CN104076457A - Light emission component - Google Patents
Light emission component Download PDFInfo
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- CN104076457A CN104076457A CN201410361112.XA CN201410361112A CN104076457A CN 104076457 A CN104076457 A CN 104076457A CN 201410361112 A CN201410361112 A CN 201410361112A CN 104076457 A CN104076457 A CN 104076457A
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Abstract
The invention provides a light emission component. The component comprises a can type packaging emitter, wherein a metal pipe base is arranged on the can type packaging emitter; a luminous diode chip and a photodiode chip are packaged on the metal pipe base; a pipe cap is arranged on the metal pipe base; an optical lens is arranged in the middle part of the top wall of the pipe cap; an emitter protecting base is further arranged on the light emission component and positioned above the pipe cap of the can type packaging emitter; a light-transmitting hole is formed in the middle part of the top of the emitter protecting base; the light emission component further comprises an adapter positioned above the top of the emitter protecting base; in the axial direction of the can type packaging emitter, the luminous groove of the luminous diode chip deviates from the axis of the optical lens, and the included angle formed between the direction of the ray emitted from the optical lens and the axis of the optical lens is an acute angle. The light emission component is smaller in return loss, simple in structure, and low in production cost, and avoids the use of a ceramic inserting core.
Description
Technical field
The present invention relates to fiber optic communication field, specifically, relate to a kind of for launching the light emission component of light beam.
Background technology
In modern optical communication system, often using various optical device, is wherein a kind of conventional optical device with the light emission component of ceramic insertion core.Existing light emission component has a tank type encapsulation transmitter, in tank type encapsulation transmitter, is provided with light-emitting diode chip for backlight unit and photodiode chip, and is provided with optical fiber outward at tank type encapsulation transmitter.Light-emitting diode chip for backlight unit is used for sending light beam, and the light beam sending incides optical fiber, and light beam passes through Optical Fiber Transmission.In existing light emission component, the light beam that light-emitting diode chip for backlight unit sends and the axis of optical fiber are on same straight line, arriving optical fiber Hui Yuan road by the light beam of optical axis returns, the light beam returning is got back to light-emitting diode chip for backlight unit, cause the return loss of light emission component excessive, affect the work of light emission component.
Notification number is the coaxial optoelectronic component that the Chinese utility model patent application of CN203217125U discloses a kind of high return loss, it has adapter, feature metal tube and tank type encapsulation transmitter, in tank type encapsulation transmitter, be provided with light-emitting diode chip for backlight unit, in adapter, be fixed with a ceramic insertion core, the axis of ceramic insertion core is on the axis of adapter.Tank type encapsulation transmitter has pipe cap, and pipe cap is provided with hemispheric lens, and the axis of light-emitting diode chip for backlight unit and the axis of lens are on same axis.And, the problem that can not touch the mark in order to solve return loss, the tank type encapsulation axis of transmitter of above-mentioned coaxial optoelectronic component and the axis of adapter be not on same straight line, and namely the axis of light-emitting diode chip for backlight unit departs from mutually with the axis that is arranged on the ceramic insertion core in adapter.
The light beam that light-emitting diode chip for backlight unit sends incides in ceramic insertion core after lens, and incides the optical fiber being positioned at outside adapter.The light beam returning from optical fiber also needs to return to tank type encapsulation transmitter through ceramic insertion core, but the light beam returning can not affect the light beam that light-emitting diode chip for backlight unit sends.
But this coaxial optoelectronic component need to arrange ceramic insertion core in adapter, and the axis of the axis runout tank type encapsulation transmitter of ceramic insertion core is realized to the requirement of return loss index.Because adapter volume is less, also need to arrange ceramic insertion core, will cause coaxial optoelectronic component volume excessive, assembling is complicated, also causes the production cost of coaxial optoelectronic component too high.In addition,, because the tank type encapsulation axis of transmitter and the axis of ceramic insertion core are parallel to each other, the light beam that light-emitting diode chip for backlight unit sends, by the direction outgoing to be parallel to ceramic insertion core axis, causes return loss too high.
