CN104168712B - Groove profile metallized semi-pore and preparation method thereof - Google Patents
Groove profile metallized semi-pore and preparation method thereof Download PDFInfo
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- CN104168712B CN104168712B CN201410413477.2A CN201410413477A CN104168712B CN 104168712 B CN104168712 B CN 104168712B CN 201410413477 A CN201410413477 A CN 201410413477A CN 104168712 B CN104168712 B CN 104168712B
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- pore
- groove profile
- hole
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Abstract
The present invention discloses a kind of groove profile metallized semi-pore, the half bore on its side wall is opened in including the thickness direction along pcb board, the aperture of half bore is d, and the thickness of pcb board is h, extend to form locating slot in the upper end of half bore, length, width, the depth of locating slot are respectively X, Y, H, and X >=d, Y ＞ d/2, H ＜ h, on the hole wall of half bore, the inwall of locating slot be provided with metal level in integral structure, wherein, d, h, X, Y, H are the real number more than zero.Groove profile metallized semi-pore due to add X, Y-direction solder side, greatly improve weld strength, the mechanical resistant external force ability of sidewall weld of hole wall, welding, assembly reliability be substantially improved.Invention additionally discloses a kind of preparation method of groove profile metallized semi-pore, when making groove profile metallized semi-pore by this method, metal level is difficult to crimp towards cutter direction of rotation, will not be pulled, tilted, damaged and copper thorn is remained, open circuit, short circuit problem when being effectively improved welding, improve soldering reliability.
Description
Technical field
The present invention relates to pcb board technical field, more particularly to a kind of groove profile metallized semi-pore of pcb board and its processing side
Method.
Background technology
Half-pore plate is the class for making full use of the three dimensions of wiring board and turning on or be connected with electronic component in its side wall
Special circuit panel products, its half bore had both remained the conducting function of circular hole, can be welded and fixed again using the hole wall of half bore,
Realize by simply and easily structure come the function of retaining element or component.Such as mother baby plate, daughter board is generally used for attachment
Daughter board after chip, pasting chip is mounted on motherboard again as a component, in order to realize this structure, it is necessary on daughter board
Metallized semi-pore is processed, chip pin is fixed in the metallized semi-pore, is then welded on together on motherboard again.
As shown in Figure 1 and Figure 2, in traditional half-pore plate, gold is formed with the hole wall for the half bore 2` for taking shape in substrate layer 1` sides wall
The adhesion of categoryization layer 3`, metal layer 3` and hole wall is limited, directly affects the ability that sidewall weld resists mechanical external force.
On the other hand, when being molded half bore, the direction of rotation of milling cutter is all clockwise, therefore, when tool sharpening is to A points, due to A
Metal layer 3` and substrate layer 1` is closely coupled at point, therefore the metal layer 3` being attached on hole wall has support, can prevent
Extensions of the metal layer 3` in processing and the separation with hole wall, it is ensured that copper thorn residual will not be produced process herein after；And work as
When tool sharpening is to B points, because the metal layer 3` being attached on hole wall does not have any support herein, cutter operation process forward
In, influenceed metal layer 3` easily to be crimped towards cutter direction of rotation by external force, cause metal layer 3` pulled, tilted, damaged
And copper thorn residual, these will all directly affect the installation of client and use；In addition, the copper wire remained in half bore was being welded
Cheng Zhong, easily occur solder joint loosely, rosin joint, bridge joint short circuit the problems such as.
Separated with half bore hole wall therefore, it is necessary to provide one kind and can be prevented effectively from hole wall metal level, improve the welding of half hole wall
Half pore structure of intensity, to solve above-mentioned the deficiencies in the prior art.
The content of the invention
Hole wall metal level can be prevented effectively from it is an object of the invention to provide one kind to separate with half bore hole wall, improve half hole wall
Half pore structure of weld strength.
Hole wall metal level can be prevented effectively from another object of the present invention is to providing one kind to separate with half bore hole wall, improve half
The preparation method of half pore structure of hole wall weld strength.
To achieve the above object, the technical scheme is that：A kind of groove profile metallized semi-pore is provided, it is located at pcb board
Side-walls, the groove profile metallized semi-pore includes half bore, and thickness direction of the half bore along the pcb board is opened in described
On the side wall of pcb board, the aperture of the half bore is d, and the thickness of the pcb board is h, extends to form fixed in the upper end of the half bore
Position groove, length, width, the depth of the locating slot are respectively X, Y, H, and X >=d, Y ＞ d/2, H ＜ h, the hole wall of the half bore
The inwall of the upper, locating slot is provided with the metal level in integral structure, wherein, d, h, X, Y, H are the real number more than zero.
