CN104178741B - Sputter equipment with Splittable magnet - Google Patents

Sputter equipment with Splittable magnet Download PDF

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Publication number
CN104178741B
CN104178741B CN201410222220.9A CN201410222220A CN104178741B CN 104178741 B CN104178741 B CN 104178741B CN 201410222220 A CN201410222220 A CN 201410222220A CN 104178741 B CN104178741 B CN 104178741B
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magnet
central
target
incorporated
screw rod
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CN104178741A (en
Inventor
刘桓圭
崔渽抆
高光洙
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IRUJA Co Ltd
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IRUJA Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/345Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455Movable magnets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • H01J37/3408Planar magnetron sputtering

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a kind of sputter equipment, it includes:Substrate;Target, positioned at the region with the real estate pair;Multiple magnet portions, positioned at the region with the target surface pair, in vertical direction with length, and are separated by arrangement with horizontal direction;Wherein, each described magnet portion is included with the divided multiple Splittable magnets of the length direction, for the distance between being independently adjusted with the target.

Description

Sputter equipment with Splittable magnet
Technical field
The present invention relates to a kind of sputter equipment with Splittable magnet.
Background technology
Sputtering is to constitute liquid crystal display device (liquid crystal display), organic light-emitting display device Evaporated film is main on the glass substrates of panel display apparatus such as (organic light-emitting diode device) Method.
Magnet is configured at the rear of target by sputter equipment so that above generating magnetic field, so that the evaporated film on substrate, Now, due to failing to be formed uniformly magnetic field on the whole before target, the film formed on substrate will produce thickness difference.Especially Be exist substrate upper and lower part compared with central part will thicker evaporated film the problem of.Therefore, in order to improve in base The distribution of the thickness of the material of film forming and surface resistance on plate,
Sputter equipment is utilized inclined method of magnet itself etc..But, this method is due to being to make magnet integrally enterprising Row movement, the improvement effect spread for overall thickness and surface resistance is little.
Also, also have by setting magnetic shunt path to change the side of the plasma density of part on the surface of magnet Method, but there is the problem of chamber can not be kept to vacuum state and need to be adjusted in this method.
[prior art literature]
[patent document]
Korean Patent Laid 2011-0129279 (2011.12.01)
The content of the invention
Technical task
It can reduce the distribution of the film thickness of film forming and surface resistance on substrate it is an object of the invention to provide a kind of The sputter equipment with Splittable magnet.
Technical scheme
The sputter equipment of one embodiment of the invention, including:Substrate;Target, positioned at the region with the real estate pair;One Or it is separated by multiple magnet portions of arrangement with horizontal direction, positioned at the region with the target surface pair, and there is length in vertical direction Degree, wherein, each described magnet portion is included with the divided multiple Splittable magnets of the length direction, for can independently adjust The distance between section and the target.
The distance between corresponding with upper-side area and underside area Splittable magnet and target in the vertical direction can The distance between corresponding less than or greater than with the middle section in the vertical direction Splittable magnet and target.
Each described Splittable magnet may include:Magnet unit;Ball axle, is incorporated into the magnet unit, and described in insertion The wall of chamber;Axle guide, is incorporated into the magnet unit, and the wall of chamber described in insertion;Unit rack, is through with insertion institute State the ball axle and axle guide of support;And, distance adjustment is incorporated into the ball axle of unit rack described in insertion, for adjusting The displacement of the magnet unit.The distance adjustment can be the handle or motor for being incorporated into the ball axle.
The sputter equipment with Splittable magnet of one embodiment of the invention, including:Substrate;Target, positioned at the base The region of plate face pair;Multiple magnet portions, positioned at the region with the target surface pair, in upper-side area, middle section and underside area Direction on there is length, and arrangement is separated by with the direction of left field, middle section and right side area;Wherein, it is described each Magnet portion may include with the divided multiple Splittable magnets of the length direction, for being independently adjusted between the target Distance.
Technique effect
The sputter equipment of the present invention is provided with multiple Splittable magnets, and by adjust upper-side area and underside area and in The distance between multiple Splittable magnets and target in region are entreated, to change the plasma density on the target surface for being conditioned position, It can reduce the effect of film distribution of the thickness of film forming and surface resistance on substrate so as to have.
Brief description of the drawings
Fig. 1 a are the planes of the structure of the simple sputter equipment with Splittable magnet for showing one embodiment of the invention Figure, Fig. 1 b are side views.
Fig. 2 a are the side views that amplification shows a Splittable magnet, and Fig. 2 b are that amplification shows that the distance of Splittable magnet is adjusted The side view of nodular state.
Fig. 3 a are to show each Splittable magnetic in the sputter equipment with Splittable magnet of one embodiment of the invention The side view of the distance between body and target adjustment state, Fig. 3 b are the main views of the distribution of the simple thickness for showing to be formed on substrate Figure.
Fig. 4 is the vertical sectional view to the sputter equipment with Splittable magnet of another embodiment of the present invention.
Reference
100、200:Sputter equipment with Splittable magnet
110:Vacuum chamber 120:Substrate
130:Substrate holder 140:Target
150、250:Magnet portion 150a, 150b, 150c:Splittable magnet
160:Vacuum 170:Gas injection unit
350:Central magnet unit 450:Top magnet unit
550:Lower magnet unit
Embodiment
Hereinafter, the preferred embodiments of the present invention are described in detail referring to the drawings.
The sputter equipment with Splittable magnet of one embodiment of the invention is illustrated first.
