CN207456724U - Vacuum suction quick mounting type vibration device applied to chip class device - Google Patents
Vacuum suction quick mounting type vibration device applied to chip class device Download PDFInfo
- Publication number
- CN207456724U CN207456724U CN201721701978.6U CN201721701978U CN207456724U CN 207456724 U CN207456724 U CN 207456724U CN 201721701978 U CN201721701978 U CN 201721701978U CN 207456724 U CN207456724 U CN 207456724U
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- CN
- China
- Prior art keywords
- vacuum suction
- mounting type
- type vibration
- quick mounting
- head cover
- Prior art date
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- Expired - Fee Related
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Abstract
The utility model is related to a kind of vacuum suction quick mounting type vibration devices applied to chip class device, are related to time and frequency measurement technical field.The utility model proposes a kind of vacuum suction quick mounting type vibration devices applied to chip class device, are formed by head cover and box body vacuum brazing, form the airtight cavity of an inner hollow.Cavity has reserved a gas nozzle, vacuumize process can be realized to this airtight cavity by vacuum pump, so as to fulfill chip product and the quick adsorption of miniature device.
Description
Technical field
The utility model is related to vibration tool technical fields, and in particular to a kind of vacuum suction applied to chip class device
Quick mounting type vibration device.
Background technology
61843 products are a chip products of China's research and development, need to carry out environmental stress sieve to every product before delivery
Choosing experiment, and delivery quantity is larger.The characteristics of 61843 product is small, light weight and housing is very thin, and top shell thinnest part is thick
Degree is only 0.15mm, and pin seals for bead, is easy to trigger due to artificial by the method that screw fastens with traditional press strip
Outer housing caused by factor deforms, and is ruptured so as to cause bead, and device is scrapped.Outer housing is deformed it is also possible to being passed by stress
Passing causes chip internal structure to be damaged, and making product, there are potential risks during follow-up use.And this method efficiency ten
Divide low, it is necessary to occupy testing equipment for a long time, product testing cost is very high.With model batch production, the demand of this product
Rise to 6000 sets/year.So being badly in need of designing a kind of new test tool, realization is quick, easily installs, and ensures product safety
On the premise of realize bulge test.
Utility model content
(1) technical problems to be solved
The technical problems to be solved in the utility model is：How to realize chip class device it is quick, easily install.
(2) technical solution
In order to solve the above-mentioned technical problem, it is fast to provide a kind of vacuum suction applied to chip class device for the utility model
Dress type vibration device, the device are formed by head cover 1 and 2 vacuum brazing of box body, and formation one is hollow between head cover 1 and box body 2
Closed cavity, the head cover 1, which is equipped with, can connect the gas nozzle 3 of external vacuum pump；48 cores are reserved on 1 surface of head cover
The installation site of piece class device, each installation site has dug slot, and sealing element 5 is equipped in slot.
Preferably, each installation site is equipped with and is additionally provided with limiting device 6 on the head cover 1.
Preferably, three Angle Positions set chamfering in four angles of the head cover 1.
Preferably, three Angle Positions set chamfering in four angles of the box body 2.
Preferably, the chamfering position of the head cover 1 and box body 2 corresponds respectively.
Preferably, the sealing element is O-ring.
(3) advantageous effect
The utility model proposes a kind of vacuum suction quick mounting type vibration device applied to chip class device, by head cover
It is formed with box body vacuum brazing, forms the airtight cavity of an inner hollow.Cavity has reserved a gas nozzle, can be by vacuum
Pump realizes vacuumize process to this airtight cavity, so as to fulfill chip product and the quick adsorption of miniature device.
Description of the drawings
Fig. 1 is the apparatus structure schematic diagram of the utility model.
Specific embodiment
To make the purpose of this utility model, content and advantage clearer, with reference to the accompanying drawings and examples, to this reality
It is described in further detail with new specific embodiment.
