CN104087405A - Cooling liquid for double-side thinning processing of touch screen panel of mobile phone and preparation method of cooling liquid - Google Patents
Cooling liquid for double-side thinning processing of touch screen panel of mobile phone and preparation method of cooling liquid Download PDFInfo
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- CN104087405A CN104087405A CN201410309990.7A CN201410309990A CN104087405A CN 104087405 A CN104087405 A CN 104087405A CN 201410309990 A CN201410309990 A CN 201410309990A CN 104087405 A CN104087405 A CN 104087405A
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Abstract
The invention discloses cooling liquid for double-side thinning processing of a touch screen panel of a mobile phone and a preparation method of the cooling liquid. The cooling liquid is characterized by comprising the following components in percentage by mass: 94%-98% of de-ionized water, 1%-2% of flat aluminum oxide powder ZWA-15 and 1%-4% of a low-viscosity grinding liquid suspension additive CHALLENGE 543-HT. The preparation method comprises the following steps: adding water in percentage by mass into a cooling liquid bucket, wherein the rotary speed of an impeller is 1000-1500rpm; starting a stirrer, slowly adding the flat aluminum oxide powder ZWA-15 in proportion, and stirring for 4-8 minutes to ensure that the powder ZWA-15 is fully dispersed; adding the low-viscosity grinding liquid suspension additive CHALLENGE 543-HT in proportion and continuously stirring at a high speed for 4-10 minutes; stopping the stirrer or maintaining the rotary speed of the stirrer at 50rpm, wherein the prepared cooling liquid is uniform and viscous.
Description
Technical field
The present invention relates to a kind of cooling fluid, particularly disclose a kind of cooling fluid and compound method thereof for the two-sided attenuate processing of touch screen panel of mobile phone, belong to photoelectricity manufacture field.
Background technology
Traditional touch-screen mobile phone uses common glass or healthy and free from worry gorilla glass as mobile phone faceplate, for the intensity, the scratch resistance that improve mobile phone faceplate injure optical property, the large factory of International Mobile headed by American apple will be used sapphire as mobile phone faceplate on mobile phone of new generation.Sapphire hardness is only second to diamond, so without using safeguard film for cellular phone also can not produce scratch on mobile phone screen, its excellent optical property and heat conductivility also make sapphire mobile phone faceplate become the development trend of following touch-screen mobile phone simultaneously.But just because of the characteristic of sapphire high rigidity, make its precision sizing face lot of challenges, in the plane machining process of sapphire mobile phone faceplate, conventionally need through twin grinding attenuate, two-sided fine grinding and twin polishing, twin grinding attenuate wherein often needs mobile phone faceplate to grind off the surplus of 50 μ m～100 μ m, traditional processing mode is to use twin grinder to coordinate on cast iron abrasive disk, to carry out attrition process with norbide or the silicon carbide abrasive of particle diameter approximately 50 μ m, grinding removal amount approximately 1.5 ~ 3 μ m of per minute, this tradition grinding technics has following problem and defect:
1, working (machining) efficiency is low, makes to meet the demand of cell phone manufacturer's short period of time supply of material in enormous quantities;
2, tooling cost is high, because sapphire hardness is very high, so while using norbide or silicon carbide to grind it, the loop cycle of abrasive material is very short, causes cost higher;
3, the sapphire mobile phone faceplate roughness of processing is inhomogeneous, and in the different time sections of attrition process, due to the decay of abrasive size and cutting force, the roughness of the mobile phone faceplate after grinding is also different, arrives time and the efficiency of precision grinding process after can having influence on;
4, the sapphire mobile phone faceplate different batches thickness difference of processing is too large, because the decay of abrasive material rate of cutting causes same milling time to complete different cutting outputs, can have influence on equally process period and the efficiency of precision grinding process.
Summary of the invention
The object of the invention is to address the deficiencies of the prior art, a kind of cooling fluid for the two-sided attenuate processing of touch screen panel of mobile phone is proposed, use boart boart wheel disc to carry out attenuate processing to sapphire touch screen panel of mobile phone, use cooling fluid of the present invention carry out cooling, lubricate and keep the sharp of abrasive disc.
The present invention is achieved in that a kind of cooling fluid for the two-sided attenuate processing of touch screen panel of mobile phone, it is characterized in that the composition of described cooling fluid and quality per distribution ratio are:
Deionized water 94～98%;
Flats alumina lap powder ZWA-15 1～2%;
Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 1～4%.
The compound method of the described cooling fluid for the two-sided attenuate processing of touch screen panel of mobile phone, is characterized in that described compound method comprises the following steps:
The first step: the quality per distribution ratio by cooling fluid in cooling fluid bucket adds water, wheel speed 1000～1500rpm;
Second step: turn on agitator also slowly adds flats alumina lap powder ZWA-15 by quality per distribution ratio, stirs 4～8 minutes, guarantees that ZWA-15 particle fully disperses;
The 3rd step: add low viscosity lapping liquid suspension additive CHALLENGE 543-HT and continue by quality per distribution ratio and stir under the rotating speed of 1000rpm ~ 1500rpm 4～10 minutes, the liquid level of cooling fluid forms little whirlpool;
The 4th step: close agitator or maintain the rotating speed of agitator at 50rpm, the cooling fluid preparing presents the state of even thickness.
Cooling fluid of the present invention adopts Shanghai to cause the flats alumina lap powder ZWA-15 of neck semi-conductor development in science and technology company limited production and the low viscosity lapping liquid suspension additive Challenge 543-HT preparation that American I ntersurface Dynamics Inc produces.Twin grinder carries out attenuate to sapphire touch screen panel of mobile phone and adds man-hour, adopts boart boart wheel disc is installed.Use diamond wheel can produce high attenuate speed, cooling fluid of the present invention can maintain the sharpness of boart boart wheel disc, and obtains effective cooling and lubrication.
The invention has the beneficial effects as follows:
1, twin grinder can be promoted more than 10～20 times to the two-sided attenuate working (machining) efficiency of sapphire touch screen panel of mobile phone, twin grinder uses the diamond wheel of 30 μ m can reach the attenuate removal amount of per minute approximately 40 μ m;
2, effectively reduce attenuate cost, will be without using the abrasive materials such as silicon carbide or norbide in the attenuate course of processing;
3, keep the stable of attenuate converted products quality, the employing of product of the present invention can make twin grinder produce lasting constant cutting force and constant surfaceness, be convenient to the effectively two-sided ground finish operation in the rear road of planning, reduce ground finish cost and improve working (machining) efficiency.
Embodiment
Composition and the quality per distribution ratio of a kind of cooling fluid for the two-sided attenuate processing of touch screen panel of mobile phone of the present invention are: deionized water 94～98%; Flats alumina lap powder ZWA-15 1～2%; Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 1～4%.
Its compound method is drawn together following steps:
The first step: the quality per distribution ratio by cooling fluid in cooling fluid bucket adds water, wheel speed 1000～1500rpm;
Second step: turn on agitator also slowly adds flats alumina lap powder ZWA-15 by quality per distribution ratio, stirs 4～8 minutes, guarantees that ZWA-15 particle fully disperses;
The 3rd step: add low viscosity lapping liquid suspension additive CHALLENGE 543-HT and continue by quality per distribution ratio and stir under the rotating speed of 1000rpm～1500rpm 4～10 minutes, the liquid level of cooling fluid forms little whirlpool;
The 4th step: close agitator or maintain the rotating speed of agitator at 50rpm, the cooling fluid preparing presents the state of even thickness.
Cooling fluid configuration of the present invention and feeding mechanism require:
1, the stirring of lapping liquid need be used to shearing force blade (as water screw impeller);
2, the rotating speed of paddle wheel is adjustable, more than maximum speed need reach 1000rpm;
3, the supply of cooling fluid adopts peristaltic pump (pump of constant delivery type) supply.
Embodiment 1:
The present invention for composition and the quality per distribution ratio of the cooling fluid of the two-sided attenuate processing of touch screen panel of mobile phone is:
Deionized water 94%;
Flats alumina lap powder ZWA-15 2%;
Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 4%.
Embodiment 2:
The present invention for composition and the quality per distribution ratio of the cooling fluid of the two-sided attenuate processing of touch screen panel of mobile phone is:
Deionized water 98%;
Flats alumina lap powder ZWA-15 1%;
Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 1%.
Embodiment 3:
The present invention for composition and the quality per distribution ratio of the cooling fluid of the two-sided attenuate processing of touch screen panel of mobile phone is:
Deionized water 96%;
Flats alumina lap powder ZWA-15 1.5%;
Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 2.5%.
Claims (5)
1. for a cooling fluid for the two-sided attenuate processing of touch screen panel of mobile phone, it is characterized in that the composition of described cooling fluid and quality per distribution ratio are:
Deionized water 94～98%;
Flats alumina lap powder ZWA-15 1～2%;
Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 1～4%.
2. according to the cooling fluid for the two-sided attenuate processing of touch screen panel of mobile phone described in claim 1, it is characterized in that the composition of described cooling fluid and quality per distribution ratio are:
Deionized water 94%;
Flats alumina lap powder ZWA-15 2%;
Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 4%.
3. according to the cooling fluid for the two-sided attenuate processing of touch screen panel of mobile phone described in claim 1, it is characterized in that the composition of described cooling fluid and quality per distribution ratio are:
Deionized water 98%;
Flats alumina lap powder ZWA-15 1%;
Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 1%.
4. according to the cooling fluid for the two-sided attenuate processing of touch screen panel of mobile phone described in claim 1, it is characterized in that the composition of described cooling fluid and quality per distribution ratio are:
Deionized water 96%;
Flats alumina lap powder ZWA-15 1.5%;
Low viscosity lapping liquid suspension additive CHALLENGE 543-HT 2.5%.
5. the compound method of the cooling fluid of processing for the two-sided attenuate of touch screen panel of mobile phone described in any one in claim 1～4, is characterized in that described compound method comprises the following steps:
The first step: the quality per distribution ratio by cooling fluid in cooling fluid bucket adds water, wheel speed 1000～1500rpm;
Second step: turn on agitator also slowly adds flats alumina lap powder ZWA-15 by quality per distribution ratio, stirs 4～8 minutes, guarantees that ZWA-15 particle fully disperses;
The 3rd step: add low viscosity lapping liquid suspension additive CHALLENGE 543-HT and continue by quality per distribution ratio and stir under the rotating speed of 1000rpm～1500rpm 4～10 minutes, the liquid level of cooling fluid forms little whirlpool;
The 4th step: close agitator or maintain the rotating speed of agitator at 50rpm, the cooling fluid preparing presents the state of even thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410309990.7A CN104087405A (en) | 2014-07-02 | 2014-07-02 | Cooling liquid for double-side thinning processing of touch screen panel of mobile phone and preparation method of cooling liquid |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410309990.7A CN104087405A (en) | 2014-07-02 | 2014-07-02 | Cooling liquid for double-side thinning processing of touch screen panel of mobile phone and preparation method of cooling liquid |
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| CN104087405A true CN104087405A (en) | 2014-10-08 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100266862A1 (en) * | 2009-04-17 | 2010-10-21 | 3M Innovative Properties Company | Metal particle transfer article, metal modified substrate, and method of making and using the same |
| CN101870850A (en) * | 2009-04-21 | 2010-10-27 | 铜陵市琨鹏光电科技有限公司 | Mortar cutting fluid for cutting sapphire wafers |
| CN102029551A (en) * | 2010-11-18 | 2011-04-27 | 长沙理工大学 | Lubricating and cooling method for cutting process and device thereof |
| CN103525531A (en) * | 2013-09-27 | 2014-01-22 | 奥克化学扬州有限公司 | Cooling liquid for carrying out crystal bar taking on sapphire |
| CN103639877A (en) * | 2013-11-26 | 2014-03-19 | 浙江上城科技有限公司 | Polishing processing method for ultrathin sapphire wafer |
-
2014
- 2014-07-02 CN CN201410309990.7A patent/CN104087405A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100266862A1 (en) * | 2009-04-17 | 2010-10-21 | 3M Innovative Properties Company | Metal particle transfer article, metal modified substrate, and method of making and using the same |
| CN101870850A (en) * | 2009-04-21 | 2010-10-27 | 铜陵市琨鹏光电科技有限公司 | Mortar cutting fluid for cutting sapphire wafers |
| CN102029551A (en) * | 2010-11-18 | 2011-04-27 | 长沙理工大学 | Lubricating and cooling method for cutting process and device thereof |
| CN103525531A (en) * | 2013-09-27 | 2014-01-22 | 奥克化学扬州有限公司 | Cooling liquid for carrying out crystal bar taking on sapphire |
| CN103639877A (en) * | 2013-11-26 | 2014-03-19 | 浙江上城科技有限公司 | Polishing processing method for ultrathin sapphire wafer |
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Application publication date: 20141008 |