CN104078552B - 一种红外发光二极管 - Google Patents
一种红外发光二极管 Download PDFInfo
- Publication number
- CN104078552B CN104078552B CN201410216057.5A CN201410216057A CN104078552B CN 104078552 B CN104078552 B CN 104078552B CN 201410216057 A CN201410216057 A CN 201410216057A CN 104078552 B CN104078552 B CN 104078552B
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- China
- Prior art keywords
- glass
- emitting diode
- layer
- interval
- luminescence chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410216057.5A CN104078552B (zh) | 2014-05-21 | 2014-05-21 | 一种红外发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410216057.5A CN104078552B (zh) | 2014-05-21 | 2014-05-21 | 一种红外发光二极管 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104078552A CN104078552A (zh) | 2014-10-01 |
CN104078552B true CN104078552B (zh) | 2017-01-25 |
Family
ID=51599706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410216057.5A Active CN104078552B (zh) | 2014-05-21 | 2014-05-21 | 一种红外发光二极管 |
Country Status (1)
Country | Link |
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CN (1) | CN104078552B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110752205B (zh) * | 2019-09-03 | 2021-07-20 | 江西驰宇光电科技发展有限公司 | 一种基于激光陀螺使用的光电二极管的屏蔽结构及其屏蔽方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06112534A (ja) * | 1991-12-09 | 1994-04-22 | Rohm Co Ltd | 発光ダイオード |
CN101516174A (zh) * | 2008-02-21 | 2009-08-26 | 黄干元 | 散热屏蔽盖 |
CN101894896A (zh) * | 2010-06-13 | 2010-11-24 | 东南大学 | 发光二极管的玻璃球腔封装方法 |
CN202205807U (zh) * | 2011-07-18 | 2012-04-25 | 厦门华晟电子有限公司 | 红外线发射二极管 |
CN103011614A (zh) * | 2012-11-28 | 2013-04-03 | 武汉利之达科技有限公司 | 一种荧光玻璃片及其制备方法 |
CN103515512A (zh) * | 2012-06-29 | 2014-01-15 | 四川柏狮光电技术有限公司 | Led二次封装工艺以及通过该工艺制造的led像素管 |
-
2014
- 2014-05-21 CN CN201410216057.5A patent/CN104078552B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06112534A (ja) * | 1991-12-09 | 1994-04-22 | Rohm Co Ltd | 発光ダイオード |
CN101516174A (zh) * | 2008-02-21 | 2009-08-26 | 黄干元 | 散热屏蔽盖 |
CN101894896A (zh) * | 2010-06-13 | 2010-11-24 | 东南大学 | 发光二极管的玻璃球腔封装方法 |
CN202205807U (zh) * | 2011-07-18 | 2012-04-25 | 厦门华晟电子有限公司 | 红外线发射二极管 |
CN103515512A (zh) * | 2012-06-29 | 2014-01-15 | 四川柏狮光电技术有限公司 | Led二次封装工艺以及通过该工艺制造的led像素管 |
CN103011614A (zh) * | 2012-11-28 | 2013-04-03 | 武汉利之达科技有限公司 | 一种荧光玻璃片及其制备方法 |
Also Published As
Publication number | Publication date |
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CN104078552A (zh) | 2014-10-01 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Feng Haitao Inventor after: Shi Guangdian Inventor before: Shi Guangdian |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: SHI GUANGDIAN TO: FENG HAITAO SHI GUANGDIAN |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 518106, 95, Fifth Industrial Zone, Mashan village, Gongming Town, Shenzhen, Guangdong, Baoan District Applicant after: SHENZHEN LIGHT ELECTRONICS CO., LTD. Address before: 518106, 95, Fifth Industrial Zone, Mashan village, Gongming Town, Shenzhen, Guangdong, Baoan District Applicant before: Shenzhen LIGHT Electronics Co., Ltd. |
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COR | Change of bibliographic data | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |