edge on two length directions of the same side of the ceramic body is respectively provided with the first fillet, the ceramic body Seamed edge on two other length direction is right-angle side or is respectively provided with the second fillet；First fillet and second circle The fillet angle at angle differs.
- 2. ceramic electronic components as claimed in claim 1, it is characterised in that：On the two other length direction of the ceramic body Seamed edge when being right-angle side, the sine value of first fillet is not less than 0.5；The two other length direction of the ceramic body On seamed edge when being respectively provided with the second fillet, the difference of the sine value of the sine value of first fillet and second fillet it is absolute Value is not less than 0.5.
- 3. ceramic electronic components as claimed in claim 1, it is characterised in that：The half of first fillet and second fillet Footpath is identical.
- 4. ceramic electronic components as claimed in claim 1, it is characterised in that：The ceramic body is arranged viscous by layered product and sintered Arrive, the layered product includes ceramic substrate, the starch film located at ceramic base plate surface and the protecting cover located at starch film surface.
- 5. ceramic electronic components as claimed in claim 1, it is characterised in that：The ceramic electronic components also include two end electricity Pole, the termination electrode are respectively arranged in the first end face and second end face.
- 6. ceramic electronic components as claimed in claim 1, it is characterised in that：The ceramic electronic components also include interior electrode, The interior electrode is parallel to each other in the ceramic body and with the first side and second side, the interior electrode and the 3rd Gap is respectively formed between side and the 4th side；Dielectric layer is provided between the interior electrode.
- 7. ceramic electronic components as claimed in claim 6, it is characterised in that：The interior electrode is by electrode in multiple first and more Individual the second inner electrode is formed, and electrode and the second inner electrode are arranged alternately in the ceramic body in described first, in described first Electrode has in the first end face draws side and forms gap with the second end face, and the second inner electrode is described the Biend, which has, draws side and forms gap with the first end face.
- A kind of 8. preparation method of the ceramic electronic components as described in any one of claim 1~7, it is characterised in that：Including following Step：(1) it is laminated starch film on ceramic substrate and protecting cover obtains multilayer board；(2) multilayer board is fixed after pressing on stainless steel and cut, obtain layered product；(3) by layered product chamfer grinding；(4) row is carried out to the layered product after chamfer grinding to glue and sinter, and obtains ceramic body；(5) termination electrode is enclosed in the first end face and second end face of ceramic body respectively, obtains ceramic electronic components.
- 9. the preparation method of ceramic electronic components as claimed in claim 8, it is characterised in that：In the step (1), in ceramics The surface of substrate is laminated a starch film, then in superficial layer stack guard lid of the starch film away from ceramic substrate, obtains multilayer board；Or Person, a starch film is folded in relative two surface layers of ceramic substrate, then respectively in two tables of the starch film away from ceramic substrate Face is respectively laminated a mutually different protecting cover of thickness, obtains multilayer board.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109273258A (en) * | 2018-09-13 | 2019-01-25 | 广东风华高新科技股份有限公司 | A kind of preparation method of multilayer ceramic capacitor |
| CN110253343A (en) * | 2019-05-16 | 2019-09-20 | 厦门华信安电子科技有限公司 | A kind of multilayer ceramic capacitor dry type beforehand research grinding process and preparation method thereof |
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| CN1413803A (en) * | 2001-10-22 | 2003-04-30 | 精工爱普生株式会社 | Chamfer processing method and device for rectangular plate |
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| CN110253343A (en) * | 2019-05-16 | 2019-09-20 | 厦门华信安电子科技有限公司 | A kind of multilayer ceramic capacitor dry type beforehand research grinding process and preparation method thereof |
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