In addition, in the adapter of more existing light emission components, use the ceramic ring of open annular to fix optical fiber, as the ceramic ring that uses " C " type is fixed on optical fiber in adapter, cause light emission component job insecurity in the time waving test, cannot meet the requirement of work.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of return loss light emission component less and simple in structure.
Another object of the present invention is to provide a kind of comparatively desirable light emission component of test performance index that waves.
In order to realize above-mentioned fundamental purpose, light emission component provided by the invention has tank type encapsulation transmitter, tank type encapsulation transmitter has metal base, on metal base, be packaged with light-emitting diode chip for backlight unit and photodiode chip, and metal base is provided with pipe cap, the middle part of the roof of pipe cap is provided with lens, light emission component is also provided with transmitter protecting seat, be arranged on the pipe cap top of tank type encapsulation transmitter, the middle part at the top of transmitter protecting seat is provided with light hole, light emission component is also provided with adapter, be positioned at the top at transmitter protecting seat top, wherein, in the axial direction of tank type encapsulation transmitter, the luminous groove of light-emitting diode chip for backlight unit departs from the axis of lens, be acute angle from the angle forming between the direction of light beam of lens outgoing and the axis of lens.
From such scheme, the luminous groove of light-emitting diode chip for backlight unit and the eccentric axis setting of lens, the light beam returning through lens can directly not have influence on the luminous groove of light-emitting diode chip for backlight unit, thereby reduces the return loss of light emission component.In addition, the solution of the present invention is to solve the problem of return loss by the luminous groove of light-emitting diode chip for backlight unit and the eccentric axis setting of lens, therefore adapter is interior without ceramic insertion core is set, light emission component simple in structure, packaging technology is also comparatively simple, and can reduce the production cost of light emission component.
A preferred scheme is that the luminous groove of light-emitting diode chip for backlight unit is positioned on the axis of tank type encapsulation transmitter, the axis of the axis runout tank type encapsulation transmitter of lens.
As can be seen here, the eccentric setting of scioptics can be realized the eccentric setting between luminous groove and the lens axis of light-emitting diode chip for backlight unit easily, reduces the producting process difficulty of light emission component.
Further scheme is, the axis of lens is positioned on the axis of tank type encapsulation transmitter, and the luminous groove of light-emitting diode chip for backlight unit departs from the axis of tank type encapsulation transmitter.
Visible, by by the arranged off-centre of light-emitting diode chip for backlight unit, the luminous groove that can realize simply light-emitting diode chip for backlight unit departs from the object of lens axis.
Further scheme is, adapter comprises becket, is provided with ceramic ring in becket, and optical fiber is arranged in ceramic ring, and the xsect of ceramic ring is annular.
As can be seen here, use annular ceramic ring that optical fiber is fixed in adapter, can avoid optical fiber too to rock in the time waving test, thereby promote light emission component in the performance of waving in test, meet the request for utilization of light emission component.
Further scheme is; the bottom surface of pipe cap is provided with the first boss; pipe cap is fixed on metal base in resistance welded mode by the first boss, and the bottom surface of transmitter protecting seat is provided with the second boss, and transmitter protecting seat is fixed on metal base in resistance welded mode by the second boss.
Like this, by resistance welded mode, transmitter protecting seat is fixed on metal base, pipe cap is also positioned at transmitter protecting seat, can avoid the pollution lens such as dust, guarantees the performance of light emission component.
Brief description of the drawings
Fig. 1 is the structural drawing of first embodiment of the invention.
Fig. 2 is the STRUCTURE DECOMPOSITION figure of first embodiment of the invention.
Fig. 3 is the cut-open view of first embodiment of the invention and optical fiber.
Fig. 4 is the partial enlarged drawing of tank type encapsulation transmitter in first embodiment of the invention.
Fig. 5 is the partial enlarged drawing of Fig. 3.
Fig. 6 is the partial enlarged drawing of tank type encapsulation transmitter in second embodiment of the invention.
