CN114300270A - Preparation method of multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics - Google Patents

Preparation method of multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics Download PDF

Info

Publication number
CN114300270A
CN114300270A CN202210089479.5A CN202210089479A CN114300270A CN 114300270 A CN114300270 A CN 114300270A CN 202210089479 A CN202210089479 A CN 202210089479A CN 114300270 A CN114300270 A CN 114300270A
Authority
CN
China
Prior art keywords
microstructure
waterproof
parallel grooves
mlcc
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210089479.5A
Other languages
Chinese (zh)
Inventor
柯燎亮
丁建淳
隋天一
王皓吉
林彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin University
Original Assignee
Tianjin University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin University filed Critical Tianjin University
Priority to CN202210089479.5A priority Critical patent/CN114300270A/en
Publication of CN114300270A publication Critical patent/CN114300270A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

A preparation method of a multilayer ceramic capacitor structure with waterproof and anti-breakdown characteristics relates to a preparation method of a multilayer ceramic capacitor structure. The invention aims to solve the problems that the existing multilayer ceramic capacitor has poor waterproof performance, the surface waterproof film is easy to peel off and fall off, the bonding force is improved by a surface punching or scribing method, the structural integrity of the MLCC is damaged, and the reliability is reduced. The preparation method comprises the following steps: firstly, preparing a surface microstructure of an MLCC ceramic substrate; secondly, preparing a waterproof coating; and thirdly, preparing a hydrophobic microstructure on the surface of the waterproof coating. The method is used for preparing the multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics.

