CN104183779A - 填充膜以及利用该填充膜制造有机发光显示设备的方法 - Google Patents

填充膜以及利用该填充膜制造有机发光显示设备的方法 Download PDF

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CN104183779A
CN104183779A CN201410114298.9A CN201410114298A CN104183779A CN 104183779 A CN104183779 A CN 104183779A CN 201410114298 A CN201410114298 A CN 201410114298A CN 104183779 A CN104183779 A CN 104183779A
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film
filling
packing material
thickness
substrate
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CN104183779B (zh
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金正洙
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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    • B32B7/06—Interconnection of layers permitting easy separation
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
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Abstract

本发明提供了一种填充膜以及利用该填充膜制造有机发光显示设备的方法。所述填充膜包括：填充材料；第一脱离膜，附着到填充材料的表面；第二脱离膜，附着到填充材料的另一表面；以及支撑层，附着到第二脱离膜。第二脱离膜和支撑层之间的结合力大于填充材料和第二脱离膜之间的结合力。

Description

填充膜以及利用该填充膜制造有机发光显示设备的方法
本申请要求于2013年5月22日在韩国知识产权局提交的第10-2013-0057953号韩国专利申请的权益，该申请的公开内容通过引用被全部包含于此。
技术领域
本发明的示例性实施例涉及填充膜以及利用该填充膜制造有机发光显示设备的方法，更具体地讲，涉及能够改善有机发光显示设备的制造效率的填充膜以及利用该填充膜制造有机发光显示设备的方法。
背景技术
近来，显示设备已经被便携式薄膜平板显示设备取代。在平板显示设备中，场发射显示设备是具有宽视角和高对比度的发射显示设备，因此，平板显示设备作为下一代显示设备引发人们关注。另外，其中发光层由有机材料形成的有机发射显示设备具有诸如宽视角、高对比度、短响应时间和多种颜色显示的可期望的特性。
有机发光显示设备通常包括在其上形成显示单元的基底以及在显示单元上形成的包封基底，并且基底和包封基底利用密封剂彼此组合。然而，由于有机发光显示设备的尺寸不断改善的趋势，也改善了包封基底的尺寸和重量。因此，为了确保有机发光显示设备的结构可靠性，已经开发了在基底和包封基底之间还包括填充膜的方法。
发明内容
本发明的示例性实施例提供一种能提高有机发光显示设备的制造效率的填充膜以及通过利用该填充膜制造有机发光显示设备的方法。
本发明的示例性实施例公开一种填充膜。所述填充膜包括：填充材料；第一脱离膜，附着到填充材料的第一表面；第二脱离膜，附着到填充材料的第二表面；以及支撑层，附着到第二脱离膜。第二脱离膜和支撑层之间的结合力大于填充材料和第二脱离膜之间的结合力。
本发明的示例性实施例还公开一种制造显示设备的方法。所述方法包括：将填充膜从堆叠多个填充膜的堆叠件分离；在膜台上将分离的填充膜置于中心；在包封基底上层叠填充膜的填充材料；以及将包封基底和包括显示单元的基底组合。在层叠之前，填充膜包括：附着到填充材料的第一表面的第一脱离膜、附着到填充材料的第二表面的第二脱离膜和附着到第二脱离膜的支撑层，支撑层包括聚对苯二甲酸乙二酯并具有大约50微米至大约100微米范围的厚度。
