CN104194715A - Formula and preparation process of instant organic silicon adhesive - Google Patents
Formula and preparation process of instant organic silicon adhesive Download PDFInfo
- Publication number
- CN104194715A CN104194715A CN201410424365.7A CN201410424365A CN104194715A CN 104194715 A CN104194715 A CN 104194715A CN 201410424365 A CN201410424365 A CN 201410424365A CN 104194715 A CN104194715 A CN 104194715A
- Authority
- CN
- China
- Prior art keywords
- parts
- add
- agent
- organic silicon
- silicon adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a formula and preparation process of an instant organic silicon adhesive. The instant organic silicon adhesive is characterized by mainly comprising the following components: 50-60 parts of epoxy organosilicone, 10-15 parts of toughening agent, 1-2 parts of coupling agent, 2-3 parts of curing agent, 100-150 parts of ethyl cyanoacetate, 50-60 parts of solid formaldehyde, 2-3 parts of piperidine, 70-80 parts of methanol, 2-5 parts of cyclohexane, 1-3 parts of ethyl acetate, 2-5 parts of phosphorus pentoxide, 1-2 parts of sulfur dioxide and 1-3 parts of p-dihydroxybenzene. The preparation process comprises the steps of mixing epoxy silicone, the toughening agent and the coupling agent, completely dissolving the mixture, and then, adding the curing agent to prepare a semi-finished product of the adhesive; and then, preparing a condensation polymer, cracking a crude monomer, refining and mixing to obtain the instant organic silicon adhesive. The instant organic silicon adhesive has the characteristics of no toxicity, no harm, simple process, good performance, low price, wide application range, good stability, strong water resistance, high bonding strength and strong practicability.
Description
Technical field:
The present invention relates to a kind of sizing agent, be specifically related to organosilicon moment gluing agent prescription and preparation technology thereof.
Background technology:
Chemical industry is development in modern times mainstay of the national economy industry very rapidly, and fine chemistry industry tail gas important component part, obtained the development of advancing by leaps and bounds in 20th century, the unresolved mankind's clothing, food, lodging and transportion--basic necessities of life and the energy, resource and environment problem are made significant contribution.
Sizing agent is that development of modern industry and human living standard improve requisite important materials, and sizing agent and bonding technology, with the incomparable special warfare of other mode of connection, are being brought into play great effect in modern economy, modern national defense, modern science and technology.
Summary of the invention:
Technical problem to be solved by this invention is to overcome the defect of prior art, and a kind of organosilicon moment gluing agent prescription and preparation technology thereof are provided.
Technical problem to be solved by this invention realizes by the following technical solutions.
Organosilicon moment gluing agent prescription, is characterized in that: its composition mainly comprises:
Epoxy organosilicon: 50-60 part, toughner: 10-15 part, coupling agent: 1-2 part, solidifying agent: 2-3 part, ethyl cyanoacetate: 100-150 part, solid formaldehyde: 50-60 part, piperidines: 2-3 part, methyl alcohol: 70-80 part, hexanaphthene: 2-5 part, ethyl acetate: 1-3 part, Vanadium Pentoxide in FLAKES: 2-5 part, sulfurous gas 1-2 part, Resorcinol: 1-3 part.