Description

Preparation method of multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics
Technical Field
The invention relates to a preparation method of a multilayer ceramic capacitor structure.
Background
The multilayer Ceramic capacitor (MLCC) is a multilayer laminated structure, and is a parallel body formed by combining a plurality of simple parallel plate Capacitors, Ceramic dielectric films printed with electrodes (inner electrodes) are laminated in a staggered mode, a Ceramic chip is formed by one-time high-temperature sintering, and metal layers (outer electrodes) are sealed at two ends of the chip, so that a structural body similar to a monolithic body is formed, and the monolithic capacitor is also called as the monolithic capacitor. The structure of the device comprises three components: ceramic dielectric (porcelain body), metal internal electrode and metal terminal electrode.
The MLCC chip is divided into Precious Metal Electrode (such as silver, palladium silver, gold and the like) MLCC (i.e. a Precious Metal Electrode (PME MLCC) for short) and Base Metal Electrode (such as copper, nickel and the like) MLCC (i.e. a Base Metal Electrode (BME MLCC for short) according to the used Metal Electrode materials. The terminal electrode plays a role in connecting the multilayer internal electrode of the porcelain body with an external conductor, the material and the structure of the terminal electrode are different according to different welding or assembling modes, and the structure of the three-layer terminal electrode mainly comprises Ag-Ni-SnPb (corresponding to a PME end) and Cu-Ni-SnPb (corresponding to a BME end).
The manufacturing process flow is as follows: the electronic ceramic powder is added into an organic adhesive system to be cast into a ceramic membrane, metal internal electrode slurry is printed through a screen printing process, then the ceramic membrane is laminated in a staggered mode and cut into green bodies, the green bodies are then subjected to discharge adhesion and high-temperature sintering to form ceramic, end silver electrodes are packaged at two end heads to form a capacitor with a multilayer structure, namely, the two adjacent internal electrodes form a flat capacitor, and a plurality of capacitors are connected in parallel through the end electrodes.
When the humidity in the air is too high, the water film is condensed on the surface of the MLCC shell, so that the surface insulation resistance of the capacitor can be reduced. In addition, moisture can also penetrate into the capacitor dielectric, which reduces the insulating ability of the capacitor dielectric. Therefore, the influence of high-temperature and high-humidity environment on deterioration of capacitor parameters is extremely significant. The electrical performance of the capacitor can be improved after drying and dehumidification, but the result of water molecule electrolysis cannot be eradicated. For example, when the capacitor works in a high-temperature working environment, water molecules are electrolyzed into hydrogen ions (H +) and hydroxyl ions (OH-) under the action of an electric field, and electrochemical corrosion is generated at the root of the lead. Even if the lead is dried and dehumidified, the lead cannot be restored. Therefore, the surface spraying of the waterproof and heat-proof film has important significance for improving the performance of the MLCC and preventing the parameter deterioration of the capacitor. However, if the waterproof film is directly sprayed on the surface of the existing multilayer capacitor, the film is easy to peel off due to insufficient bonding force between the film and the ceramic surface of the capacitor, and a reliable waterproof function cannot be realized. The conventional method for punching or scribing the surface of the MLCC can improve the bonding force between the coating film and the ceramic surface of the capacitor to a certain extent, but can damage the structural integrity of the MLCC and reduce the reliability. Therefore, a method for improving the water resistance of the conventional thin film to some extent while ensuring the adhesion between the surface-sprayed thin film and the ceramic substrate is urgently required.
Disclosure of Invention
The invention aims to solve the problems that the existing multilayer ceramic capacitor is poor in waterproof performance, a surface waterproof film is easy to peel off and fall off, the bonding force is improved by a surface punching or scribing method, the structural integrity of the MLCC is damaged, and the reliability is reduced, and further provides a preparation method of a multilayer ceramic capacitor structure with waterproof and anti-breakdown characteristics.
A preparation method of a multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics is carried out according to the following steps:
firstly, preparing a surface microstructure of an MLCC ceramic substrate:
arranging microstructure parallel grooves on the surface of a ceramic substrate of the multilayer ceramic capacitor by utilizing laser processing or roller processing to obtain an MLCC ceramic substrate with the surface provided with the microstructure parallel grooves;
secondly, preparing a waterproof coating:
spraying silicon-based hydrophobic coating on the surface of the MLCC ceramic substrate with the microstructure parallel grooves on the surface to obtain a waterproof coating;
thirdly, preparing a hydrophobic microstructure on the surface of the waterproof coating:
