CN104070912B - 图案制作装置以及图案制作方法 - Google Patents

图案制作装置以及图案制作方法 Download PDF

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Publication number
CN104070912B
CN104070912B CN201410120932.XA CN201410120932A CN104070912B CN 104070912 B CN104070912 B CN 104070912B CN 201410120932 A CN201410120932 A CN 201410120932A CN 104070912 B CN104070912 B CN 104070912B
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China
Prior art keywords
color
pattern
length
line
colors
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Expired - Fee Related
Application number
CN201410120932.XA
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English (en)
Chinese (zh)
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CN104070912A (zh
Inventor
西川文裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shima Seiki Mfg Ltd
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Shima Seiki Mfg Ltd
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Publication date
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Publication of CN104070912A publication Critical patent/CN104070912A/zh
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Publication of CN104070912B publication Critical patent/CN104070912B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/00—Two-dimensional [2D] image generation
    • G06T11/10—Texturing; Colouring; Generation of textures or colours
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/125—Active-matrix OLED [AMOLED] displays including organic TFTs [OTFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Processing Or Creating Images (AREA)
  • Coloring (AREA)
  • Electroluminescent Light Sources (AREA)
  • Treatment Of Fiber Materials (AREA)
CN201410120932.XA 2013-03-29 2014-03-28 图案制作装置以及图案制作方法 Expired - Fee Related CN104070912B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013073063A JP6029515B2 (ja) 2013-03-29 2013-03-29 パターン作成装置及びパターン作成方法
JP2013-073063 2013-03-29

Publications (2)

Publication Number Publication Date
CN104070912A CN104070912A (zh) 2014-10-01
CN104070912B true CN104070912B (zh) 2017-04-12

Family

ID=51592677

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410120932.XA Expired - Fee Related CN104070912B (zh) 2013-03-29 2014-03-28 图案制作装置以及图案制作方法

Country Status (3)

Country Link
US (2) US9087802B2 (https=)
JP (1) JP6029515B2 (https=)
CN (1) CN104070912B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3625881C2 (de) 1986-07-31 1995-02-02 Duerkopp Adler Ag Nähautomat mit einem Nähkopf mit Drehgehäuse
US11137438B2 (en) * 2014-08-22 2021-10-05 Disruptive Technologies Systems and methods for testing electrical leakage
CN106935599B (zh) * 2017-05-12 2020-05-26 京东方科技集团股份有限公司 一种显示基板的制作方法、显示基板及显示装置
EP3803643A1 (en) 2018-05-30 2021-04-14 NIKE Innovate C.V. Garment production systems and methods
CN110492016B (zh) * 2019-07-30 2020-10-27 武汉华星光电半导体显示技术有限公司 阵列基板及显示面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740057A (en) * 1994-11-22 1998-04-14 Brother Kogyo Kabushiki Kaisha Embroidery data creating device
JPH1157261A (ja) * 1997-08-21 1999-03-02 Brother Ind Ltd 縫い目様式設定方法及びその装置並びに記憶媒体
CN1470030A (zh) * 2000-10-18 2004-01-21 株式会社岛精机制作所 编织设计系统
CN1585950A (zh) * 2001-10-05 2005-02-23 株式会社岛精机制作所 针织物的设计方法与设备
CN1773514A (zh) * 2005-08-25 2006-05-17 刘林泉 一种布料花纹电脑仿真排版喷花的方法及其喷花装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3770459B2 (ja) * 2000-05-23 2006-04-26 シャープ株式会社 画像表示装置、画像表示方法および記録媒体
US7164155B2 (en) * 2002-05-15 2007-01-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP4518484B2 (ja) * 2003-10-15 2010-08-04 株式会社川島織物セルコン 画像生成プログラムおよび画像生成装置
JP2006054111A (ja) * 2004-08-12 2006-02-23 Sony Corp 表示装置
EP1950676B1 (en) 2005-11-17 2014-07-23 Shima Seiki Manufacturing., Ltd. Border pattern designing device, designing method, and designing program
US7915816B2 (en) * 2007-05-14 2011-03-29 Sony Corporation Organic electroluminescence display device comprising auxiliary wiring
JP2010131272A (ja) * 2008-12-05 2010-06-17 Brother Ind Ltd 刺繍データ作成装置および刺繍データ作成プログラム
JP2011136061A (ja) * 2009-12-28 2011-07-14 Brother Industries Ltd 刺繍データ作成装置及び刺繍データ作成プログラム
JP2011242705A (ja) * 2010-05-21 2011-12-01 Sony Corp 表示装置、および表示装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740057A (en) * 1994-11-22 1998-04-14 Brother Kogyo Kabushiki Kaisha Embroidery data creating device
JPH1157261A (ja) * 1997-08-21 1999-03-02 Brother Ind Ltd 縫い目様式設定方法及びその装置並びに記憶媒体
CN1470030A (zh) * 2000-10-18 2004-01-21 株式会社岛精机制作所 编织设计系统
CN1585950A (zh) * 2001-10-05 2005-02-23 株式会社岛精机制作所 针织物的设计方法与设备
CN1773514A (zh) * 2005-08-25 2006-05-17 刘林泉 一种布料花纹电脑仿真排版喷花的方法及其喷花装置

Also Published As

Publication number Publication date
JP2014197335A (ja) 2014-10-16
US9087802B2 (en) 2015-07-21
JP6029515B2 (ja) 2016-11-24
CN104070912A (zh) 2014-10-01
US20140297020A1 (en) 2014-10-02
US20140291687A1 (en) 2014-10-02

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