CN209001971U - A kind of optical module for reducing optical crosstalk - Google Patents
A kind of optical module for reducing optical crosstalk Download PDFInfo
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- CN209001971U CN209001971U CN201822139901.5U CN201822139901U CN209001971U CN 209001971 U CN209001971 U CN 209001971U CN 201822139901 U CN201822139901 U CN 201822139901U CN 209001971 U CN209001971 U CN 209001971U
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- chip
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- hole
- optical module
- optical crosstalk
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Abstract
The utility model discloses a kind of optical modules for reducing optical crosstalk, should include chip pad, chip of laser, heat sink and baffle for reducing the optical module of optical crosstalk；Heat sink to be located in chip pad, the side at heat sink close chip pad center is provided with chip of laser, and baffle plate setting is on heat sink；A through-hole is offered on baffle, projection of the through-hole in chip pad covers projection of the chip of laser in chip pad；The size of the light-emitting surface of the size and chip of laser of through-hole matches, so that the laser of chip of laser transmitting passes through outside through-hole directive.The utility model is by increasing baffle, and the through-hole on baffle is aligned with the light-emitting surface of chip of laser, limit the transmission path of light, the laser that chip of laser is emitted by through-hole directive outside, and the reflected light of the overwhelming majority can not be by through-hole, the light for avoiding external reflection from returning generates optical crosstalk to chip of laser.
Description
Technical field
The utility model belongs to technical field of photo communication, more particularly, to a kind of optical module for reducing optical crosstalk.
Background technique
With flourishing for optical communication, demand of the people to network is higher and higher, while the requirement to cost is also more next
It is harsher.As optical communication core devices, most of cost is determined by optical module.
The laser signal that optical module is emitted inevitably generates reflected light in optic path, and reflected light is back to
In optical module, optical module job insecurity will lead to, influence the working performance of optical module.It is multiplexed especially for multipath light signal
Optical module, the optical crosstalk between optical signal is especially prominent, existing general using optical isolator is increased, and reflected light is prevented to enter
Optical module can be fully solved optical crosstalk problem caused by reflected light, but every paths are both needed to increase optical isolator, cost
It is higher.
In consideration of it, overcoming defect present in the prior art is the art urgent problem to be solved.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the utility model provides a kind of for reducing optical crosstalk
Optical module its object is to pass through to increase by a baffle, and the through-hole on baffle is aligned with the light-emitting surface of chip of laser, is limited
The transmission path of light so that the laser that chip of laser is emitted, can be by through-hole directive outside, most external reflections
Light back can not can be prevented in outside by through-hole by baffle, so that the light for avoiding external reflection from returning is to chip of laser
Optical crosstalk is generated, the performance of optical module is improved, reflected light is thus solved and is back in optical module, it is unstable to will lead to optical module work
The technical issues of determining, influencing the working performance of optical module.
To achieve the above object, according to the one aspect of the utility model, a kind of light for reducing optical crosstalk is provided
Module, the optical module for reducing optical crosstalk include chip pad 1, chip of laser 2, heat sink 3 and baffle 4；
Described heat sink 3 are located in the chip pad 1, and described heat sink 3 are arranged close to the side at 1 center of chip pad
There is chip of laser 2, the baffle 4 is arranged on described heat sink 3；
Offer a through-hole 41 on the baffle 4, projection of the through-hole 41 in the chip pad 1, described in covering
Projection of the chip of laser 2 in the chip pad 1；
Wherein, the size of the through-hole 41 and the size of the light-emitting surface of the chip of laser 2 match, so that described swash
The laser that light device chip 2 emits passes through outside 41 directive of through-hole.
Preferably, the size of the through-hole 41 and the light-emitting surface of the chip of laser 2 is equal in magnitude；
Projection of the center of the through-hole 41 in the chip pad 1, the light-emitting surface center with the chip of laser 2
Projection in the chip pad 1 overlaps.
Preferably, the optical module for reducing optical crosstalk includes back light detector chip 5, the back light detector core
Piece 5 is arranged in the chip pad 1；
Company between the receipts smooth surface center of the back light detector chip 5 and the light-emitting surface center of the chip of laser 2
Line is perpendicular to the chip pad 1.
Preferably, multiple pins are provided in the chip pad 1；
The chip of laser 2 and the back light detector chip 5 are connected with corresponding pin by spun gold bonding wire respectively
It connects.
Preferably, the number of the pin is three, specially the first power pin 11, second source pin 12 and is connect
Ground pin 13；
First power pin 11 is connect with the voltage end of the chip of laser 2 by spun gold bonding wire；Described second
Power pin 12 is connect with the voltage end of the back light detector chip 5 by spun gold bonding wire；The ground pin 13 respectively with
The ground terminal of the ground terminal of the chip of laser 2 and the back light detector chip 5 is connected by spun gold bonding wire.
