CN104144572A - 微粘带供料机构 - Google Patents
微粘带供料机构 Download PDFInfo
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- CN104144572A CN104144572A CN201410326169.6A CN201410326169A CN104144572A CN 104144572 A CN104144572 A CN 104144572A CN 201410326169 A CN201410326169 A CN 201410326169A CN 104144572 A CN104144572 A CN 104144572A
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410326169.6A CN104144572B (zh) | 2014-07-09 | 2014-07-09 | 微粘带供料机构 |
Applications Claiming Priority (1)
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CN201410326169.6A CN104144572B (zh) | 2014-07-09 | 2014-07-09 | 微粘带供料机构 |
Publications (2)
Publication Number | Publication Date |
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CN104144572A true CN104144572A (zh) | 2014-11-12 |
CN104144572B CN104144572B (zh) | 2017-07-21 |
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CN201410326169.6A Active CN104144572B (zh) | 2014-07-09 | 2014-07-09 | 微粘带供料机构 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201245383Y (zh) * | 2008-07-23 | 2009-05-27 | 徐大鸿 | 不干胶纸输送装置 |
US20110017405A1 (en) * | 2009-07-24 | 2011-01-27 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Bonding apparatus |
CN202414860U (zh) * | 2012-06-01 | 2012-09-05 | 深圳市智动力胶粘制品有限公司 | 复合薄膜转贴卷绕机 |
CN103619123A (zh) * | 2013-09-30 | 2014-03-05 | 韩华社 | 一种pfc贴合补强片的全自动设备 |
CN203482499U (zh) * | 2013-08-23 | 2014-03-12 | 珠海华冠电子科技有限公司 | 电路板补强贴合机 |
CN204090306U (zh) * | 2014-07-09 | 2015-01-07 | 东莞市升宇智能科技有限公司 | 微粘带供料机构 |
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2014
- 2014-07-09 CN CN201410326169.6A patent/CN104144572B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201245383Y (zh) * | 2008-07-23 | 2009-05-27 | 徐大鸿 | 不干胶纸输送装置 |
US20110017405A1 (en) * | 2009-07-24 | 2011-01-27 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Bonding apparatus |
CN202414860U (zh) * | 2012-06-01 | 2012-09-05 | 深圳市智动力胶粘制品有限公司 | 复合薄膜转贴卷绕机 |
CN203482499U (zh) * | 2013-08-23 | 2014-03-12 | 珠海华冠电子科技有限公司 | 电路板补强贴合机 |
CN103619123A (zh) * | 2013-09-30 | 2014-03-05 | 韩华社 | 一种pfc贴合补强片的全自动设备 |
CN204090306U (zh) * | 2014-07-09 | 2015-01-07 | 东莞市升宇智能科技有限公司 | 微粘带供料机构 |
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Publication number | Publication date |
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CN104144572B (zh) | 2017-07-21 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
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GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Baoan District manhole Street Xinsha road Shenzhen city Guangdong province 518104 an MT High-tech Industrial Park No. 3 building four layer Patentee after: Shenzhen Shengyu Intelligent Technology Co., Ltd. Address before: Eighth, 3 storey factory building of small science and technology enterprise park in the North Industrial Zone of Songshan high tech Industrial Development Zone, Dongguan, Guangdong, 523808 Patentee before: DONGGUAN SHENGYU INTELLIGENT SCIENCE & TECHNOLOGY CO., LTD. |
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CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 402, building 3, Zhizao Central Park, No. 12, Chongqing Road, Heping community, Fuhai street, Bao'an District, Shenzhen, Guangdong 518000 Patentee after: SHENZHEN ADVANCED INETLLIGENT MACHINE Co.,Ltd. Address before: 518104 Shenzhen, Baoan District, Guangdong, Sha Sha Street, new Sha Road, an Tuo Shan high tech Industrial Park 3 factory four floor. Patentee before: SHENZHEN ADVANCED INETLLIGENT MACHINE Co.,Ltd. |