Fig. 1 a are the planes of the structure of the simple sputter equipment with Splittable magnet for showing one embodiment of the invention Figure, Fig. 1 b are side views.
The sputter equipment 100 with Splittable magnet of one embodiment of the invention include vacuum chamber 110, substrate 120, Substrate holder 130, target 140, the multiple magnet portions 150, vacuum 160 and gas injection unit 170 for being separated by with horizontal direction arrangement. Wherein, horizontal direction represents the X-direction in figure, and vertical direction represents the Z-direction in figure.
The vacuum chamber 110 is to maintain high vacuum state, for realizing sputtering with the sky of the evaporated film on substrate 120 Between.Being erect in the interior side of the vacuum chamber 110 with vertical direction has substrate 120, and setting is provided with for branch support group The substrate holder 130 of plate 120, the target 140 being formed with as evaporation material is erect in opposite side, and setting is formed with for producing Multiple magnet portions 150 of magnetisation.Meanwhile, in being externally connected to for by vacuum chamber 110 for the vacuum chamber 110 Portion keeps the vacuum 160 of vacuum.Also, in being externally connected to for into vacuum chamber 110 for the vacuum chamber 110 Portion supplies the gas supply part 170 of plasma gas.
The substrate 120 erects the side for being formed at vacuum chamber 110 with vertical direction.The one side knot of the substrate 120 Together in substrate holder 130, another side is faced with target 140.The substrate 120 can constitute liquid crystal display device (liquid Crystal display), plasma display system (plasma display panel device), organic light-emitting display device The glass substrate of panel display apparatus such as (organic light-emitting diode device), but the present invention is not It is defined in this.
The substrate holder 130 erects the side for being formed at vacuum chamber 110 with vertical direction, for supporting substrate 120 To be fixed on vacuum chamber 110.The anode supply of outside can be connected in the substrate holder 130.
The target 140 is separated by and erect with vertical direction the opposite side for being formed at vacuum chamber 110 with substrate 120.It is described The one side of target 140 is faced with substrate 120, and the size that target 140 can be more than substrate 120 is formed.The target 140 can be by substrate The material that film is formed on 120 is constituted.As one, according to the film to be formed, the target 140 can be by aluminium Al, aluminium alloy The many kinds of substance such as AlNd, titanium Ti, cobalt Co, zinc Zn, copper Cu, silicon Si, platinum Pt, gold Au are constituted.But, the present invention is not limited to this A little materials.The cathode power of outside can be connected on the target 140.
The multiple magnet portion 150 is located at the region faced with target 140, and while erectting to be formed with vertical direction, structure Into the form for being separated by arrangement with horizontal direction.That is, the multiple magnet portion 150 forms a magnet portion in vertical direction, and The form for constituting multiple be separated by the horizontal direction and arranging.Or it may also be said that the multiple magnet portion 150 is by with upside One magnet portion in region, middle section and underside area is formed, and in the direction of left field, middle section and right side area The upper form for constituting multiple be separated by and arranging.In addition, the multiple magnet portion 150 is formed as one, and using horizontal direction as Benchmark and form a magnet portion.
Also, the multiple magnet portion 150 is equally applicable to conventional inclination (tilting) type magnet.That is, it is the multiple Magnet portion 150 forwards or back sweep is formed, makes upper-side area or underside area be compared with middle section on the whole, will forward Side or rear movement.
Also, the multiple magnet portion 150 is equally applicable to conventional movable type magnet.That is, the multiple magnet Portion 150 forwards or rear movement, makes upper-side area or underside area be compared with middle section on the whole, will forwards or rear It is mobile.
Also, as shown in Figure 1 b, the multiple magnet portion 150 includes multiple Splittable magnet 150a, 150b, 150c, institute State multiple Splittable magnet 150a, 150b, 150c with the length direction of vertical direction be divided, with allow to be independently adjusted with The distance of target 140.Although showing three Splittables magnet 150a, 150b, 150c with identical length in accompanying drawing, this Invention is not limited to these length and number.That is, according to the characteristic for the substrate 120 for wanting film forming, three Splittable magnet 150a, The length of 150b, 150c each other can be different, and its number can also be more or less.Below to the Splittable magnetic Body 150a, 150b, 150c detailed construction are illustrated again.
Another side with target 140 is separated by be formed by the magnet portion 150 for being so separated by arrangement with horizontal direction.It is the multiple Magnet portion 150 produces magnetic field in vacuum chamber 110, for target substance to be deposited in substrate 120.
Also, the magnet portion 150 as described above for being separated by arrangement with horizontal direction is included respectively with the length of vertical direction Direction divided multiple Splittable magnet 150a, 150b, 150c, therefore, it is possible to separately adjust target 140 and Splittable The distance between magnet 150a, 150b, 150c.
As one, Splittable magnet 150a corresponding with upper-side area and underside area in the vertical direction, The distance between 150c and target 140, can be adjusted to the Splittable corresponding with middle section being more than in the vertical direction The distance between magnet 150b and target 140.Be the reason for so regulation, generally in the characteristic of plasma, base The upper-side area of plate 120 and the thickness of underside area are rendered as the thickness of the middle section more than substrate 120.Therefore, by inciting somebody to action Between Splittable magnet 150a, 150b and target 140 corresponding with the upper-side area and underside area of substrate 120 and/or target 140 Distance is adjusted to be more than between Splittable magnet 150c corresponding with the middle section of substrate 120 and/or target 140 and target 140 Distance, makes the density step-down of the surface plasma for the substrate 120 of the part and/or target 140 being conditioned, so as to reduce substrate The thickness of film forming and increase surface resistance on 120.In other words, the present invention is characterized in the thicker part of thickness, make Splittable magnet 150c, in the relatively thin part of thickness, makes Splittable magnet 150c close to target 140 away from target 140.