Fig. 7 is the partial enlarged drawing of tank type encapsulation transmitter in third embodiment of the invention.
Fig. 8 is the partial enlarged drawing of tank type encapsulation transmitter in fourth embodiment of the invention.
Fig. 9 is the partial enlarged drawing of tank type encapsulation transmitter in fifth embodiment of the invention.
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment
Light emission component of the present invention is for optical fiber telecommunications system, and for launching light beam, light emission component is connected with optical fiber, and its light beam sending incides optical fiber and has spread fiber.
The first embodiment:
Referring to Fig. 1, the light emission component of the present embodiment has tank type encapsulation transmitter 30, on tank type encapsulation transmitter 30, is provided with transmitter protecting seat 20, and transmitter protecting seat 20 is provided with adapter 10.Referring to Fig. 2, tank type encapsulation transmitter 30 has a metal base 31, and metal base 31 is provided with many pins 33, and many pins 33 are for receiving electric signal, and provides electric energy to light-emitting diode chip for backlight unit and photodiode chip.Pedestal 31 is provided with pipe cap 35, and the middle part of pipe cap 35 is provided with spherical lens 37.Adapter 10 is arranged on the top of transmitter protecting seat 20.
Referring to Fig. 3, metal base 31 has the pedestal 32 of a flat, and many pins 33 are positioned at the below of pedestal 32.Referring to Fig. 4, on metal base 31, be welded with light-emitting diode chip for backlight unit 40 and photodiode chip 42, light-emitting diode chip for backlight unit 40 is welded on a ceramic gasket 41, and ceramic gasket 41 is fixed on metal base 31.Photodiode chip 42 is welded on ceramic gasket 43, and ceramic gasket 43 is fixed on metal base 31.
The top of metal base 31 is provided with pipe cap 35, and the middle part of the roof 36 of pipe cap 35 is provided with spherical lens 37, and lens 37 are by light transmissive material, as glass is made.As seen from Figure 4, light-emitting diode chip for backlight unit 40 is than photodiode chip 42 more near lens 37, and therefore light-emitting diode chip for backlight unit 40 is positioned at the side near lens 37.
On the axis direction of tank type encapsulation transmitter 30, between light-emitting diode chip for backlight unit 40 and ceramic gasket 41, be not to arrange up and down, but left and right layout, in Fig. 4, light-emitting diode chip for backlight unit 40 is positioned at the right side of ceramic gasket 41.The rightmost side of light-emitting diode chip for backlight unit 40 is the luminous groove of light-emitting diode chip for backlight unit 40, and light beam is from luminous groove outgoing, and incides on lens 37.
In the present embodiment, it is upper that the luminous groove of light-emitting diode chip for backlight unit 40 is positioned at the axis L1 of tank type encapsulation transmitter 30, but pipe cap 35 is welded on metal base 31 prejudicially, and the axis L2 of lens 37 departs from the axis L1 of tank type encapsulation transmitter 30.As seen from Figure 4, the axis L1 of the axis L2 of lens 37 and tank type encapsulation transmitter 30 is parallel to each other, but has certain distance.Therefore, the luminous groove of light-emitting diode chip for backlight unit 40 and the axis L2 of lens 37 are not overlapping.Therefore, inciding lens 37 from the light beam of light-emitting diode chip for backlight unit 40 outgoing, is not the axis direction outgoing along lens 37, but forms a pitch angle with the axis of lens 37, visible, be acute angle through the angle between light beam and lens 37 axis of lens 37.
In the direction of the axis L1 of tank type encapsulation transmitter 30, photodiode chip 42 is positioned at the top of ceramic gasket 43, and photodiode chip 42 be positioned at light-emitting diode chip for backlight unit 40 under.Due to the luminous groove of light-emitting diode chip for backlight unit 40 and the axis L2 of lens 37 not overlapping, therefore the light beam returning from lens 37 will incide photodiode chip 42 obliquely, avoid the light beam that light-emitting diode chip for backlight unit 40 is sent to impact, also just reduced the return loss of light emission component.