本发明的示例性实施例还公开了：具有第一厚度的第一脱离膜、设置在第一脱离膜上的填充材料、设置在填充材料上并具有第二厚度且第二厚度小于第一厚度的第二脱离膜以及设置在第二脱离膜上的支撑层。支撑层包括聚对苯二甲酸乙二酯并具有大于第二厚度的第三厚度。
将理解的是，前面的概括描述和下面的详细描述是示例性的和说明性的，并且旨在提供对所要求保护的本发明的进一步解释。
附图说明
通过参照附图详细描述本发明的示例性实施例，本发明的以上和其他特征以及优点将变得更明显。
图1是根据本发明示例性实施例的有机发光显示设备的示意性剖视图。
图2是图1的有机发光显示设备的显示单元的示意性剖视图。
图3是用于形成图1的有机发光显示设备的填充材料的填充膜的剖视图。
图4、图5、图6和图7是示出制造图1的有机发光显示设备的方法的示意性剖视图。
具体实施方式
尽管示例性实施例能够进行各种修改和可选择的形式，通过示例在图中示出了其实施例，并在此将对其进行详细描述。然而，应该理解的是，并非意图将示例性实施例限制为公开的具体形式，而是相反，示例性实施例覆盖落入本发明的范围内的所有的修改、等同物和替代物。在描述本发明时，当相对于相关的已知功能和构造的实际描述会不必要地使得本发明的范围不清楚时，将省略对它们的描述。
将理解的是，尽管在这里可使用术语“第一”、“第二”等来描述不同的元件，但是这些元件不应受这些术语的限制。这些术语仅是用来将一个元件与另一个元件区分开来。
将理解的是，当元件或层被称作“在”另一元件或层“上”或“连接到”另一元件或层时，该元件或层可以直接在另一元件或层上或直接连接到另一元件或层，或者可存在中间元件或中间层。相反，当元件被称作“直接在”另一元件或层“上”或“直接连接到”另一元件或层时，不存在中间元件或中间层。将理解的是，出于本公开的目的，“X、Y和Z中的至少一个（种）”可以被解释为只有X、只有Y、只有Z或X、Y和Z的任意两项或多个项的组合（例如，XYZ、XYY、YZ、ZZ）。
在下文中，将参照附图更充分地描述本发明，在附图中示出了本发明的示例性实施例。在参照附图描述本发明的示例性实施例时，相同的附图标记被用于基本相同或彼此对应的元件，并且将不会对其重复描述。在附图中，为了层和区域的清楚起见，可能放大了厚度。另外，为了便于描述，可能夸大了一些层和区域。
图1是根据本发明的示例性实施例的有机发光显示设备10的示意性剖视图。图2是图1的有机发光显示设备10的显示单元200的示意性剖视图。
参照图1和图2，有机发光显示设备10包括基底100在基底100上形成的显示单元200、设置为与基底100面对的包封基底400、通过将基底100和包封基底400组合来密封显示单元200的密封材料310、以及在显示单元200和包封基底400之间的填充材料500。
基底100可以由包括SiO2作为主要成分的透明玻璃材料形成。然而，基底100可以利用其他材料形成。例如，基底100可以由透明塑料材料形成。用于形成基底100的塑料材料可以包括例如诸如聚醚砜（PES）、聚丙烯酸酯（PAR）、聚醚酰亚胺（PEI）、聚萘二甲酸乙二醇酯（PEN）、聚对苯二甲酸乙二酯（PET）、聚苯硫醚（PPS）、聚烯丙基化物、聚酰亚胺、聚碳酸酯（PC）、三乙酸酯（TAC）或乙酸-丙酸纤维（CAP）中的至少一种绝缘有机材料。
当有机发光显示设备10是图像沿朝着基底100的方向实现的底部发射型时，基底100由透明材料形成。然而，当有机发光显示设备10是图像沿着与基底100相反的方向实现的顶部发射型时，基底100可以由诸如金属材料的反射材料形成。当基底100由金属材料形成时，基底100可以包括例如碳、铁、铬、锰、镍、钛、钼和不锈钢（SUS）中的至少一种。
显示单元200可以包括薄膜晶体管层200a和像素单元200b。薄膜晶体管层200a可以利用有机材料、无机材料或可以用于形成薄膜晶体管的任何其他材料形成。像素单元200b可以是有机发光装置（OLED）。在下文中，将参照图2详细地描述显示单元200。
