CN104070467A - Micro blade grinding product and preparation method and application thereof - Google Patents
Micro blade grinding product and preparation method and application thereof Download PDFInfo
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- CN104070467A CN104070467A CN201410279777.6A CN201410279777A CN104070467A CN 104070467 A CN104070467 A CN 104070467A CN 201410279777 A CN201410279777 A CN 201410279777A CN 104070467 A CN104070467 A CN 104070467A
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Abstract
The invention relates to a micro blade grinding product which comprises a diamond particle. One plane of the diamond particle is provided with a plurality of recessed microdefects, and accordingly grinding micro blades are formed on the plane. The invention further relates to a method for preparing the product. The plane of the diamond particle is etched by utilizing pulse laser to form the recessed microdefects. The invention further relates to application of the product. The plane of the diamond particle is etched to form the recessed microdefects, so that plenty of micro blades for grinding are formed, diamond abrasive grains engaged in grinding are no longer in a single-particle mode, the micro blades simultaneously engage in grinding, grinding efficiency and processing precision are improved; the diamond abrasive grains engaged in grinding are in a micro broken mode, new grinding blades can be continuously generated during the grinding, grinding time is greatly reduced, and processing efficiency is improved. The micro blade grinding product can be applied to diamond brazing products.
Description
Technical field
The present invention relates to a kind of micro-sword grinding product and its preparation method and application.
Background technology
Because diamond forms the height of protrusion higher than diamond particles 50% when the soldering, brazed diamond tool has than other as metallic bond sintered diamond tool, resin bonding agent diamond instrument, ceramic bond diamond instrument and the higher sharpness of plating diamond tool, be conducive to improve the working (machining) efficiency of instrument, and the metallurgical binding that diamond and brazing alloy form when soldering makes adamantine bond strength also higher than the diamond tool of other bonding agents, the instrument that can ensure has the good life-span.
But also there is larger difficulty in the manufacture of the diamond grinding tool that the orderly soldering of current fine-grained diamond fine grained forms, because the thickness of ordered arrangement technology and brazing filler metal alloy layer is difficult to control on the one hand, on the other hand, in the time of high temperature brazing, diamond surface has formed interfacial reaction layer and the graphitization layer of several micron thick, also there is graphitization to a certain degree in adamantine exposure surface, this makes fine-granularity diamond strength decreased obvious; And, the diamond grinding tool of fine grit, abrasive particle diameter is several microns and even submicron-scale, be conducive to obtain less surface roughness and subsurface stratum damage, but fine grit emery wheel chip space is little, easily stops up; Bonding agent is less to the hold of abrasive particle simultaneously, and abrasive particle easily comes off, and abrasion of grinding wheel is large, causes the change of abrasive grain layer pattern, affects the raising of surface precision, and fine grit emery wheel often needs periodic shaping and dressing in using, and this can increase process time and cost.Therefore in the diamond brazing diamond tool of coarseness, apply more.
The wear form of the diamond abrasive grain in skive of the prior art has three kinds: 1, abrasion wearing and tearing; 2, micro-fragmentation; 3, block fracture.The easy thing grinding tool rust of abrasion wearing and tearing, need often repair; Block fracture, easily affects the life-span of grinding.And in diamond grinding tool of the prior art, diamond abrasive grain participates in grinding is the diamond of individual particle, and the particle of braze welding diamond is larger, and machining accuracy is restricted.
Summary of the invention
In order to overcome above-mentioned technical problem, the object of the present invention is to provide micro-sword grinding product that a kind of machining accuracy is high and its preparation method and application.
The technical solution adopted in the present invention is:
A kind of micro-sword grinding product, comprises diamond particles, and one of them plane of described diamond particles is provided with some recessed microdefects, thereby forms the micro-sword of grinding in this plane.
As the further improvement of technique scheme, thereby some uniform solderings of diamond particles with complete crystal formation form the diamond particles structure of individual layer at matrix surface, the adamantine intensity of complete crystal formation of coarseness is high, graphitization impact is relatively little, easily carry out ordered arrangement, is therefore applicable to being applied in this.The plane that each diamond particles is provided with microdefect matrix and at grade or roughly at grade dorsad, thereby formation product surface, described product surface or almost parallel parallel with matrix surface, when goods and product surface are conducive to improve machining accuracy and surface quality during for processing and finishing.