Organosilicon moment sizing agent preparation technology, is characterized in that: be specially:
After getting epoxy organosilicon, toughner, coupling agent and mixing and dissolve completely, add solidifying agent to make work in-process glue;
Get solid formaldehyde, piperidines, methyl alcohol simultaneously and add in a flask, heating, stirs, dissolve, then dropped in reactor, reactor is warming up to 90 DEG C, add ethyl cyanoacetate, heat 2 hours, then reclaim solvent methanol, to 120 DEG C of temperature, stop heating, add hexanaphthene, ethyl acetate to mix, reflux dewatering, temperature rises to 125 DEG C, and discharging, obtains condensation polymer;
Condensation polymer and work in-process glue are mixed, and proportion is 100:20-50, adds 5-10 part promotor, is warming up to 90 DEG C, and heating duration can obtain copolymerization sizing agent in 1 hour;
Get 1-2 part Vanadium Pentoxide in FLAKES and add copolymerization sizing agent, be heated to 190 DEG C-200 DEG C, under vacuum tightness 0.1MPa, carry out cracking, obtain crude monomer;
In crude monomer, add remaining Vanadium Pentoxide in FLAKES, Resorcinol, sulfurous gas, in reactor, stir, it is that under 0.1MPa, to collect cut be the product of 70-80 DEG C that temperature is controlled at 80-100 DEG C, vacuum tightness, obtains smart monomer;
Getting smart monomer, to add massfraction be the dioctyl phthalate (DOP) of 1%-2%, the mixture of lucite powder, obtains moment sizing agent.
Feature of the present invention: nontoxic, technique is simple, property favorable rates is honest and clean, of many uses, good stability, water resisting property is strong, and cohesive strength is high, practical.
Embodiment:
For technique means, creation characteristic that the present invention is realized, reach object and effect is easy to understand, below in conjunction with specific embodiment, further set forth the present invention.
Specific embodiment: organosilicon moment gluing agent prescription, its composition mainly comprises:
Epoxy organosilicon: 60 parts, toughner: 10 parts, coupling agent: 1 part, solidifying agent: 2 parts, ethyl cyanoacetate: 100 parts, solid formaldehyde: 50 parts, piperidines: 2 parts, methyl alcohol: 70 parts, hexanaphthene: 2 parts, ethyl acetate: 1 part, Vanadium Pentoxide in FLAKES: 2 parts, 1 part of sulfurous gas, Resorcinol: 1 part.
Organosilicon moment sizing agent preparation technology, is specially:
After getting epoxy organosilicon, toughner, coupling agent and mixing and dissolve completely, add solidifying agent to make work in-process glue;
Get solid formaldehyde, piperidines, methyl alcohol simultaneously and add in a flask, heating, stirs, dissolve, then dropped in reactor, reactor is warming up to 90 DEG C, add ethyl cyanoacetate, heat 2 hours, then reclaim solvent methanol, to 120 DEG C of temperature, stop heating, add hexanaphthene, ethyl acetate to mix, reflux dewatering, temperature rises to 125 DEG C, and discharging, obtains condensation polymer;
Condensation polymer and work in-process glue are mixed, and proportion is 100:40, adds 5 parts of promotor, is warming up to 90 DEG C, and heating duration can obtain copolymerization sizing agent in 1 hour;
Get 1-2 part Vanadium Pentoxide in FLAKES and add copolymerization sizing agent, be heated to 190 DEG C-200 DEG C, under vacuum tightness 0.1MPa, carry out cracking, obtain crude monomer;
In crude monomer, add remaining Vanadium Pentoxide in FLAKES, Resorcinol, sulfurous gas, in reactor, stir, it is that under 0.1MPa, to collect cut be the product of 70-80 DEG C that temperature is controlled at 80-100 DEG C, vacuum tightness, obtains smart monomer;
Getting smart monomer, to add massfraction be the dioctyl phthalate (DOP) of 1%-2%, the mixture of lucite powder, obtains moment sizing agent.
More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and specification sheets, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (2)
1. organosilicon moment gluing agent prescription, is characterized in that: its composition mainly comprises:
Epoxy organosilicon: 50-60 part, toughner: 10-15 part, coupling agent: 1-2 part, solidifying agent: 2-3 part, ethyl cyanoacetate: 100-150 part, solid formaldehyde: 50-60 part, piperidines: 2-3 part, methyl alcohol: 70-80 part, hexanaphthene: 2-5 part, ethyl acetate: 1-3 part, Vanadium Pentoxide in FLAKES: 2-5 part, sulfurous gas 1-2 part, Resorcinol: 1-3 part.