It is preferred that the metal level is copper material.
Compared with prior art, due to the groove profile metallized semi-pore of the present invention, extend to form locating slot in the upper end of half bore,
And hole wall in half bore, the metal level that sets on the inwall of locating slot on metal level in integral structure, the inwall of locating slot,
Groove profile metallized semi-pore is added in X, the solder side of Y-direction, therefore the welding for greatly improving groove profile metallized semi-pore hole wall is strong
Degree, improves the mechanical resistant external force ability of sidewall weld, so that welding, the reliability of assembling is substantially improved.
Accordingly, the present invention also provides a kind of preparation method of groove profile metallized semi-pore, wherein, the groove profile metallized semi
Hole includes half bore and the locating slot being connected, and the preparation method of the groove profile metallized semi-pore comprises the following steps：
(1) provide and through hole is penetratingly offered on pcb board to be processed, the pcb board to be processed, and the through hole
Aperture is d, a height of h in hole of the through hole, wherein, described d, h are the real number more than zero；
(2) size of the locating slot is determined, wherein, length, width, the depth of the locating slot are respectively X, Y, H, and
X >=d, Y ＞ d/2, H ＜ h, wherein, described X, Y, H are the real number more than zero；
(3) size of initial alignment groove, the length of the initial alignment groove, width are drawn according to the size of the locating slot
Degree, depth are respectively 2Y, X, H；
(4) through hole on the pcb board is enlarged by deep milling, so as to form the initial alignment groove；
(5) the metallization initial alignment groove and the through hole make to form the metal in integral structure on the inwall of the two
Layer；
(6) the initial alignment groove and the through hole are filled using consent material；
(7) half of the through hole is cut along the length direction of the initial alignment groove to metallize so as to obtain the groove profile
Half bore.
It is preferred that the step of also including being etched the layers of copper on the pcb board before the step (6), the copper
Line layer is formed after layer etching.
It is preferred that also comprising the following steps before the step (7)：Carrying out baking to the consent material hardens into it
Type is integrated.
It is preferred that also comprising the following steps after the step (7)：By pcb board described in acid solution or dipping by lye to go
Except the consent material.
It is preferred that the metal level is copper material.
It is preferred that the consent material is resin, inorganic filler, one-component material or multicomponent mixture.
Compared with prior art, due to the preparation method of groove profile metallized semi-pore of the invention, first to logical on pcb board
Hole is enlarged by deep milling and obtains initial alignment groove, and then metallization initial alignment groove and through hole make to be formed on the inwall of the two
In the metal level of integral structure；Then before shaping groove profile metallized semi-pore, using consent material is to initial alignment groove and leads to
Hole is filled and carrying out baking to consent material is integrated its hardened forming, then cuts the half of through hole to obtain institute
State groove profile metallized semi-pore；Finally again by acid solution or dipping by lye pcb board to remove the consent material.Due to initially fixed
Consent material is filled with position groove, through hole, therefore, when being molded groove profile metallized semi-pore, the metal level on the hole wall of through hole is each
Point has physical support, and metal level is difficult to crimp towards cutter direction of rotation, and the metal level that can be prevented effectively from hole wall is drawn support, stuck up
Rise, damaged and copper thorn is remained, so as to avoid thus caused open circuit, short circuit problem.And hole wall, the inwall of locating slot of half bore
On the metal level that is provided with metal level in integral structure, locating slot inwall add groove profile metallized semi-pore in X, Y side
To solder side, due to locating slot in the x, y direction welding positioning, greatly improve the welding of groove profile metallized semi-pore hole wall
Intensity, improves sidewall weld mechanical resistant external force ability, greatly improves welding, the assembly reliability of groove profile metallized semi-pore.
Brief description of the drawings
Fig. 1 is the structural representation of groove profile metallized semi-pore in the prior art.
Fig. 2 is Fig. 1 schematic cross-section.
Fig. 3 is the structural representation of groove profile metallized semi-pore of the present invention.
Fig. 4 is the flow chart of the preparation method of groove profile metallized semi-pore of the present invention.
Fig. 5 is the sectional view for the pcb board that the present invention is formed with through hole.
Fig. 6 is the sectional view after Fig. 5 is enlarged by deep milling.
