CN104076457B - Light emission component - Google Patents
Light emission component Download PDFInfo
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- CN104076457B CN104076457B CN201410361112.XA CN201410361112A CN104076457B CN 104076457 B CN104076457 B CN 104076457B CN 201410361112 A CN201410361112 A CN 201410361112A CN 104076457 B CN104076457 B CN 104076457B
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Abstract
The invention provides a light emission component. The component comprises a can type packaging emitter, wherein a metal pipe base is arranged on the can type packaging emitter; a luminous diode chip and a photodiode chip are packaged on the metal pipe base; a pipe cap is arranged on the metal pipe base; an optical lens is arranged in the middle part of the top wall of the pipe cap; an emitter protecting base is further arranged on the light emission component and positioned above the pipe cap of the can type packaging emitter; a light-transmitting hole is formed in the middle part of the top of the emitter protecting base; the light emission component further comprises an adapter positioned above the top of the emitter protecting base; in the axial direction of the can type packaging emitter, the luminous groove of the luminous diode chip deviates from the axis of the optical lens, and the included angle formed between the direction of the ray emitted from the optical lens and the axis of the optical lens is an acute angle. The light emission component is smaller in return loss, simple in structure, and low in production cost, and avoids the use of a ceramic inserting core.
Description
Technical field
The present invention relates to fiber optic communication field, specifically, it is to be related to a kind of light emission component for launching light beam.
Background technology
Commonly used various optics in modern optical communication system, the light wherein carrying ceramic insertion core is sent out
Penetrating assembly is a kind of conventional optics.Existing light emission component has a pot encapsulation transmitter, and pot encapsulation is sent out
It is provided with light-emitting diode chip for backlight unit and photodiode chip in emitter, and be externally provided with optical fiber in pot encapsulation transmitter.Luminous
Diode chip for backlight unit is used for sending light beam, and the light beam sending incides optical fiber, and light beam passes through Optical Fiber Transmission.Due to the transmitting of existing light
In assembly, the axis of light beam that light-emitting diode chip for backlight unit sends and optical fiber on the same line, reaches light by the light beam of optical axis
Fine meeting backtracking, the light beam of return returns to light-emitting diode chip for backlight unit, then leads to the return loss of light emission component excessive, impact
The work of light emission component.
Notification number is that the Chinese utility model patent application of CN203217125U discloses a kind of the coaxial of high return loss
Photoelectric subassembly, it has adapter, characteristic metal body and pot encapsulation transmitter, is provided with luminous in pot encapsulation transmitter
Diode chip for backlight unit, is fixed with a ceramic insertion core, the axis of ceramic insertion core is on the axis of adapter in adapter.Pot encapsulates
Transmitter has pipe cap, and pipe cap is provided with hemispherical lens, and the axis of light-emitting diode chip for backlight unit and the axis of lens exist
On same axis.And, in order to solve the problems, such as that return loss can not touch the mark, the pot of above-mentioned coaxial optoelectronic component
The axis of axis and the adapter of encapsulation transmitter not on the same line, that is, the axis of light-emitting diode chip for backlight unit and installation
The axis of the ceramic insertion core in adapter deviates from each other.
The light beam that light-emitting diode chip for backlight unit sends incides in ceramic insertion core after lens, and incides positioned at adaptation
Optical fiber outside device.The light beam returning from optical fiber is also required to return pot encapsulation transmitter through ceramic insertion core, but the light beam returning
Do not interfere with the light beam that light-emitting diode chip for backlight unit sends.
However, this coaxial optoelectronic component needs to arrange ceramic insertion core in adapter, and the axis by ceramic insertion core
The requirement to realize return loss index for the axis of deviation pot encapsulation transmitter.Due to adapter small volume in addition it is also necessary to set
Put ceramic insertion core, coaxial optoelectronic component volume will be led to excessive, assembling is complicated, also results in the production cost mistake of coaxial optoelectronic component
High.Further, since the axis that pot encapsulates transmitter is parallel to each other with the axis of ceramic insertion core, light-emitting diode chip for backlight unit sends
Light beam, by with the direction outgoing parallel to ceramic insertion core axis, leads to return loss too high.