2. organosilicon moment sizing agent preparation technology, is characterized in that: be specially:
After getting epoxy organosilicon, toughner, coupling agent and mixing and dissolve completely, add solidifying agent to make work in-process glue;
Get solid formaldehyde, piperidines, methyl alcohol simultaneously and add in a flask, heating, stirs, dissolve, then dropped in reactor, reactor is warming up to 90 DEG C, add ethyl cyanoacetate, heat 2 hours, then reclaim solvent methanol, to 120 DEG C of temperature, stop heating, add hexanaphthene, ethyl acetate to mix, reflux dewatering, temperature rises to 125 DEG C, and discharging, obtains condensation polymer;
Condensation polymer and work in-process glue are mixed, and proportion is 100:20-50, adds 5-10 part promotor, is warming up to 90 DEG C, and heating duration can obtain copolymerization sizing agent in 1 hour;
Get 1-2 part Vanadium Pentoxide in FLAKES and add copolymerization sizing agent, be heated to 190 DEG C-200 DEG C, under vacuum tightness 0.1MPa, carry out cracking, obtain crude monomer;
In crude monomer, add remaining Vanadium Pentoxide in FLAKES, Resorcinol, sulfurous gas, in reactor, stir, it is that under 0.1MPa, to collect cut be the product of 70-80 DEG C that temperature is controlled at 80-100 DEG C, vacuum tightness, obtains smart monomer;
Getting smart monomer, to add massfraction be the dioctyl phthalate (DOP) of 1%-2%, the mixture of lucite powder, obtains moment sizing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410424365.7A CN104194715A (en) | 2014-08-26 | 2014-08-26 | Formula and preparation process of instant organic silicon adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410424365.7A CN104194715A (en) | 2014-08-26 | 2014-08-26 | Formula and preparation process of instant organic silicon adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104194715A true CN104194715A (en) | 2014-12-10 |
Family
ID=52080093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410424365.7A Pending CN104194715A (en) | 2014-08-26 | 2014-08-26 | Formula and preparation process of instant organic silicon adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104194715A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105482699A (en) * | 2015-12-11 | 2016-04-13 | 安徽省颐馨木业有限公司 | Board painting facilitating preservation and preparation method thereof |
| CN105802555A (en) * | 2016-04-19 | 2016-07-27 | 安徽亿诺新能源有限责任公司 | Sealant special for power batteries and preparation process of sealant |
| CN105838300A (en) * | 2016-04-19 | 2016-08-10 | 安徽亿诺新能源有限责任公司 | Special sealant for ordinary batteries and preparation process thereof |
| CN105838301A (en) * | 2016-04-19 | 2016-08-10 | 安徽亿诺新能源有限责任公司 | Special sealant for high capacity batteries and preparation process thereof |
| CN105838302A (en) * | 2016-04-19 | 2016-08-10 | 安徽亿诺新能源有限责任公司 | Special sealant for high-temperature batteries and preparation process thereof |
| CN105907345A (en) * | 2016-04-19 | 2016-08-31 | 安徽亿诺新能源有限责任公司 | Seal gum specially used for low-self-discharge battery and preparation process of same |
| CN107651889A (en) * | 2017-09-05 | 2018-02-02 | 和县浙徽新型材料有限公司 | A kind of non-burning brick preparation method of durable slag micropowder and clay |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070212551A1 (en) * | 2006-03-10 | 2007-09-13 | Andrew Collins | Adhesive composition |
| CN102757760A (en) * | 2012-08-06 | 2012-10-31 | 上海中新裕祥化工有限公司 | Organic silicon modified epoxy resin optical fiber adhesive |
-
2014
- 2014-08-26 CN CN201410424365.7A patent/CN104194715A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070212551A1 (en) * | 2006-03-10 | 2007-09-13 | Andrew Collins | Adhesive composition |
| CN102757760A (en) * | 2012-08-06 | 2012-10-31 | 上海中新裕祥化工有限公司 | Organic silicon modified epoxy resin optical fiber adhesive |