缓冲层212可以形成在基底100上。缓冲层212阻止杂质元素渗透到基底100中并且在基底100上提供平坦的表面。缓冲层212可以由执行以上描述的功能的各种材料形成。例如，缓冲层212可以包括例如诸如氧化硅、氮化硅、氮氧化硅、氧化铝、氮化铝、氧化钛和氮化钛中的至少一种无机材料或者诸如聚酰亚胺、聚酯和压克力中的至少一种有机材料，并且通过利用以上描述的材料形成为层的堆叠件。
缓冲层212可以利用例如等离子体增强化学气相沉积（PECVD）方法、常压CVD方法或低压CVD方法的各种方法沉积。
有源层221可以由诸如硅的无机半导体或者有机半导体形成在缓冲层212上。另外，有源层221包括源极区域、漏极区域和/或源极区域和漏极区域之间的沟道区域。例如，当有源层221由非晶硅形成时，有源层221可以通过如下步骤来形成：在缓冲层212的整个表面上形成非晶硅层之后；通过使非晶硅层结晶来形成多晶硅层。将多晶硅层图案化之后，在其边缘上具有源极区域和漏极区域以及位于源极区域和漏极区域之间的沟道区的有源层221通过利用掺杂剂掺杂源极区域和漏极区域来形成。
栅极绝缘膜213形成在有源层221上。栅极绝缘膜213形成为使有源层221与栅电极222绝缘，并且栅极绝缘膜213可以由诸如SiNx或SiO2的无机材料形成。
栅电极222形成在栅极绝缘膜213的上表面上。栅电极222连接到栅极线（未示出），通过栅极线向薄膜晶体管（TFT）施加导通/截止信号。
栅电极222可以包括例如诸如Au、Ag、Cu、Ni、Pt、Pd、Al和Mo的至少一种金属材料，并且可以包括诸如Al-Nd或Mo-W的合金。然而，考虑到设计条件，栅电极222可以由其他材料形成。
在栅电极222上形成的层间绝缘层214形成为使栅电极222与源电极和漏电极223绝缘，并且层间绝缘层214可以由诸如SiNx或SiO2的无机材料形成。
源电极和漏电极223形成在层间绝缘层214上。更具体地讲，接触孔形成在层间绝缘层214和栅极绝缘膜213中以暴露有源层221的源极区域和漏极区域，并且源电极和漏电极223通过接触孔电连接到有源层221的暴露的源极区域和漏极区域。
图2描绘了依次包括有源层221、栅电极222及源电极和漏电极223的顶部栅极型TFT。然而，TFT可以具有其他结构。例如，栅电极222可以设置在有源层221下方。
上述的有机薄膜晶体管层200a电连接到像素单元200b以驱动像素单元200b，并且通过被平坦化膜215覆盖而受到保护。
平坦化膜215可以是无机绝缘膜和/或有机绝缘膜。无机绝缘膜可以包括例如SiO2、SiNx、SiON、Al2O3、TiO2、Ta2O5、ZrO2、BST和PZT中的至少一种。有机绝缘膜可以包括例如通用聚合物（诸如，聚甲基丙烯酸甲酯（PMMA）或聚苯乙烯（PS）、具有苯酚基团的聚合物衍生物、丙烯酰聚合物、酰亚胺聚合物、芳基醚聚合物、酰胺聚合物、氟化聚合物、对二甲苯聚合物（p-gilyrene polymer）、乙烯醇聚合物和这些材料的共混物）中的至少一种。另外，平坦化膜215可以形成为无机绝缘膜和有机绝缘膜的复合堆叠层。
像素单元200b形成在平坦化膜215上。像素单元200b可以包括像素电极231、中间层232和对电极233。
像素电极231可以形成在平坦化膜215上，并且通过形成在平坦化膜215中的接触孔230电连接到源电极或漏电极223。
像素电极231可以是反射电极，在这种情况下，像素电极231可以包括反射膜以及形成在反射膜上的透明或半透明电极，反射膜包括例如Ag、Mg、Al、Pt、Pd、Au、Ni、Nd、Ir、Cr和这些材料的化合物中的至少一种。透明或半透明电极可以包括例如氧化铟锡（ITO）、氧化铟锌（IZO）、氧化锌（ZnO）、氧化铟（In2O3）和氧化铟镓（IGO）中的至少一种。
面向像素电极231的对电极233可以是透明电极或半透明电极，并且可以由具有低逸出功的金属薄膜形成。金属薄膜可以包括例如Li、Ca、LiF/Ca、LiF/Al、Al、Ag、Mg和这些材料的化合物中的至少一种。另外，在金属薄膜上还可以形成由用于形成例如ITO、IZO、ZnO或In2O3的透明电极的材料形成的辅助电极层或汇流电极。
因此，对电极233可以传输从包括在中间层232中的有机发光层（未示出）发射的光。即，从有机发光层发射的光可以直接地朝着对电极233释放，或者被形成为反射电极的像素电极231反射。