Fig. 7 is that Fig. 6 carries out the sectional view after plated-through hole and initial alignment groove.
Fig. 8 is the sectional view after being etched to the layers of copper in Fig. 7.
Fig. 9 is the sectional view after Fig. 8 filling consent materials.
Figure 10 is the sectional view of the groove profile metallized semi-pore drawn according to the preparation method of groove profile metallized semi-pore of the present invention.
Embodiment
Element numbers similar in embodiments of the invention, accompanying drawing, which are described, with reference now to accompanying drawing represents similar element.
As shown in Fig. 3, Figure 10, groove profile metallized semi-pore 2 provided by the present invention, it is located at the side-walls of pcb board 1, institute
Stating groove profile metallized semi-pore 2 includes half bore 21, and thickness direction of the half bore 21 along pcb board 1 is opened in the side of the pcb board 1
On wall, the aperture of the half bore 21 is d, and the thickness of the pcb board 1 is h, extends to form locating slot in the upper end of the half bore 21
22, length, width, the depth of the locating slot 22 are respectively X, Y, H, and X >=d, Y ＞ d/2, H ＜ h, the hole of the half bore 21
On wall, the inwall of the locating slot 22 be provided with metal level in integral structure, wherein, d, h, X, Y, H are more than zero
Real number.
Preferably, the metal level 3 is copper material, so that metal level 3 has with the layer within the circuit made of copper in pcb board 1
There is more preferable connectivity, so as to improve the stability and electric conductivity of its connection.
Due to the groove profile metallized semi-pore 2 of the present invention, extend to form locating slot 22 in the upper end of half bore 21, and in half bore 21
Hole wall, the metal level 3 that sets on the inwall of locating slot 22 on metal level 3 in integral structure, the inwall of locating slot 22, increase
Add groove profile metallized semi-pore 2 in X, the solder side of Y-direction, therefore greatly improve the welding of the hole wall of groove profile metallized semi-pore 2
Intensity, improves the mechanical resistant external force ability of sidewall weld, so that welding, the reliability of assembling is substantially improved.
As shown in figure 4, the preparation method to groove profile metallized semi-pore of the present invention is illustrated below, wherein, pass through the party
Method makes half bore and the locating slot that obtained groove profile metallized semi-pore includes being connected, the making side of the groove profile metallized semi-pore
Method comprises the following steps：
Step S01：There is provided and penetratingly offer through hole on pcb board to be processed, the pcb board to be processed, and it is described
The aperture of through hole be d, a height of h in hole of the through hole, wherein, described d, h are the real number more than zero；
Step S02：Determine the size of the locating slot, wherein, length, width, the depth of the locating slot be respectively X,
Y, H, and X >=d, Y ＞ d/2, H ＜ h, wherein, described X, Y, H are the real number more than zero；
Step S03：The size of initial alignment groove, the length of the initial alignment groove are drawn according to the size of the locating slot
Degree, width, depth are respectively 2Y, X, H；
Step S04：Through hole on the pcb board is enlarged by deep milling, so as to form the initial alignment groove；
Step S05：Metallize the initial alignment groove and the through hole to make to be formed on the inwall of the two be in integral structure
Metal level；
Step S06：The initial alignment groove and the through hole are filled using consent material；
Step S07：Carrying out baking to the consent material is integrated its hardened forming；
Step S08：Cut the half of the through hole to obtain the groove profile along the length direction of the initial alignment groove
Metallized semi-pore；
Step S09：By pcb board described in acid solution or dipping by lye to remove the consent material.
It is preferred that the step of also including being etched the layers of copper on the pcb board before the step S06, the copper
Line layer is formed after layer etching.
Preferably, the metal level is copper material, so that metal level has more with the layer within the circuit made of copper in pcb board
Good connectivity, so as to improve the stability and electric conductivity of its connection.
Preferably, the consent material is resin, inorganic filler, one-component material or multicomponent mixture etc., the plug
The general character of hole material is can be molded with baking hardening, can be removed after shaping by acid solution or dipping by lye, the present invention one
Plant in specific embodiment, consent material uses ink, therefore, the ink can be removed by the roasting type aqueous slkali of heat, when
So, consent material of the invention is not limited with ink.
With reference to shown in Fig. 3-Figure 10, the manufacturing process to groove profile metallized semi-pore 2 of the present invention is described.
