CN104178747B - Split type gas shower assembly and metal organic chemical vapor deposition device - Google Patents
Split type gas shower assembly and metal organic chemical vapor deposition device Download PDFInfo
- Publication number
- CN104178747B CN104178747B CN201310198956.2A CN201310198956A CN104178747B CN 104178747 B CN104178747 B CN 104178747B CN 201310198956 A CN201310198956 A CN 201310198956A CN 104178747 B CN104178747 B CN 104178747B
- Authority
- CN
- China
- Prior art keywords
- type
- gas
- plate parts
- gas distribution
- distribution member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
The present invention relates to a kind of split type gas shower assembly and metal organic chemical vapor deposition device, described gas shower assembly includes the first air inlet pipeline, second air inlet pipeline, if gas distribution member and dry plate parts, described gas distribution member includes A type and Type B gas distribution chamber, described A type, Type B gas distribution chamber interval is arranged, it is respectively used to distribute first, second gas, A type is installed in described gas distribution member, Type B plate parts, described A type, Type B plate parts respectively with described A type, Type B gas distribution chamber is oppositely arranged, described A type, Type B plate parts mutually splice, and described gas distribution member is separated with described pedestal.Gas shower modular construction provided by the present invention is simple, gas distribution member handling ease, and have only to safeguard described A type, Type B plate parts during using, decrease dismounting or the installation of whole gas shower assembly, decrease the maintenance time of described metal organic vapor phase deposition device, improve utilization rate.
Description
Technical field
The present invention relates to semiconductor Preparation equipment field, particularly relate to a kind of split type gas shower assembly and gold
Belong to organic chemical vapor deposition device.
Background technology
Chemical gaseous phase deposition (Chemical vapor deposition is called for short CVD) is that reactive material is at gaseous state bar
Part issues biochemical reaction, generates solid matter and is deposited on the solid matrix surface of heating, and then prepares solid
The technology of body material, it is achieved by chemical vapor deposition unit.Specifically, CVD device
By inlet duct, reacting gas is passed through in reative cell, and controls the reactions such as the pressure of reative cell, temperature
Condition so that reacting gas reacts, thus complete deposition process step.Chemical gaseous phase deposition comprises
Many types, as plasma gas phase deposition (Plasma Enhanced Chemical Vapor Deposition,
PECVD), low-pressure chemical vapor deposition (Low Pressure Chemical Vapor Deposition,
LPCVD) and metal organic chemical vapor deposition (Metal Organic Chemical Vapor Deposition,
MOCVD) etc., each CVD method is respectively suitable for the preparation of different types of thin film solid material.
MOCVD be mainly used in the Group III-V compound semiconductor such as gallium nitride, GaAs, indium phosphide and
The preparation of the thin layer monocrystalline functional structure material of alloy, along with above-mentioned functions structural material range of application not
Disconnected expansion, one of MOCVD device important device having become as chemical vapor deposition unit.MOCVD
General using III metal organic source and V race hydride source etc. as reacting gas, with hydrogen or nitrogen conduct
Carrier gas, carries out vapor phase epitaxial growth on substrate in pyrolysis mode, thus grows various iii-v
The thin layer monocrystal material of compound semiconductor and their multivariate solid solution.MOCVD of the prior art
Device generally comprises:
Reaction chamber, is arranged at the glove box outside described reaction chamber and air-spy's gas surge chamber；
Being positioned at the gas shower assembly at described reaction chamber top, described gas shower assembly includes two air inlets
Pipeline and gas distribution member, III metal organic source and V race are hydrogenated by said two air inlet pipeline respectively
Thing source is transmitted to gas distribution member, and described gas distribution member has deflation area, and described deflation area has
There is steam vent, be used for discharging described III metal organic source and V race hydride source；
The pedestal being oppositely arranged with described gas shower assembly, described pedestal has heating unit, described base
Seat be used for supporting and heating substrate, by described gas shower assembly discharge described III metal organic source and
V race hydride source reacts after arriving described substrate, generates Group III-V compound semiconductor.
Generally, being provided with glove box in the outside of MOCVD reaction chamber, the atmosphere in described glove box is
High pure nitrogen.Described III metal organic source and V race hydride source in MOCVD reaction chamber easily exist
Reaction intracavity contact generation parasitic reaction, and then, reaction chamber inwall or gas shower assembly temperature relatively
Low position forms loose film, when described loose film reaches to a certain degree, can produce the most micro-
Grain, and drop to film surface when deposited semiconductor device film, in causing film, defect concentration increases,
Affect film quality so that the yield of product reduces.Additionally, described microparticle adsorbs at described steam vent
Sidewall on this may reduce described steam vent discharge gas speed.When described deflation area is by described loose
When film portion covers, the heat-radiating properties of described deflation area, as its thermal emissivity also can change,
This thermal balance can broken in described reaction chamber, causes the change of described reaction cavity temperature, final shadow
Ring the stability of technical process.