有机发光显示设备10可以具有其他构造。例如，有机发光显示设备10可以是光朝着基底100释放的底部发射型有机发光显示设备。当有机发光显示设备10是底部发射型时，像素电极231可以形成为透明或半透明电极，并且对电极233可以形成为反射电极。另外，有机发光显示设备10可以是光沿着顶部和底部两个方向发射的双发光显示设备。
利用绝缘材料在像素电极231上形成像素限定层216。像素限定层216可以包括例如聚酰亚胺、聚酰胺、丙烯酸树脂、苯并环丁烯和酚树脂中的至少一种并且通过旋涂方法形成。像素限定层216暴露像素电极231的一部分，并且包括有机发光层的中间层232位于像素电极231的暴露的部分上。
包括在中间层232中的有机发光层（未示出）可以由低分子量有机材料或高分子量有机材料形成。除有机发光层之外，中间层232还可以选择性地包括诸如空穴传输层（HTL）、空穴注入层（HIL）、电子传输层（ETL）和电子注入层（EIL）的功能层。
在其上包括显示单元200的基底100与设置在显示单元200上的包封基底400组合。包封基底400可以由各种材料形成。例如，除了玻璃材料以外，包封基底400可以由塑料材料（诸如亚克力）形成，此外，包封基底400可以由金属板形成。
基底100和包封基底400通过利用密封材料310组合。密封材料310可以是通常使用的材料，诸如密封玻璃料。密封材料310和包封基底400阻挡外部湿气或空气到达显示单元200。
吸湿剂320还可以设置在密封材料310的侧部。吸湿剂320容易与湿气和氧起反应，因此，防止由于湿气和氧导致的OLED的寿命的缩短，吸湿剂320可以包括例如碱金属氧化物、碱土金属氧化物、金属卤化物、硫酸锂、金属硫酸盐、金属高氯酸盐以及硅胶与五氧化二磷中的一者之中的至少一种，或这些材料的混合物。然而，吸湿剂320的类型和位置可具有各种其它构造。
填充材料500被包括在由密封材料310密封的内侧区域中。包括填充材料500，以填充基底100和包封基底400之间的空间。
填充材料500可以包括例如环氧树脂、丙烯酸树脂、硅、乙烯醋酸乙烯酯（ETA）和聚乙烯中的至少一种。填充材料500可以具有大约10微米至大约30微米范围的厚度T。填充材料500可以具有热硬化射线或紫外线（UV）射线硬化特性，并且可以包括诸如硬化剂、抗氧化剂和偶联剂的各种添加剂。
以上描述的填充材料500可以利用在图3中描绘的填充膜500A形成。现在将参照图3详细描述填充膜500A。
图3是用于形成图1的有机发光显示设备10的填充材料500的填充膜500A的剖视图。
参照图3，填充膜500A可以包括填充材料500、附着到填充材料500的第一表面的第一脱离膜501、附着到填充材料500的第二表面的第二脱离膜502以及附着在第二脱离膜502上的支撑层503。
填充材料500可以具有大约10微米至大约30微米范围的厚度，并且如上所述，可以由环氧树脂、丙烯酸树脂、硅、乙烯醋酸乙烯酯（ETA）和聚乙烯中的至少一种形成。
第一脱离膜501和第二脱离膜502保护填充材料500，并在有机发光显示设备10的制造工艺期间与填充材料500分离。第一脱离膜501和第二脱离膜502均可以包括例如聚甲基戊烯膜、聚对苯二甲酸乙二酯（PET）膜、膜和聚丙烯膜中的至少一种。
如下面描述的，在制造有机发光显示设备10的工艺期间，第一脱离膜501和第二脱离膜502可以顺序地从填充材料500分离，更具体地讲，根据一个示例性实施例，在将第一脱离膜501从填充材料500分离之前，可以使第二脱离膜502从填充材料500分离。因此，在这种情况下，当第二脱离膜500被分离时，第一脱离膜501应保持附着到填充材料500。因此，第一脱离膜501和填充材料500之间的结合力应大于第二脱离膜502和填充材料500之间的结合力。
为此，第一脱离膜501可以比第二脱离膜502厚。例如，第一脱离膜501可以具有大约50微米至大约100微米范围的厚度，第二脱离膜502可以具有大约20微米至大约50微米范围的厚度。因此，因为第一脱离膜501比第二脱离膜502厚，所以第一脱离膜501和填充材料500之间的结合力大于第二脱离膜502和填充材料500之间的结合力，因此，可以稳定地执行制造有机发显示设备10的工艺。