In addition, in the adapter of some light emission components existing, the ceramic ring using open annular fixes optical fiber, such as
Optical fiber is fixed in adapter the ceramic ring of " C " type of use, leads to light emission component job insecurity when waving test, no
Method meets the requirement of work.
Content of the invention
The main object of the present invention is to provide a kind of return loss less and the simple light emission component of structure.
It is a further object of the present invention to provide a kind of wave the ideal light emission component of test performance index.
In order to realize above-mentioned main purpose, the light emission component that the present invention provides has pot encapsulation transmitter, pot
Encapsulation transmitter has metal base, and metal base is packaged with light-emitting diode chip for backlight unit and photodiode chip, and metal
Base is provided with pipe cap, and the middle part of the roof of pipe cap is provided with lens, and light emission component is additionally provided with transmitter protecting seat, is arranged on tank
Type encapsulates above the pipe cap of transmitter, and the middle part at the top of transmitter protecting seat is provided with loophole, and light emission component is additionally provided with suitable
Orchestration, positioned at the top at transmitter protecting seat top, wherein, encapsulates in the axial direction of transmitter in pot, light-emitting diode chip for backlight unit
Luminous groove deviate the axis of lens, the angle being formed between the direction of the light beam of lens outgoing and the axis of lens is sharp
Angle.
From such scheme, the luminous groove of light-emitting diode chip for backlight unit and the eccentric axis setting of lens, return through lens
The light beam returning will not directly influence the luminous groove of light-emitting diode chip for backlight unit, thus reducing the return loss of light emission component.This
Outward, the solution of the present invention is to arrange to solve return loss by the eccentric axis of the luminous groove of light-emitting diode chip for backlight unit and lens
Problem, ceramic insertion core therefore need not be set in adapter, and the structure of light emission component is simple, and packaging technology is also relatively simple,
And the production cost of light emission component can be reduced.
One preferred scheme is that the luminous groove of light-emitting diode chip for backlight unit is located at pot and encapsulates on the axis of transmitter, thoroughly
The axis runout pot of mirror encapsulates the axis of transmitter.
As can be seen here, luminous groove and the lens of light-emitting diode chip for backlight unit can be conveniently realized by the eccentric setting of lens
Eccentric setting between axis, reduces the producting process difficulty of light emission component.
Further scheme is that the axis of lens is located at pot and encapsulates on the axis of transmitter, light-emitting diode chip for backlight unit
Luminous groove deviates the axis that pot encapsulates transmitter.
It can be seen that, by by the arranged off-centre of light-emitting diode chip for backlight unit, can simply realize sending out of light-emitting diode chip for backlight unit
Light groove deviates the purpose of lens axis.
Further scheme is, adapter includes becket, is provided with ceramic ring in becket, and optical fiber is arranged on ceramic ring
Interior, the cross section of ceramic ring is annular.
As can be seen here, using annular ceramic ring, optical fiber is fixed in adapter, optical fiber can be avoided to wave test
When too rock, thus lifting performance in waving test for the light emission component, meet the use requirement of light emission component.
Further scheme is, the bottom surface of pipe cap is provided with first boss, and pipe cap passes through first boss with resistance welding side
Formula is fixed on metal base, and the bottom surface of transmitter protecting seat is provided with second boss, and transmitter protecting seat passes through second boss
It is fixed on metal base in resistance welding mode.
So, by resistance welding mode, transmitter protecting seat is fixed on metal base, pipe cap also is located at transmitter
In protecting seat, the pollution lens such as dust can be avoided it is ensured that the performance of light emission component.
Brief description
Fig. 1 is the structure chart of first embodiment of the invention.
Fig. 2 is the structure decomposition figure of first embodiment of the invention.
Fig. 3 is the sectional view of first embodiment of the invention and optical fiber.
Fig. 4 is the partial enlarged drawing that in first embodiment of the invention, pot encapsulates transmitter.
