CN108084930A - A kind of LED display binding agent and preparation method thereof - Google Patents
A kind of LED display binding agent and preparation method thereof Download PDFInfo
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- CN108084930A CN108084930A CN201711471362.9A CN201711471362A CN108084930A CN 108084930 A CN108084930 A CN 108084930A CN 201711471362 A CN201711471362 A CN 201711471362A CN 108084930 A CN108084930 A CN 108084930A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The invention belongs to technical fields prepared by binding agent, provide a kind of LED display binding agent and preparation method thereof.Phenol, formaldehyde, triethylamine, ammonium hydroxide, organic solvent, the methanol solution of p-methyl benzenesulfonic acid and poly (aryl ether sulfone ketone) are stirred by this method, then curing agent, chain extender and organo-silicon coupling agent are added in, be mixed and heated being reacted, then discharge, be dehydrated the phenolic resin being modified up to poly (aryl ether sulfone ketone), can be used as the binding agent of LED display.Compared with conventional method, the present invention passes through poly (aryl ether sulfone ketone) phenol-formaldehyde resin modified, obtained binding agent has excellent high temperature resistance and cohesive force is stronger, there are good toughness, water resistance, weatherability and corrosion resistance simultaneously, it can be widely used on LED display, and whole preparation process is simple, and raw material is easy to get, cost is relatively low, has a good application prospect.
Description
Technical field
The invention belongs to technical fields prepared by binding agent, provide a kind of LED display binding agent and preparation method thereof.
Background technology
Binding agent is that one kind can be the similar or inhomogeneous combined substance of material tight.With science and technology
With the development of national economy, binding agent has been widely used in timber processing, architectural engineering, textile printing and dyeing, shoemaking, leather, electricity
The every profession and trades such as son, automobile, machinery, aerospace, biologic medical and high-tech area, binding agent and the bonding technology development in China
Also quickly, kind increases, and yield increase, quality is greatly enhanced, and the quality and performance of a small amount of binding agent are met or exceeded
The world similar advanced product.Requirement of the different industries to binding agent and adhesive technology is higher and higher, and wherein electronics industry is because of it
The particularity of material, the research and application of binding agent become the important content of industry development.
It is usually at this stage synthetic resin binding agent for the binding agent of electronics industry, wherein phenolic resin is very
Important one kind.Phenolic resin is to realize industrialized synthetic resin earliest in the world, has the history of last 100 years so far, former
Material is easy to get, of low cost, it is cured after product have good heat resistance and mechanical property, and performance stablize.It is synthesizing
In resin adhesive field, the features such as phenolic resin is with its good weatherability, water resistance, high temperature tolerance and adhesive strength,
It is widely used in coating, friction material, insulating materials, moulding compound etc..But because of itself intrinsic characteristic, make
There are the problems such as heat resisting temperature is not high, performance is unstable in, particularly for LED display when in electronic products, it is necessary to have
The characteristic for having high temperature resistant and easily forming a film, it is therefore desirable to which high-technology field at this stage can just be met by, which being modified to phenolic resin, makes
It is required that.
The side such as heat resistance, caking property, Residual carbon and impact resistance is concentrated mainly on to the modification of phenolic resin in recent years
Face.Modification in terms of heat resistance, which has, adds in the progress of the materials such as organosilicon, polymer, nano-powder, metal and nonmetallic ion
Modified method；Residual carbon has mainly carried out study on the modification from the modification by copolymerization etc. of inorganic material blending and modifying, different phenol；
The methods of impact resistance is modified using nitrile rubber with phenol, formaldehyde copolymer；Caking property is mainly changed using materials such as polysulfones
Property.In short, researcher has carried out study on the modification with different means to phenolic resin, changed a certain performance of phenolic resin
It is kind, and achieve significant effect.Wherein phenolic resin is used in the application of LED display binding agent, polysulfones modified phenolic resin
Fat, so the operations such as vacuum dehydration are not required, eliminates pollution of the sewage to environment since monomer is using paraformaldehyde, and
Modified resin adhesive property is good, has a extensive future.