And, although described above is, will be corresponding with the upper-side area and underside area of substrate 120 and/or target 140 The distance between Splittable magnet 150a, 150b and target 140 are adjusted to be less than the middle section pair with substrate 120 and/or target 140 The distance between Splittable magnet 150c and target 140 for answering, but mode that according to circumstances can also be in contrast is adjusted, And also can arbitrarily it be adjusted according to thickness and surface resistance.
Wherein, the upper-side area and underside area of the substrate 120 and/or target 140 can represent from the upper end of target 140 and under Hold to 1/10 to 1/3 width of whole width, middle section can represent remaining width.But, the present invention is not limited to this A little numerical value, according to the characteristic for the substrate 120 for wanting film forming, can somewhat differently set the upper lateral areas of substrate 120 and/or target 140 Domain, underside area and middle section.
As described above, the magnet portion 150 includes being independently adjusted multiple Splittable magnets with the distance of target 140 150a, 150b, 150c, so that in addition to the middle section of substrate 120, in the upper-side area and underside area of substrate 120 Also the film with uniform thickness and surface resistance can be formed.
The vacuum 160 is formed at the outside of vacuum chamber 110, for the inside of vacuum chamber 110 to be kept into Gao Zhen Dummy status.The vacuum 160 can be formed by low temperature (cryo) pump or turbine pump.But, the present invention is not limited to this.
The gas injection unit 170 is formed at the outside of vacuum chamber 110, for the vacuum chamber to high vacuum state The inert gases such as 110 inside injection argon Ar.
Fig. 2 a are the side views that amplification shows a Splittable magnet, and Fig. 2 b are that amplification shows that the distance of Splittable magnet is adjusted The side view of nodular state.Wherein, Splittable magnet 150a, 150b, 150c structure all same, therefore, only to representational one Individual Splittable magnet 150a structure is illustrated.
As shown in Fig. 2 a and Fig. 2 b, the Splittable magnet 150a includes magnet 151, magnet carrier 152, ball axle 153, axle Guide 154, unit rack 155 and distance adjustment 156.
The magnet 151 can be the permanent magnet with N poles and S poles, electromagnet or its equipollent, the magnet 151 By keeping and the distance between target 140 and producing magnetic force, so as to be produced between substrate 120 and target 140 and keep required The plasma of density.
The magnet carrier 152 is used to support magnet 151 described above in vertical direction.
One end of the ball axle 153 is incorporated into magnet carrier 152, other end insertion chamber wall 157 and is incorporated into unit branch Frame 155.Meanwhile, the distance adjustment 156 that the other end of ball axle 153 is described below by being connected to makes according to distance regulation The action in portion 156 is rotated with defined direction.
The axle guide 154 is incorporated into magnet unit 151, and is incorporated into the unit rack 155 of insertion chamber wall 157.
The unit rack 155 is incorporated into the ball axle 153 and axle guide 154 of insertion above-described chamber wall 157 End.
Also, the distance adjustment 156 is incorporated into the ball axle 153 of insertion unit rack 155, with adjustable magnetic body unit 151 displacement.The distance adjustment 156 can be selected from handle 156b, motor and its equalization for being incorporated into ball axle 153 One in thing, but the present invention is not limited to this.It is to be incorporated into ball axle 153 and handle that mark 156a is not specified in accompanying drawing Decelerator between 156b.
By structure as described above, according to the action of distance adjustment 156 in the present invention, ball axle 153 will be with clockwise Direction is rotated, or is rotated in a counterclockwise direction.Thus, magnet unit 151 is directed to by axle guide 154, With close to the side of target 140 or away from target 140.
Thus, film forming is considered in the present invention in thickness and surface resistance on substrate 120, by partly adjusting Splittable The distance between magnet 150a and target 140, can minimize the thickness of substrate 120 and the distribution of surface resistance.
Further, the present invention in need not change the internal vacuum of vacuum chamber 110, by from outside simply adjust away from From adjustment portion 156, you can easily adjust the distance between target 140 and magnet unit 151.
Fig. 3 a are to show each Splittable magnetic in the sputter equipment with Splittable magnet of one embodiment of the invention The side view of the distance between body and target adjustment state, Fig. 3 b are the main views of the distribution of the simple thickness for showing to be formed on substrate Figure.
With the region shown in relatively deep hatching it is the middle section of substantially substrate 120 in Fig. 3 b, it represents relative Form the part of thickness relatively thinly, with the region shown in relatively shallower hatching be substantially the upper-side area of substrate 120 and under Side region, it represents the part for forming thickness relatively thickly.
As shown in Figure 3 a, the magnet portion 150 is located at the region that is faced with target 140, and upper-side area, middle section and There is length on the direction (vertical direction) of underside area.It is of course also possible, as described before, the multiple magnet portion 150 with left field, The direction (horizontal direction) of middle section and right side area is separated by and arranged.Also, each described magnet portion 150 is included with length Direction (vertical direction) segmentation multiple Splittable magnet 150a, 150b, 150c, the multiple Splittable magnet 150a, 150b, 150c the distance between is independently adjusted with target 140.