Fig. 5 is the partial enlarged drawing of Fig. 3.
Fig. 6 is the partial enlarged drawing that in second embodiment of the invention, pot encapsulates transmitter.
Fig. 7 is the partial enlarged drawing that in third embodiment of the invention, pot encapsulates transmitter.
Fig. 8 is the partial enlarged drawing that in fourth embodiment of the invention, pot encapsulates transmitter.
Fig. 9 is the partial enlarged drawing that in fifth embodiment of the invention, pot encapsulates transmitter.
Below in conjunction with drawings and Examples, the invention will be further described.
Specific embodiment
The light emission component of the present invention is used for optical fiber telecommunications system, and is used for launching light beam, light emission component and optical fiber phase
Connect, the light beam that it sends incides optical fiber and has spread fiber.
First embodiment：
Referring to Fig. 1, the light emission component of the present embodiment has pot encapsulation transmitter 30, encapsulates on transmitter 30 in pot
It is provided with transmitter protecting seat 20, transmitter protecting seat 20 is provided with adapter 10.Referring to Fig. 2, pot encapsulation transmitter 30 has
One metal base 31, metal base 31 is provided with many pins 33, and many pins 33 are used for receiving electric signal, and to light-emitting diodes
Die and photodiode chip provide electric energy.Pedestal 31 is provided with pipe cap 35, and the middle part of pipe cap 35 is provided with spherical saturating
Mirror 37.Adapter 10 is arranged on the top of transmitter protecting seat 20.
Referring to Fig. 3, metal base 31 has the pedestal 32 of a flat, and many pins 33 are located at the lower section of pedestal 32.
Referring to Fig. 4, metal base 31 is welded with light-emitting diode chip for backlight unit 40 and photodiode chip 42, light-emitting diode chip for backlight unit
40 are welded on one piece of ceramic gasket 41, and ceramic gasket 41 is fixed on metal base 31.Photodiode chip 42 is welded on
On ceramic gasket 43, ceramic gasket 43 is fixed on metal base 31.
The top of metal base 31 is provided with pipe cap 35, and the middle part of the roof 36 of pipe cap 35 is provided with spherical lens 37,
Lens 37 by light transmissive material, make by such as glass.As seen from Figure 4, light-emitting diode chip for backlight unit 40 is than photodiode chip 42 more
Near lens 37, therefore light-emitting diode chip for backlight unit 40 is located at the side near lens 37.
Encapsulate on the axis direction of transmitter 30 in pot, between light-emitting diode chip for backlight unit 40 and ceramic gasket 41 be not
Arrange up and down, but left and right arrangement, in the diagram, light-emitting diode chip for backlight unit 40 is located at the right side of ceramic gasket 41.Light emitting diode
The rightmost side of chip 40 is the luminous groove of light-emitting diode chip for backlight unit 40, and light beam is from luminous groove outgoing, and incides on lens 37.
In the present embodiment, the luminous groove of light-emitting diode chip for backlight unit 40 is located at pot and encapsulates on the axis L1 of transmitter 30, but
Pipe cap 35 is prejudicially welded on metal base 31, and the axis L2 of lens 37 deviates the axis L1 that pot encapsulates transmitter 30.
As seen from Figure 4, the axis L1 that the axis L2 of lens 37 encapsulates transmitter 30 with pot is parallel to each other, but has certain distance.Cause
This, the luminous groove of light-emitting diode chip for backlight unit 40 is not overlapping with the axis L2 of lens 37.Therefore, go out from light-emitting diode chip for backlight unit 40
After the light beam penetrated incides lens 37, it is not the axis direction outgoing along lens 37, but is formed with the axis of lens 37
One inclination angle is it is seen then that the angle between the light beam and lens 37 axis of lens 37 is acute angle.
On the direction of the axis L1 encapsulating transmitter 30 in pot, photodiode chip 42 is located at the upper of ceramic gasket 43
Side, and photodiode chip 42 is located at the underface of light-emitting diode chip for backlight unit 40.Due to sending out of light-emitting diode chip for backlight unit 40
Light groove is not overlapping with the axis L2 of lens 37, and the light beam therefore returning from lens 37 will obliquely incide photodiode core
On piece 42, it is to avoid the light beam that light-emitting diode chip for backlight unit 40 is sent impacts, the echo also just reducing light emission component damages
Consumption.
