CN104204119B - 固态灯和形成方法 - Google Patents

固态灯和形成方法 Download PDF

Info

Publication number
CN104204119B
CN104204119B CN201280070705.XA CN201280070705A CN104204119B CN 104204119 B CN104204119 B CN 104204119B CN 201280070705 A CN201280070705 A CN 201280070705A CN 104204119 B CN104204119 B CN 104204119B
Authority
CN
China
Prior art keywords
compositions
linear
sio
resin
organosiloxane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280070705.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN104204119A (zh
Inventor
尼子雅章
S·斯维尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Dow Silicones Corp
Original Assignee
Dow Corning Toray Co Ltd
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd, Dow Corning Corp filed Critical Dow Corning Toray Co Ltd
Publication of CN104204119A publication Critical patent/CN104204119A/zh
Application granted granted Critical
Publication of CN104204119B publication Critical patent/CN104204119B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
CN201280070705.XA 2011-12-30 2012-12-20 固态灯和形成方法 Active CN104204119B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161581852P 2011-12-30 2011-12-30
US61/581,852 2011-12-30
PCT/US2012/071011 WO2013101674A1 (en) 2011-12-30 2012-12-20 Solid state light and method of forming

Publications (2)

Publication Number Publication Date
CN104204119A CN104204119A (zh) 2014-12-10
CN104204119B true CN104204119B (zh) 2016-10-12

Family

ID=47553431

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280070705.XA Active CN104204119B (zh) 2011-12-30 2012-12-20 固态灯和形成方法

Country Status (6)

Country Link
US (1) US9000472B2 (https=)
EP (1) EP2798024B1 (https=)
JP (1) JP6001676B2 (https=)
KR (1) KR102067384B1 (https=)
CN (1) CN104204119B (https=)
WO (1) WO2013101674A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6001676B2 (ja) 2011-12-30 2016-10-05 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 固体ライト及び形成方法
WO2013109607A1 (en) * 2012-01-16 2013-07-25 Dow Corning Corporation Optical article and method of forming
EP2812738B1 (en) 2012-02-09 2016-10-12 Dow Corning Corporation Gradient polymer structures and methods
KR102063029B1 (ko) * 2012-03-20 2020-02-11 다우 실리콘즈 코포레이션 광 가이드 및 관련된 광 어셈블리
US20160032148A1 (en) * 2013-03-15 2016-02-04 Dow Corning Corporation A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof
WO2014152522A1 (en) * 2013-03-15 2014-09-25 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
US20140339474A1 (en) * 2013-05-15 2014-11-20 Dow Corning Corporation Silicone composition comprising nanoparticles and cured product formed therefrom
WO2015042285A1 (en) 2013-09-18 2015-03-26 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
CN105637660B (zh) * 2013-11-07 2018-11-09 东丽株式会社 层叠体及使用所述层叠体的发光装置的制造方法
US10106838B2 (en) 2014-03-07 2018-10-23 IfP Privates Institut für Produktqualität GmbH Method and kit of parts for extraction of nucleic acids
EP3161881A4 (en) * 2014-06-25 2018-02-21 Dow Corning Corporation Layered polymer structures and methods
US20170306201A1 (en) * 2014-09-23 2017-10-26 Dow Corning Corporation Adhesive compositions and uses thereof
TWI678551B (zh) * 2015-07-28 2019-12-01 美商道康寧公司 智慧型光學材料、配方、方法、用途、物品、及裝置
JP6055054B1 (ja) * 2015-09-09 2016-12-27 奥本　健二 発光デバイスおよびその製造方法
JP7110105B2 (ja) 2016-02-10 2022-08-01 コーニンクレッカ フィリップス エヌ ヴェ Ｌｅｄ用途におけるシロキサン樹脂の気相硬化触媒及び不動態化
DE102016114921A1 (de) * 2016-08-11 2018-02-15 Osram Opto Semiconductors Gmbh Silikonzusammensetzung
EP3524633A4 (en) * 2016-10-04 2020-06-03 Dow Toray Co., Ltd. INNOVATIVE RESIN LINEAR ORGANOPOLYSILOXANE BLOCK COPOLYMERS, USE THEREOF AND METHOD FOR PRODUCING THE SAME
TWI848915B (zh) * 2017-07-28 2024-07-21 日商杜邦東麗特殊材料股份有限公司 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法
US20200029403A1 (en) * 2018-07-18 2020-01-23 Appleton Grp Llc Encapsulated led engine and a process for encapsulating an led engine
US11255797B2 (en) * 2019-07-09 2022-02-22 Kla Corporation Strontium tetraborate as optical glass material
CN116457205B (zh) * 2020-12-25 2025-07-29 陶氏东丽株式会社 固化性有机硅组合物、其固化物以及层叠体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294737A (en) * 1963-12-23 1966-12-27 Gen Electric Organopolysiloxanes
EP1801163A1 (en) * 2005-12-22 2007-06-27 Rohm and Haas Company Siloxane Encapsulants
CN101484503A (zh) * 2006-07-21 2009-07-15 东京应化工业株式会社 高折射率材料
CN101792529A (zh) * 2008-12-24 2010-08-04 日东电工株式会社 硅树脂组合物
US20110062424A1 (en) * 2009-09-11 2011-03-17 Nitto Denko Corporation Polymer compositions comprising additive block copolymers