Thus, one as shown in Figure 3 b, if the substrate 120 upper-side area and underside area thickness relatively , as shown in Figure 3 a, will Splittable magnet 150a, 150b corresponding with upper-side area and underside area more than the thickness of middle section And the distance between target 140 L1, L2 be adjusted to be more than between Splittable magnet 150c corresponding with middle section and target 140 away from From L3, so that the distribution of the upper-side area of substrate 120, the thickness of underside area and middle section and surface resistance is minimized.
More specifically, what following table 1 was recorded is the distance between target 140 and Splittable magnet 150a, 150b, 150c In the case of all same, the surface resistance measured at regular intervals with horizontal direction, what table 2 was recorded is by target 140 and Splittable magnetic The distance between body 150a, 150b, 150c be adjusted to about as shown in Figure 3 a after surface resistance.
[table 1]
Ref. P1(Ω/□) P2(Ω/□) P3(Ω/□) P4(Ω/□) P5(Ω/□) UT (%)
1 0.6519 0.5525 0.4951 0.6247 0.6424 13.67
2 0.6539 0.5888 0.5562 0.6418 0.6433 8.07
3 0.6460 0.6178 0.5883 0.6677 0.6610 6.32
4 0.6513 0.6469 0.6152 0.6896 0.6665 5.70
5 0.6442 0.6275 0.5917 0.6648 0.6618 5.82
6 0.6240 0.6012 0.5576 0.6453 0.6690 9.08
7 0.6440 0.5848 0.5392 0.6150 0.6774 11.36
[table 2]
Ref. P1(Ω/□) P2(Ω/□) P3(Ω/□) P4(Ω/□) P5(Ω/□) UT (%)
1 0.6429 0.5514 0.5269 0.6083 0.6484 10.34
2 0.6459 0.5985 0.6126 0.6491 0.6459 4.06
3 0.6442 0.6340 0.6592 0.6835 0.6628 3.76
4 0.6518 0.6697 0.6874 0.7099 0.6731 4.27
5 0.6430 0.6484 0.6579 0.6820 0.6685 2.94
6 0.6222 0.6114 0.6061 0.6546 0.6761 5.46
7 0.6370 0.5755 0.5625 0.6111 0.6780 9.31
As described in Table 1, the situation apart from all same between target 140 and Splittable magnet 150a, 150b, 150c Under, the surface resistance uniformity UT of uppermost areas and lowermost distal end region is 13.67% and 11.36% respectively.But, such as the institute of table 2 Record, in the case of distance as shown in Figure 3 a between regulation target 140 and Splittable magnet 150a, 150b, 150c, can confirm The surface resistance uniformity UT of uppermost areas and lowermost distal end region is reduced to 10.34% and 9.31% respectively.
Wherein, Ref.1,7 can regard upper area and lower area as respectively, and Ref.2~6 are considered as central area Domain.Meanwhile, the data of table 1,2 are from the magnet for being constituted, being separated by with horizontal direction and being moved by the Splittable magnet of substantially seven Data derived from portion.
The sputter equipment with Splittable magnet of another embodiment of the present invention is illustrated below.
Fig. 4 is the vertical sectional view to the sputter equipment with Splittable magnet of another embodiment of the present invention.
The sputter equipment 200 with Splittable magnet of another embodiment of the present invention includes vacuum chamber 110, substrate 120th, substrate holder 130, target 140, magnet portion 250, vacuum 160 and gas injection unit 170.
Sputter equipment 200 and Fig. 1 a's to Fig. 3 b with Splittable magnet of another embodiment of the present invention has segmentation The sputter equipment 100 of type magnet is form differently compared to the structure of magnet 250.Therefore, it is right centered on magnet part 250 below The sputter equipment 200 with Splittable magnet of another embodiment of the present invention is illustrated.Also, it is described that there is Splittable magnetic The sputter equipment 200 of body is used with Fig. 1 to Fig. 3 b same or similar part of sputter equipment 100 with Splittable magnet Identical reference, omits detailed description herein.
On the other hand, in the following description, before or front side and below or rear side be illustrated respectively in Fig. 4 direction-y-axis and The face or direction of+y-axis.Also, the upper and lower part represent to be located towards or vertically+z-axis and the-direction of z-axis on part. Also, horizontal direction or left and right directions represent+x ,-x-axis direction.Also, the upper and lower part can in a structural element Represent the relative position on the basis of+z-axis and-z-axis.
The magnet portion 250 includes central magnet unit 350, top magnet unit 450 and lower magnet unit 550.And And, the magnet portion 250 can further comprise central transfer unit 650.
The magnet portion 250 with vertical direction by being extended and divided multiple units are formed.
The magnet portion 250, its central magnet unit 350 is together with top magnet unit 450 and lower magnet unit 550 Link and move forward and backward, and the distance of adjustable and target 140.Also, the magnet portion 250, its central magnet unit 350 is inclined Obliquely it is conditioned tiltedly and on the whole.Now, the top magnet unit 450 and lower magnet unit 550 are also inclined by together. Also, the magnet portion 250, central distance between central magnet unit 350 and target 140 and top magnet unit 450 and under Top distance and bottom distance between portion's magnet unit 550 and target 140 are differently from each other conditioned.That is, described top magnet Unit 450 and lower magnet unit 550 respectively move forward and backward with central magnet unit 350.