Pipe cap 35 is welded on the pedestal 32 of metal base 31, and referring to Fig. 5, the bottom surface of pipe cap 35 is provided with the convex of a loop
Platform 38, the axis L1 direction that boss 38 encapsulates transmitter 30 from the bottom surface of pipe cap 35 along pot extends downwardly.Pipe cap 35 is welded
During to pot encapsulation transmitter 30, boss 38 is adjoined with pedestal 32, is melted boss 38 by resistance welder mode, you can to incite somebody to action
Pipe cap 35 is fixed on metal base 31.
In the present embodiment, lens 37 are located at the middle part of pipe cap 35, and the axis runout pot in order to realize lens 37 encapsulates to be sent out
The purpose of emitter 30 axis, pipe cap 35 is prejudicially welded on metal base 31, and that is, the axis L2 of pipe cap 35 deviates pot encapsulation
The axis L1 of transmitter 30.
Transmitter protecting seat 20 is welded on pot encapsulation transmitter 30, it can be seen from figure 3 that transmitter protecting seat 20 is located at pipe
Outside cap 35, and pipe cap 35 is wrapped up, for protection pipe cap 35.Referring to Fig. 5, the bottom surface of pipe cap 20 is provided with the boss of a loop
24, boss 24 extends downwardly from the bottom surface of pipe cap 20 along the axis direction of pipe cap 20, and is located on pedestal 32.Pipe cap 20 is welded
During on pot encapsulation transmitter 30, boss 24 is adjoined with the upper surface of pedestal 32, and by boss by way of resistance welding
24 meltings, thus transmitter protecting seat 20 is fixed on pot encapsulation transmitter 30.So, transmitter protecting seat 20 is by pipe cap
35 parcels, it is to avoid dust etc. penetrates in transmitter protecting seat 20, and then avoids dust that lens 37 are impacted.
Referring to Fig. 5, the bottom interior wall of transmitter protecting seat 20 is provided with a circle groove 25, and groove 25 is along transmitter protecting seat
20 circumferentially extending, and, inwall the extending radially outwardly along transmitter protecting seat 20 of the spontaneous emitter protecting seat 20 of groove 25,
The setting of groove 25 can improve reliability during boss 24 welding.
The middle part of the roof 21 of transmitter protecting seat 20 is provided with loophole 22, from the light beam of light-emitting diode chip for backlight unit 40 outgoing
Through loophole 22 outgoing, also pass through loophole 22 from the light beam that optical fiber 13 returns and incide in pot encapsulation transmitter 30, and
Received by photodiode chip 42.Preferably, the axis of loophole 22 and the axis of transmitter protecting seat 20 are in same straight line
On.
Adapter 10 is fixed on the top of transmitter protecting seat 20, and adapter 10 has a becket 11, becket 11
Inside it is provided with ceramic ring 12, optical fiber 13 is contained in ceramic ring 12.In the present embodiment, the cross section of ceramic ring 12 is annular, optical fiber 13
Being fixed in ceramic ring 12, in waving test, optical fiber 13 being avoided to rock it is ensured that waving the finger of test light emission assembly
Mark performance.
Due to pipe cap 35 bias design, the light beam that light-emitting diode chip for backlight unit 40 sends after lens 37 with lens 37
Axis L2 tilt angle incide in optical fiber 13.The light beam returning from optical fiber 13 does not interfere with light-emitting diode chip for backlight unit 40
The light beam going out, thus reduce the return loss of light emission component.And, do not need setting ceramic insertion core to be used in light emission component
Realize the skew of light path, light emission component mechanism is simple, low production cost.
Second embodiment：
The light emission component of the present embodiment has pot encapsulation transmitter, transmitter protecting seat and adapter, transmitter
Protecting seat is arranged on pot encapsulation transmitter, and adapter is located at the top of transmitter protecting seat.