Preferably, the optical module for reducing optical crosstalk further includes sealing cap 6, the light-emitting surface of the chip of laser 2
The line between window center on center and the sealing cap 6 is perpendicular to the chip pad 1.
Preferably, lens 61 are provided on the window at 6 center of sealing cap, the focus of the lens 61 is at the chip bottom
Projection on seat 1, is overlapped with projection of the luminous point of the chip of laser 2 in the chip pad 1.
Preferably, the chip pad 1, described heat sink 3 and the sealing cap 6 make according to the specification of TO56.
Preferably, the optical module for reducing optical crosstalk further includes contact block 7, and the contact block 7 is arranged described
On heat sink 3, the chip of laser 2 is arranged on the contact block 7.
Preferably, at least one capacitor is provided in the chip pad 1, the capacitor is adjacent to the chip of laser 2
Setting.
In general, have the above technical solutions conceived by the present invention are compared with the prior art, has as follows
Beneficial effect: the optical module for reducing optical crosstalk of the utility model by increasing by a baffle, and by the through-hole on baffle and swashs
The light-emitting surface of light device chip is aligned, and the transmission path of light is limited, so that the laser that chip of laser is emitted, can pass through through-hole
Outside directive.And the light that most external reflections are returned, it can not can be prevented by baffle by through-hole in outside, to avoid
The light that external reflection is returned generates optical crosstalk to chip of laser, reduces optical crosstalk, improves the stability of optical module.Another party
The manufacture craft in face, baffle is simple, and cost is relatively low.
Detailed description of the invention
It, below will be in the utility model embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Required attached drawing is briefly described.It should be evident that drawings described below is only the one of the utility model
A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram of optical module for reducing optical crosstalk provided by the embodiment of the utility model；
Fig. 2 is the structure of another optical module (no baffle) for reducing optical crosstalk provided by the embodiment of the utility model
Schematic diagram；
Fig. 3 is a kind of structural schematic diagram of sealing cap provided by the embodiment of the utility model；
Fig. 4 is a kind of schematic top plan view of optical module for reducing optical crosstalk provided by the embodiment of the utility model；
Fig. 5 is a kind of schematic cross-sectional view of optical module for reducing optical crosstalk provided by the embodiment of the utility model.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
Term "inner", "outside", " longitudinal direction ", " transverse direction ", "upper", "lower", "top", "bottom" in the description of the present invention,
The orientation or positional relationship of equal instructions is to be based on the orientation or positional relationship shown in the drawings, and being merely for convenience of description, this is practical new
Type rather than require the utility model that must be constructed and operated in a specific orientation, therefore be not construed as to the utility model
Limitation.
As long as in addition, technical characteristic involved in the various embodiments of the present invention described below each other it
Between do not constitute conflict and can be combined with each other.
The utility model embodiment provides a kind of optical module for reducing optical crosstalk, and as shown in Figure 1 to 4, this is used for
The optical module for reducing optical crosstalk includes chip pad 1, chip of laser 2, heat sink 3 and baffle 4.
Described heat sink 3 are located in the chip pad 1, and described heat sink 3 are arranged close to the side at 1 center of chip pad
There is chip of laser 2, in the present embodiment, chip of laser 2 generates the laser perpendicular to the plane where pedestal 1, wherein preceding
Light emission propagates to subsequent optical module to outside, and backlight is acquired by detector to detect and adjust the watt level of chip of laser 2.
The baffle 4 is arranged on described heat sink 3, wherein a through-hole 41, the through-hole 41 are offered on the baffle 4
Projection in the chip pad 1 covers projection of the chip of laser 2 in the chip pad 1, the through-hole 41
Size and the size of the light-emitting surface of the chip of laser 2 match so that the laser that the chip of laser 2 emits passes through
Outside 41 directive of through-hole.Wherein, through-hole 41 can be round, rectangular or other shapes, and the shape of through-hole 41, which is not done, to be had
Body limits, and guarantees that laser signal can launch outward, and external reflected light is more difficult passes through through-hole 41.
The optical module for reducing optical crosstalk of the utility model, by increasing by a baffle 4, and by the through-hole on baffle 4
41 are aligned with the light-emitting surface of chip of laser 2, limit the transmission path of light, so that the laser that chip of laser 2 is emitted, it can
Outside 41 directive of through-hole.And the light that most external reflections are returned, it can not can be prevented by baffle 4 by through-hole 41
The performance of optical module is improved so that the light for avoiding external reflection from returning generates optical crosstalk to chip of laser 2 in outside.Another party
The manufacture craft in face, baffle 4 is simple, and cost is relatively low.