and finally, end sealing is carried out to prepare a terminal electrode, and the preparation method of the multilayer ceramic capacitor structure with the waterproof and anti-breakdown characteristics is completed.
The invention has the beneficial effects that:
1. the invention provides the ceramic surface microstructure of the MLCC, and the physical connection performance of the spraying film and the ceramic substrate is enhanced, so that the better performance can be achieved under the same spraying material and environmental condition, the manufacturing cost is reduced, the surface coating quality is improved, and the service life of the product is prolonged. Because a physical method is adopted, no chemical pollution is caused, so that the technology meets the requirement of environmental protection.
2. The invention provides three key technologies for processing the surface of the laminated ceramic, different methods can be adopted for different raw ceramic materials, the problems of crack risk and reliability brought by the later-stage surface processing of the traditional MLCC are effectively solved, the structural integrity of the MLCC cannot be damaged, the method can be expanded and applied to the technologies such as LTCC, HTCC and the like, and the method has strong universality.
3. According to the invention, the surface microstructure of the coating is changed, so that the hydrophobic property of the coating is better, and the waterproof and moistureproof properties of the MLCC are effectively improved.
4. The invention provides three methods of combining the surface microstructure of the ceramic matrix, spraying the waterproof layer and the surface microstructure of the waterproof layer, and can greatly improve the waterproof and moistureproof performance of the multilayer ceramic capacitor on the existing basis, thereby improving the waterproof performance and the electric strength of the surface of a product and preventing the product from arcing caused by the breakdown of the surface of the ceramic body.
Drawings
Drawings
FIG. 1 is a schematic diagram of a multilayer ceramic capacitor structure with waterproof and breakdown-resistant properties according to an embodiment, where 1 is a microstructure parallel groove on the surface of an MLCC ceramic substrate, 2 is a waterproof coating, and 3 is a hydrophobic microstructure on the surface of the waterproof coating;
fig. 2 is a schematic structural view of a waterproof coating and an MLCC ceramic substrate after a triangular microstructure parallel groove is formed on the surface of the MLCC ceramic substrate according to the second embodiment, where 1 is the waterproof coating and 2 is the MLCC ceramic substrate;
FIG. 3 is a schematic structural diagram of a waterproof coating and an MLCC ceramic substrate after parallel grooves with rectangular microstructures are formed on the surface of the MLCC ceramic substrate according to the second embodiment, wherein 1 is the waterproof coating, and 2 is the MLCC ceramic substrate;
fig. 4 is a schematic structural view of a waterproof coating and an MLCC ceramic substrate after a wedge-shaped microstructure parallel groove is formed on the surface of the MLCC ceramic substrate according to the second embodiment, where 1 is the waterproof coating and 2 is the MLCC ceramic substrate;
FIG. 5 is a schematic diagram of a micro-groove mesh array in step three according to one embodiment;
FIG. 6 is a flow chart illustrating the fabrication of a multilayer ceramic capacitor structure having waterproof and breakdown-resistant properties according to a fourth embodiment;
FIG. 7 is a flow chart illustrating the fabrication of a multilayer ceramic capacitor structure having waterproof and breakdown-resistant properties according to one embodiment;
FIG. 8 is a flow chart illustrating the fabrication of a multilayer ceramic capacitor structure having waterproof and breakdown-resistant properties according to a sixth embodiment;
FIG. 9 is a schematic structural diagram of a 1812-630V-104 MLCC in the first embodiment, where 1 is an MLCC ceramic substrate with parallel grooves on the surface, 2 is a waterproof coating with hydrophobic microstructures on the surface, and 3 is a metal terminal electrode;
FIG. 10 is a schematic view of an MLCC ceramic substrate with microstructure parallel grooves formed on the surface thereof in step one according to the first embodiment;
FIG. 11 is a schematic perspective view of an MLCC ceramic substrate with microstructure parallel grooves formed on the surface thereof in the first step according to the first embodiment;
fig. 12 is a schematic diagram of a lamination in the first embodiment, where 1 is a surface layer portion, 2 is a capacitor portion, 3 is a surface microstructure, 4 is a side microstructure, 5 is a microstructure parallel groove, a is a lamination process, and b is a lamination back.
Detailed Description
The first embodiment is as follows: specifically, referring to fig. 1 and 5, the method for manufacturing a multilayer ceramic capacitor structure having waterproof and anti-breakdown characteristics according to the present embodiment is performed by the following steps:
firstly, preparing a surface microstructure of an MLCC ceramic substrate:
arranging microstructure parallel grooves on the surface of a ceramic substrate of the multilayer ceramic capacitor by utilizing laser processing or roller processing to obtain an MLCC ceramic substrate with the surface provided with the microstructure parallel grooves;