Referring to Fig. 6, pot encapsulation transmitter has metal base 53, and metal base 53 has many pins, and metal
It is cased with pipe cap 50 above base 53, in the middle part of the roof of pipe cap 50, is provided with lens 51, lens 51 are spherical lens.In the present embodiment,
Lens 51 are located at the middle part of pipe cap 50, and the axis that the axis L3 of lens 51 encapsulates transmitter with pot is on the same line.
Metal base 53 is provided with light-emitting diode chip for backlight unit 55 and photodiode chip 57, light-emitting diode chip for backlight unit 55
It is fixed on metal base 53 by ceramic gasket 56, photodiode chip 57 is fixed on metal base by ceramic gasket 58
On 53.Encapsulate on the axis direction of transmitter in pot, light-emitting diode chip for backlight unit 55 is located at the top of photodiode chip 57,
The light beam that i.e. light-emitting diode chip for backlight unit 55 sends closer to lens 51, light-emitting diode chip for backlight unit 55 than photodiode chip 57
Through lens 51 outgoing.
In the present embodiment, the rightmost side of light-emitting diode chip for backlight unit 55 is provided with luminous groove, and light beam sends from luminous groove.And,
Luminous groove deviates the axis that pot encapsulates transmitter, that is, the axis deviateing lens 51.As seen from Figure 6, the axis of lens 51
Through light-emitting diode chip for backlight unit 55.So, the light beam that light-emitting diode chip for backlight unit 55 sends prejudicially incides in lens 51, passes through
The axis L3 of the light beam of lens 51 outgoing and lens 51 forms inclination angle, and the axis L3 of the direction of outgoing beam and lens 51 it
Between formed angle be acute angle.
The present embodiment is to be set the luminous groove of light-emitting diode chip for backlight unit 55 by way of increasing the thickness of ceramic gasket 56
Put the right side of the axis L3 in lens 51, thus realizing the eccentric setting of light-emitting diode chip for backlight unit 55 and lens 51.Certainly, also may be used
To continue to increase the thickness of ceramic gasket 56, the axis L3 of lens 51 passes through ceramic gasket 56, so also enables the present invention's
Purpose.
3rd embodiment：
The light emission component of the present embodiment has pot encapsulation transmitter, transmitter protecting seat and adapter, transmitter
Protecting seat is arranged on pot encapsulation transmitter, and adapter is located at the top of transmitter protecting seat.
Referring to Fig. 7, pot encapsulation transmitter has metal base 63, is cased with pipe cap 60, pipe cap 60 above metal base 63
Roof in the middle part of be provided with lens 61, lens 61 are spherical lens, and, lens 61 are located at the middle part of pipe cap 60, and lens 61
The axis that axis L4 encapsulates transmitter with pot is on the same line.Metal base 63 is provided with light-emitting diode chip for backlight unit 64 and light
Electric diode chip 66, light-emitting diode chip for backlight unit 64 is welded on ceramic gasket 65, and photodiode chip 66 is welded on pottery
On pad 67.
From unlike second embodiment, ceramic gasket 65 thickness of the present embodiment is less, therefore ceramic gasket 65 with send out
Luminous diode chip 64 is respectively positioned on the side of lens 61 axis L4.From fig.7, it can be seen that the rightmost side of light-emitting diode chip for backlight unit 64 is to send out
Light groove, luminous groove is located at the left side of the axis L4 of lens 61, and therefore luminous groove deviates the axis L4 of lens 61, from light emitting diode
It is acute angle with the angle of the axis L4 formation of lens 61 that the light beam of chip 64 outgoing passes through lens 61.
Fourth embodiment：
The light emission component of the present embodiment has pot encapsulation transmitter, transmitter protecting seat and adapter, transmitter
Protecting seat is arranged on the top that pot encapsulates transmitter, and adapter is located at the top of transmitter protecting seat, and adapter is provided with gold
Belong to ring, be provided with the ceramic ring that cross section is annular in becket, ceramic ring is built with optical fiber.