Pipe cap 35 is welded on the pedestal 32 of metal base 31, and referring to Fig. 5, the bottom surface of pipe cap 35 is provided with the boss 38 of a loop, and the axis L1 direction that boss 38 encapsulates transmitter 30 from the bottom surface of pipe cap 35 along tank type is to downward-extension.When pipe cap 35 is welded to tank type encapsulation transmitter 30, boss 38 and pedestal 32 adjacency,, can be fixed on pipe cap 35 on metal base 31 boss 38 meltings by resistance welder mode.
In the present embodiment, lens 37 are positioned at the middle part of pipe cap 35, the object that encapsulates transmitter 30 axis in order to realize the axis runout tank type of lens 37, pipe cap 35 is welded on metal base 31 prejudicially, and the axis L2 of pipe cap 35 departs from the axis L1 of tank type encapsulation transmitter 30.
Transmitter protecting seat 20 is welded on tank type encapsulation transmitter 30, and as seen from Figure 3, transmitter protecting seat 20 is positioned at outside pipe cap 35, and pipe cap 35 is wrapped up, for the protection of pipe cap 35.Referring to Fig. 5, the bottom surface of pipe cap 20 is provided with the boss 24 of a loop, and boss 24, and is positioned on pedestal 32 along the axis direction of pipe cap 20 to downward-extension from the bottom surface of pipe cap 20.When pipe cap 20 is welded on tank type encapsulation transmitter 30, the upper surface abut of boss 24 and pedestal 32, and the mode of passing through resistance welded is by boss 24 meltings, encapsulates on transmitter 30 thereby transmitter protecting seat 20 is fixed on to tank type.Like this, transmitter protecting seat 20 wraps up pipe cap 35, avoids dust etc. to penetrate in transmitter protecting seat 20, and then avoids dust to impact lens 37.
Referring to Fig. 5; the bottom interior wall of transmitter protecting seat 20 is provided with a circle groove 25; groove 25 is along the circumferential extension of transmitter protecting seat 20; and; the inwall of the spontaneous emitter protecting seat 20 of groove 25 extends radially outwardly along transmitter protecting seat 20, reliability when the arranging of groove 25 can be improved boss 24 and welded.
The middle part of the roof 21 of transmitter protecting seat 20 is provided with light hole 22; pass light hole 22 outgoing from the light beam of light-emitting diode chip for backlight unit 40 outgoing; the light beam returning from optical fiber 13 also incides in tank type encapsulation transmitter 30 through light hole 22, and is received by photodiode chip 42.Preferably, the axis of the axis of light hole 22 and transmitter protecting seat 20 is on same straight line.
Adapter 10 is fixed on the top of transmitter protecting seat 20, and adapter 10 has a becket 11, is provided with ceramic ring 12 in becket 11, and optical fiber 13 is contained in ceramic ring 12.In the present embodiment, the xsect of ceramic ring 12 is annular, and optical fiber 13 is fixed in ceramic ring 12, waving in test, can avoid optical fiber 13 to rock, the index performance of light emission component while guaranteeing to wave test.
Due to the bias design of pipe cap 35, the light beam that light-emitting diode chip for backlight unit 40 sends incides in optical fiber 13 with the angle tilting with the axis L2 of lens 37 after lens 37.The light beam returning from optical fiber 13 can not affect the light beam that light-emitting diode chip for backlight unit 40 sends, thereby reduces the return loss of light emission component.And, in light emission component, not needing to arrange ceramic insertion core for realizing the skew of light path, light emission component mechanism is simple, and production cost is low.
The second embodiment:
The light emission component of the present embodiment has the encapsulation of tank type transmitter, transmitter protecting seat and adapter, and transmitter protecting seat is arranged on tank type encapsulation transmitter, and adapter is positioned at the top of transmitter protecting seat.
Referring to Fig. 6, tank type encapsulation transmitter has metal base 53, and metal base 53 has many pins, and on metal base 53, square set has pipe cap 50, and the roof middle part of pipe cap 50 is provided with lens 51, and lens 51 are spherical lens.In the present embodiment, lens 51 are positioned at the middle part of pipe cap 50, and the axis of the axis L3 of lens 51 and tank type encapsulation transmitter is on same straight line.