secondly, preparing a waterproof coating:
spraying silicon-based hydrophobic coating on the surface of the MLCC ceramic substrate with the microstructure parallel grooves on the surface to obtain a waterproof coating;
thirdly, preparing a hydrophobic microstructure on the surface of the waterproof coating:
and finally, end sealing is carried out to prepare a terminal electrode, and the preparation method of the multilayer ceramic capacitor structure with the waterproof and anti-breakdown characteristics is completed.
The conventional structural form of the MLCC is changed, and the microstructure is processed on the surface of the substrate and the surface of the coating, as shown in figure 1, the structure 1 is used for increasing the contact area of the coating and the substrate, improving the interface adsorption force and the mechanical interlocking effect between a paint film and the substrate, and further enhancing the adhesive force between the waterproof coating and the MLCC ceramic substrate. The structure 3 serves to further improve the surface waterproofing ability of the MLCC. The surface of the coating imitates a waterproof fabric structure, and the fibrous arrangement is carried out, so that the performance of the waterproof coating is effectively improved.
The beneficial effects of the embodiment are as follows:
1. the specific embodiment provides the ceramic surface microstructure of the MLCC, and the physical connection performance of the spraying film and the ceramic substrate is enhanced, so that the better performance can be achieved under the same spraying material and environmental condition, the manufacturing cost is reduced, the surface coating quality is improved, and the service life of the product is prolonged. Because a physical method is adopted, no chemical pollution is caused, so that the technology meets the requirement of environmental protection.
2. The specific embodiment provides three key technologies for processing the surface of the laminated ceramic, different methods can be adopted for different raw ceramic materials, the problems of crack risk and reliability caused by the later-stage surface processing of the traditional MLCC are effectively solved, the structural integrity of the MLCC cannot be damaged, the laminated ceramic can be expanded and applied to the technologies such as LTCC and HTCC, and the laminated ceramic has strong universality.
3. The specific embodiment changes the surface microstructure of the coating, so that the hydrophobic property of the coating is better, and the waterproof and moistureproof performance of the MLCC is effectively improved.
4. The specific embodiment provides a method for combining the ceramic substrate surface microstructure, the waterproof layer spraying method and the waterproof layer surface microstructure, and can greatly improve the waterproof and moistureproof performance of the multilayer ceramic capacitor on the existing basis, so that the waterproof performance and the electric strength of the product surface are improved, and the product is prevented from arcing due to ceramic surface breakdown.
The second embodiment is as follows: as described in detail with reference to fig. 2 to 4, the first embodiment is different from the second embodiment in that: the microstructure parallel groove in the first step is a triangular microstructure parallel groove, a rectangular microstructure parallel groove or a wedge-shaped microstructure parallel groove. The rest is the same as the first embodiment.
The third concrete implementation mode: this embodiment is different from the first or second embodiment in that: the groove width of the microstructure parallel groove in the first step is 10-500 μm, the depth is 20-500 μm, and the adjacent groove distance is 10-500 μm. The other is the same as in the first or second embodiment.
The fourth concrete implementation mode: specifically, referring to fig. 6, the difference between this embodiment and one of the first to third embodiments is: the method comprises the following steps of firstly, preparing an MLCC ceramic substrate with microstructure parallel grooves on the surface, specifically:
firstly, carrying out tape casting and slide glass on ceramic powder to obtain a raw ceramic tape;
secondly, preparing a capacitor part: punching, filling and printing the raw porcelain strips, then carrying out laser processing on side edge microstructures on two side edges which are not in contact with the terminal electrode to obtain printed raw porcelain strips, and using two or more printed raw porcelain strip laminations as a capacitor part;
preparing a surface layer part: one or more processed green ceramic band laminates are used as a surface layer part; the processed raw porcelain band is characterized in that according to the actual requirement of the depth of the parallel grooves of the microstructures, a plurality of surface layer microstructures corresponding to the laser processing positions on the surface of all or part of the raw porcelain band serving as a surface layer part are formed, so that the surface layer microstructures corresponding to the surface positions of all the raw porcelain bands after lamination form microstructure parallel grooves, and side microstructures are laser processed on the side edges of two sides which are not in contact with the terminal electrode;