The described deflation area of the most described gas shower assembly must periodically clean, in order to remove on it because of
Parasitic reaction and the described loose film that deposits or the described microparticle of absorption, just can carry out normal technique
Course of reaction.For gas shower assembly of the prior art, due to the row of a kind of reacting gas
Pore is on integrated with described gas distribution member, and the most described deflation area has with described
The integrated structure of gas distribution member, and this part can not be processed by individually removing, therefore
Need to take out described gas shower assembly entirety from reaction chamber, and put in baking box and toast,
Or be carried out by other means.But owing to described gas shower assembly yardstick is big, and comprise substantial amounts of
Parts, carry out integral demounting and are again fixed on described reaction chamber top and relate to described gas shower assembly
And operation extremely complex, substantial amounts of time and cost can be wasted；And at described gas shower assembly
Dismounting and installation process can make described reaction chamber be in open state for a long time, destroy it internal high-purity
The nitrogen atmosphere of degree, needs again to be passed through above-mentioned gas and could recover to carry out the atmosphere needed for deposition reaction,
This can make device systems need the longer time just can return to carry out the state needed for technological reaction.
The gas shower assembly of the most existing multiple gases distribution cavity is sandwich construction, is processed as multi-point welding,
Generally want thousands of pads, such as the Shen by Aix-en-Provence spy bright (Aixtron) the company application of Germany
Please be number for the gas shower comprising multiple structuring dish disclosed in the Chinese patent of CN200880019034
Assembly, or the gas shower assembly disclosed in Publication No. US20110186228 United States Patent (USP).Its processing
Extremely complex, expensive, and follow-up maintenance cost is high.
It is thus desirable to it is a kind of simple, low cost but the gas shower of multiple gases distribution cavity can be realized
Assembly, described gas shower assembly has complete dismountable deflation area so that can facilitate timely to institute
State deflation area to dismantle and clean, reduce the maintenance cost of equipment.
Summary of the invention
It is an object of the invention to provide a kind of simple in construction, be prone to processing split type gas shower assembly
And metal organic vapor phase deposition device.
The present invention provide metal organic chemical vapor deposition device, including reaction chamber, be arranged at described instead
Answer the glove box outside chamber and air-spy's gas surge chamber, be positioned at the gas shower assembly at described reaction chamber top with
And the pedestal being oppositely arranged with described gas shower assembly, described pedestal can the most described gas shower group
Part rotates, and described gas shower assembly includes that the distribution of the first air inlet pipeline, the second air inlet pipeline, gas is single
If unit and dry plate parts, described first, second air inlet pipeline is respectively used to the first gas and the second gas
Transmission is to described gas distribution member, and described gas shower assembly has deflation area, and the distribution of described gas is single
The single layer structure that unit is formed in one, described gas distribution member includes A type gas distribution chamber and Type B gas
Body distribution cavity, described A type gas distribution chamber and Type B gas distribution chamber interval are arranged, and are respectively used to distribution
Described first gas and the second gas, be provided with described plate parts, described plate in described gas distribution member
Parts include A template parts and Type B plate parts, described A template parts and described A type gas distribution chamber
Being oppositely arranged, described Type B plate parts are oppositely arranged with described Type B gas distribution chamber, described A template portion
Part and Type B plate parts have steam vent, are respectively used to discharge described first gas and the second gas, described
A template parts and Type B plate parts mutually splice, and described gas distribution member are separated with described pedestal.
The metal organic chemical vapor deposition device that the present invention provides provides the benefit that: described gas shower
The single layer structure that described gas distribution member in assembly is formed in one, not existing substantial amounts of needs multiple spot
The parts welded together, it is easy to be processed manufacturing and simple in construction.Described gas shower assembly
Described deflation area is by the described A template parts being installed in described gas distribution member and Type B plate parts structure
Becoming, described A type, Type B plate parts have steam vent, are respectively used to discharge described first, second gas.
Owing to described A template parts and Type B plate parts all can remove from described gas distribution member, when
When needing to remove the described microparticle of the described loose film of deposition on described deflation area or absorption, only need by
Than gas shower assembly, overall much smaller A type, Type B plate parts remove, and are buffered by air-spy's gas
Room transmits out in nitrogen atmosphere, puts in baking box or is carried out otherwise, and changing one
Overlap new A type, Type B plate parts, it is simply installed in described gas distribution member, without
Described gas shower assembly entirety is disassembled from described reaction chamber and processes, save described metal
The time that organic vapor phase deposition device is shut down, also will not destroy the height in the glove box outside reaction chamber simultaneously
Purity nitrogen gas atmosphere.Therefore, gas shower modular construction provided by the present invention is simple, and gas distribution is single
Unit's handling ease, and there are easy-to-dismount A type, Type B plate parts, have only to during use safeguard
Described A type, Type B plate parts, decrease dismounting or the installation of whole gas shower assembly, decrease institute
State the maintenance time of metal organic vapor phase deposition device, improve utilization rate.Additionally, when described reaction chamber
When internal airflow field needs regulation, it is only necessary to change the described steam vent on described A type, Type B plate parts
Distribution, it is not necessary to change described gas shower assembly.
Preferably, described gas distribution member has the space bar of the upper surface being perpendicular to described pedestal, uses
Described A type gas distribution chamber and Type B gas distribution chamber to be separated, described space bar is provided with groove,
Described A type, Type B plate parts two sides parallel with described space bar are provided with and described groove fit
Buckle teeth portion, in order to install described A type, Type B plate parts.
Preferably, described space bar is provided with the first groove towards the side of described A type gas distribution chamber,
Described space bar is provided with the second groove, described first groove towards the side of described Type B gas distribution chamber
It is respectively used to install described A template parts and Type B plate parts, described first groove and with the second groove
Two grooves mutually stagger along the direction of the upper surface being perpendicular to described pedestal.Described space bar is due to described recessed
The existence of groove and its thickness can be made to diminish, reduce its mechanical strength, if described first groove and the second groove
Being arranged at described pedestal upper surface sustained height, described space bar will become there is described groove
Thinner, in order to reduce the impact on space bar mechanical strength of the described groove, it is desirable to described first groove and
Second groove is mutually staggering along the direction of the upper surface being perpendicular to described pedestal.
