JP6001676B2 - 固体ライト及び形成方法 - Google Patents

固体ライト及び形成方法 Download PDF

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Publication number
JP6001676B2
JP6001676B2 JP2014550382A JP2014550382A JP6001676B2 JP 6001676 B2 JP6001676 B2 JP 6001676B2 JP 2014550382 A JP2014550382 A JP 2014550382A JP 2014550382 A JP2014550382 A JP 2014550382A JP 6001676 B2 JP6001676 B2 JP 6001676B2
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composition
linear
sio
resin
organosiloxane
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Japanese (ja)
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JP2015510257A (ja
JP2015510257A5 (https=
Inventor
雅章 尼子
雅章 尼子
スウィアー スティーブン
スウィアー スティーブン
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Dow Silicones Corp
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Dow Corning Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
JP2014550382A 2011-12-30 2012-12-20 固体ライト及び形成方法 Active JP6001676B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161581852P 2011-12-30 2011-12-30
US61/581,852 2011-12-30
PCT/US2012/071011 WO2013101674A1 (en) 2011-12-30 2012-12-20 Solid state light and method of forming

Publications (3)

Publication Number Publication Date
JP2015510257A JP2015510257A (ja) 2015-04-02
JP2015510257A5 JP2015510257A5 (https=) 2015-12-17
JP6001676B2 true JP6001676B2 (ja) 2016-10-05

Family

ID=47553431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014550382A Active JP6001676B2 (ja) 2011-12-30 2012-12-20 固体ライト及び形成方法

Country Status (6)

Country Link
US (1) US9000472B2 (https=)
EP (1) EP2798024B1 (https=)
JP (1) JP6001676B2 (https=)
KR (1) KR102067384B1 (https=)
CN (1) CN104204119B (https=)
WO (1) WO2013101674A1 (https=)

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JP6001676B2 (ja) 2011-12-30 2016-10-05 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 固体ライト及び形成方法
WO2013109607A1 (en) * 2012-01-16 2013-07-25 Dow Corning Corporation Optical article and method of forming
EP2812738B1 (en) 2012-02-09 2016-10-12 Dow Corning Corporation Gradient polymer structures and methods
KR102063029B1 (ko) * 2012-03-20 2020-02-11 다우 실리콘즈 코포레이션 광 가이드 및 관련된 광 어셈블리
US20160032148A1 (en) * 2013-03-15 2016-02-04 Dow Corning Corporation A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof
WO2014152522A1 (en) * 2013-03-15 2014-09-25 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
US20140339474A1 (en) * 2013-05-15 2014-11-20 Dow Corning Corporation Silicone composition comprising nanoparticles and cured product formed therefrom
WO2015042285A1 (en) 2013-09-18 2015-03-26 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
CN105637660B (zh) * 2013-11-07 2018-11-09 东丽株式会社 层叠体及使用所述层叠体的发光装置的制造方法
US10106838B2 (en) 2014-03-07 2018-10-23 IfP Privates Institut für Produktqualität GmbH Method and kit of parts for extraction of nucleic acids
EP3161881A4 (en) * 2014-06-25 2018-02-21 Dow Corning Corporation Layered polymer structures and methods
US20170306201A1 (en) * 2014-09-23 2017-10-26 Dow Corning Corporation Adhesive compositions and uses thereof
TWI678551B (zh) * 2015-07-28 2019-12-01 美商道康寧公司 智慧型光學材料、配方、方法、用途、物品、及裝置
JP6055054B1 (ja) * 2015-09-09 2016-12-27 奥本　健二 発光デバイスおよびその製造方法
JP7110105B2 (ja) 2016-02-10 2022-08-01 コーニンクレッカ フィリップス エヌ ヴェ Ｌｅｄ用途におけるシロキサン樹脂の気相硬化触媒及び不動態化
DE102016114921A1 (de) * 2016-08-11 2018-02-15 Osram Opto Semiconductors Gmbh Silikonzusammensetzung
EP3524633A4 (en) * 2016-10-04 2020-06-03 Dow Toray Co., Ltd. INNOVATIVE RESIN LINEAR ORGANOPOLYSILOXANE BLOCK COPOLYMERS, USE THEREOF AND METHOD FOR PRODUCING THE SAME
TWI848915B (zh) * 2017-07-28 2024-07-21 日商杜邦東麗特殊材料股份有限公司 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法
US20200029403A1 (en) * 2018-07-18 2020-01-23 Appleton Grp Llc Encapsulated led engine and a process for encapsulating an led engine
US11255797B2 (en) * 2019-07-09 2022-02-22 Kla Corporation Strontium tetraborate as optical glass material
CN116457205B (zh) * 2020-12-25 2025-07-29 陶氏东丽株式会社 固化性有机硅组合物、其固化物以及层叠体

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JP6001676B2 (ja) 2011-12-30 2016-10-05 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 固体ライト及び形成方法

Also Published As

Publication number Publication date
KR20140109462A (ko) 2014-09-15
US20150001567A1 (en) 2015-01-01
JP2015510257A (ja) 2015-04-02
EP2798024B1 (en) 2016-07-20
EP2798024A1 (en) 2014-11-05
CN104204119B (zh) 2016-10-12
KR102067384B1 (ko) 2020-01-17
US9000472B2 (en) 2015-04-07
WO2013101674A1 (en) 2013-07-04
CN104204119A (zh) 2014-12-10

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