One pcb board 1 to be processed after sawing sheet, drilling, nog plate processing, the pcb board 1 to be processed are provided first
On penetratingly offer through hole 4, and the aperture of the through hole 4 is d, a height of h in hole of the through hole 4, and d, h are the reality more than zero
Number, as shown in Figure 5；Also there is layers of copper 6 on other pcb board 1, the layers of copper 6 forms line layer (referring to aftermentioned) for etching.
It is then determined that the size of the locating slot 22 for the groove profile metallized semi-pore 2 processed is needed, wherein, the locating slot 22
Length, width, depth are respectively X, Y, H, and X >=d, Y ＞ d/2, H ＜ h, X, Y, H are the real number more than zero；That is locating slot 22
Length be greater than or equal to the diameter of through hole 4, radius of the width at least above the through hole 4 of locating slot 22 of locating slot 22, ginseng
Read Fig. 3；Size further according to the locating slot 22 draws the size of initial alignment groove 5, the length of the initial alignment groove 5, width
Degree, depth are respectively 2Y, X, H.
Then, the through hole 4 on the pcb board 1 is enlarged by deep milling, so as to extend to be formed in the upper end of through hole 4
The initial alignment groove 5, length, width, the depth of the beginning locating slot 5 are respectively 2Y, X, H, with reference to shown in Fig. 3, Fig. 6.
Then metallization initial alignment groove 5 and through hole 4 and make to form the metal level in integral structure on the inwall of the two
3；And the layers of copper 6 on the pcb board 1 is etched, the layers of copper 6 forms line layer 6a after etching, referring to Fig. 7, Fig. 8 institutes
Show.
Next initial alignment groove 5 and through hole 4 are filled using consent material 7, and consent material 7 is toasted
It is integrated its hardened forming, as shown in Figure 9；The half of the through hole 4 is cut along the length direction of the initial alignment groove 5 again
So as to obtaining the groove profile metallized semi-pore 2, i.e., by the cutting of through hole 4 it is two along plane where Fig. 9 cathetus LL, wherein, straight line
LL passes through the length sides 2Y of initial alignment groove 5 center and normal thereto, therefore plane where straight line LL is by the straight of through hole 4
Footpath and pcb board 1 is divided into two after the length sides of initial alignment groove 5, cutting, so as to obtain two symmetrical groove profiles
Metallized semi-pore 2；Due to being filled with consent material 7 in initial alignment groove 5 and through hole 4, therefore, the one of the through hole 4 is being cut
When half, each point of metal level 3 on the hole wall of through hole 4 has physical support, and metal level 3 is difficult to crimp towards cutter direction of rotation, can
Be prevented effectively from metal level 3 on hole wall drawn support, tilt, damaged and copper thorn is remained, so as to avoid thus caused open circuit, short
Road problem.
Finally again by pcb board 1 described in acid solution or dipping by lye to remove the consent material 7, so as to obtain groove profile gold
Formed in categoryization half bore 2 (referring to Fig. 3), and the inwall of the through hole 21 of the groove profile metallized semi-pore 2, the inwall of locating slot 22
In the metal level 3 of integral structure, as shown in Figure 10.
With reference to shown in Fig. 3-Figure 10, due to the preparation method of the groove profile metallized semi-pore 2 of the present invention, first on pcb board 1
Through hole 4 be enlarged by deep milling and obtain initial alignment groove 5, then metallize initial alignment groove 5 and through hole 4 make the interior of the two
The metal level 3 in integral structure is formed on wall；Then before the groove profile metallized semi-pore 2 is molded, 7 pairs of consent material is used
Initial alignment groove 5 and through hole 4 are filled and carrying out baking to consent material 7 is integrated its hardened forming, are then cut logical
The half in hole 4 is so as to obtain the groove profile metallized semi-pore 2；It is finally described to remove by acid solution or dipping by lye pcb board 1 again
Consent material 7.Due to being filled with consent material 7 in initial alignment groove 5, through hole 4, therefore, in shaping groove profile metallized semi-pore 2
When, each point of metal level 3 on the hole wall of through hole 4 has physical support, and metal level 3 is difficult to crimp towards cutter direction of rotation, can had
Effect avoids the metal level 3 on hole wall from being drawn support, tilting, damaged and copper thorn to remain, so as to avoid thus caused open circuit, short circuit
Problem.And the metal level 3 in integral structure is provided with the hole wall of half bore 21, the inwall of locating slot 22, locating slot 22 it is interior
Metal level on wall adds groove profile metallized semi-pore 2 in X, the solder side of Y-direction, due to locating slot 22 in the x, y direction
Welding positioning, greatly improves the weld strength of the hole wall of groove profile metallized semi-pore 2, improves sidewall weld mechanical resistant external force ability,
Greatly improve welding, the assembly reliability of groove profile metallized semi-pore.