支撑层503附着到第二脱离膜502，增加了填充膜500A的总体厚度和重量，并且可以防止由于施加到填充膜500A的侧面的压力而导致填充膜500A弯曲或起皱。
支撑层503可以包括例如PET，但是不限于此。
在制造有机发光显示设备10的工艺期间，支撑层503不与第二脱离膜502分离。而是，当第二脱离膜502从填充材料500分离时，支撑层503和第二脱离膜502一起从填充材料500分离。因此，支撑层503和第二脱离膜502之间的结合力应大于第二脱离膜502和填充材料500之间的结合力。
为了实现这种较大的结合力，支撑层503可以具有大约50微米至大约100微米范围的厚度。当支撑层503小于50微米厚度时，在对准填充膜500A的工艺（如下参照图5描述）中，填充膜500A可能由于定心鞘720（参照图5）而弯曲或起皱。另外，当支撑层503小于50微米厚度时，支撑层503和第二脱离膜502之间的结合力减小，因此，当第二脱离膜502从填充材料500分离时，支撑层503可能从第二脱离膜502分离，从而降低了制造有机发光显示设备10的效率。
当支撑层503大于100微米厚时，极大地增加了填充膜500A的重量，因此，填充膜500A可能未被拾取单元620（参照图4）提起。因此，支撑层503可以具有大约50微米至大约100微米范围的厚度。
支撑层503的上表面可以被静电屏蔽。通过在支撑层503的上表面上涂覆抗静电剂可以获得静电屏蔽。可以使用其他方法来获得静电屏蔽。例如，当支撑层503包括抗静电剂时，可以实现静电屏蔽。
以这种方式，当支撑层503的上表面被静电屏蔽时，如在图4中所示，当通过堆叠多个填充膜500A形成层堆叠件500B时，可以防止填充膜500A之间的静电力的作用。因此，拾取单元620（参照图4）可以容易地逐片地提起填充膜500A。
图4至图7是示出制造图1的有机发光显示设备10的方法的示意剖视图。虽然以下描述的方法涉及有机发光显示设备的制造，但是本发明的示例性实施例可以应用到任何显示设备或用于其保护（诸如保护以免冲击、空气或湿气）而密封的发光体。
根据本发明的示例性实施例，制造有机发光显示设备10的方法包括：将填充膜500A逐片地从层堆叠件500B分离；将分离的填充膜500A在膜台710的中心上对准；使对准的填充膜500A的填充材料500与包封基底400叠置；并且使在其上形成显示单元200的基底100与包封基底400组合。
在下文中，现在将参照图3和图4至图7详细地描述制造有机发光显示设备10的方法。
将填充膜500A逐片地从层堆叠件500B分离的步骤包括：如在图4中所示，通过拾取单元620从层堆叠件500B逐片地提起填充膜500A，其中，层堆叠件500B通过堆叠多个填充膜500A形成。
拾取单元620包括真空垫（未示出），并且在真空垫接触层堆叠件500B的上表面之后真空垫通过真空力提起层堆叠件500B的最上面的填充膜500A。在一些示例性实施例中，由于真空力，拾取单元620可以在不实际接触最上面的填充膜500A的情况下提起最上面的填充膜500A。
堆叠的填充膜由于摩擦而可能产生静电。静电力可以在彼此接触的两个填充膜之间起作用，因此，填充膜可能不容易逐片地分离。当两片填充膜同时被提起并且进入像图5中所示的定心工艺时，在制造有机发光显示设备的工艺中可能发生差错，因此降低了制造效率。
然而，根据本发明的示例性实施例，除了包括填充材料500和附着到填充材料500的两侧的第一脱离膜501和第二脱离膜502之外，由于填充膜500A还包括支撑层503，所以可以增加填充膜500A的总体重量。从而，填充膜500A可以容易地逐片地被拾取单元620提起。另外，当提起填充膜500A时，拾取单元620可以执行至少一次震动操作。由于拾取单元620的分离操作，即使提起两片或更多片填充膜500A，由于支撑层503增加的重量，填充膜500A也可以容易地逐片地分离。
另外，根据本发明的示例性实施例，支撑层503的上表面可以被静电屏蔽。因此，可以防止或减小堆叠的填充膜500A之间的静电的产生。因此，可以有效地执行填充膜500A的分离操作。换句话说，可以在逐片的基础上更容易地拾取填充膜500A，并且在拾取两个或更多个填充膜500A的情况下，由于拾取单元620的震动操作，可以更容易地分离两个或更多个填充膜500A，因此，留下附着到拾取单元620的单个填充膜500A。