Metal base 53 is provided with light-emitting diode chip for backlight unit 55 and photodiode chip 57, and light-emitting diode chip for backlight unit 55 is fixed on metal base 53 by ceramic gasket 56, and photodiode chip 57 is fixed on metal base 53 by ceramic gasket 58.On the axis direction of tank type encapsulation transmitter, light-emitting diode chip for backlight unit 55 is positioned at the top of photodiode chip 57, be light-emitting diode chip for backlight unit 55 than photodiode chip 57 more near lens 51, the light beam that light-emitting diode chip for backlight unit 55 sends is through lens 51 outgoing.
In the present embodiment, the rightmost side of light-emitting diode chip for backlight unit 55 is provided with luminous groove, and light beam sends from luminous groove.And luminous groove departs from the axis of tank type encapsulation transmitter, namely depart from the axis of lens 51.As seen from Figure 6, the axis of lens 51 is through light-emitting diode chip for backlight unit 55.Like this, the light beam that light-emitting diode chip for backlight unit 55 sends incides in lens 51 prejudicially, form pitch angle, and the angle forming between the direction of outgoing beam and the axis L3 of lens 51 is acute angle through the light beam of lens 51 outgoing and the axis L3 of lens 51.
The present embodiment is that the mode of the thickness by increasing ceramic gasket 56 is arranged on the luminous groove of light-emitting diode chip for backlight unit 55 on the right side of the axis L3 of lens 51, thereby realizes the eccentric setting of light-emitting diode chip for backlight unit 55 and lens 51.Certainly, also can continue to increase the thickness of ceramic gasket 56, the axis L3 of lens 51, through ceramic gasket 56, so also can realize object of the present invention.
The 3rd embodiment:
The light emission component of the present embodiment has the encapsulation of tank type transmitter, transmitter protecting seat and adapter, and transmitter protecting seat is arranged on tank type encapsulation transmitter, and adapter is positioned at the top of transmitter protecting seat.
Referring to Fig. 7, tank type encapsulation transmitter has metal base 63, on metal base 63, square set has pipe cap 60, the roof middle part of pipe cap 60 is provided with lens 61, lens 61 are spherical lens, and lens 61 are positioned at the middle part of pipe cap 60, and the axis of the axis L4 of lens 61 and tank type encapsulation transmitter is on same straight line.Metal base 63 is provided with light-emitting diode chip for backlight unit 64 and photodiode chip 66, and light-emitting diode chip for backlight unit 64 is welded on ceramic gasket 65, and photodiode chip 66 is welded on ceramic gasket 67.
Different from the second embodiment, ceramic gasket 65 thickness of the present embodiment are less, and therefore ceramic gasket 65 and light-emitting diode chip for backlight unit 64 are all positioned at a side of lens 61 axis L4.As seen from Figure 7, the rightmost side of light-emitting diode chip for backlight unit 64 is luminous groove, luminous groove is positioned at the left side of the axis L4 of lens 61, and therefore luminous groove departs from the axis L4 of lens 61, is acute angle from the light beam of light-emitting diode chip for backlight unit 64 outgoing through lens 61 with the angle that the axis L4 of lens 61 forms.
The 4th embodiment:
The light emission component of the present embodiment has the encapsulation of tank type transmitter, transmitter protecting seat and adapter; transmitter protecting seat is arranged on the top of tank type encapsulation transmitter; adapter is positioned at the top of transmitter protecting seat; and adapter is provided with becket; in becket, being provided with xsect is annular ceramic ring, and optical fiber is housed in ceramic ring.
Referring to Fig. 8, tank type encapsulation transmitter has metal base 73, and on metal base 73, square set has pipe cap 70, and the roof middle part of pipe cap 70 is provided with lens 71, and lens 71 are spherical lens.Lens 71 are positioned at the middle part of pipe cap 70, and the axis of the axis L5 of lens 71 and tank type encapsulation transmitter is on same straight line.