The central magnet unit 350 includes central magnet 351, centre pedestal 353, central ball screw 355 and center Motor 357.The central magnet unit 350, central magnet 351 is supported by centre pedestal 353, and centre pedestal 353 passes through Central ball screw 355 and central motor 357 move forward and backward.Also, the central magnet unit 350, with centre pedestal 353 are inclined by by central ball screw 355 and central motor 357, and central magnet 351 is also inclined by.Therefore, the central magnetic Body 351, and the distance of target 140 are conditioned, or are tilted to tilt relative to vertical plane direction.Also, the central magnet list Member 350 can in the horizontal direction be moved by central transfer unit 650.Now, the top magnet unit 450 and lower magnet Unit 550 is also moved in the horizontal direction together.
The central magnet 351 is formed by permanent magnet or electromagnet, and has regulation with what is extended in vertical direction The shaft-like formation of height and width.The height of the central magnet 351 is less than the whole height of substrate, it is preferable that the center The height of magnet 351 is the 1/3 to 8/10 of substrate whole height.The distance between the central magnet 351 and target 140 are according to institute The plasma density needed is conditioned.The central magnet 351 is incorporated into central base by other combination member (not shown) Seat 353.
Shaft-like formation of the centre pedestal 353 to extend in vertical direction, and with the width with central magnet 351 Corresponding width.Also, the centre pedestal 353 has the height higher than central magnet 351, to form centrally located magnet The region that the top magnet unit 450 and lower magnet unit 550 of 351 upper and lower part are combined.That is, described centre pedestal 353 middle section 353a's and combination top magnet unit 450 and lower magnet unit 550 including combination central magnet 351 Upper area 353b and lower area 353c.The centre pedestal 353 above in conjunction with behind central magnet 351 and making Centre magnet 351 advances, retreats and tilted.
Also, the centre pedestal 353 can form the first bracket 354a for combining central ball screw 355 and the below One rotating dog 354b.The first bracket 354a and the first rotating dog 354b are respectively formed at the top and the bottom of centre pedestal 353.Institute The first rotating dog 354b is stated to be rotatably engaged in the first bracket 354a by bearing (not shown) etc..The first bracket 354a Supported on both sides the first rotating dog 354b in the first rotating dog 354b or the central supporting first in the first rotating dog 354b rotate Sell 354b.And the first rotating dog 354b, which has, is more than what the central ball screw 355 being combined was moved in the horizontal direction The length of distance.
Therefore, the centre pedestal 353 can in the horizontal direction be moved relative to central ball screw 355.That is, described One rotating dog 354b is moved in the horizontal direction relative to fixed central ball screw 355 on the basis of horizontal direction, in making Centre pedestal 353 can be moved in the horizontal direction.The central transfer unit 650 that the centre pedestal 353 passes through detailed description below In the horizontal direction by round transfer predetermined distance.
The middle section 353a with the corresponding height of central magnet 351 to form.The upper area 353b and bottom Region 353c is formed in the upper and lower part of central magnet 351 respectively.Also, the upper area 353b and lower area 353c To have the groove shapes of difference in height to be formed relative to middle section 353a.The upper area 353b and lower area 353c hold Receive top magnet unit 450 and a part for lower magnet unit 550.Also, the upper area 353b and lower area What 353c offer top magnet units 450 and lower magnet unit 550 can be separately advanced and retreat with central magnet unit 350 Space.
The front end of the central ball screw 355 is incorporated into behind centre pedestal 353, and passes through other parts of bearings (not shown) is combined in which can be rotated upwardly and downwardly on the basis of the binding site of centre pedestal 353.That is, described central ball screw 355 It is incorporated into the first rotating dog 354b and combines with can rotating upwardly and downwardly.Also, the first rotating dog 354b is with relative to center rolling Pearl screw rod 355 can movably be combined with horizontal direction.Also, the rear side of the central ball screw 355 and central motor 357 Rotary shaft is combined.The central ball screw 355 behind the middle section 353a of centre pedestal 353 by be separated by up and down to Few two formation.The central ball screw 355 rotates and supports centre pedestal 353 in top and the bottom and it is moved forward and backward.
The central motor 357 is located at the outside of vacuum chamber 110, and the axial rotary vacuum of the central motor 357 The Inner elongate of chamber 110 and combined with the rear end of central ball screw 355.The central motor 357 makes central ball Screw rod 355 rotates.The central motor 357 two is operated simultaneously makes centre pedestal 353 and central magnet 351 move forward and backward. Also, the central motor 357, makes centre pedestal by only having one of both operating or making both rotary speeies different 353 and central magnet 351 tilt.The central motor 357 can be formed by the servomotor of rotation-controlled number.
The top magnet unit 450 includes top magnet 451, top base 453, upper spheres screw rod 455, top ten thousand To joint 457 and upper motor 459.The top magnet unit 450, top magnet 451 and central magnet 351 independently or with It moves forward and backward together, is tilted together with central magnet 351.Now, the top magnet 451 in the state of being inclined by with Central magnet 351 is independently progressed and retreated.Also, the top magnet unit 450 is together with central magnet unit 350 in water Square reciprocate upwards.
The top magnet 451 with the identical magnet of central magnet 351 by forming, and the tool to extend in vertical direction There is the shaft-like formation of specified altitude and width.The top of the centrally located magnet 351 of top magnet 451, and with being less than Entreat the height of magnet 351.The top magnet 451 it is highly preferred for the 1/10 to 1/3 of substrate whole height.Also, it is described Top magnet 451 can using on substrate film forming thickness as the height according to the reflection thickness upper-side area different from middle section come Decision Height.The top magnet 451 advances together with central magnet 351, retreats or tilted.Also, the top magnet 451 Independently progress and retreat with central magnet 351.Also, the top magnet 451 is in the inclined shape together with central magnet 351 Independently progress and retreat with central magnet 351 under state.Therefore, the top magnet 451 can be adjusted between target 140 Distance and the distance between central magnet 351 and target 140 difference.Therefore, the distance between described top magnet 451 and target 140 It can be adjusted according to required plasma density.