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328481A (en) * 1964-04-20 1967-06-27 Dow Corning Organosilicon resins
US3619229A (en) * 1968-09-05 1971-11-09 Dow Corning Reinforced polystyrene and its copolymers
BE759621A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences d'organosiloxanes non corrosifs, vulcanisables a la temperature ambiante
BE759624A (fr) * 1969-12-01 1971-06-01 Dow Corning Caoutchouc de silicone resistant aux salissures et sa fabrication
BE759619A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences d'organosiloxanes a fonctionnalite cetoxime, vulcanisables a la temperature ambiante et resistant a l'arc
BE759618A (fr) * 1969-12-01 1971-06-01 Dow Corning Procede pour promouvoir la reaction entre un radical hydroxyle lie au silicium et un radical alcoxy lie au silicium
US3670649A (en) * 1970-08-13 1972-06-20 Dow Corning Combustible cartridges
US4419402A (en) * 1982-02-16 1983-12-06 Dow Corning Corporation Flame retardant polyorganopolysiloxane resin compositions
US4443502A (en) * 1983-04-12 1984-04-17 Dow Corning Corporation Liquid organosiloxane resin compositions
US4508887A (en) * 1983-08-01 1985-04-02 Dow Corning Corporation Method and novel catalyst compositions for preparing polyorganosiloxanes
NZ238807A (en) * 1990-07-05 1994-03-25 Merrell Dow Pharma Bis[4-(2,6-dialkyl)phenol]silane derivatives and antiatherosclerotic compositions
US5075103A (en) 1990-07-06 1991-12-24 Dow Corning Corporation Hair fixatives comprising nonpolar silsesquioxanes
US7169859B2 (en) * 1999-05-18 2007-01-30 General Electric Company Weatherable, thermostable polymers having improved flow composition
US6842577B2 (en) * 2002-12-02 2005-01-11 Shipley Company L.L.C. Photoimageable waveguide composition and waveguide formed therefrom
KR100882409B1 (ko) * 2003-06-03 2009-02-05 신에쓰 가가꾸 고교 가부시끼가이샤 반사 방지용 실리콘 수지, 반사 방지막 재료, 이것을 이용한 반사 방지막 및 패턴 형성 방법
US7312008B2 (en) * 2005-02-10 2007-12-25 Xerox Corporation High-performance surface layer for photoreceptors
JP2007270056A (ja) * 2006-03-31 2007-10-18 Jsr Corp 金属酸化物微粒子含有ポリシロキサン組成物およびその製造方法
WO2012040453A1 (en) 2010-09-22 2012-03-29 Dow Corning Corporation Thermally stable compositions containing resin-linear organosiloxane block copolymers
US9045668B2 (en) 2010-09-22 2015-06-02 Dow Corning Corporation Organosiloxane block copolymer
JP2013540169A (ja) 2010-09-22 2013-10-31 ダウ コーニング コーポレーション 樹脂−直鎖状オルガノシロキサンブロックコポリマーの調製方法
WO2012040457A1 (en) 2010-09-22 2012-03-29 Dow Corning Corporation High refractive index compositions containing resin-linear organosiloxane block copolymers
JP2012102167A (ja) * 2010-11-05 2012-05-31 Nitto Denko Corp シリコーン樹脂、封止材料および光半導体装置
JP6001676B2 (ja) 2011-12-30 2016-10-05 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 固体ライト及び形成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294737A (en) * 1963-12-23 1966-12-27 Gen Electric Organopolysiloxanes
EP1801163A1 (en) * 2005-12-22 2007-06-27 Rohm and Haas Company Siloxane Encapsulants
CN1990521A (zh) * 2005-12-22 2007-07-04 罗门哈斯公司 硅氧烷包封剂
CN101484503A (zh) * 2006-07-21 2009-07-15 东京应化工业株式会社 高折射率材料
CN101792529A (zh) * 2008-12-24 2010-08-04 日东电工株式会社 硅树脂组合物
US20110062424A1 (en) * 2009-09-11 2011-03-17 Nitto Denko Corporation Polymer compositions comprising additive block copolymers

Also Published As

Publication number Publication date
KR20140109462A (ko) 2014-09-15
US20150001567A1 (en) 2015-01-01
JP2015510257A (ja) 2015-04-02
EP2798024B1 (en) 2016-07-20
JP6001676B2 (ja) 2016-10-05
EP2798024A1 (en) 2014-11-05
KR102067384B1 (ko) 2020-01-17
US9000472B2 (en) 2015-04-07
WO2013101674A1 (en) 2013-07-04
CN104204119A (zh) 2014-12-10

Similar Documents

Publication Publication Date Title
CN104204119B (zh) 固态灯和形成方法
CN104220902B (zh) 梯度聚合物结构和方法
JP6309898B2 (ja) 光学物品及び形成方法
CN103201317B (zh) 含有树脂-线型有机硅氧烷嵌段共聚物的热稳定组合物
CN104838516B (zh) 层状聚合物结构和方法
JP5662580B2 (ja) 樹脂−直鎖状オルガノシロキサンブロックコポリマー
CN103189419B (zh) 包含树脂-线型有机硅氧烷嵌段共聚物的高折射率组合物
CN104114656B (zh) 树脂‑线性有机硅氧烷嵌段共聚物的固化性组合物
US20160032148A1 (en) A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof
US20140187733A1 (en) Organopolysiloxane, And Method For Producing Same
KR20110132533A (ko) 열경화성 실리콘 수지용 조성물
JP6323086B2 (ja) 熱硬化性樹脂組成物及びそれを用いた物品

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: michigan

Co-patentee after: Dow Corning Toray Co., Ltd.

Patentee after: Dow organosilicon company

Address before: michigan

Co-patentee before: Dow Corning Toray Co., Ltd.

Patentee before: Dow Corning

CP01 Change in the name or title of a patent holder