Masterbatch is bonded in LED display both at home and abroad at present, has especially been taken using modified phenolic resin adhesive aspect
Obtained certain effect.Wherein Li Ke work(has invented a kind of boron modified phenolic resin adhesive（Chinese invention patent application number
201510022692.4）, comprise the steps of：Synthesize polyborosiloxane；Synthesis modification phenolic resin；Prepare boron modification phenolic aldehyde tree
Fat adhesive, it is more mild to prepare polyborosiloxane method condition in the invention boron modified phenolic resin adhesive, easy to operate,
Without harmful gas generation, environmentally protective, gained polyborosiloxane high temperature resistance is excellent, containing substantial amounts of terminal hydroxy group, as changing
Property agent, can improve the heat-resisting quantity and adhesion strength of phenolic resin, be provided to prepare thermostable phenolic resin adhesive simultaneously
A kind of feasible method.In addition, the summer, which learns cloud, has invented a kind of novel C O2Hardening phenolic resin binding agent（Chinese invention patent Shen
It please numbers 201610634552.7）, including following component：Resol body, crosslinking agent, dispersant, coupling agent, the invention
Also disclose novel C O2The preparation method of hardening phenolic resin binding agent prepares resol body first, then with system
Standby resol body is mixed to prepare novel C O with crosslinking agent, dispersant, coupling agent2Hardening phenolic resin binding agent.
From the foregoing, it will be observed that in the prior art for electrical product, the binding agent generally existing for being particularly LED display is anti-oxidant
The problems such as poor performance, Corrosion Protection are poor, high temperature resistance is poor and is not easy to form a film, limits LED display to a certain extent
Development, and it is traditional using the method for phenolic resin or phenol-formaldehyde resin modified there are process is complicated, of high cost, while adhesive property
The problems such as still insufficient.For such case, it is proposed that a kind of LED display binding agent and preparation method thereof, passes through poly- virtue
Ether sulfone ketone phenol-formaldehyde resin modified so that obtained binding agent is stronger with excellent high temperature resistance and cohesive force, can extensive use
In on LED display.
The content of the invention
The object of the present invention is to provide a kind of LED display binding agents and preparation method thereof, can solve existing LED and show
Shield the problems such as binding agent antioxygenic property is poor, Corrosion Protection is poor, high temperature resistance is poor and is not easy to form a film, while avoid tradition
The defects of phenolic resin modified procedure is complicated, cohesive force of high cost and gained binding agent is not strong.
Specific technical solution of the present invention is as follows：
A kind of preparation method of LED display binding agent, by phenol, formaldehyde, triethylamine, ammonium hydroxide, organic solvent, p-methyl benzenesulfonic acid
Methanol solution and poly (aryl ether sulfone ketone) after be stirred, then add in curing agent, chain extender and organo-silicon coupling agent, mixed
Merge heating to be reacted, then discharge, be dehydrated the phenolic resin being modified up to poly (aryl ether sulfone ketone), can be used as LED display
Binding agent, preparation are as follows：
（1）In the reaction kettle with insulation jacket, add in phenol, formaldehyde by certain mass ratio, triethylamine, ammonium hydroxide, have
The methanol solution of solvent, p-methyl benzenesulfonic acid, turn on agitator are uniformly mixed, and obtain mixture A；Wherein, 20~30 weight of phenol
Measure part, 10~15 parts by weight of formaldehyde, 0.4~0.6 parts by weight of triethylamine, 0.4~0.6 parts by weight of ammonium hydroxide, organic solvent 47.8~
66.2 parts by weight, 3~6 parts by weight of methanol solution of p-methyl benzenesulfonic acid；
（2）The poly (aryl ether sulfone ketone) of certain mass ratio is added in into mixture A, and is uniformly mixed, obtains mixture B；
（3）Curing agent, chain extender and the organo-silicon coupling agent of certain mass ratio are added in into mixture B, is uniformly mixed,
Heater when temperature is increased to certain value, stops heating, and with formaldehyde polycondensation reaction occurs for phenol, and liberated heat makes
System temperature continues to raise, and maintains the progress of reaction；
（4）After the completion of reaction, then discharging carries out vacuum dehydration, and the moisture and volatile matter in removing system show to get LED
The phenolic resin that the binding agent of screen --- poly (aryl ether sulfone ketone) is modified.
Preferably, step（1）The organic solvent is styrene, perchloroethylene, ethylene glycol ether, trichloro ethylene or ring
One kind in hexane.
Preferably, step（1）The mass concentration of the ammonium hydroxide is 20~25%.
Preferably, step（1）The mass concentration of the methanol solution of the p-methyl benzenesulfonic acid is 12~18%.