Shaft-like formation of the top base 453 to extend in vertical direction, and with the width with top magnet 451 Highly corresponding width and height.Also, the top base 453, is combined before it with top magnet 451 and supports top Magnet 451 makes the top magnet 451 advance, retreat and tilt.Also, the top base 453 can come and go in the horizontal direction Transfer.
The upper spheres screw rod 455, its front end is incorporated into behind top base 453, and it is universal that rear end is incorporated into top Joint 457.Now, the upper spheres screw rod 455 can be housed inside upper area 353b or the insertion center of centre pedestal 353 The upper area 353b of pedestal 353 and extend.The upper spheres screw rod 455 makes top base 453 move forward and backward.
The top universal joint 457 is incorporated between the rear end of upper spheres screw rod 455 and upper motor 459.It is described Top universal joint 457 makes that the revolving force of upper motor 459 is inclined by centre pedestal 353 and top base 453 and top is electric The rotary shaft of machine 459 and the angle of upper spheres screw rod 455 are not also communicated to upper spheres screw rod in the case of a line 455.Therefore, the top base 453 is moved forward and backward in the state of being inclined by by upper spheres screw rod 455.Also, institute Top universal joint 457 is stated by adjusting the rotary shaft of upper motor 459 and the angle of upper spheres screw rod 455, makes top base Seat 453 is reciprocated in the horizontal direction together with centre pedestal 353.
The upper motor 459 be located at vacuum chamber 110 outside, the Inner elongate of axial rotary vacuum chamber 110 and Combined with top universal joint 457.The upper motor 459 rotates and rotates top universal joint 457.The top Motor 459 can be formed by the servomotor for accurately controlling rotation number.
The lower magnet unit 550 includes lower magnet 551, lower base 553, lower spheres screw rod 555, bottom ten thousand To joint 557 and lower motor 559.The lower magnet unit 550, lower magnet 551 and central magnet 351 independently or with It moves forward and backward together, is tilted together with central magnet 351.
The lower magnet 551 with the identical magnet of central magnet 351 by forming, and the tool to extend in vertical direction There is the shaft-like formation of specified altitude and width.The bottom of the centrally located magnet 351 of lower magnet 551, and with being less than Entreat the height of magnet 351.The lower magnet 551 has with the identical of top magnet 451 highly, and preferably ground level is that substrate is whole The 1/10 to 1/3 of body height.The lower magnet 551 is advanced, retreats or inclined together with central magnet 351 and top magnet 451 Tiltedly.Also, the lower magnet 551 is independently progressed and retreated with central magnet 351.Also, the lower magnet 551 with Central magnet 351 and top magnet 451 are independently progressed in the state of tilting together with central magnet 351 and top magnet 451 And retrogressing.Therefore, the lower magnet 551 can be adjusted to the distance between target 140 and central magnet 351 and target 140 it Between distance it is different.The distance between the lower magnet 551 and target 140 are adjusted according to required plasma density.
Shaft-like formation of the lower base 553 to extend in vertical direction, and with the width with lower magnet 551 Highly identical or small width and height.Also, the lower base 553, is combined and is supported with lower magnet 551 before it Lower magnet 551 makes the lower magnet 551 advance, retreat and tilt.
The lower spheres screw rod 555, its front end is incorporated into behind lower base 553, and it is universal that rear end is incorporated into bottom Joint 557.Now, the lower area 353c of the insertion centre pedestal 353 of lower spheres screw rod 555 and with bottom universal joint 557 combine.The lower spheres screw rod 555 rotates and lower base 553 is moved forward and backward.
The bottom universal joint 557 is incorporated between the rear end of lower spheres screw rod 555 and lower motor 559.It is described Bottom universal joint 557 makes the revolving force of lower motor 559 be tilted and lower motor in centre pedestal 353 and lower base 553 559 rotary shaft and the angle of lower spheres screw rod 555 are not also communicated to lower spheres screw rod 555 in the case of a line. Therefore, the lower base 553 is moved forward and backward in the state of being inclined by by lower spheres screw rod 555.Also, under described Portion's universal joint 557 by by the rotary shaft of lower motor 559 and the angular adjustment of lower spheres screw rod 555 to horizontal direction, Lower base 553 is set to be reciprocated in the horizontal direction together with centre pedestal 353.
The lower motor 559 be located at vacuum chamber 110 outside, the Inner elongate of axial rotary vacuum chamber 110 and Combined with bottom universal joint 557.The lower motor 559 rotates and rotates bottom universal joint 557.The lower motor 559 can be formed by the servomotor of rotation-controlled number.
The central transfer unit 650 includes spline 651, central branches fagging 653, central supporting axle 655 and center transfer Motor 657.The support of central transfer unit 650 centre pedestal 353 causes centre pedestal 353 stably to move forward and backward.And And, the central transfer unit 650 makes central magnet unit 350, top magnet unit 450 and lower magnet unit 550 in water Square reciprocate predetermined distance upwards.On the other hand, the central transfer unit 650 can be by making magnet portion in sputter equipment 250 general structures reciprocated in the horizontal direction are formed.