表1总结了分离操作的成功率。这里“成功”指的是通过拾取单元620初次拾取单个填充膜500A，或者在拾取两个或更多个填充膜500A的情况下，拾取单元620的震动操作导致留下附着到拾取单元620的单个填充膜500A。在比较示例中，填充膜500A包括填充材料500、第一脱离膜501和第二脱离膜502，但是不包括支撑层503。然而，在实施例1和实施例2中，填充膜500A额外地包括支撑层503。另外，与实施例1不同，在实施例2中，支撑层503的上表面被静电屏蔽。填充膜500A包括厚度为20微米的填充材料500、厚度为100微米的第一脱离膜501和厚度为25微米的第二脱离膜502。支撑层503具有100微米的厚度。
表1
成功率
比较示例 50%
实施例1 95%
实施例2 100%
其次，如在图5中所描绘，在膜台710上使分离的填充膜500A对准。
更具体地讲，当将填充膜500A置于膜台710上时，通过从膜台710的边缘单元移来的定心鞘720接触填充膜500A的侧表面使填充膜500A对准。对准的填充膜500A可以被吸附并固定在形成在膜台710的表面上的真空孔上。
定心鞘720在填充膜500A的四侧上施加力。此时，如果填充膜500A具有非常小的厚度，则填充膜500A可能定心鞘720施加的压力而弯曲或起皱。在这种情况下，填充膜500A可能未很少地对准并可能引起后续工艺的差错。
然而，根据本发明的示例性实施例，除了填充材料500和附着到填充材料500的两侧的第一脱离膜501和第二脱离膜502，由于填充膜500A还包括支撑层503，所以增加了填充膜500A的厚度。因此，可以防止由于定心鞘720施加到填充膜500A的侧表面的压力而导致填充膜500A弯曲或起皱。
表2总结了定心操作的成功率。这里“成功”指的是填充膜500A未发生足以引起后续工艺差错的弯曲或起皱。在比较示例中，与以上比较示例相同，填充膜500A不包括支撑层503。然而，在实施例中，填充膜500A包括支撑层503。另外，在比较示例和实施例中使用的填充膜500A与在表1的分离操作中使用的填充膜500A相同。
表2
成功率
比较示例 70%
实施例 90%或更大
如从表1和表2中看出的，在包括支撑层503的填充膜500A的情况下，实现大于90%的成功率，即，在制造有机发光显示设备10的工艺中的分离操作和定心操作中可以减小差错的发生。因此，可以提高有机发光显示设备10的制造效率。
接下来，如在图6中所示，可以将填充膜500A的填充材料500设置在包封基底400上。例如，填充材料500可以与包封基底400层叠。
将包封基底400固定在基底台410上，并且可以将包封基底400设置为面对地面。通过由真空吸附包封基底400可以使基底台410与包封基底400固定。
在膜台710上对准的填充膜500A中，将支撑层503和第二脱离膜502与填充材料500分离，并且将暴露的填充材料500设置为面对包封基底400。另外，第一脱离膜501与填充材料500保持在组合状态。为此，支撑层503和第二脱离膜502之间的结合力大于第二脱离膜502和填充材料500之间的结合力，并且第一脱离膜501和填充材料500之间的结合力大于第二脱离膜502和填充材料500之间的结合力。
可以通过沿着一个方向旋转地移动包括在膜台710的侧部上的辊730执行包封基底400和填充材料500的层叠。即，以接触包封基底400的点作为在填充材料500的侧部的起始点沿着图6中的箭头所示的方向可以执行层叠。
在填充膜500层叠在包封基底400的表面上之后，可以去除第一脱离膜501。
最后，如图7所示，通过利用密封材料310作为媒介来组合包封基底400和其上形成有显示单元200的基底100。
参照图2描述显示单元200。然而，在本领域中公知的各种有机发光显示器可以应用到当前实施例，因此，省略了制造有机发光显示设备的实际方法的描述。
可以将密封材料310形成为围绕包封基底400上的填充材料500。密封材料310可以通过涂覆液体或糊状密封材料形成。在图7中，描绘了密封材料310形成在包封基底400的表面上，但是其他构造也是可以的。例如，密封材料310可以形成在基底100的表面上。另外，吸湿剂320可以进一步形成在密封材料310的内侧。例如，吸湿剂320可以通过涂覆液体吸湿剂320形成。