Referring to Fig. 8, pot encapsulation transmitter has metal base 73, is cased with pipe cap 70, pipe cap 70 above metal base 73
Roof in the middle part of be provided with lens 71, lens 71 be spherical lens.Lens 71 are located at the middle part of pipe cap 70, and the axis L5 of lens 71
The axis encapsulating transmitter with pot is on the same line.
Metal base 73 is provided with light-emitting diode chip for backlight unit 74 and photodiode chip（Invisible in Fig. 8）, luminous two
Pole pipe chip 74 is welded on ceramic gasket 75, and photodiode chip is welded on another piece of ceramic gasket, and in pot envelope
In the axial direction of dress transmitter, photodiode chip is located at the lower section of light-emitting diode chip for backlight unit 74.
In the present embodiment, light-emitting diode chip for backlight unit 74 has luminous groove, and luminous groove deviates the axis L5 of lens 71, from Fig. 8
It can be seen that, luminous groove is located at the left side of the axis L5 of lens 71, and luminous groove is parallel with the axis L5 of lens 71.Light-emitting diodes tube core
The light beam that piece 74 sends, through lens 71 hypsokinesis tiltedly outgoing, is formed between the axis L5 of the direction of outgoing beam and lens 71
Angle is acute angle.
5th embodiment：
The light emission component of the present embodiment has pot encapsulation transmitter, transmitter protecting seat and adapter, transmitter
Protecting seat is arranged on the top that pot encapsulates transmitter, and adapter is located at the top of transmitter protecting seat, and adapter is provided with gold
Belong to ring, be provided with the ceramic ring that cross section is annular in becket, ceramic ring is built with optical fiber.
Referring to Fig. 9, pot encapsulation transmitter has metal base 83, is cased with pipe cap 80, pipe cap 80 above metal base 83
Roof in the middle part of be provided with lens 81, lens 81 be spherical lens.Lens 81 are located at the middle part of pipe cap 80, and the axis L6 of lens 81
The axis encapsulating transmitter with pot is on the same line.
Metal base 83 is provided with light-emitting diode chip for backlight unit 84, and light-emitting diode chip for backlight unit 84 is welded on ceramic gasket 85.
Photodiode chip is additionally provided with metal base 83, invisible in Fig. 9.In the present embodiment, light-emitting diode chip for backlight unit 84 has
Luminous groove, luminous groove is parallel to the axis L6 of lens 81, but deviates the axis L6 of lens 81.As seen from Figure 9, light-emitting diodes tube core
Piece 84 is fully located at the left side of the axis L6 of lens 81, therefore, from the light beam of light-emitting diode chip for backlight unit 84 outgoing through lens 81
Afterwards, the axis L6 angulation of the direction of the light beam of outgoing and lens 81 is the angle of acute angle.
Above-mentioned several embodiments are all will be inclined with the axis of lens for the luminous groove of light-emitting diode chip for backlight unit by setting
Heart setting is so that pass through the axis direction run-off the straight of light beam and the lens of the lens return loss to reduce light emission component.
Certainly, such scheme is only currently preferred aforesaid way, can also have more changes, example during practical application
As pipe cap can be to be fixed on metal base using the mode other modes such as bonding with transmitter protecting seat；Or, use
Metallic gasket substitutes ceramic gasket, and these changes all can realize the purpose of the present invention.
Finally it is emphasized that the invention is not restricted to above-mentioned embodiment, the such as change of lens shape, light emitting diode
Chip also should include within the scope of the invention as claimed with changes such as the changes of photodiode chip position.