The front end of the spline 651 is incorporated into behind centre pedestal 353, and using the binding site of centre pedestal 353 as Benchmark is combined in which can rotate upwardly and downwardly.The spline 651 is at least formed by two, and is formed with being separated by the vertical direction.And Also, the rear side of the spline 651 is incorporated into central branches fagging 653.The spline 651 is in central magnet unit 350 by multiple The combination on respective centre pedestal 353 in the case of formation.
The spline 651 is formed by general spline.That is, described spline 651 includes splined shaft and multiple spline hub, ties respectively Together in behind centre pedestal 353 and before central branches fagging 653.The spline 651 moves forward and backward in centre pedestal 353 When splined shaft moved forward and backward in the inside of multiple spline hub and support centre pedestal 353.
Also, the spline 651 when centre pedestal 353 is inclined by by with the basis of the binding site of centre pedestal 353 Rotate and support centre pedestal 353.Therefore, the second of the front end for combining spline 651 is formed behind the centre pedestal 353 Bracket 354c and the second rotating dog 354d.Also, the rear end of the spline 651 is also rotationally incorporated into central branches fagging 653. Therefore, the back or front of the central branches fagging 653 can also form the 3rd bracket 653a and the 3rd rotating dog 653b.Therefore, The front-end and back-end of the spline 651 are respectively rotatably incorporated into centre pedestal 353 and central branches fagging 653.
The central branches fagging 635 is formed with tabular, and with being faced behind centre pedestal 353 before it.In described Centre supporting plate 653 is combined and fixed the rear side of spline 651 with the rear end for the spline 651 being separated by the vertical direction.On the other hand, The central branches fagging 653 and respectively in connection with multiple splines 651 in the multiple centre pedestals 351 being separated by the horizontal direction all With reference to.Therefore, the central branches fagging 653 makes multiple centre pedestals 351 all to move together in the horizontal direction.
The central supporting axle 655, its front end is incorporated into behind central branches fagging 653, rear side insertion vacuum chamber 110 Wall body and extend.The central supporting axle 655 supports central branches fagging 653 and its is come and gone transfer in the horizontal direction.Separately On the one hand, central supporting axle 655 is formed with the wall body of the vacuum chamber 110 and comes and goes passing through needed for transferring in the horizontal direction Through hole (not shown).
The central feeding motor 657 is combined with the rear end of central supporting axle 655, makes central supporting axle 655 in level side Reciprocate upwards.Although the central feeding motor 657 is not specifically illustrated, include reductor in the end of motor shaft And ball screw.Therefore, the central feeding motor 657 makes central supporting axle 655 reciprocate in the horizontal direction.
The operation to the sputter equipment with Splittable magnet of another embodiment of the present invention is illustrated below.
Illustrated below centered on the operation of the magnet portion 250.Also, substrate branch is installed in the substrate Illustrated centered on the process that the distance for being inclined by state and adjusting target 140 and magnet portion 250 is kept after frame.Now, it is described Target 140 can keep vertical state or inclined state.
First, two central motors 357 of the central magnet unit 350 operate and make ball screw 355 respectively simultaneously Rotation.As the central ball screw 355 rotates, centre pedestal 353 advances, top magnet 451 and central magnet 351 away from From and lower magnet 551 and target 140 with a distance from be conditioned simultaneously.Now, the central transfer unit 650, splined shaft is in spline The inside of wheel hub moves forward and backward, and stably supports the centre pedestal 353 moved forward and backward.
Then, it is located at top in two central motors 357 for being separated by and combining up and down behind the centre pedestal 353 The central ball screw 355 that operates and be connected to central motor 357 of central motor 357 rotate.With the central ball Screw rod 355 rotates, and the top of centre pedestal 353 is to tilting before orientation substrate and then on the whole.Now, the central ball screw 355, because it is rotationally incorporated into centre pedestal 353, therefore keep axially with it is out of square behind centre pedestal 353 and The state combined with centre pedestal 353.Also, the upper spheres screw rod 455 and upper motor of the top magnet unit 450 The state that 459 rotary shaft keeps not forming straight line and connecting by top universal joint 457.Also, the lower magnet unit 550 lower spheres screw rod 555 and the rotary shaft of lower motor 559 keep not forming straight line and connected by bottom universal joint 557 The state connect.By the inclination of the centre pedestal 353, central magnet 351, top magnet 451 and lower magnet 551 are also inclined Tiltedly.
Then, the upper motor 459 of the top magnet unit 450 operates and rotates upper spheres screw rod 455.This When, the top base 453 and top magnet 451 are in heeling condition, therefore keep rotary shaft and the top of upper motor 459 The axial direction of ball screw 455 does not keep the state of a straight line.But, by being incorporated into the upper motor 459 and upper spheres The top universal joint 457 of the centre of screw rod 455, the revolving force of upper motor 459 is communicated to upper spheres screw rod 455.Institute State top base 453 and top magnet 451 advances with the rotation of upper spheres screw rod 455, top magnet 451 and target 140 The distance between become smaller compared to central magnet 351.
Also, the lower magnet unit 550 is operated, lower magnet 551 and target identically with top magnet unit 450 The distance between 140 also become smaller compared to central magnet 351.On the other hand, the top magnet unit 450 and bottom magnetic Body unit 550 can be operated simultaneously, individually only one of which can also be operated.