执行基底100和包封基底400的组合，从而在将第一脱离膜501与填充材料500分离之后，将基底100设置为面对包封基底400，然后，通过将紫外（UV）线照射到对应于密封材料310的基底100和包封基底400在真空状态下使基底100和包封基底400组合。当在真空状态下执行组合操作时，可以减小外界湿气和外来物质的透入。
另外，当将UV线照射到基底100和包封基底400上时，基底100和包封基底400的接触密封材料310的部分熔化，因此，基底100和包封基底400可以附着。然而，这仅仅是示例性实施例，根据密封材料310的种类，基底100和包封基底400可以以各种方式附着。
虽然已经参照本发明的示例性实施例具体地示出且描述了本发明，但是本领域普通技术人员将理解的是，在不脱离如由权利要求所限定的本发明的精神和范围的情况下，在此可以在形式和细节方面进行各种改变。

Claims (20)

1.一种填充膜，所述填充膜包括：
填充材料；
第一脱离膜，附着到填充材料的第一表面；
第二脱离膜，附着到填充材料的第二表面；以及
支撑层，附着到第二脱离膜，
其中，第二脱离膜和支撑层之间的结合力大于填充材料和第二脱离膜之间的结合力。
2.根据权利要求1所述的填充膜，其中，支撑层包括聚对苯二甲酸乙二酯并且具有50微米至100微米范围的厚度。
3.根据权利要求1所述的填充膜，其中，第一脱离膜的厚度大于第二脱离膜的厚度。
4.根据权利要求3所述的填充膜，其中，第一脱离膜和填充材料之间的结合力大于第二脱离膜和填充材料之间的结合力。
5.根据权利要求1所述的填充膜，其中，支撑层的上表面被静电屏蔽。
6.一种制造显示设备的方法，所述方法包括：
将填充膜与堆叠多个填充膜的堆叠件分离；
在膜台上将分离的填充膜置于中心；
在包封基底上层叠填充膜的填充材料；以及
将包封基底和包括显示单元的基底组合，
其中，在层叠之前，填充膜包括：附着到填充材料的第一表面的第一脱离膜、附着到填充材料的第二表面的第二脱离膜和附着到第二脱离膜的支撑层，
支撑层包括聚对苯二甲酸乙二酯并且具有50微米至100微米范围的厚度。
7.根据权利要求6所述的方法，其中，支撑层的上表面被静电屏蔽。
8.根据权利要求6所述的方法，其中，第二脱离膜和支撑层之间的结合力大于第二脱离膜和填充材料之间的结合力。
9.根据权利要求6所述的方法，其中，第一脱离膜和填充材料之间的结合力大于第二脱离膜和填充材料之间的结合力。
10.根据权利要求6所述的方法，其中，第一脱离膜的厚度大于第二脱离膜的厚度。
11.根据权利要求6所述的方法，其中，分离填充膜的步骤包括：利用拾取单元的真空垫提起填充膜。
12.根据权利要求11所述的方法，其中，分离填充膜的步骤还包括当提起填充膜时或提起填充膜之后的震动操作。
13.根据权利要求6所述的方法，其中，将分离的填充膜置于中心的步骤包括：通过形成在膜台上的定心鞘来按压填充膜的侧表面，其中，支撑膜被构造为防止填充膜在置于中心的步骤期间弯曲或起皱。
14.根据权利要求6所述的方法，所述方法还包括：在层叠填充膜之前，将支撑层和第二脱离膜从填充材料分离。
15.根据权利要求6所述的方法，所述方法还包括：在组合包封基底和基底之前，将第一脱离膜从填充材料分离。
16.根据权利要求6所述的方法，所述方法还包括：在组合包封基底和基底之前，在包封基底上设置密封材料和吸湿剂。
17.一种填充膜，所述填充膜包括：
第一脱离膜，具有第一厚度；
填充材料，设置在第一脱离膜上；
第二脱离膜，设置在填充材料上并具有第二厚度，第二厚度小于第一厚度；以及
支撑层，设置在第二脱离膜上，支撑层包括聚对苯二甲酸乙二酯并且具有第三厚度，第三厚度大于第二厚度。
18.根据权利要求17所述的填充膜，其中，第一脱离膜包括聚甲基戊烯膜、聚对苯二甲酸乙二酯膜、膜和聚丙烯膜中的至少一种，第二脱离膜包括聚甲基戊烯膜、聚对苯二甲酸乙二酯膜、膜和聚丙烯膜中的至少一种。
19.根据权利要求18所述的填充膜，其中，第三厚度大于或等于50微米并且小于或等于100微米。
20.根据权利要求19所述的填充膜，其中：
支撑层的上表面被静电屏蔽，
第一厚度和第三厚度都等于100微米。
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