Metal base 73 is provided with light-emitting diode chip for backlight unit 74 and photodiode chip (invisible in Fig. 8), light-emitting diode chip for backlight unit 74 is welded on ceramic gasket 75, photodiode chip is welded on another piece ceramic gasket, and in the axial direction of tank type encapsulation transmitter, photodiode chip is positioned at the below of light-emitting diode chip for backlight unit 74.
In the present embodiment, light-emitting diode chip for backlight unit 74 has luminous groove, and luminous groove departs from the axis L5 of lens 71, and as seen from Figure 8, luminous groove is positioned at the left side of the axis L5 of lens 71, and luminous groove is parallel with the axis L5 of lens 71.The light beam that light-emitting diode chip for backlight unit 74 sends is through tiltedly outgoing of lens 71 hypsokinesis, and the angle forming between the direction of outgoing beam and the axis L5 of lens 71 is acute angle.
The 5th embodiment:
The light emission component of the present embodiment has the encapsulation of tank type transmitter, transmitter protecting seat and adapter; transmitter protecting seat is arranged on the top of tank type encapsulation transmitter; adapter is positioned at the top of transmitter protecting seat; and adapter is provided with becket; in becket, being provided with xsect is annular ceramic ring, and optical fiber is housed in ceramic ring.
Referring to Fig. 9, tank type encapsulation transmitter has metal base 83, and on metal base 83, square set has pipe cap 80, and the roof middle part of pipe cap 80 is provided with lens 81, and lens 81 are spherical lens.Lens 81 are positioned at the middle part of pipe cap 80, and the axis of the axis L6 of lens 81 and tank type encapsulation transmitter is on same straight line.
Metal base 83 is provided with light-emitting diode chip for backlight unit 84, and light-emitting diode chip for backlight unit 84 is welded on ceramic gasket 85.On metal base 83, be also provided with photodiode chip, invisible in Fig. 9.In the present embodiment, light-emitting diode chip for backlight unit 84 has luminous groove, and luminous groove is parallel to the axis L6 of lens 81, but departs from the axis L6 of lens 81.As seen from Figure 9, light-emitting diode chip for backlight unit 84 is positioned at the left side of the axis L6 of lens 81 completely, therefore, from the light beam of light-emitting diode chip for backlight unit 84 outgoing after lens 81, the angle that the axis L6 angulation of the direction of the light beam of outgoing and lens 81 is acute angle.
Above-mentioned several embodiments are all by arranging the eccentric axis setting of the luminous groove of light-emitting diode chip for backlight unit and lens, make to reduce through the light beam of lens and the axis direction run-off the straight of lens the return loss of light emission component.
Certainly, such scheme is only the preferred aforesaid way of the present invention, when practical application, can also have more change, and for example, pipe cap and transmitter protecting seat can use such as other modes of mode such as bonding and be fixed on metal base; Or, use metallic gasket to substitute ceramic gasket, these change all can realize object of the present invention.
The variations such as the change of the change of lens shape, light-emitting diode chip for backlight unit and photodiode chip position finally it is emphasized that and the invention is not restricted to above-mentioned embodiment, as also should being included in the protection domain of the claims in the present invention.
Claims (10)
1. light emission component, comprises
Tank type encapsulation transmitter, described tank type encapsulation transmitter has metal base, on described metal base, is packaged with light-emitting diode chip for backlight unit and photodiode chip, and described metal base is provided with pipe cap, and the middle part of the roof of described pipe cap is provided with lens;
Transmitter protecting seat, is arranged on above the described pipe cap of described tank type encapsulation transmitter, and the middle part at the top of described transmitter protecting seat is provided with light hole;
Adapter, is positioned at the top at described transmitter protecting seat top;
It is characterized in that:
In the axial direction of described tank type encapsulation transmitter, the luminous groove of described light-emitting diode chip for backlight unit departs from the axis of described lens, is acute angle from the angle forming between the direction of light beam of described lens outgoing and the axis of described lens.