Preferably, described A template parts two sides parallel with described space bar are additionally provided with groove,
Described Type B plate parts two sides parallel with described space bar are provided with and the institute of described A template parts
State the buckle teeth portion of groove fit, in order to described Type B plate parts to be installed on two the described A being adjacent
On template parts.Have an advantage in that and need not lengthen described space bar two kinds of described plate parts are installed,
Only described A template parts need to be installed on described space bar, and described Type B plate parts are by its buckle teeth
Portion was i.e. securable in described gas distribution member, jointly with coordinating of the groove on described A template parts
It is spliced into a complete deflation area.
Preferably, described plate parts have end on the cross section being parallel to described pedestal upper surface, described
End is near the edge of described gas distribution member, and described plate parts are respectively provided with in the both sides of described end
Nip portion and auxiliary section, the described auxiliary section that described nip portion is adjacent cooperates, in order to prevent
State plate parts along described gas distribution member radial direction produce displacement, in described plate parts at least one with
Lock mode is fixed in described gas distribution member.Gas in described A type, Type B gas distribution chamber
When described end quickly flows, described A type, Type B plate parts can there be is active force, it is often more important that,
When described gas shower assembly is being heated and is cooling down in cyclic process, and described A type, Type B plate parts are subject to
The compression that described gas distribution member body causes due to thermal deformation, causes described A type, Type B plate parts
There is the trend of radial outward movement along described gas distribution member, by described A type, Type B plate portion
The described end of part arranges described nip portion and auxiliary section, and described A type, Type B plate parts can be hindered to produce
Raw actual displacement, can facilitate simultaneously and timely described A type, Type B plate parts are dismantled or pacified
Dress.
It is further preferred that the protuberance on the right side that described nip portion is described end, described protuberance to
The adjacent described plate parts on right side extend, and described auxiliary section is the notch part in the left side of described end, institute
The described notch part stating protuberance adjacent with on the right side of it cooperates, in order to prevent described plate parts along institute
The radial direction stating gas distribution member produces displacement.Described plate parts at least one be scheduled on described with screwed lock
In gas distribution member.
Preferably, described gas distribution member is provided with nesting part near the face of described pedestal in its edge,
In order to described plate parts are more firmly fixed in described gas distribution member.It is further preferred that
Described nesting part is an annulus contacted with the described end of described plate parts, and the center of circle of described annulus is institute
State the center of gas distribution member.
Preferably, described gas shower assembly also includes the connecting plate parts being disposed therein the heart, described A
Type, Type B plate parts are connected with described connecting plate parts near the one end at described gas distribution member center,
In order to more firm, described A type, Type B plate parts are installed.
Preferably, described gas distribution member has circular depressions, described circular depressions away from the mask of pedestal
Connect with described first air inlet pipeline, in order to transmit described first gas to described A type gas distribution chamber.
Preferably, there are an annular channel, described annular channel and described B in the center of described gas distribution member
Type gas distribution chamber connects, and connects with described second air inlet pipeline, in order to transmit described second gas extremely
Described Type B gas distribution chamber.
Preferably, described gas distribution member and described A type, the material of Type B plate parts include following material
One or more in matter: graphite, stainless steel, aluminium, aluminium nitride, carborundum, molybdenum, boron nitride, carbon
Change boron, tungsten.
Preferably, described first gas is III metal organic source, and described second gas is V race hydride
Source；Preferably, described first gas is V race hydride source, and described second gas is that III metal is organic
Source.Preferably, described III metal organic source includes Ga (CH3)3、In(CH3)3、Al(CH3)3、
Ga(C2H5)3、Zn(C2H5)2Deng one or more in gas；Preferably, described V race hydride source bag
Include NH3、PH3、AsH3Deng one or more in gas.
Present invention also offers the spray of a kind of gas being arranged in described metal organic chemical vapor deposition device
Drenching assembly, described gas shower assembly includes that the distribution of the first air inlet pipeline, the second air inlet pipeline, gas is single
If unit and dry plate parts, described first, second air inlet pipeline is respectively used to the first gas and the second gas
Transmission is to described gas distribution member, and described gas distribution member has deflation area, and the distribution of described gas is single
The single layer structure that unit is formed in one, described gas distribution member includes A type gas distribution chamber and Type B gas
Body distribution cavity, described A type gas distribution chamber and Type B gas distribution chamber interval are arranged, and are respectively used to distribution
Described first gas and the second gas, be provided with described plate parts, described plate in described gas distribution member
Parts include A template parts and Type B plate parts, described A template parts and described A type gas distribution chamber
Being oppositely arranged, described Type B plate parts are oppositely arranged with described Type B gas distribution chamber, described A template portion
Part and Type B plate parts have steam vent, are respectively used to discharge described first gas and the second gas, described
A template parts and Type B plate parts mutually splice, and described gas distribution member are separated with described pedestal.
Preferably, described gas distribution member and described A type, the material of Type B plate parts include following material
One or more in matter: graphite, stainless steel, aluminium, aluminium nitride, carborundum, molybdenum, boron nitride, carbon
Change boron, tungsten.