Tool involved by concrete structure, operation principle and the preparation method of the invention of pcb board 1 involved in the present invention
The error that body size is allowed is well known to those of ordinary skill in the art, is no longer described in detail herein.
Above disclosed is only the preferred embodiments of the present invention, can not limit the right of the present invention with this certainly
Scope, therefore the equivalent variations made according to scope of the present invention patent, still belong to the scope that the present invention is covered.
Claims (8)
1. a kind of groove profile metallized semi-pore, located at the side-walls of pcb board, it is characterised in that the groove profile metallized semi-pore includes
Half bore, thickness direction of the half bore along the pcb board is opened on the side wall of the pcb board, and the aperture of the half bore is d,
The thickness of the pcb board is h, extends to form locating slot in the upper end of the half bore, length, width, the depth of the locating slot
On respectively X, Y, H, and X >=d, Y ＞ d/2, H ＜ h, the hole wall of the half bore, the inwall of the locating slot is provided with one
The metal level of formula structure, wherein, d, h, X, Y, H are the real number more than zero.
2. groove profile metallized semi-pore as claimed in claim 1, it is characterised in that the metal level is copper material.
3. a kind of preparation method of groove profile metallized semi-pore, wherein, the groove profile metallized semi-pore include the half bore being connected and
Locating slot, it is characterised in that comprise the following steps：
(1) provide on pcb board to be processed, the pcb board to be processed and penetratingly offer through hole, and the aperture of the through hole
For d, a height of h in hole of the through hole, wherein d, h are the real number more than zero；
(2) size of the locating slot is determined, wherein, length, width, the depth of the locating slot are respectively X, Y, H, and X >=
D, Y ＞ d/2, H ＜ h, wherein X, Y, H are the real number more than zero；
(3) size of initial alignment groove, length, width, the depth of the initial alignment groove are drawn according to the size of the locating slot
Degree is respectively 2Y, X, H；
(4) through hole on the pcb board is enlarged by deep milling, so as to form the initial alignment groove；
(5) the metallization initial alignment groove and the through hole make to form the metal level in integral structure on the inwall of the two；
(6) the initial alignment groove and the through hole are filled using consent material；
(7) cut the half of the through hole to obtain the groove profile metallized semi along the length direction of the initial alignment groove
Hole.
4. the preparation method of groove profile metallized semi-pore as claimed in claim 3, it is characterised in that before the step (6) also
The step of including being etched to the layers of copper on the pcb board, line layer is formed after the layers of copper etching.
5. the preparation method of groove profile metallized semi-pore as claimed in claim 3, it is characterised in that before the step (7) also
Comprise the following steps：Carrying out baking to the consent material is integrated its hardened forming.
6. the preparation method of groove profile metallized semi-pore as claimed in claim 3, it is characterised in that after the step (7) also
Comprise the following steps：By pcb board described in acid solution or dipping by lye to remove the consent material.
7. the preparation method of groove profile metallized semi-pore as claimed in claim 3, it is characterised in that the metal level is copper material
Matter.
8. the preparation method of groove profile metallized semi-pore as claimed in claim 3, it is characterised in that the consent material is tree
Fat, inorganic filler, one-component material or multicomponent mixture.
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| CN201410413477.2A CN104168712B (en) | 2014-08-20 | 2014-08-20 | Groove profile metallized semi-pore and preparation method thereof |
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| CN201410413477.2A CN104168712B (en) | 2014-08-20 | 2014-08-20 | Groove profile metallized semi-pore and preparation method thereof |
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| CN104168712B true CN104168712B (en) | 2017-09-12 |
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| CN105163495B (en) * | 2015-08-04 | 2017-11-17 | 大连崇达电路有限公司 | It is a kind of to be provided with slotted eye, the processing method of plane line plate |
| CN106793581B (en) * | 2016-11-18 | 2019-05-14 | 深圳崇达多层线路板有限公司 | Multilayer N+N folds structure circuit board pressing localization method |
| CN112291930A (en) * | 2019-08-07 | 2021-01-29 | 宏华胜精密电子(烟台)有限公司 | Method for manufacturing metallized semi-hole of circuit board |
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