2. light emission component according to claim 1, is characterized in that:
The described luminous groove of described light-emitting diode chip for backlight unit is positioned on the axis of described tank type encapsulation transmitter, the axis of tank type encapsulation transmitter described in the axis runout of described lens.
3. light emission component according to claim 2, is characterized in that:
Described pipe cap is welded on described metal base prejudicially.
4. light emission component according to claim 1, is characterized in that:
The axis of described lens is positioned on the axis of described tank type encapsulation transmitter, and the described luminous groove of described light-emitting diode chip for backlight unit departs from the axis of described tank type encapsulation transmitter.
5. light emission component according to claim 4, is characterized in that:
Described light-emitting diode chip for backlight unit is welded on ceramic gasket, and described ceramic gasket and described light-emitting diode chip for backlight unit are positioned at a side of the axis of described tank type encapsulation transmitter.
6. light emission component according to claim 4, is characterized in that:
Described light-emitting diode chip for backlight unit is welded on ceramic gasket, and on the axis of described tank type encapsulation transmitter, the axis of described lens is through described light-emitting diode chip for backlight unit or described ceramic gasket.
7. according to the light emission component described in claim 1 to 6 any one, it is characterized in that:
Described adapter comprises becket, in described becket, is provided with ceramic ring, and described optical fiber is arranged in described ceramic ring, and the xsect of described ceramic ring is annular.
8. according to the light emission component described in claim 1 to 6 any one, it is characterized in that:
The bottom surface of described pipe cap is provided with the first boss, and described pipe cap is fixed on described metal base in resistance welded mode by described the first boss.
9. according to the light emission component described in claim 1 to 6 any one, it is characterized in that:
The bottom surface of described transmitter protecting seat is provided with the second boss, and described transmitter protecting seat is fixed on described metal base in resistance welded mode by described the second boss.
10. according to the light emission component described in claim 1 to 6 any one, it is characterized in that:
The bottom interior wall of described transmitter protecting seat is provided with the groove that a circle circumferentially extends along described transmitter protecting seat, and described groove is extending radially outwardly along described transmitter protecting seat from described inwall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410361112.XA CN104076457B (en) | 2014-07-25 | 2014-07-25 | Light emission component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410361112.XA CN104076457B (en) | 2014-07-25 | 2014-07-25 | Light emission component |
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| CN104076457A true CN104076457A (en) | 2014-10-01 |
| CN104076457B CN104076457B (en) | 2017-02-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108398752A (en) * | 2018-04-02 | 2018-08-14 | 深圳市光兴创科技有限公司 | The novel single fiber bi-directional electrooptical device and its integrated base without lock pin |
| CN111463655A (en) * | 2019-04-18 | 2020-07-28 | 祥茂光电科技股份有限公司 | Transistor-based can laser assembly with eccentric lens cap and optical transceiver or optical transmitter implementing same |
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| CN103529524A (en) * | 2013-10-21 | 2014-01-22 | 重庆航伟光电科技有限公司 | Optical signal receiving detector and manufacturing method thereof |
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| US20090116838A1 (en) * | 2006-10-03 | 2009-05-07 | Sumitomo Electric Industries, Ltd. | Bi-directional optical module with a polarization independent optical isolator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108398752A (en) * | 2018-04-02 | 2018-08-14 | 深圳市光兴创科技有限公司 | The novel single fiber bi-directional electrooptical device and its integrated base without lock pin |
| CN111463655A (en) * | 2019-04-18 | 2020-07-28 | 祥茂光电科技股份有限公司 | Transistor-based can laser assembly with eccentric lens cap and optical transceiver or optical transmitter implementing same |
| CN111463655B (en) * | 2019-04-18 | 2023-07-25 | 祥茂光电科技股份有限公司 | Transistor-shaped can laser assembly with eccentric lens cover and optical transceiver or optical transmitter implementing same |
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| Publication number | Publication date |
|---|---|
| CN104076457B (en) | 2017-02-15 |
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