Claims (10)
1. light emission component, including
Pot encapsulates transmitter, and described pot encapsulation transmitter has metal base, described metal base is packaged with luminous two
Pole pipe chip and photodiode chip, and described metal base is provided with pipe cap, the middle part of the roof of described pipe cap is provided with ball
The lens of shape；
Transmitter protecting seat, is arranged on described pot and encapsulates above the described pipe cap of transmitter, the top of described transmitter protecting seat
The middle part in portion is provided with loophole；
Adapter, positioned at the top at described transmitter protecting seat top；
It is characterized in that：
The light that described light-emitting diode chip for backlight unit sends is directly incident on described lens and outgoing after described lens,
Described pot encapsulates in the axial direction of transmitter, the luminous groove of described light-emitting diode chip for backlight unit and the diameter parallel of described lens, and
Described luminous groove deviates the axis certain distance of described lens, from the axle in the direction of the light beam of described lens outgoing and described lens
The angle being formed between line is acute angle.
2. light emission component according to claim 1 it is characterised in that：
The described luminous groove of described light-emitting diode chip for backlight unit is located at described pot and encapsulates on the axis of transmitter, the axle of described lens
Line deviates the axis that described pot encapsulates transmitter.
3. light emission component according to claim 2 it is characterised in that：
Described pipe cap is prejudicially welded on described metal base.
4. light emission component according to claim 1 it is characterised in that：
The axis of described lens is located at described pot and encapsulates on the axis of transmitter, and the described of described light-emitting diode chip for backlight unit lights
Groove deviates the axis that described pot encapsulates transmitter.
5. light emission component according to claim 4 it is characterised in that：
Described light-emitting diode chip for backlight unit is welded on ceramic gasket, and described ceramic gasket is located at institute with described light-emitting diode chip for backlight unit
State the side that pot encapsulates the axis of transmitter.
6. light emission component according to claim 4 it is characterised in that：
Described light-emitting diode chip for backlight unit is welded on ceramic gasket, encapsulates on the axis of transmitter in described pot, described lens
Axis pass through described light-emitting diode chip for backlight unit or described ceramic gasket.
7. the light emission component according to any one of claim 1 to 6 it is characterised in that：
Described adapter includes becket, is provided with ceramic ring in described becket, and optical fiber is arranged in described ceramic ring, described pottery
The cross section of ceramic ring is annular.
8. the light emission component according to any one of claim 1 to 6 it is characterised in that：
The bottom surface of described pipe cap is provided with first boss, and described pipe cap is fixed on institute by described first boss in resistance welding mode
State on metal base.
9. the light emission component according to any one of claim 1 to 6 it is characterised in that：
The bottom surface of described transmitter protecting seat is provided with second boss, and described transmitter protecting seat is by described second boss with resistance
Welding manner is fixed on described metal base.
10. the light emission component according to any one of claim 1 to 6 it is characterised in that：
The bottom interior wall of described transmitter protecting seat is provided with a circle along described transmitter protecting seat circumferentially extending groove, described
Groove extending radially outwardly from described inwall along described transmitter protecting seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410361112.XA CN104076457B (en) | 2014-07-25 | 2014-07-25 | Light emission component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410361112.XA CN104076457B (en) | 2014-07-25 | 2014-07-25 | Light emission component |
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| Publication Number | Publication Date |
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| CN104076457A CN104076457A (en) | 2014-10-01 |
| CN104076457B true CN104076457B (en) | 2017-02-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108398752A (en) * | 2018-04-02 | 2018-08-14 | 深圳市光兴创科技有限公司 | The novel single fiber bi-directional electrooptical device and its integrated base without lock pin |
| US10811839B1 (en) * | 2019-04-18 | 2020-10-20 | Applied Optoelectronics, Inc. | TO can laser assembly with off-center lens cap and an optical transceiver or transmitter implementing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2008090019A (en) * | 2006-10-03 | 2008-04-17 | Sumitomo Electric Ind Ltd | Bidirectional optical module |
| JP2008112148A (en) * | 2006-10-04 | 2008-05-15 | Victor Co Of Japan Ltd | Light emitting apparatus and light receiving apparatus |
| JP2008233584A (en) * | 2007-03-22 | 2008-10-02 | Konica Minolta Holdings Inc | Optical communication module and assembling method of optical communication module |
| CN103529524A (en) * | 2013-10-21 | 2014-01-22 | 重庆航伟光电科技有限公司 | Optical signal receiving detector and manufacturing method thereof |
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