Preferably, step（1）The blade of the blender is push type, helical-ribbon type, screw, frame, anchor formula or fan
Formula, stirring linear velocity are 20~40m/min.
Preferably, step（2）The addition of the poly (aryl ether sulfone ketone) is the 4~8% of mixture A mass.
Preferably, step（3）The curing agent is vinyl triamine, isophorone diamine, diaminocyclohexane, methylene
At least one of bis cyclohexane amine, diethylenetriamine, dimethylamine propylamine or trimethylhexamethylenediamine, addition are mixed
Close the 1~2% of object B mass.
Preferably, step（3）The chain extender is 1,4-butanediol, 1,6- hexylene glycols, glycerine, trimethylolpropane, two
At least one of glycol, triethylene glycol, neopentyl glycol or diethylaminoethanol, addition for mixture B mass 0.2~
0.5%。
Preferably, step（3）The organo-silicon coupling agent is gamma-aminopropyl-triethoxy-silane, vinyl triethoxyl
At least one of silane or γ-methacryloxypropyl trimethoxy silane, addition are the 0.5 of mixture B mass
~1%.
Preferably, step（3）Temperature when stopping heating for 83~86 DEG C, temperature of reaction system should maintain 85~
98 DEG C, when system is seethed with excitement, water flowing is answered to cool down.
Preferably, it is characterised in that：Step（3）The vacuum dehydration is using double conic rotary vacuum dryer, vacuum disc type
One kind in drying machine or vacuum rake dryer, in vacuum dewatering process, the speed of mainshaft is 80~100r/min, temperature 60
~70 DEG C, dewatering time for 18~for 24 hours.
Modified phenolic resin adhesive prepared by the present invention is changed with cyanurotriamide modified method, organic-silicon-modified method and aromatic hydrocarbons
Property adhesion strength, heat resisting temperature and the filming performance of modified phenolic resin adhesive for preparing of method compared, as a result such as 1 institute of table
Show, it is seen then that method of the invention can effectively improve the adhesion strength and heat resistance of phenolic resin adhesive, while improve into
Film properties.
Table 1：
The present invention provides a kind of LED display binding agent and preparation method thereof, compared with prior art, the characteristics of protruding and
Excellent effect is：
1. modified phenolic resin adhesive prepared by the present invention has good water resistance, weatherability and corrosion resistance, application
Extensively.
2. in the preparation of the present invention, by modification of the poly (aryl ether sulfone ketone) to phenolic resin, improve binding agent toughness and
Mechanical property.
3. the modified phenolic resin adhesive of the preparation of the present invention has, excellent high temperature resistance and cohesive force are stronger, energy
It is widely used on LED display.
4. the preparation method of the present invention, raw material are easy to get, process is simple, and cost is relatively low, can be applicable.
Specific embodiment
In the following, the present invention will be further described in detail by way of specific embodiments, but this should not be interpreted as to the present invention
Scope be only limitted to following example.Without departing from the idea of the above method of the present invention, according to ordinary skill
The various replacements or change that knowledge and customary means are made, should be included in the scope of the present invention.
Embodiment 1
The phenol of 25kg, the formaldehyde of 12kg, the triethylamine of 0.5kg, 0.5kg concentration are added in the reaction kettle with insulation jacket
The methanol solution for the p-methyl benzenesulfonic acid that the styrene of ammonium hydroxide, 58kg for 22%, 4kg mass concentrations are 15% is opened push type and is stirred
It mixes device to be uniformly mixed with the linear velocity of 30m/min, obtains mixture A；Then the poly (aryl ether sulfone ketone) of 6kg is added in into mixture A,
And be uniformly mixed, obtain mixture B；Then vinyl triamine, the Isosorbide-5-Nitrae-fourth two of 0.4kg of 2kg is added in into mixture B
The gamma-aminopropyl-triethoxy-silane of alcohol and 0.8kg, is uniformly mixed, heater, when temperature is increased to 85 DEG C,
Stop heating, temperature maintains 85~98 DEG C, and with formaldehyde polycondensation reaction occurs for phenol, and liberated heat makes system temperature after of continuing rising
Height maintains the progress of reaction；After the completion of reaction, discharging, then using double conic rotary vacuum dryer vacuum dehydration at 65 DEG C
The phenolic resin that poly (aryl ether sulfone ketone) is modified is made in 21h, moisture and volatile matter in removing system, can be used as the viscous of LED display
Tie agent；
Modified phenolic resin adhesive prepared by embodiment 1, test adhesion strength, heat resisting temperature and filming performance, obtained knot
Fruit is as shown in table 2.