Accompanying drawing explanation
Fig. 1 is the structural representation of metal organic chemical vapor deposition device provided by the present invention；
Fig. 2 A is the structural representation of a kind of described gas shower assembly in the preferred embodiment of the invention；
Fig. 2 B is the structural representation of another kind of described gas shower assembly in the preferred embodiment of the invention；
Fig. 3 is the described gas distribution member structural representation away from the cross section of pedestal；
Fig. 4 is in the preferred embodiment of the invention, and a kind of described gas distribution member is along the cross section of A-A ' line
Schematic diagram；
Fig. 5 is in the preferred embodiment of the invention, another kind of described gas distribution member cutting along A-A ' line
Face schematic diagram；
Fig. 6 is that in a kind of preferred embodiment of the present invention, described gas distribution member is near described pedestal
Face on the schematic diagram of adjacent two described plate parts.
Fig. 7 is in the preferred embodiment of the invention, the structural representation of another described gas shower assembly.
Detailed description of the invention
Understandable, below in conjunction with the accompanying drawings for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from
The detailed description of the invention of the present invention is described in detail.
Elaborate a lot of detail in the following description so that fully understanding the present invention, but this
Bright other can also be used to be different from alternate manner described here implement, therefore the present invention is not by following
The restriction of disclosed specific embodiment.
Fig. 1 is the structural representation of metal organic chemical vapor deposition device provided by the present invention.Reference
Fig. 1, described metal organic chemical vapor deposition device 10 includes reaction chamber 11, is arranged at described reaction chamber
Glove box 50 outside 11 and air-spy's gas surge chamber 40, and it is arranged at the gas in described reaction chamber 11
Spray assemblies 12 and pedestal 13；Described gas shower assembly 12 is fixedly installed on the top of reaction chamber 11,
Described pedestal 13 is arranged at the bottom of described reaction chamber 11, and described pedestal has heating unit 131.Described
Gas shower assembly 12 is oppositely arranged with described pedestal 13.Described gas shower assembly 12 and described pedestal
Reaction zone is formed between 13.Reacting gas is incorporated into described reaction zone from described gas shower assembly 12.
Described pedestal 13 includes one towards the substrate seating surface of described gas shower assembly 12, described substrate
Supporting surface is used for supporting one or more pending substrate 14.During carrying out chemical gaseous phase deposition,
Pending substrate 14 is sent in reaction chamber 11 by air-spy's gas surge chamber 40, and is arranged on described base
On sheet supporting surface, the substrate 14 processed is transmitted from reaction chamber 11 by described air-spy's gas surge chamber 40
Out；Described pedestal 13 is supported in a rotating shaft 132, described rotating shaft 132 make described pedestal 13 around
The axis in one vertical described substrate support face rotates.Owing to described spray assemblies 12 is fixed on reaction chamber 11
On, therefore, described pedestal 13 also rotates relative to described gas shower assembly 12 simultaneously.
Fig. 2 A is the structural representation of a kind of described gas shower assembly in the preferred embodiment of the invention.Ginseng
According to Fig. 2 A, described gas shower assembly 12 include first air inlet pipeline the 111, second air inlet pipeline 112,
If being positioned at the gas distribution member 122 below described reaction chamber top board 110 and dry plate parts；Described first
Air inlet pipeline 111 and the second air inlet pipeline 112 are single to the distribution of described gas respectively through reaction chamber top board 110
Unit 122 conveying the first gas and the second gas, the individual layer that described gas distribution member 122 is formed in one
Structure, described gas distribution member 122 includes A type gas distribution chamber 210 and Type B gas distribution chamber 220,
Described A type gas distribution chamber 210 and Type B gas distribution chamber 220 interval are arranged, and described A type gas divides
Join chamber 210 and basis that Type B gas distribution chamber 220 is described plate parts and described gas distribution member 210
The cavity that body surrounds, is respectively used to distribute described first gas and the second gas.
Being provided with described plate parts in described gas distribution member 122, described plate parts include A template portion
Part 123 and Type B plate parts 124, described A template parts 123 and described A type gas distribution chamber 210
Being oppositely arranged, described Type B plate parts 124 are oppositely arranged with described Type B gas distribution chamber 220, described
A template parts 123 and Type B plate parts 124 have steam vent (not shown), are respectively used to discharge institute
Stating the first gas and the second gas, described A template parts 123 and Type B plate parts 124 mutually splice,
And described gas distribution member is separated with described pedestal.
The individual layer being formed in one due to the described gas distribution member 122 in described gas shower assembly 12
Structure, is not related to parts and the multi-point welding technique of complexity during processing and manufacturing.Due to described A template portion
Part 123 and Type B plate parts 124 all can remove from described gas distribution member 122, work as needs
When removing on described deflation area 125 the described microparticle of the described loose film of deposition or absorption, only need by
Than gas shower assembly 12, overall much smaller described A type, Type B plate parts 123/124 remove, logical
Cross air-spy's gas surge chamber 40 to transmit out in nitrogen atmosphere, put in baking box or enter otherwise
Row cleans, and does without described gas shower assembly 12 entirety being disassembled from described reaction chamber 11
Process, save the time that described metal organic vapor phase deposition device 10 is shut down, also will not destroy anti-simultaneously
Answer the high-purity nitrogen atmosphere in the glove box 50 outside chamber.Therefore, gas shower provided by the present invention
Modular construction is simple, gas distribution member handling ease, and has easy-to-dismount A type, Type B plate portion
Part 123/124, has only to during use safeguard described A type, Type B plate parts 123/124, decreases
The dismounting of whole gas shower assembly 12 or installation, decrease the dimension of described metal organic vapor phase deposition device
Protect the time, improve utilization rate.Additionally, when the airflow field in described reaction chamber 11 body needs regulation,
Have only to the described steam vent distribution changing on described A type, Type B plate parts 123/124, it is not necessary to more
Change described gas shower assembly 12.