and fourthly, laminating according to the mode of the surface layer part, the capacitor part and the surface layer part, forming microstructure parallel grooves by the side microstructures of the surface layer part and the capacitor part after lamination, and finally performing static pressure and sintering to obtain the MLCC ceramic substrate with the microstructure parallel grooves on the surface. The others are the same as the first to third embodiments.
The fifth concrete implementation mode: specifically, referring to fig. 7, the difference between this embodiment and one of the first to fourth embodiments is: the method comprises the following steps of firstly, preparing an MLCC ceramic substrate with parallel grooves of a microstructure on the surface, specifically:
firstly, carrying out tape casting and slide glass on ceramic powder to obtain a raw ceramic tape;
punching, filling and printing the green porcelain strips obtained in the step I to obtain printed green porcelain strips, and taking two or more printed green porcelain strip laminations as a capacitor part; one or more than one step of laminating the raw porcelain strips as a surface layer part; laminating, static pressing and sintering are carried out according to the mode of surface layer part-capacitance part-surface layer part to obtain a ceramic substrate of the multilayer ceramic capacitor;
and thirdly, laser processing microstructure parallel grooves on four surfaces of the ceramic substrate of the multilayer ceramic capacitor, which are not in contact with the terminal electrode, to obtain the MLCC ceramic substrate with the microstructure parallel grooves on the surface. The rest is the same as the first to fourth embodiments.
The sixth specific implementation mode: specifically, referring to fig. 8, the difference between this embodiment and one of the first to fifth embodiments is: the method comprises the following steps of firstly, preparing an MLCC ceramic substrate with parallel grooves of a microstructure on the surface, specifically:
firstly, carrying out tape casting and slide glass on ceramic powder to obtain a raw ceramic tape;
punching, filling and printing the green porcelain strips obtained in the step I to obtain printed green porcelain strips, and taking two or more printed green porcelain strip laminations as a capacitor part; one or more than one step of laminating the raw porcelain strips as a surface layer part; laminating and static-pressing in a surface layer part-capacitance part-surface layer part manner to obtain an unsintered ceramic substrate of the multilayer ceramic capacitor;
and thirdly, pressing microstructure parallel grooves on four surfaces of the unsintered multilayer ceramic capacitor ceramic substrate, which are not in contact with the terminal electrode, by using a roller, and finally sintering to obtain the MLCC ceramic substrate with the microstructure parallel grooves on the surface. The rest is the same as the first to fifth embodiments.
The seventh embodiment: the difference between this embodiment and one of the first to sixth embodiments is: the laser processing is specifically to utilize CO2The rated power of the laser engraving machine is 10W-200W and the processing precision<Laser processing under the condition of 0.02 mm. The others are the same as the first to sixth embodiments.
The specific implementation mode is eight: the present embodiment differs from one of the first to seventh embodiments in that: the diameter of the roller is 0.1 mm-1 mm, and a plurality of rows of parallel micro-bulges are arranged on the roller. The rest is the same as the first to seventh embodiments.
The specific implementation method nine: the present embodiment differs from the first to eighth embodiments in that: and the silicon-based hydrophobic coating in the second step is a Teflon waterproof coating or a Neverwet waterproof coating. The other points are the same as those in the first to eighth embodiments.
The detailed implementation mode is ten: the present embodiment differs from one of the first to ninth embodiments in that: the diameter of the micropore in the micropore lattice in the step three is 1-200 mu m, the depth is 2-100 mu m, and the distance between adjacent micropores is 10-500 mu m; the width of the micro groove in the micro groove net array in the third step is 1-200 μm, the depth of the groove is 2-100 μm, and the groove distance between the parallel and adjacent micro grooves is 1-500 μm. The other points are the same as those in the first to ninth embodiments.
The following examples were used to demonstrate the beneficial effects of the present invention:
the first embodiment is described in detail with reference to fig. 9 to 12:
the method of example one was used to prepare the 1812-630V-104 type MLCC, as shown in FIG. 9. The 1812-630V-104 type MLCC size is: the length is 4.5 +/-0.3 mm, the width is 3.2 +/-0.2 mm, the end point is 0.61 +/-0.36 mm, and the capacitance range is 1 uF-100 uF.
A preparation method of a multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics is carried out according to the following steps:
firstly, preparing a surface microstructure of an MLCC ceramic substrate:
firstly, carrying out tape casting and slide glass on ceramic powder to obtain a raw ceramic tape;
secondly, preparing a capacitor part: punching, filling and printing the raw porcelain strips, then carrying out laser processing on side edge microstructures on two side edges which are not in contact with the terminal electrode to obtain printed raw porcelain strips, and taking 11 printed raw porcelain strip laminations as capacitance parts;