Non-Patent Citations (2)
| Title |
|---|
| 李芝华等: "耐高低温环氧有机硅胶黏剂的力学性能研究", 《化工新型材料》 * |
| 甘家雄: "正交试验优化瞬间胶粘剂生产工艺", 《中国胶粘剂》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105482699A (en) * | 2015-12-11 | 2016-04-13 | 安徽省颐馨木业有限公司 | Board painting facilitating preservation and preparation method thereof |
| CN105802555A (en) * | 2016-04-19 | 2016-07-27 | 安徽亿诺新能源有限责任公司 | Sealant special for power batteries and preparation process of sealant |
| CN105838300A (en) * | 2016-04-19 | 2016-08-10 | 安徽亿诺新能源有限责任公司 | Special sealant for ordinary batteries and preparation process thereof |
| CN105838301A (en) * | 2016-04-19 | 2016-08-10 | 安徽亿诺新能源有限责任公司 | Special sealant for high capacity batteries and preparation process thereof |
| CN105838302A (en) * | 2016-04-19 | 2016-08-10 | 安徽亿诺新能源有限责任公司 | Special sealant for high-temperature batteries and preparation process thereof |
| CN105907345A (en) * | 2016-04-19 | 2016-08-31 | 安徽亿诺新能源有限责任公司 | Seal gum specially used for low-self-discharge battery and preparation process of same |
| CN107651889A (en) * | 2017-09-05 | 2018-02-02 | 和县浙徽新型材料有限公司 | A kind of non-burning brick preparation method of durable slag micropowder and clay |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104194715A (en) | Formula and preparation process of instant organic silicon adhesive | |
| CN104194699A (en) | Formula and preparation process of epoxy resin-soybean protein glue environment-friendly copolymer adhesive | |
| CN104610521B (en) | silane-modified phenolic resin and preparation method thereof | |
| CN102627927A (en) | Medium temperature curing high temperature resistant phenolic adhesive | |
| CN103709990B (en) | Vegetable-protein base based Wood Adhesives of a kind of enzyme modified and preparation method thereof | |
| CN105885754B (en) | Low form fire retarding epoxide resin adhesive and preparation method thereof | |
| CN104762044A (en) | Production method for melamine, oxidized starch and organic silicone emulsion modified urea-formaldehyde resin adhesive with low residual formaldehyde residue amount | |
| CN103409035A (en) | Special paint for food can and preparation method thereof | |
| CN107236249A (en) | A kind of benzoxazine colophony based composites and preparation method thereof | |
| CN109694679A (en) | A kind of modified phenolic resin adhesive and preparation method thereof | |
| CN104312507B (en) | A kind of high-temperature resistance adhesive and preparation method thereof | |
| CN103468182B (en) | Preparation method of boron modified phenolic resin adhesive | |
| CN105111980B (en) | Special modified phenolic aldehyde high-temperature Resistance Adhesives | |
| CN104762042A (en) | Modified urea resin adhesive and preparation method thereof | |
| CN103588942B (en) | High Performance Phenolic Resins composition and method of making the same | |
| CN103204756A (en) | High temperature-resistant solid propellant for oilfield fracturing | |
| CN104559866B (en) | A kind of preparation method of phenolic resin adhesive | |
| CN104087213A (en) | Preparation method of polyvinyl formal adhesive | |
| CN104804194B (en) | The preparation of poly- titanium Borosiloxane and the method for modifying to phenolic resin | |
| CN104073206B (en) | Modified epoxy glue paste formula and preparation technology thereof | |
| CN103360961A (en) | High-strength waterproof adhesive and preparation method thereof | |
| CN103319671B (en) | The preparation method of phenolic resin for refractory material | |
| CN108084930A (en) | A kind of LED display binding agent and preparation method thereof | |
| CN105665965A (en) | Waterproof and dampproof welding rod coating and preparation method thereof | |
| CN104073203A (en) | Modified chipboard reinforced adhesive formula and preparation process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141210 |