Fig. 3 is the described gas distribution member 122 structural representation away from the cross section of pedestal 13.Join simultaneously
According to Fig. 2 A and Fig. 3, described gas distribution member 122 has circular depressions 211 away from the cross section of pedestal,
Described circular depressions 211 connects with described first air inlet pipeline 111, in order to transmit described first gas to institute
State A type gas distribution chamber 210.Described first gas is arranged by the steam vent on described A template parts 123
Go out.
There are an annular channel 221, described annular channel 221 and institute in the center of described gas distribution member 122
State Type B gas distribution chamber 220 to connect, and connect, in order to transmit with described second air inlet pipeline 112
State the second gas to described Type B gas distribution chamber 220, described annular channel 221 and described A type gas
There is a dividing plate 212 distribution cavity 210 junction, enters described A type gas in order to completely cut off described second gas
Distribution cavity 210, described second gas is discharged by the steam vent on described Type B plate parts 124.
Described gas distribution member 122 has the space bar of the upper surface being perpendicular to described pedestal 13, in order to
Described A type gas distribution chamber 210 and Type B gas distribution chamber 220 are separated, described space bar is arranged
Fluted, described A template parts 123 and Type B plate parts 124 two sides parallel with described space bar
It is provided with the buckle teeth portion with described groove fit, in order to install described A template parts 123 and Type B plate
Parts 124.
Fig. 4 is that in one preferred embodiment of the present invention, gas distribution member 122 is along the cross section of A-A ' line
Schematic diagram.With reference to Fig. 4, described groove includes the first groove 1261 and the second groove 1262, described interval
On plate 126, side towards described A type gas distribution chamber 210 is provided with the first groove 1261, described between
On dividing plate 126, the side towards described Type B gas distribution chamber 220 is provided with the second groove 1262, described
First groove 1261 cooperates with the buckle teeth portion 1230 on A template parts 123, described second groove
1262 and Type B plate parts 124 on buckle teeth portion 1240 cooperate, be respectively used to described A type is installed
Plate parts 123 and Type B plate parts 124.On described A template parts 123, there is steam vent 1231, use
In discharging described first gas, described Type B plate parts 124 has steam vent 1241, for described the
Two gases.Described first groove 1261 and the second groove 1262 are along the upper surface being perpendicular to described pedestal 13
Direction mutually stagger, i.e. the height apart from the upper surface of described pedestal 13 is different.Its reason is, institute
Stating space bar 126 can make its thickness diminish owing to there is described groove 1261/1262, reduces its machinery strong
Degree, if described first groove 1261 and the second groove 1262 are arranged at the upper surface away from described pedestal 13 together
At one height, the most described space bar 126 will become thinner, in order to reduce there is described groove
State the groove 1261/1262 impact on space bar mechanical strength, it is desirable to described first groove 1261 and second
Groove 1262 is mutually staggering along the direction of the upper surface being perpendicular to described pedestal.
Refer to shown in Fig. 2 B, in some embodiment being more highly preferred to of the present invention, described gas sprays
Drenching assembly and also include the connecting plate parts 2111 that are disposed therein the heart, described A template parts 123 are near institute
The one end stating gas distribution member 122 center is connected with described connecting plate parts 2111, specifically, and institute
State connecting plate parts and there is slot (not shown), for housing a part for described A template parts 123.
Equally, described Type B plate parts 124 and described connecting plate parts 2111 are near described gas distribution member 122
The one end at center is connected, and specifically, a part for described Type B plate parts 124 is housed in described slot
In.Described connecting plate parts 2111 install described A type, Type B plate parts 123/124 in order to more firm.
Fig. 5 is in another kind preferred embodiment of the present invention, gas distribution member 122 cutting along A-A ' line
Face schematic diagram.With reference to Fig. 5, described A template parts 210 are by its buckle teeth portion 1230 and described space bar
The cooperation of the described groove 1261 on 126 is installed in described gas distribution member 122.Additionally, it is described
A template 210 two sides parallel with described space bar 126 are additionally provided with groove 1232, described Type B
Plate parts 124 two sides parallel with described space bar 126 are provided with and the institute of described A template parts
State the buckle teeth portion 1242 that groove 1232 coordinates, in order to be installed on and its phase by described Type B plate parts 124
On two adjacent described A template parts 123.Its beneficial functional is, it is not necessary to by described space bar 126
Lengthen and described plate parts are installed, only described A template parts 123 need to be installed on described space bar 126
On, and described Type B plate parts 124 are by described buckle teeth portion 1242 and described A template parts 123
The cooperation of groove 1232 is i.e. securable in described gas distribution member 122, be jointly spliced into one complete
Face 125.