Embodiment 2
The phenol of 21kg, the formaldehyde of 12kg, the triethylamine of 0.4kg, 0.6kg concentration are added in the reaction kettle with insulation jacket
The methanol solution for the p-methyl benzenesulfonic acid that the perchloroethylene of ammonium hydroxide, 62kg for 20%, 4kg mass concentrations are 12~18% opens spiral shell
Ribbon agitator is uniformly mixed with the linear velocity of 20~40m/min, obtains mixture A；Then add in 4kg's into mixture A
Poly (aryl ether sulfone ketone), and be uniformly mixed, obtain mixture B；Then into mixture B add in 1.1kg isophorone diamine,
1, the 6- hexylene glycols of 0.3kg and the vinyltriethoxysilane of 0.6kg, are uniformly mixed, heater, treat temperature liter
At up to 84 DEG C, stop heating, temperature maintains 85~98 DEG C, and with formaldehyde polycondensation reaction occurs for phenol, and liberated heat makes body
It is that temperature continues to raise, maintains the progress of reaction；After the completion of reaction, discharging, then using double conic rotary vacuum dryer 60
For 24 hours, moisture and volatile matter in removing system are made the phenolic resin that poly (aryl ether sulfone ketone) is modified, can be used as vacuum dehydration at DEG C
The binding agent of LED display；
Modified phenolic resin adhesive prepared by embodiment 2, test adhesion strength, heat resisting temperature and filming performance, obtained knot
Fruit is as shown in table 2.
Embodiment 3
The phenol of 28kg, the formaldehyde of 14kg, the triethylamine of 0.6kg, 0.6kg concentration are added in the reaction kettle with insulation jacket
The methanol solution for the p-methyl benzenesulfonic acid that the ethylene glycol ether of ammonium hydroxide, 51.8kg for 25%, 5kg mass concentrations are 18% is opened
Screw blender is uniformly mixed with the linear velocity of 40m/min, obtains mixture A；Then the poly- of 8kg is added in into mixture A
Aryl ether sulfone ketone, and be uniformly mixed, obtain mixture B；Then into mixture B add in 2kg diaminocyclohexane,
The glycerine of 0.5kg and γ-methacryloxypropyl trimethoxy silane of 1kg, are uniformly mixed, heater,
When temperature is increased to 86 DEG C, stop heating, temperature maintains 85~98 DEG C, and with formaldehyde polycondensation reaction occurs for phenol, releasing
Heat makes system temperature continue to raise, and maintains the progress of reaction；After the completion of reaction, discharging, then using vacuum disc type drying machine
The phenolic aldehyde tree that poly (aryl ether sulfone ketone) is modified is made in the vacuum dehydration 19h at 60~70 DEG C, moisture and volatile matter in removing system
Fat can be used as the binding agent of LED display；
Modified phenolic resin adhesive prepared by embodiment 3, test adhesion strength, heat resisting temperature and filming performance, obtained knot
Fruit is as shown in table 2.
Embodiment 4
The phenol of 24kg, the formaldehyde of 13kg, the triethylamine of 0.5kg, 0.4kg concentration are added in the reaction kettle with insulation jacket
The methanol solution for the p-methyl benzenesulfonic acid that the trichloro ethylene of ammonium hydroxide, 57.1kg for 22%, 5kg mass concentrations are 17% opens frame
Blender is uniformly mixed with the linear velocity of 40m/min, obtains mixture A；Then the polyether sulphone of 7kg is added in into mixture A
Ketone, and be uniformly mixed, obtain mixture B；Then into mixture B add in 1.6kg di-2-ethylhexylphosphine oxide hexamethylene alkanamine,
The trimethylolpropane of 0.4kg and the gamma-aminopropyl-triethoxy-silane of 0.8kg, are uniformly mixed, and heater is treated
When temperature is increased to 86 DEG C, stop heating, temperature maintains 85~98 DEG C, and with formaldehyde polycondensation reaction, the heat of releasing occur for phenol
Amount makes system temperature continue to raise, and maintains the progress of reaction；After the completion of reaction, then discharging is existed using vacuum disc type drying machine
Vacuum dehydration 20h at 64 DEG C, moisture and volatile matter in removing system are made the phenolic resin that poly (aryl ether sulfone ketone) is modified, can use
Make the binding agent of LED display；
Modified phenolic resin adhesive prepared by embodiment 4, test adhesion strength, heat resisting temperature and filming performance, obtained knot
Fruit is as shown in table 2.
