CN102709334A

CN102709334A - High-performance semiconductor photo receiver

Info

Publication number: CN102709334A
Application number: CN2012100695228A
Authority: CN
Inventors: 周艳
Original assignee: Engrave Prosperous Optoelectronics Technology (zhenjiang) Co Ltd
Current assignee: Engrave Prosperous Optoelectronics Technology (zhenjiang) Co Ltd
Priority date: 2012-03-16
Filing date: 2012-03-16
Publication date: 2012-10-03

Abstract

The invention belongs to the field of photo communication and a high-performance semiconductor optical receiver consisting of a tube seat, a PD (photo device) chip, a tube cap with a lens and a heat sink. The PD chip is attached at the center of the tube seat, and a photosensitive side of the PD chip is not perpendicular to a ray axis of the lens. By redesigning the bottom surface of the tube seat used in the TO-can of the photo receiver and on the premise of keeping received photosensitivity of the PD chip, interference to emitted signals on a communication link from emitted light of the photosensitive side of a photoelectric diode is reduced, light return loss index is increased, communication quality is improved, and communication distance is lengthened. Further, using an isolator in a light emitting system can be omitted, and integral cost of a photo communication module is saved greatly.

Description

The high-performance semiconductor optical receiver

Technical field

The invention belongs in optical communication field, relate to a kind of high-performance semiconductor optical receiver.

Background technology

In the optical fiber telecommunications system, the light transmitting chip of light transmitting terminal is responsive to light energy descending in the optical fiber link, and when descending light was higher than certain numerical value, the spectrum of the emission system that light is logical will occur unusually, thus the communication system cisco unity malfunction that is; In high-speed optical transmission system, the descending light of crosstalking that transmitting chip received is mainly derived from the emission light of photosurface of the optical receiver of communication system.The also echo loss of this reverberation; Industry is in order to reduce this catoptrical influence; Generally be employed in the way that the emitting laser front adds isolator and prevent the influence of reverberation transmitting chip, bring like this unfavorable be the cost that has increased the emission optical device because isolator is at the optical link Insertion Loss; Reduce the luminous power of transmitting chip, thereby reduced the transmission range of optical communication.

For light transmitting and receiving system, Optical Return Loss is a very important index.General optical receiver require Optical Return Loss-more than the 30dB, could guarantee normal optical signal transmission.

The optical receiver of TO-can encapsulation commonly used is as shown in Figure 1, generally consists of the following components: the pipe cap 02 of base 01, band lens 05, heat sink 03, chip 04, and the optical receiver that has also has trans-impedance amplifier, electric capacity etc.; The baseplane of present existing base is perpendicular to the light path axial direction; As shown in Figure 2; Deriving from the reflection meeting that the light of optical fiber G produces on the photosurface of receiving chip turns back in the light path along original optical path; Lens on the process pipe cap converge and are coupled into light path once more, form the stray light to the light transmitting terminal, have influenced communication quality.

Summary of the invention

Technical problem to be solved by this invention is, provides a kind of reverberation that can reduce in the optical signal transmission to disturb, improve optical communication quality, high-performance semiconductor optical receiver that cost is low

High-performance semiconductor optical receiver of the present invention pastes the PD chip by pipe cap, the heat sink composition of base, PD chip, band lens in the center of base; The optical axis out of plumb of the photosurface of said PD chip and lens.

Angle is 3 °～15 ° between the vertical plane of the photosurface of said PD chip and the optical axis of lens.

The present invention is in order to reduce the reverberation of receiving chip; With originally with optical path axis to vertical PD chip inclination certain angle; Make flashlight incide on the photosurface of receiving chip with certain incidence angle; When emission light just can not be launched back into optical fibers along original optical path through photosurface reflection back, but be reflected to other to reflecting other places of no any reaction, this structure Design good treatment the unmanageable reverberation of script; Improved the Optical Return Loss of optical receiver, be applicable to and produce in enormous quantities and the quality management and control.The present invention is through the design again to employed base baseplane among the optical receiver TO-can; Under the prerequisite of the reception luminous sensitivity that does not change photodiode (PD) chip, reduced the interference of emission light to transmitting on the communication link of photodiode photosurface, improved light return loss index; Thereby improved communication quality; Increase communication distance, and can save the use of the isolator in the light emission system, saved the whole cost of Communication ray module greatly.

Description of drawings

Fig. 1 is known optical receiving set PD TO-can decomposing schematic representation.

Fig. 2 is known TO-can encapsulation receiver optical path analysis figure.

Fig. 3 is a structural representation of the present invention.

Fig. 4 is optical path analysis figure of the present invention.

Embodiment

As shown in Figure 3; The high-performance semiconductor optical receiver of the embodiment of the invention is made up of base 11, lens 15, pipe cap 12, PD chip 14 and heat sink 13; Base end face and optical axis out of plumb; Post heat sink and PD chip on it, making the angle between the vertical plane of optical axis of photosurface and lens of PD chip is 3 °～15 °.

As shown in Figure 4 during work, because the photosurface of PD chip is not vertical with optical axis, most of reverberation of incident light can not reflex among the optical fiber G, thereby realizes having improved the Optical Return Loss of optical receiver.

Claims

1. a high-performance semiconductor optical receiver by pipe cap, the heat sink composition of base, PD chip, band lens, pastes the PD chip in the center of base; It is characterized in that: the optical axis out of plumb of the photosurface of said PD chip and lens.

2. high-performance semiconductor optical receiver according to claim 1 is characterized in that: angle is 3 °～15 ° between the vertical plane of the photosurface of said PD chip and the optical axis of lens.