Fig. 6 is in a kind of preferred embodiment of the present invention, two plate parts adjacent on described deflation area
Schematic diagram.With reference to Fig. 6, described plate parts 140 and plate parts 150 are in adjacent position, described plate portion
There is on part 140/150 steam vent 1400/1500, be used for discharging described first gas or the second gas.Institute
State plate parts 140/150, on the cross section of upper surface being parallel to described pedestal 13, there is end 141/151,
Described end 141/151 is near the edge of described gas distribution member 122, and described plate parts 140/150 exist
The both sides of described end are respectively provided with nip portion 142/152 and auxiliary section 143/153, the institute of plate parts 140
The described auxiliary section 153 stating the plate parts 150 that nip portion 142 is adjacent cooperates, in order to prevent
Described plate parts produce displacement along the radial direction of described gas distribution member 122.In the preferred embodiment,
Described nip portion 142/152 is the protuberance on the right side of described end 141/151, and described protuberance is right to it
The adjacent described plate parts of side extend, and described auxiliary section 142/152 is the left side of described end 141/151
Notch part, the described notch part that described protuberance is adjacent with on the right side of it cooperates, in order to prevent
State the plate parts 140/150 radial direction generation displacement along described gas distribution member 122, described plate parts 140
Being fixed in described gas distribution member with lock mode, as shown in Figure 6, described lock mode is for using spiral shell
Silk 144 locking.
Gas in described A type, Type B gas distribution chamber, can be right when described end 141 quickly flows
Described A type, Type B plate parts have active force, it is often more important that, when described gas shower assembly 12 is being subject to
Heat and cooling cyclic process in, described plate parts 140/150 by described gas distribution member 12 body by
In the compression that thermal deformation causes, described plate parts 140/150 are caused to have the footpath along described gas distribution member
To the trend moved out, described by arranging at the described end 141/151 of described plate parts 140/150
Pressing 142/152 and auxiliary section 143/153, it is possible to hinder described plate parts 140/150 to produce reality
Displacement
Additionally, arrange the nip portion that cooperates and auxiliary section fixes described plate parts, it is only necessary to use
Screw 144 locks described plate parts 140, thus can facilitate and tear described plate parts open timely
Unload or install.Needs dismantle described plate parts do cleaning treatment time, only need to will lock with screw 144
Described plate parts 140 disassemble in advance, the direction that other plate parts just can extend along described nip portion
The most sequentially disassemble, described air-spy's gas surge chamber 40 transmit out described reaction chamber 11；Install
Can take during new cage plate parts same method by described air-spy gas surge chamber 40 transmit into described in
Reaction chamber 11 is also sequentially installed, thus considerably simplify dismounting and the erector of described plate parts
Sequence, improves the utilization rate of described metal organic vapor phase deposition device.
Described gas distribution member is provided with nesting part near the face of described pedestal in its edge, in order to incite somebody to action
Described A template parts 123 and Type B plate parts 124 are more firmly fixed to described gas distribution member
On.Described nesting part is an annulus contacted with the described end of described plate parts, the center of circle of described annulus
Center for described gas distribution member.
Fig. 7 is in the preferred embodiment of the present invention, the structural representation of another described gas shower assembly
Figure.With reference to Fig. 7, described nesting part 60 has two cross sections, left and right, the most respectively with described A template parts
The cross section that the described end of 123 contacts with the described end of Type B plate parts 124, in described A template portion
The described end of part 123, described nesting part 60 has upper and lower two external members separated, at described Type B plate
The described end of parts 124, described nesting part 60 is continuously one, in order to by described A template parts
123 and Type B plate parts 124 be more firmly fixed in described gas distribution member.
In the preferred embodiment of the invention, described gas distribution member and described A type, Type B plate parts
Material include one or more in following material: graphite, stainless steel, aluminium, aluminium nitride, carborundum,
Molybdenum, boron nitride and tungsten.
In the preferred embodiment of the invention, described first gas is for including III metal organic source, described
Second gas is one or more in V race hydride source and carrier gas；In the present invention, other are the most real
Executing in example, described first gas is V race hydride source, and described second gas is organic for including III metal
Source.
Described III metal organic source includes Ga (CH3)3、In(CH3)3、Al(CH3)3、Ga(C2H5)3、
Zn(C2H5)2One or more in gas；Described V race hydride source includes NH3、PH3、AsH3Gas
One or more in body；Described carrier gas includes N2、H2, one or more in Ar gas.
Although the present invention discloses as above with preferred embodiment, but the present invention is not limited to this.Any
Skilled person, without departing from the spirit and scope of the present invention, all can make various changes or modifications,
Therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (18)
1. a metal organic chemical vapor deposition device, including reaction chamber, is arranged at the hand outside described reaction chamber
Casing and air-spy's gas surge chamber, be positioned at the gas shower assembly at described reaction chamber top and with described
The pedestal that gas shower assembly is oppositely arranged, described pedestal can rotate relative to described gas shower assembly,
If described gas shower assembly include the first air inlet pipeline, the second air inlet pipeline, gas distribution member and
Dry plate parts, described first, second air inlet pipeline is respectively used to the first gas and the second gas transport
To described gas distribution member, described gas distribution member has deflation area, it is characterised in that described
The single layer structure that gas distribution member is formed in one, described gas distribution member includes that A type gas divides
Join chamber and Type B gas distribution chamber, described A type gas distribution chamber and Type B gas distribution chamber interval to arrange,
Being respectively used to distribute described first gas and the second gas, described gas distribution member bottom has been installed
Stating plate parts, described plate parts include A template parts and Type B plate parts, described A template parts with
Described A type gas distribution chamber is oppositely arranged, described Type B plate parts and described Type B gas distribution chamber phase
To setting, described A template parts and Type B plate parts have steam vent, are respectively used to discharge described
One gas and the second gas, described A template parts and Type B plate parts mutually splice, and by described gas
Body allocation unit separates with described pedestal.