preparing a surface layer part: taking 5 processed green porcelain belt laminations as a surface layer part; the processed raw porcelain band is characterized in that according to the actual requirement of the depth of the parallel grooves of the microstructure, a plurality of surface layer microstructures corresponding to the laser processing positions on the surface of all raw porcelain bands serving as surface layer parts are formed, so that the surface layer microstructures corresponding to the surface positions of all the raw porcelain bands after lamination form parallel grooves of the microstructure, and side microstructures are laser processed on the side edges of two sides which are not in contact with the terminal electrode;
laminating according to the mode of the surface layer part, the capacitor part and the surface layer part, forming a microstructure parallel groove by the side microstructures of the surface layer part and the capacitor part after laminating, and finally performing static pressure and sintering to obtain the MLCC ceramic substrate with the microstructure parallel groove on the surface;
the microstructure parallel grooves are rectangular microstructure parallel grooves, the groove width is 10 micrometers, the depth is 20 micrometers, and the adjacent groove distance is 20 micrometers;
secondly, preparing a waterproof coating:
spraying Teflon waterproof paint on the surface of the MLCC ceramic substrate with the microstructure parallel grooves on the surface to obtain a waterproof coating;
thirdly, preparing a hydrophobic microstructure on the surface of the waterproof coating:
processing the micro-groove net array on the waterproof coating by laser to obtain the waterproof coating with the hydrophobic microstructure on the surface, and finally sealing the end to prepare an end electrode, thereby completing the preparation method of the multilayer ceramic capacitor structure with waterproof and anti-breakdown characteristics;
the width of the micro groove in the micro groove net array is 10 mu m, the depth of the groove is 5 mu m, and the groove distance between the parallel and adjacent micro grooves is 20 mu m.
And in the first step and the third step, an SJ-1610 laser engraving machine is selected, the rated power is 60W, the precision is 0.0125mm, and the working breadth is 1600mm multiplied by 1000mm for laser processing.
Example two: the difference between the present embodiment and the first embodiment is: the method comprises the following steps of firstly, preparing an MLCC ceramic matrix with microstructure parallel grooves on the surface, and specifically:
firstly, carrying out tape casting and slide glass on ceramic powder to obtain a raw ceramic tape;
punching, filling and printing the green porcelain strips obtained in the step I to obtain printed green porcelain strips, and taking 11 printed green porcelain strip laminations as a capacitor part; taking 5 steps of stacking raw porcelain strips as a surface layer part; laminating, static pressing and sintering are carried out according to the mode of surface layer part-capacitance part-surface layer part to obtain a ceramic substrate of the multilayer ceramic capacitor;
and thirdly, laser processing microstructure parallel grooves on four surfaces of the ceramic substrate of the multilayer ceramic capacitor, which are not in contact with the terminal electrode, to obtain the MLCC ceramic substrate with the microstructure parallel grooves on the surface. The rest is the same as the first embodiment.
Comparison experiment one: the difference between the present embodiment and the first embodiment is: the preparation of the microstructure in the first step, the preparation of the waterproof coating in the second step and the preparation of the hydrophobic microstructure in the third step are omitted.
Comparative experiment two: the difference between the present embodiment and the first embodiment is: directly mechanically drilling and punching the upper surface and the lower surface of the 1812-630V-104 MLCC, wherein the aperture is 300 microns, the matrix is arranged by 6 multiplied by 6, the depth is 100 microns, and Teflon waterproof paint is sprayed on the four surfaces which are not contacted with the terminal electrode; the preparation of the hydrophobic microstructure in step three is omitted.
According to the QJ 2220.3-1992 test method for electrical insulation performance of the coating, the MLCC which is the same type as 1812-630V-104 is subjected to a voltage withstand test, and is divided into nine groups to form a control experiment, and the experimental data shows that the method provided by the embodiment has smaller influence on the parameter performance of the MLCC than that of the ordinary coating. Along with the increase of humidity, the compressive strength of a comparison experiment I is reduced sharply, which shows that the performance of the MLCC is greatly influenced in a humid environment, and the comparison experiment has a certain effect of improving the waterproof and moistureproof capacity of the MLCC, but is still not ideal enough and has great influence on the performance parameters of the MLCC. By adopting the technology provided by the first embodiment, the waterproof performance and the electric strength of the surface of the product can be effectively improved under the condition that the performance of the product is influenced to the minimum extent, and the product is prevented from arcing due to the surface breakdown of a porcelain body.
Figure BDA0003488718980000081