As shown in Figure 1, the utility model, which provides a kind of vacuum suction quick mounting type applied to chip class device, vibrates use
Device, the device are formed by head cover 1 and 2 vacuum brazing of box body, and a hollow closed chamber is formed between head cover 1 and box body 2
Body, the head cover 1 are equipped with the gas nozzle 3 that can connect external vacuum pump, and vacuum pump can be to hollow cavity after being connected by reserved gas nozzle 3
Body vacuumizes.The installation site of more 48 chip class devices is reserved on 1 surface of head cover, each installation site has dug slot,
And sealing element 5 is equipped in slot, which is O-ring, ensures also protect chip class to the greatest extent while air-tightness
Product casing is not frayed.
Each installation site, which is equipped with, on the head cover 1 is additionally provided with limiting device 6.
Three Angle Positions set chamfering in four angles of the head cover 1, and three Angle Positions are set in four angles of the box body 2
Chamfering is put, the chamfering position of the head cover 1 and box body 2 corresponds respectively, sets chamfering that can reduce the length of cantilever beam,
The present apparatus is preferably controlled during vibration so that vibration input value is more accurately loaded on chip class device.
During experiment, chip 4 is first placed in 1 corresponding position of device upper top cover, vacuum pump is recycled to vacuumize cavity, is utilized
Negative pressure sucks chip 4, and vibration test can be carried out after inspection.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, on the premise of the utility model technical principle is not departed from, several improvement and deformation can also be made, these change
The scope of protection of the utility model is also should be regarded as into deformation.
Claims (7)
1. a kind of vacuum suction quick mounting type vibration device applied to chip class device, which is characterized in that the device is by head cover
(1) formed with box body (2) vacuum brazing, a hollow closed cavity, the top are formed between head cover (1) and box body (2)
Lid (1) is equipped with the gas nozzle (3) that can connect external vacuum pump；The peace of multiple chip class devices is reserved on head cover (1) surface
Holding position, each installation site has dug slot, and sealing element (5) is equipped in slot.
2. it is applied to the vacuum suction quick mounting type vibration device of chip class device as described in claim 1, which is characterized in that
Each installation site, which is equipped with, on the head cover (1) is additionally provided with limiting device (6).
3. it is applied to the vacuum suction quick mounting type vibration device of chip class device as described in claim 1, which is characterized in that
Three Angle Positions set chamfering in four angles of the head cover (1).
4. it is applied to the vacuum suction quick mounting type vibration device of chip class device as claimed in claim 3, which is characterized in that
Three Angle Positions set chamfering in four angles of the box body (2).
5. it is applied to the vacuum suction quick mounting type vibration device of chip class device as claimed in claim 4, which is characterized in that
The head cover (1) and the chamfering position of box body (2) correspond respectively.
6. it is applied to the vacuum suction quick mounting type vibration device of chip class device as described in claim 1, which is characterized in that
The sealing element (5) is O-ring.
7. such as vacuum suction quick mounting type vibration device according to any one of claims 1 to 6 applied to chip class device,
It is characterized in that, the installation site of 48 chip class devices is reserved on head cover (1) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721701978.6U CN207456724U (en) | 2017-12-08 | 2017-12-08 | Vacuum suction quick mounting type vibration device applied to chip class device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721701978.6U CN207456724U (en) | 2017-12-08 | 2017-12-08 | Vacuum suction quick mounting type vibration device applied to chip class device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207456724U true CN207456724U (en) | 2018-06-05 |
Family
ID=62275832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721701978.6U Expired - Fee Related CN207456724U (en) | 2017-12-08 | 2017-12-08 | Vacuum suction quick mounting type vibration device applied to chip class device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207456724U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109443270A (en) * | 2018-12-31 | 2019-03-08 | 天津正天医疗器械有限公司 | A kind of bulb inner conical surface lot size measurement tooling |
| CN111731654A (en) * | 2020-06-29 | 2020-10-02 | 平怀英 | Semiconductor chip storage device, array assembly structure and assembly method thereof |
-
2017
- 2017-12-08 CN CN201721701978.6U patent/CN207456724U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109443270A (en) * | 2018-12-31 | 2019-03-08 | 天津正天医疗器械有限公司 | A kind of bulb inner conical surface lot size measurement tooling |
| CN111731654A (en) * | 2020-06-29 | 2020-10-02 | 平怀英 | Semiconductor chip storage device, array assembly structure and assembly method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180605 Termination date: 20191208 |