Embodiment 5
The phenol of 27kg, the formaldehyde of 13kg, the triethylamine of 0.6kg, 0.4kg concentration are added in the reaction kettle with insulation jacket
The methanol solution for the p-methyl benzenesulfonic acid that the hexamethylene of ammonium hydroxide, 54kg for 24%, 5kg mass concentrations are 12~18% opens anchor formula
Blender is uniformly mixed with the linear velocity of 35m/min, obtains mixture A；Then the polyether sulphone of 7kg is added in into mixture A
Ketone, and be uniformly mixed, obtain mixture B；Then the diethylenetriamine of addition 1.5kg, the two of 0.3kg into mixture B
The vinyltriethoxysilane of glycol and 0.7kg, is uniformly mixed, heater, when temperature is increased to 85 DEG C, stops
It only heats, temperature maintains 85~98 DEG C, and with formaldehyde polycondensation reaction occurs for phenol, and liberated heat makes system temperature after of continuing rising
Height maintains the progress of reaction；After the completion of reaction, discharging, then using vacuum rake dryer at 66 DEG C vacuum dehydration 22h,
Moisture and volatile matter in removing system are made the phenolic resin that poly (aryl ether sulfone ketone) is modified, can be used as the bonding of LED display
Agent；
Modified phenolic resin adhesive prepared by embodiment 5, test adhesion strength, heat resisting temperature and filming performance, obtained knot
Fruit is as shown in table 2.
Embodiment 6
The phenol of 25kg, the formaldehyde of 13kg, the triethylamine of 0.5kg, 0.5kg concentration are added in the reaction kettle with insulation jacket
The methanol solution for the p-methyl benzenesulfonic acid that the ethylene glycol ether of ammonium hydroxide, 56kg for 21%, 5kg mass concentrations are 14% opens wind
Fan formula blender is uniformly mixed with the linear velocity of 25m/min, obtains mixture A；Then the poly- virtue of 5kg is added in into mixture A
Ether sulfone ketone, and be uniformly mixed, obtain mixture B；Then the tri-methyl hexamethylene two of 1.8kg is added in into mixture B
γ-methacryloxypropyl trimethoxy silane of amine, the diethylaminoethanol of 0.4kg and 0.8kg is stirred
Even, heater when temperature is increased to 86 DEG C, stops heating, and temperature maintains 85~98 DEG C, and phenol contracts with formaldehyde
Poly- reaction, liberated heat make system temperature continue to raise, and maintain the progress of reaction；After the completion of reaction, discharging, then using double
Rotary vacuum dryer vacuum dehydration 22h at 65 DEG C is bored, moisture and volatile matter in removing system, obtained poly (aryl ether sulfone ketone) change
The phenolic resin of property, can be used as the binding agent of LED display；
Modified phenolic resin adhesive prepared by embodiment 6, test adhesion strength, heat resisting temperature and filming performance, obtained knot
Fruit is as shown in table 2.
Comparative example 1
It is not added with poly (aryl ether sulfone ketone) to be modified, other preparation conditions are consistent with embodiment 6.