One embodiment described above for being only for implementing the sputter equipment with Splittable magnet of the present invention, this hair It is bright to be not limited to described embodiment, as asked in following claims, do not departing from the technology of the present invention In the range of thought, the those of ordinary skill of the technical field belonging to the present invention can implement numerous variations to it, and these are variable The scope more implemented should also be as belonging to protection scope of the present invention.

Claims (3)

1. a kind of sputter equipment, including:Substrate;Target, positioned at the region with the real estate pair;One or it is separated by with horizontal direction Multiple magnet portions of arrangement, positioned at the region with the target surface pair, in vertical direction with length;Characterized in that,
The magnet portion includes:
Central magnet unit, including central magnet, the central magnet are advanced relative to the target, retreat and tilted;
Top magnet unit, including the top magnet positioned at the top of the central magnet, the top magnet and the center Magnet moves forward and backward together;And
Lower magnet unit, including the lower magnet positioned at the bottom of the central magnet, the lower magnet and the center Magnet moves forward and backward together,
The top magnet of the top magnet unit is inclined by together with the central magnet, after inclination, relative to the center Magnet is independently progressed and retreated,
The lower magnet of the lower magnet unit is inclined by together with the central magnet, after inclination, relative to the center Magnet is independently progressed and retreated,
The central magnet unit includes:
Centre pedestal, with the middle section being incorporated into behind the central magnet, on the top of the middle section with phase There is the upper area of the groove shapes formation of difference in height for middle section and in the bottom of the middle section with relative There is the lower area of the groove shapes formation of difference in height in middle section,
The top magnet unit includes:
Top base, is incorporated into behind the top magnet and is contained in the upper area;
Upper spheres screw rod, upper area described in insertion and be incorporated into behind the top base;
Top universal joint, is incorporated into the upper spheres screw rod;And
Upper motor, is incorporated into the top universal joint,
The lower magnet unit includes:
Lower base, is incorporated into behind the lower magnet and is contained in the lower area;
Lower spheres screw rod, lower area described in insertion and be incorporated into behind the lower base;
Bottom universal joint, is incorporated into the lower spheres screw rod;And
Lower motor, is incorporated into the bottom universal joint,
The top universal joint make the revolving force of upper motor the centre pedestal and top base be inclined by and it is described on The angle of portion's motor and the upper spheres screw rod is not also communicated to the upper spheres screw rod in the case of a line,
The bottom universal joint makes the revolving force of lower motor be tilted and the bottom in the centre pedestal and lower base The angle of motor and the lower spheres screw rod is not also communicated to the lower spheres screw rod in the case of a line.
2. sputter equipment according to claim 1, it is characterised in that
The central magnet unit also includes:
At least two central ball screws, respectively in connection with the upper and lower part of the middle section in the centre pedestal, with described Combined with rotating upwardly and downwardly on the basis of the binding site of centre pedestal;And
At least two central motors, are incorporated into the central ball screw and make the central ball screw rotation.
3. sputter equipment according to claim 2, it is characterised in that
The central magnet unit,
The central motor has two, described two operatings and the centre pedestal and central magnet is moved forward and backward, or
Any one in described two operates or makes described two rotary speeies different and make the centre pedestal and central magnetic Body is tilted.
CN201410222220.9A 2013-05-23 2014-05-23 Sputter equipment with Splittable magnet Active CN104178741B (en)

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CN108456859B (en) * 2017-02-22 2021-05-07 北京北方华创微电子装备有限公司 Magnetron sputtering cavity and magnetron sputtering equipment
KR102181087B1 (en) * 2018-08-23 2020-11-20 주식회사 아바코 Sputtering Apparatus and Method for Controlling Sputtering Apparatus
KR102180214B1 (en) * 2018-09-03 2020-11-18 주식회사 아바코 Sputtering Apparatus and Method for Controlling Sputtering Apparatus
KR102375781B1 (en) * 2018-11-15 2022-03-18 주식회사 아바코 Sputtering Apparatus and Method for Controlling Sputtering Apparatus
KR20200056588A (en) * 2018-11-15 2020-05-25 주식회사 아바코 Sputtering Apparatus and Method for Controlling Sputtering Apparatus
CN112553583B (en) * 2019-09-25 2023-03-28 亚威科股份有限公司 Sputtering apparatus and sputtering apparatus control method
KR102353670B1 (en) * 2019-10-07 2022-01-21 주식회사 에이치앤이루자 Cylindrical Cathode for Sputtering Device
KR102301176B1 (en) * 2019-12-27 2021-09-14 주식회사 에이치앤이루자 Cathode Device for Sputtering Apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
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JP3879009B2 (en) * 1995-01-30 2007-02-07 キヤノンアネルバ株式会社 Sputtering cathode
US10043642B2 (en) * 2008-02-01 2018-08-07 Oerlikon Surface Solutions Ag, Pfäffikon Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement
US8137519B2 (en) * 2008-03-13 2012-03-20 Canon Anelva Corporation Sputtering cathode, sputtering apparatus provided with sputtering cathode, film-forming method, and method for manufacturing electronic device
KR101053054B1 (en) * 2008-12-23 2011-08-01 주식회사 테스 Magnetron sputtering device
KR101165432B1 (en) 2010-05-25 2012-07-12 (주)이루자 Driving method of magnet and sputtering apparatus using thereof
JP5951975B2 (en) 2010-12-28 2016-07-13 キヤノンアネルバ株式会社 Sputtering equipment
CN203096163U (en) * 2013-02-27 2013-07-31 东莞汇海光电科技实业有限公司 Adjusting device for uniformly coating for magnetic field

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