2. metal organic chemical vapor deposition device as claimed in claim 1, it is characterised in that described gas
Allocation unit has the space bar of the upper surface being perpendicular to described pedestal, in order to be divided by described A type gas
Join chamber and Type B gas distribution chamber separates, described space bar is provided with groove, described A type, Type B
Plate parts two sides parallel with described space bar are provided with the buckle teeth portion with described groove fit, use
To install described A type, Type B plate parts.
3. metal organic chemical vapor deposition device as claimed in claim 2, it is characterised in that described interval
Plate is provided with the first groove towards the side of described A type gas distribution chamber, and described space bar is towards described
The side of Type B gas distribution chamber is provided with the second groove, and described first groove and the second groove are used respectively
In installing described A template parts and Type B plate parts, described first groove and the second groove along being perpendicular to
Mutually stagger in the direction of the upper surface of described pedestal.
4. metal organic chemical vapor deposition device as claimed in claim 2, it is characterised in that described A type
Plate parts two sides parallel with described space bar are additionally provided with groove, described Type B plate parts and institute
State two parallel sides of space bar and be provided with the buckle teeth of the described groove fit with described A template parts
Portion, in order to be installed on described Type B plate parts on two be adjacent described A template parts.
5. metal organic chemical vapor deposition device as claimed in claim 2, it is characterised in that described plate portion
Part has end on the cross section being parallel to described pedestal upper surface, and described end divides near described gas
Joining the edge of unit, described plate parts are respectively provided with nip portion and auxiliary section in the both sides of described end,
The described auxiliary section that described nip portion is adjacent cooperates, in order to prevent described plate parts along described
The radial direction of gas distribution member produces displacement, in described plate parts at least one fix with lock mode
In described gas distribution member.
6. metal organic chemical vapor deposition device as claimed in claim 5, it is characterised in that described pressing
Portion is the protuberance on the right side of described end, and described protuberance adjacent described plate parts to the right prolong
Stretching, described auxiliary section is the notch part in the left side of described end, and described protuberance is adjacent with on the right side of it
Described notch part cooperate, in order to prevent described plate parts along the radial direction of described gas distribution member
Produce displacement, in described plate parts at least one be scheduled in described gas distribution member with screwed lock.
7. metal organic chemical vapor deposition device as claimed in claim 6, it is characterised in that described gas
Allocation unit is provided with nesting part near the face of described pedestal in its edge, in order to by described plate parts
More it is firmly fixed to described gas distribution member exist.
8. metal organic chemical vapor deposition device as claimed in claim 7, it is characterised in that described nesting
Portion is an annulus contacted with the described end of described plate parts, and the center of circle of described annulus is described gas
The center of allocation unit.
9. metal organic chemical vapor deposition device as claimed in claim 8, described gas shower assembly also wraps
Include the connecting plate parts being disposed therein the heart, described connecting plate parts and described A type, Type B plate parts
Be connected near the one end at described gas distribution member center, in order to more firm install described A type,
Type B plate parts.
10. metal organic chemical vapor deposition device as claimed in claim 8, it is characterised in that described gas
Allocation unit has circular depressions, described circular depressions and described first air inlet pipeline away from the mask of pedestal
Connection, in order to transmit described first gas to described A type gas distribution chamber.
11. metal organic chemical vapor deposition devices as claimed in claim 9, it is characterised in that described gas
The center of allocation unit has an annular channel, described annular channel to connect with described Type B gas distribution chamber,
And connect with described second air inlet pipeline, distribute to described Type B gas in order to transmit described second gas
Chamber.
12. metal organic chemical vapor deposition devices as claimed in claim 1, it is characterised in that described gas
Allocation unit and described A type, the material of Type B plate parts include one or more in following material:
Graphite, stainless steel, aluminium, aluminium nitride, carborundum, molybdenum, boron nitride, boron carbide, tungsten.
13. metal organic chemical vapor deposition devices as claimed in claim 1, it is characterised in that described first
Gas is III metal organic source, and described second gas is V race hydride source.
14. metal organic chemical vapor deposition devices as claimed in claim 1, it is characterised in that described first
Gas is V race hydride source, and described second gas is III metal organic source.
The 15. metal organic chemical vapor deposition devices as according to any one of claim 13 or 14, its feature
Being, described III metal organic source includes Ga (CH3)3、In(CH3)3、Al(CH3)3、Ga(C2H5)3、Zn(C2H5)2One or more in gas.
The 16. metal organic chemical vapor deposition devices as according to any one of claim 13 or 14, its feature
Being, described V race hydride source includes NH3、PH3、AsH3One or more in gas.
17. 1 kinds of gas shower groups being arranged in metal organic chemical vapor deposition device as claimed in claim 1
Part, described gas shower assembly includes the first air inlet pipeline, the second air inlet pipeline, gas distribution member
If with dry plate parts, described first, second air inlet pipeline is respectively used to the first gas and the second gas
Transmission is to described gas distribution member, and described gas distribution member has deflation area, it is characterised in that
The single layer structure that described gas distribution member is formed in one, described gas distribution member includes A type gas
Body distribution cavity and Type B gas distribution chamber, described A type gas distribution chamber and Type B gas distribution chamber interval
Arrange, be respectively used to distribute described first gas and the second gas, install in described gas distribution member
Described plate parts, described plate parts are had to include A template parts and Type B plate parts, described A template portion
Part is oppositely arranged with described A type gas distribution chamber, and described Type B plate parts distribute with described Type B gas
Chamber is oppositely arranged, and described A template parts and Type B plate parts have steam vent, is respectively used to discharge institute
Stating the first gas and the second gas, described A template parts and Type B plate parts mutually splice, and by institute
State gas distribution member to separate with described pedestal.