Phenolic resin adhesive prepared by comparative example 1, test adhesion strength, heat resisting temperature and filming performance, obtained knot
Fruit is as shown in table 2；
Table 2：
Claims (10)
1. a kind of preparation method of LED display binding agent, which is characterized in that by phenol, formaldehyde, triethylamine, ammonium hydroxide, You Jirong
Agent, the methanol solution of p-methyl benzenesulfonic acid and poly (aryl ether sulfone ketone) are stirred, and it is even then to add in curing agent, chain extender and organosilicon
Join agent, be mixed and heated being reacted, then discharge, be dehydrated the phenolic resin being modified up to poly (aryl ether sulfone ketone), can be used as
The binding agent of LED display, preparation are as follows：
（1）In the reaction kettle with insulation jacket, add in phenol, formaldehyde by certain mass ratio, triethylamine, ammonium hydroxide, have
The methanol solution of solvent, p-methyl benzenesulfonic acid, turn on agitator are uniformly mixed, and obtain mixture A；Wherein, 20~30 weight of phenol
Measure part, 10~15 parts by weight of formaldehyde, 0.4~0.6 parts by weight of triethylamine, 0.4~0.6 parts by weight of ammonium hydroxide, organic solvent 47.8~
66.2 parts by weight, 3~6 parts by weight of methanol solution of p-methyl benzenesulfonic acid；
（2）The poly (aryl ether sulfone ketone) of certain mass ratio is added in into mixture A, and is uniformly mixed, obtains mixture B；
（3）Curing agent, chain extender and the organo-silicon coupling agent of certain mass ratio are added in into mixture B, is uniformly mixed,
Heater when temperature is increased to certain value, stops heating, and with formaldehyde polycondensation reaction occurs for phenol, and liberated heat makes
System temperature continues to raise, and maintains the progress of reaction；
（4）After the completion of reaction, then discharging carries out vacuum dehydration, and the moisture and volatile matter in removing system show to get LED
The phenolic resin that the binding agent of screen --- poly (aryl ether sulfone ketone) is modified.
2. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（1）It is described to have
Solvent is one kind in styrene, perchloroethylene, ethylene glycol ether, trichloro ethylene or hexamethylene.
3. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（1）The ammonia
The mass concentration of water is 20~25%；The mass concentration of the methanol solution of the p-methyl benzenesulfonic acid is 12~18%.
4. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（1）It is described to stir
The blade of device is mixed as push type, helical-ribbon type, screw, frame, anchor formula or fan-type, stirring linear velocity is 20~40m/min.
5. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（2）It is described poly-
The addition of aryl ether sulfone ketone is the 4~8% of mixture A mass.
6. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（3）It is described solid
Agent is vinyl triamine, isophorone diamine, diaminocyclohexane, di-2-ethylhexylphosphine oxide hexamethylene alkanamine, diethylenetriamine, dimethylamine
At least one of base propylamine or trimethylhexamethylenediamine, addition are the 1~2% of mixture B mass.
7. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（3）The expansion
Chain agent is 1,4-butanediol, 1,6- hexylene glycols, glycerine, trimethylolpropane, diethylene glycol (DEG), triethylene glycol, neopentyl glycol or diethylamino
At least one of base ethyl alcohol, addition are the 0.2~0.5% of mixture B mass.
8. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（3）It is described to have
Machine silicone couplet is gamma-aminopropyl-triethoxy-silane, vinyltriethoxysilane or γ-methacryloxypropyl three
At least one of methoxy silane, addition are the 0.5~1% of mixture B mass.
9. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（3）It is described to stop
Temperature when only heating is 83~86 DEG C, and temperature of reaction system maintains 85~98 DEG C, when system is seethed with excitement, water flowing cooling.
10. a kind of preparation method of LED display binding agent according to claim 1, it is characterised in that：Step（3）It is described
Vacuum dehydration uses one kind in double conic rotary vacuum dryer, vacuum disc type drying machine or vacuum rake dryer, and vacuum takes off
During water, the speed of mainshaft is 80~100r/min, and temperature is 60~70 DEG C, dewatering time for 18~for 24 hours.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111077757A (en) * | 2019-12-03 | 2020-04-28 | 东莞市晶博光电有限公司 | Stereoscopic watch dial and manufacturing process thereof |
| CN114644743A (en) * | 2022-04-29 | 2022-06-21 | 浙江安益新材料有限公司 | Preparation process of low-temperature fast curing phenolic resin |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104877583A (en) * | 2015-06-16 | 2015-09-02 | 黑龙江省科学院石油化学研究院 | High-temperature-resistant phenolic unsupported structural adhesive film and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104877583A (en) * | 2015-06-16 | 2015-09-02 | 黑龙江省科学院石油化学研究院 | High-temperature-resistant phenolic unsupported structural adhesive film and preparation method thereof |
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| CN111077757A (en) * | 2019-12-03 | 2020-04-28 | 东莞市晶博光电有限公司 | Stereoscopic watch dial and manufacturing process thereof |
| CN114644743A (en) * | 2022-04-29 | 2022-06-21 | 浙江安益新材料有限公司 | Preparation process of low-temperature fast curing phenolic resin |
| CN114644743B (en) * | 2022-04-29 | 2022-12-02 | 浙江安益新材料有限公司 | Preparation process of low-temperature fast curing phenolic resin |
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