In the embodiments of the present invention, there are a kind of preferred implementation, the size of the through-hole 41 with it is described
Equal in magnitude, the shape of the light-emitting surface of the shape of the through-hole 41 and the chip of laser 2 of the light-emitting surface of chip of laser 2
Equal, projection of the center of the through-hole 41 in the chip pad 1 exists with the light-emitting surface center of the chip of laser 2
Projection in the chip pad 1 overlaps.Guarantee that the laser that chip of laser 2 is emitted can be complete using such mode
Outside directive, and the light that most external reflections are returned can be obstructed by baffle 4, be cannot be introduced into chip of laser 2, reduced
Optical crosstalk.As shown in figure 5, light (shown in dotted line) and through-hole 41 that external reflection is returned is there are when alternate position spike, it cannot be by logical
41 directive chip of laser 2 of hole, the laser that chip of laser 2 is emitted are (shown in solid) by outside 41 directive of through-hole.
Further, the optical module for reducing optical crosstalk includes back light detector chip 5, the back light detector
Chip 5 is arranged in the chip pad 1, the receipts smooth surface center of the back light detector chip 5 and the chip of laser 2
Line between light-emitting surface center is perpendicular to the chip pad 1.Under concrete application scene, back light detector chip 5 is monitored
The laser signal (backlight) inside perpendicular to pedestal 1 that the chip of laser 2 is emitted, real-time monitoring backlight signal it is big
It is small, to adjust the size of preceding optical signal indirectly.The back light detector chip 5 that the present embodiment is proposed is that light, backlight are received in side
The model of detector chip 5 is specifically as follows WGPD10, main specifications parameter: having a size of 250um*250um*150um；Re=
0.8A/W；Id=10nA.
In the present embodiment, multiple pins, the chip of laser 2 and the back are provided in the chip pad 1
Photo detector chip 5 is connected with corresponding pin by spun gold bonding wire respectively, to receive external signal, is controlled for reducing light string
The optical module work disturbed.
For example, the number of the pin be three, specially the first power pin 11, second source pin 12 and
Ground pin 13, first power pin 11 are connect with the voltage end of the chip of laser 2 by spun gold bonding wire, and described
Two power pins 12 are connect with the voltage end of the back light detector chip 5 by spun gold bonding wire；The ground pin 13 is distinguished
It is connect with the ground terminal of the ground terminal of the chip of laser 2 and the back light detector chip 5 by spun gold bonding wire.
In the present embodiment, the optical module for reducing optical crosstalk further includes sealing cap 6, the chip of laser 2
The line between window center on light-emitting surface center and the sealing cap 6 is perpendicular to chip pad 1.Specifically, in the sealing cap 6
Lens 61, projection of the focus of the lens 61 in chip pad 1, with the chip of laser 2 are provided on the window of the heart
Projection of the luminous point in chip pad 1 be overlapped.
The embodiment of the present invention chip pad 1, described heat sink 3 and the sealing cap 6 are made according to the specification of TO56, are
Existing production method, wherein TO56 is another saying of TO-CAN.In actual production production, using light emitting TO-
CAN production line makes chip pad 1, heat sink 3 and sealing cap 6.
During actual fabrication, due to shell finite volume, heat sink 3 thickness is not easy too thick, otherwise can occupy other
The wiring area of device (for example, back light detector chip 5).In order to guarantee that light-emitting surface center and the backlight of chip of laser 2 are visited
Line between the receipts smooth surface center of survey device chip 5 is described also to wrap for reducing the optical module of optical crosstalk perpendicular to chip pad 1
Contact block 7 is included, the contact block 7 is arranged on described heat sink 3, and the chip of laser 2 is arranged on the contact block 7, leads to
Setting contact block 7 is crossed to preset thickness, guarantees the light-emitting surface center of chip of laser 2 and the receipts light of back light detector chip 5
Line between the center of face is perpendicular to chip pad 1.
During the utility model embodiment is realized, in order to guarantee the performance of the optical module for reducing optical crosstalk, need
Peripheral circuit is wanted to assist, specifically, being additionally provided at least one capacitor in the chip pad 1, the capacitor swashs adjacent to described
Light device chip 2 is arranged, and the capacitor can be filter capacitor, guarantees that the signal noise for being input to chip of laser 2 is smaller.
It is different from the prior art, the optical module for reducing optical crosstalk of the utility model, by increasing by a baffle, and will
Through-hole on baffle is aligned with the light-emitting surface of chip of laser, limits the transmission path of light, so that chip of laser was emitted
Laser, can be by through-hole directive outside.And the light that most external reflections are returned, it can not can be hindered by baffle by through-hole
Only in outside, so that the light for avoiding external reflection from returning generates optical crosstalk to chip of laser, optical crosstalk is reduced, improves optical module
Stability, improve performance.On the other hand, the manufacture craft of baffle is simple, and cost is relatively low.