18. gas shower assemblies as claimed in claim 17, it is characterised in that described gas distribution member and institute
State A type, the material of Type B plate parts includes one or more in following material: graphite, stainless steel,
Aluminium, aluminium nitride, carborundum, molybdenum, boron nitride, boron carbide, tungsten.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310198956.2A CN104178747B (en) | 2013-05-24 | 2013-05-24 | Split type gas shower assembly and metal organic chemical vapor deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310198956.2A CN104178747B (en) | 2013-05-24 | 2013-05-24 | Split type gas shower assembly and metal organic chemical vapor deposition device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104178747A CN104178747A (en) | 2014-12-03 |
| CN104178747B true CN104178747B (en) | 2016-08-24 |
Family
ID=51960084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310198956.2A Active CN104178747B (en) | 2013-05-24 | 2013-05-24 | Split type gas shower assembly and metal organic chemical vapor deposition device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104178747B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI649446B (en) * | 2017-03-15 | 2019-02-01 | 漢民科技股份有限公司 | Detachable gas injectorused for semiconductor equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101545103A (en) * | 2008-03-25 | 2009-09-30 | 东捷科技股份有限公司 | Device for distributing gas |
| CN101760728A (en) * | 2008-12-24 | 2010-06-30 | 鸿富锦精密工业（深圳）有限公司 | Chemical vapor deposition system |
| CN102373440A (en) * | 2010-08-12 | 2012-03-14 | Snt能源技术有限公司 | Chemical vapor deposition device |
| CN202688435U (en) * | 2012-05-11 | 2013-01-23 | 中微半导体设备(上海)有限公司 | Gas distributing device for metal organic chemical gas phase deposition reaction device and reaction device |
-
2013
- 2013-05-24 CN CN201310198956.2A patent/CN104178747B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101545103A (en) * | 2008-03-25 | 2009-09-30 | 东捷科技股份有限公司 | Device for distributing gas |
| CN101760728A (en) * | 2008-12-24 | 2010-06-30 | 鸿富锦精密工业（深圳）有限公司 | Chemical vapor deposition system |
| CN102373440A (en) * | 2010-08-12 | 2012-03-14 | Snt能源技术有限公司 | Chemical vapor deposition device |
| CN202688435U (en) * | 2012-05-11 | 2013-01-23 | 中微半导体设备(上海)有限公司 | Gas distributing device for metal organic chemical gas phase deposition reaction device and reaction device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104178747A (en) | 2014-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101466867B (en) | Catalyst body chemical vapor depositing apparatus | |
| US9127362B2 (en) | Process kit and target for substrate processing chamber | |
| KR100816969B1 (en) | Chemical vapor deposition reactor | |
| EP2543063B1 (en) | Wafer carrier with sloped edge | |
| EP2643495B1 (en) | Thermal gradient enhanced chemical vapour deposition (tge-cvd) | |
| CN105925953A (en) | Apparatus for deposition of materials on a substrate | |
| CN103140602A (en) | Exhaust for cvd reactor | |
| US9388493B2 (en) | Self-cleaning shutter for CVD reactor | |
| US10760161B2 (en) | Inject insert for EPI chamber | |
| US8377207B2 (en) | Purge gas assembly | |
| CN104178747B (en) | Split type gas shower assembly and metal organic chemical vapor deposition device | |
| CN104141116A (en) | Metal organic chemical vapor deposition device, gas spray component and gas distribution control method | |
| CN105986244A (en) | Chemical vapor deposition device and cleaning method thereof | |
| CN101170050B (en) | Cleaning method for reaction cavity room, forming method of protection film | |
| CN103074607A (en) | Graphite plate and reaction chamber with graphite plate | |
| CN101466866A (en) | Thin film production apparatus and inner block for thin film production apparatus | |
| TWI502096B (en) | Reaction device and manufacture method for chemical vapor deposition | |
| JP3345929B2 (en) | Semiconductor grade polycrystalline silicon production reactor | |
| CN205443444U (en) | MOCVD "The reaction chamber"'s cleaning device | |
| CN103774115B (en) | Chemical vapor deposition unit | |
| CN101800164B (en) | Protective wafer | |
| CN203159707U (en) | Metal-organic chemical vapor deposition (MOCVD) apparatus having multiple sub-reactor structures | |
| JP2009249651A (en) | Vapor deposition apparatus and vapor deposition method | |
| CN102268656A (en) | Sprinkler of metal organic chemical vapor deposition (MOCVD) equipment as well as manufacture method and use method thereof | |
| CN205907398U (en) | Metal organic chemistry vapour deposition device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 402, building 3, 3255 Sixian Road, Songjiang District, Shanghai, 201602 Patentee after: Ideal semiconductor equipment (Shanghai) Co.,Ltd. Address before: 201203, room 2, building 1, 302 Curie Road, Zhangjiang hi tech park, Shanghai Patentee before: DEPOSITION EQUIPMENT AND APPLICATIONS (SHANGHAI) Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Split gas spray assembly and metal-organic chemical vapor deposition device Effective date of registration: 20230209 Granted publication date: 20160824 Pledgee: Agricultural Bank of China Limited Shanghai Songjiang Sub-branch Pledgor: Ideal semiconductor equipment (Shanghai) Co.,Ltd. Registration number: Y2023310000023 |