Claims (10)

1. A preparation method of a multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics is characterized by comprising the following steps:
firstly, preparing a surface microstructure of an MLCC ceramic substrate:
arranging microstructure parallel grooves on the surface of a ceramic substrate of the multilayer ceramic capacitor by utilizing laser processing or roller processing to obtain an MLCC ceramic substrate with the surface provided with the microstructure parallel grooves;
secondly, preparing a waterproof coating:
spraying silicon-based hydrophobic coating on the surface of the MLCC ceramic substrate with the microstructure parallel grooves on the surface to obtain a waterproof coating;
thirdly, preparing a hydrophobic microstructure on the surface of the waterproof coating:
and finally, end sealing is carried out to prepare a terminal electrode, and the preparation method of the multilayer ceramic capacitor structure with the waterproof and anti-breakdown characteristics is completed.
2. The method according to claim 1, wherein the parallel grooves of the microstructure in the first step are triangular, rectangular or wedge-shaped parallel grooves of the microstructure.
3. The method according to claim 2, wherein the width of the parallel grooves of the microstructure in the first step is 10 μm to 500 μm, the depth is 20 μm to 500 μm, and the distance between adjacent grooves is 10 μm to 500 μm.
4. The method for preparing a multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics according to claim 3, wherein the MLCC ceramic substrate with the microstructure parallel grooves on the surface in the step one is prepared by the following steps:
firstly, carrying out tape casting and slide glass on ceramic powder to obtain a raw ceramic tape;
secondly, preparing a capacitor part: punching, filling and printing the raw porcelain strips, then carrying out laser processing on side edge microstructures on two side edges which are not in contact with the terminal electrode to obtain printed raw porcelain strips, and using two or more printed raw porcelain strip laminations as a capacitor part;
preparing a surface layer part: one or more processed green ceramic band laminates are used as a surface layer part; the processed raw porcelain band is characterized in that according to the actual requirement of the depth of the parallel grooves of the microstructures, a plurality of surface layer microstructures corresponding to the laser processing positions on the surface of all or part of the raw porcelain band serving as a surface layer part are formed, so that the surface layer microstructures corresponding to the surface positions of all the raw porcelain bands after lamination form microstructure parallel grooves, and side microstructures are laser processed on the side edges of two sides which are not in contact with the terminal electrode;
and fourthly, laminating according to the mode of the surface layer part, the capacitor part and the surface layer part, forming microstructure parallel grooves by the side microstructures of the surface layer part and the capacitor part after lamination, and finally performing static pressure and sintering to obtain the MLCC ceramic substrate with the microstructure parallel grooves on the surface.
5. The method for preparing a multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics according to claim 3, wherein in the first step, the MLCC ceramic substrate with the microstructure parallel grooves on the surface is prepared by the following steps:
firstly, carrying out tape casting and slide glass on ceramic powder to obtain a raw ceramic tape;
punching, filling and printing the green porcelain strips obtained in the step I to obtain printed green porcelain strips, and taking two or more printed green porcelain strip laminations as a capacitor part; one or more than one step of laminating the raw porcelain strips as a surface layer part; laminating, static pressing and sintering are carried out according to the mode of surface layer part-capacitance part-surface layer part to obtain a ceramic substrate of the multilayer ceramic capacitor;
and thirdly, laser processing microstructure parallel grooves on four surfaces of the ceramic substrate of the multilayer ceramic capacitor, which are not in contact with the terminal electrode, to obtain the MLCC ceramic substrate with the microstructure parallel grooves on the surface.
6. The method for preparing a multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics according to claim 3, wherein in the first step, the MLCC ceramic substrate with the microstructure parallel grooves on the surface is prepared by the following steps:
firstly, carrying out tape casting and slide glass on ceramic powder to obtain a raw ceramic tape;
punching, filling and printing the green porcelain strips obtained in the step I to obtain printed green porcelain strips, and taking two or more printed green porcelain strip laminations as a capacitor part; one or more than one step of laminating the raw porcelain strips as a surface layer part; laminating and static-pressing in a surface layer part-capacitance part-surface layer part manner to obtain an unsintered ceramic substrate of the multilayer ceramic capacitor;
and thirdly, pressing microstructure parallel grooves on four surfaces of the unsintered multilayer ceramic capacitor ceramic substrate, which are not in contact with the terminal electrode, by using a roller, and finally sintering to obtain the MLCC ceramic substrate with the microstructure parallel grooves on the surface.
7. A composition according to claim 1, 4 or 5, having water-repellent and puncture-resistant propertiesThe preparation method of the laminated ceramic capacitor structure is characterized in that the laser processing specifically utilizes CO2The rated power of the laser engraving machine is 10W-200W and the processing precision<Laser processing under the condition of 0.02 mm.
8. The method according to claim 6, wherein the diameter of the roller is 0.1 mm-1 mm, and the roller is provided with a plurality of parallel micro-protrusions.
9. The method of claim 1, wherein the silicon-based hydrophobic coating in step two is teflon waterproof coating or Neverwet waterproof coating.
10. The method of claim 1, wherein the diameter of the micro-pores in the micro-pore lattice in step three is 1 μm to 200 μm, the depth is 2 μm to 100 μm, and the distance between adjacent micro-pores is 10 μm to 500 μm; the width of the micro groove in the micro groove net array in the third step is 1-200 μm, the depth of the groove is 2-100 μm, and the groove distance between the parallel and adjacent micro grooves is 1-500 μm.
CN202210089479.5A 2022-01-25 2022-01-25 Preparation method of multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics Pending CN114300270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210089479.5A CN114300270A (en) 2022-01-25 2022-01-25 Preparation method of multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210089479.5A CN114300270A (en) 2022-01-25 2022-01-25 Preparation method of multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics

Publications (1)

Publication Number Publication Date
CN114300270A true CN114300270A (en) 2022-04-08

Family

ID=80978182

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210089479.5A Pending CN114300270A (en) 2022-01-25 2022-01-25 Preparation method of multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics

Country Status (1)

Country Link
CN (1) CN114300270A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114085099A (en) * 2021-11-29 2022-02-25 佛山欧神诺陶瓷有限公司 Surface hydrophobic ceramic and processing method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102247A (en) * 1999-09-30 2001-04-13 Kyocera Corp Chip electronic component
JP2007227485A (en) * 2006-02-22 2007-09-06 Nichicon Corp Solid electrolytic capacitor and its manufacturing method
CN101054194A (en) * 2006-04-12 2007-10-17 北京化工大学 Ultra-hydrophobic lamellar dihydroxyl composite metal oxide thin film and preparing method thereof
CN101901688A (en) * 2009-06-01 2010-12-01 株式会社村田制作所 Laminated electronic component and manufacture method thereof
CN102442028A (en) * 2010-10-13 2012-05-09 鸿富锦精密工业(深圳)有限公司 Manufacturing method for compound of metal and resin
CN104134408A (en) * 2014-07-01 2014-11-05 友达光电股份有限公司 Display device
CN106813811A (en) * 2017-01-20 2017-06-09 南京大学 A kind of high sensitivity capacitor type pliable pressure sensor
CN110052714A (en) * 2019-03-29 2019-07-26 江苏大学 A kind of Laser Surface Treatment technique improving interface binding power
CN111128545A (en) * 2018-10-29 2020-05-08 三星电机株式会社 Method for manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102247A (en) * 1999-09-30 2001-04-13 Kyocera Corp Chip electronic component
JP2007227485A (en) * 2006-02-22 2007-09-06 Nichicon Corp Solid electrolytic capacitor and its manufacturing method
CN101054194A (en) * 2006-04-12 2007-10-17 北京化工大学 Ultra-hydrophobic lamellar dihydroxyl composite metal oxide thin film and preparing method thereof
CN101901688A (en) * 2009-06-01 2010-12-01 株式会社村田制作所 Laminated electronic component and manufacture method thereof
CN102442028A (en) * 2010-10-13 2012-05-09 鸿富锦精密工业(深圳)有限公司 Manufacturing method for compound of metal and resin
CN104134408A (en) * 2014-07-01 2014-11-05 友达光电股份有限公司 Display device
CN106813811A (en) * 2017-01-20 2017-06-09 南京大学 A kind of high sensitivity capacitor type pliable pressure sensor
CN111128545A (en) * 2018-10-29 2020-05-08 三星电机株式会社 Method for manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor
CN110052714A (en) * 2019-03-29 2019-07-26 江苏大学 A kind of Laser Surface Treatment technique improving interface binding power

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
中国机械工程学会特种加工分会: "精密超精密加工技术新进展", 中国科学技术出版社, pages: 279 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114085099A (en) * 2021-11-29 2022-02-25 佛山欧神诺陶瓷有限公司 Surface hydrophobic ceramic and processing method thereof

Similar Documents

Publication Publication Date Title
KR101681358B1 (en) A multilayer ceramic capacitor and a method for manufactuaring the same
KR101514512B1 (en) A multilayer ceramic capacitor and a method for manufactuaring the same
KR101565640B1 (en) A multilayer ceramic capacitor and a method for manufactuaring the same
CN107610933B (en) Multilayer ceramic capacitor and the plate for being equipped with the multilayer ceramic capacitor
KR101751079B1 (en) Multi-layered ceramic electronic parts and fabrication method thereof
CN1905098B (en) Multilayer ceramic capacitor and method for manufacturing the same
WO2016121745A1 (en) Capacitor and module
TWI270092B (en) Stack capacitor and the manufacturing method thereof
KR102193956B1 (en) Multi-layered ceramic capacitor and board for mounting the same
CN110875136B (en) Multilayer ceramic capacitor and method of manufacturing the same
KR20120000529A (en) Ceramic electronic component and method thereof
KR101620296B1 (en) Stack type piezoelectric ceramic element
KR20140003001A (en) Multi-layered ceramic electronic parts
KR101463840B1 (en) Method of manufacturing multilayer ceramic electronic part
CN115763071A (en) Multilayer ceramic capacitor and method of manufacturing the same
CN114300270A (en) Preparation method of multilayer ceramic capacitor structure with waterproof and breakdown-resistant characteristics
KR20190121146A (en) Multi-layered ceramic capacitor and method of manufacturing the same
US20160379761A1 (en) Method for fabricating solid electrolytic capacitors
KR20190121135A (en) Multi-layered ceramic capacitor and method of manufacturing the same
WO2005036571A1 (en) Electrode paste, ceramic electronic component and method for producing same
JP4654690B2 (en) Multilayer varistor
JP2000150292A (en) Layered ceramic capacitor
KR101565725B1 (en) A multilayer ceramic capacitor and a method for manufactuaring the same
KR102609156B1 (en) Multi-layered ceramic capacitor and method of manufacturing the same
KR20170121105A (en) Multi-layered ceramic electronic parts

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination