CN104080271B - 用于耦接电路板的装置 - Google Patents

用于耦接电路板的装置 Download PDF

Info

Publication number
CN104080271B
CN104080271B CN201410122356.2A CN201410122356A CN104080271B CN 104080271 B CN104080271 B CN 104080271B CN 201410122356 A CN201410122356 A CN 201410122356A CN 104080271 B CN104080271 B CN 104080271B
Authority
CN
China
Prior art keywords
circuit board
hole
conductive
spacing body
conductive pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410122356.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN104080271A (zh
Inventor
德内什瓦尔·普拉巴卡拉奥·比雅德
萨兰·沙拉德·古德克
迪莱什·阿尔温德·劳特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Control Techniques Ltd
Original Assignee
Nidec Control Techniques Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Control Techniques Ltd filed Critical Nidec Control Techniques Ltd
Publication of CN104080271A publication Critical patent/CN104080271A/zh
Application granted granted Critical
Publication of CN104080271B publication Critical patent/CN104080271B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CN201410122356.2A 2013-03-28 2014-03-28 用于耦接电路板的装置 Expired - Fee Related CN104080271B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IN1206MU2013 IN2013MU01206A (cg-RX-API-DMAC7.html) 2013-03-28 2013-03-28
IN1206/MUM/2013 2013-03-28

Publications (2)

Publication Number Publication Date
CN104080271A CN104080271A (zh) 2014-10-01
CN104080271B true CN104080271B (zh) 2017-10-03

Family

ID=48672130

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201410122356.2A Expired - Fee Related CN104080271B (zh) 2013-03-28 2014-03-28 用于耦接电路板的装置
CN201420148333.4U Expired - Fee Related CN204031589U (zh) 2013-03-28 2014-03-28 用于连接两个或更多个电路板的装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201420148333.4U Expired - Fee Related CN204031589U (zh) 2013-03-28 2014-03-28 用于连接两个或更多个电路板的装置

Country Status (4)

Country Link
US (1) US20140290052A1 (cg-RX-API-DMAC7.html)
CN (2) CN104080271B (cg-RX-API-DMAC7.html)
GB (1) GB2514333A (cg-RX-API-DMAC7.html)
IN (1) IN2013MU01206A (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6255947B2 (ja) * 2013-11-28 2018-01-10 富士通株式会社 電子装置および間隔管
GB2542958B (en) * 2015-07-27 2017-09-06 Sevcon Ltd Power electronics assembly
TWI556707B (zh) * 2015-12-17 2016-11-01 技嘉科技股份有限公司 電子組件
US10111368B2 (en) * 2015-12-17 2018-10-23 Intel Corporation Flexible substrate retention on a reusable carrier
SG10201702885PA (en) * 2016-04-20 2017-11-29 Lam Res Corp Apparatus for measuring condition of electroplating cell components and associated methods
JP6627683B2 (ja) * 2016-07-29 2020-01-08 住友電装株式会社 電気機器
US11107962B2 (en) * 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink
CN116110806A (zh) * 2021-11-09 2023-05-12 鹏鼎控股(深圳)股份有限公司 封装结构及其制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1082776A (zh) * 1992-08-05 1994-02-23 惠特克公司 双基板联接用同轴联接器
US7104805B2 (en) * 2004-08-31 2006-09-12 American Power Conversion Corporation Board to board current connection
US7772856B2 (en) * 2005-09-20 2010-08-10 Hitachi, Ltd. Electromagnetic wave generation source searching method and current probe used therefor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3960424A (en) * 1974-10-02 1976-06-01 Amp Incorporated Multi-contact spring connector for board to board connections
US5479320A (en) * 1991-12-31 1995-12-26 Compaq Computer Corporation Board-to-board connector including an insulative spacer having a conducting surface and U-shaped contacts
US6027345A (en) * 1998-03-06 2000-02-22 Hon Hai Precision Ind. Co., Ltd. Matrix-type electrical connector
US6520789B2 (en) * 2001-05-22 2003-02-18 Delphi Technologies, Inc. Connecting system for printed circuit boards
US6869291B2 (en) * 2002-09-19 2005-03-22 Delphi Technologies, Inc. Electrical connector having improved elastomeric contact pressure pad
US8144482B2 (en) * 2006-05-31 2012-03-27 Nec Corporation Circuit board device, wiring board interconnection method, and circuit board module device
EP2171836A4 (en) * 2007-07-09 2015-06-10 Power Concepts Nz Ltd LAYER STRUCTURE CONNECTION AND ASSEMBLY
CN102238806A (zh) * 2010-04-28 2011-11-09 富葵精密组件(深圳)有限公司 电路板模组

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1082776A (zh) * 1992-08-05 1994-02-23 惠特克公司 双基板联接用同轴联接器
US7104805B2 (en) * 2004-08-31 2006-09-12 American Power Conversion Corporation Board to board current connection
US7772856B2 (en) * 2005-09-20 2010-08-10 Hitachi, Ltd. Electromagnetic wave generation source searching method and current probe used therefor

Also Published As

Publication number Publication date
GB201308444D0 (en) 2013-06-19
GB2514333A (en) 2014-11-26
IN2013MU01206A (cg-RX-API-DMAC7.html) 2015-04-10
CN204031589U (zh) 2014-12-17
CN104080271A (zh) 2014-10-01
US20140290052A1 (en) 2014-10-02

Similar Documents

Publication Publication Date Title
CN204031589U (zh) 用于连接两个或更多个电路板的装置
US8351216B2 (en) Layered structure connection and assembly
CN208608886U (zh) 具有dc电压连接元件的电力电子装置
US20160111200A1 (en) Embedded magnetic component transformer device
CN103680992B (zh) 一种电容器组
CN109074925A (zh) 分流电阻器及分流电阻器的安装结构
US20120229948A1 (en) Capacitor Used as Insulating Spacer for a High Current Bus Structure
CN103687303B (zh) 功率半导体器件和pcb 的联接组件及其制造方法
JP2021516867A (ja) Ｆｐｃ接続構造体及びそれを用いた印刷回路基板の接続方法
CN103026554A (zh) 电连接器和包括该电连接器的电源设备
CN106165555A (zh) 电气设备和用于制造电气设备的方法
CN102369793A (zh) 壳体、包括该壳体的电连接器以及包括该电连接器的车辆
CN104428955B (zh) 用于诸如功率部件的电气部件的互连的电路
JP2016110993A (ja) トランジスタリード線の溶接およびはんだ付け
CN207233973U (zh) 接线端子组件及驱动器
US20060050494A1 (en) DC-AC power inverter
JP2011210962A (ja) 多層プリント配線板給電装置
CN203644986U (zh) 一种印刷电路板与接线端子的连接结构
CN101719605A (zh) 基于多块电路板间大电流传输的连接器
US20180124919A1 (en) Contact arrangement, preferably for a power electronics system
EP2991110A2 (en) Circuit protection device
US20250001321A1 (en) Unilateral electrified interlocking block system and method thereof
US20160270238A1 (en) Electronic control unit and method for arranging electronic components on a circuit carrier and for electrically connecting said electronic components to a circuit carrier
US20260013047A1 (en) Circuit board and electronic device including the same
CN222381849U (zh) 具有抗杂讯电流传输结构的电路装置及抗杂讯电流传输结构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: British Powys

Applicant after: Nideke Control Technology Co. Ltd.

Address before: British Powys

Applicant before: Control Tech Ltd

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171003

Termination date: 20200328

CF01 Termination of patent right due to non-payment of annual fee