As it will be easily appreciated by one skilled in the art that the above is only the preferred embodiment of the utility model only, not
To limit the utility model, any modification made within the spirit and principle of the present invention, equivalent replacement and change
Into etc., it should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of optical module for reducing optical crosstalk, which is characterized in that the optical module for reducing optical crosstalk includes core
Piece pedestal (1), chip of laser (2), heat sink (3) and baffle (4)；
Described heat sink (3) are located in the chip pad (1), the side of heat sink (3) close to the chip pad (1) center
It is provided with chip of laser (2), the baffle (4) is arranged on heat sink (3)；
It offers a through-hole (41), projection of the through-hole (41) on the chip pad (1), covers on the baffle (4)
Projection of the chip of laser (2) on the chip pad (1)；
Wherein, the size of the through-hole (41) and the size of the light-emitting surface of the chip of laser (2) match, so that described swash
The laser of light device chip (2) transmitting passes through outside the through-hole (41) directive.
2. the optical module according to claim 1 for reducing optical crosstalk, which is characterized in that the size of the through-hole (41)
It is equal in magnitude with the light-emitting surface of the chip of laser (2)；
Projection of the center of the through-hole (41) on the chip pad (1), in the light-emitting surface of the chip of laser (2)
Projection of the heart on the chip pad (1) overlaps.
3. the optical module according to claim 1 for reducing optical crosstalk, which is characterized in that described for reducing optical crosstalk
Optical module include back light detector chip (5), the back light detector chip (5) is arranged on the chip pad (1)；
Company between the receipts smooth surface center of the back light detector chip (5) and the light-emitting surface center of the chip of laser (2)
Line is perpendicular to the chip pad (1).
4. the optical module according to claim 3 for reducing optical crosstalk, which is characterized in that on the chip pad (1)
It is provided with multiple pins；
The chip of laser (2) and the back light detector chip (5) are connected with corresponding pin by spun gold bonding wire respectively
It connects.
5. the optical module according to claim 4 for reducing optical crosstalk, which is characterized in that the number of the pin is three
It is a, specially the first power pin (11), second source pin (12) and ground pin (13)；
First power pin (11) is connect with the voltage end of the chip of laser (2) by spun gold bonding wire；Described second
Power pin (12) is connect with the voltage end of the back light detector chip (5) by spun gold bonding wire；The ground pin (13)
Pass through spun gold bonding wire with the ground terminal of the ground terminal of the chip of laser (2) and the back light detector chip (5) respectively
Connection.
6. described in any item optical modules for reducing optical crosstalk according to claim 1~5, which is characterized in that described to be used for
The optical module for reducing optical crosstalk further includes sealing cap (6), on the light-emitting surface center and the sealing cap (6) of the chip of laser (2)
Window center between line perpendicular to the chip pad (1).
7. the optical module according to claim 6 for reducing optical crosstalk, which is characterized in that sealing cap (6) center
It is provided on window lens (61), projection of the focus of the lens (61) on the chip pad (1), with the laser
Projection of the luminous point of chip (2) on the chip pad (1) is overlapped.
8. the optical module according to claim 6 for reducing optical crosstalk, which is characterized in that the chip pad (1), institute
Heat sink (3) and the sealing cap (6) is stated to make according to the specification of TO56.
9. described in any item optical modules for reducing optical crosstalk according to claim 1~5, which is characterized in that described to be used for
The optical module for reducing optical crosstalk further includes contact block (7), and the contact block (7) is arranged on heat sink (3), the laser
Chip (2) is arranged on the contact block (7).
10. described in any item optical modules for reducing optical crosstalk according to claim 1~5, which is characterized in that the chip
At least one capacitor is provided on pedestal (1), the capacitor is arranged adjacent to the chip of laser (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822139901.5U CN209001971U (en) | 2018-12-19 | 2018-12-19 | A kind of optical module for reducing optical crosstalk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822139901.5U CN209001971U (en) | 2018-12-19 | 2018-12-19 | A kind of optical module for reducing optical crosstalk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209001971U true CN209001971U (en) | 2019-06-18 |
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ID=66808974
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822139901.5U Active CN209001971U (en) | 2018-12-19 | 2018-12-19 | A kind of optical module for reducing optical crosstalk |
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| CN (1) | CN209001971U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112444738A (en) * | 2019-08-28 | 2021-03-05 | 合肥本源量子计算科技有限责任公司 | Method for verifying crosstalk residue of superconducting quantum chip |
-
2018
- 2018-12-19 CN CN201822139901.5U patent/CN209001971U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112444738A (en) * | 2019-08-28 | 2021-03-05 | 合肥本源量子计算科技有限责任公司 | Method for verifying crosstalk residue of superconducting quantum chip |
| CN112444738B (en) * | 2019-08-28 | 2022-03-18 | 合肥本源量子计算科技有限责任公司 | Method for verifying crosstalk residue of superconducting quantum chip |
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