As the further improvement of technique scheme, described microdefect comprises uniform micropore, and the diameter of each micropore and the degree of depth are 0.015～0.035mm, and the spacing between micropore is at 0.01～0.1mm.
As the further improvement of technique scheme, described microdefect comprises uniform microflute.
As the further improvement of technique scheme, described microflute is roughly " V " type, and cell wall angle angle is 10o～80o, and each width of mini longitudinal channels is 0.015～0.035mm, and the degree of depth is 0.015～0.055mm.
As the further improvement of technique scheme, described microdefect is the combination of micropore and microflute.The diameter of each micropore and the degree of depth are 0.010～0.040mm, and the spacing between micropore is at 0.01～0.15mm, and microflute is roughly " V " type, and cell wall angle angle is 10o～80o, and each width of mini longitudinal channels is 0.015～0.035mm, and the degree of depth is 0.015～0.055mm.
The present invention also provides a kind of preparation method of micro-sword grinding product, uses pulse laser (nanosecond, psec, femtosecond isopulse laser instrument) to etch recessed microdefect in a plane of diamond particles, makes this plane form micro-sword that grinding is used.
As the further improvement of technique scheme, some diamond particles are distributed in then soldering of matrix surface by mode with ordered arrangement, the plane that makes to need in diamond particles etching microdefect at grade or roughly at grade, thereby form the product surface of flat-top, and product surface is parallel with matrix surface or almost parallel.。
The present invention also provides a kind of emery wheel, and the plane that is provided with microdefect in above-mentioned micro-sword grinding product forms grinding face.
The present invention also provides a kind of grinding wheel dressing pen, and the finishing face contacting with emery wheel is the plane that is provided with microdefect in above-mentioned micro-sword goods.
The invention has the beneficial effects as follows: form the micro-sword for grinding in a large number thereby the present invention etches microdefect in the plane of diamond particles, the diamond abrasive grain that participates in grinding is no longer the form of individual particle, multiple micro-swords participate in grinding simultaneously, improve grinding efficiency, increase machining accuracy, the diamond abrasive grain that simultaneously participates in grinding is the mode of micro-fragmentation, when grinding, can constantly upgrade the grinding sword making new advances, reduce the grinding time greatly, improve working (machining) efficiency.
Brief description of the drawings
Below in conjunction with drawings and embodiments, the present invention is further described.
Fig. 1 is the front view of first embodiment of the invention;
Fig. 2 is the generalized section of first embodiment of the invention;
Fig. 3 is the schematic diagram of the first embodiment diamond particles;
Fig. 4 is the schematic diagram of the second embodiment diamond particles;
Fig. 5 is the schematic diagram of the 3rd embodiment diamond particles;
Fig. 6 is the cutaway view of the second and the 3rd microflute in embodiment;
Fig. 7 is the schematic diagram of fourth embodiment of the invention;
Fig. 8 is the top view of fourth embodiment of the invention.
Detailed description of the invention
Emery wheel as shown in Figure 1 to Figure 3, comprises a pedestal 101, and pedestal 101 surfaces are fixedly connected with polylith matrix 201, the circular layout of each matrix 201.Each matrix 201 is provided with a diamond individual layer, and this diamond individual layer is made up of some diamond particles 301 with complete crystal formation.The granularity of diamond particles 301 is 18/20 to 70/80 order, and the area of matrix 201 surface distributed diamond particles 301 accounts for 30～80%.
The preparation method of this emery wheel is as follows:
(1) select common iron as matrix 201, by smooth matrix 201 Surface Machining, make it to become a plane;
(2) use binding agent to be evenly coated with one deck money base brazing alloy powder on matrix 201 surfaces;
(3) use the method for ordered arrangement artificial diamond's stone granulate 301 of complete crystal formation to be evenly distributed on to the surface of matrix 201;
(4) the goods soldering after (1) (2) (3) are handled well.Thereby the diamond particles 301 of complete the crystal formation coplanar or coplanar formation product surface roughly of the end face of matrix 201 dorsad after soldering, this product surface is parallel or approximate parallel with matrix 201 surfaces;
(5) attrition process is carried out on the diamond composition surface after using diamond lap dish to soldering, and the diamond composition of the flat-top of acquisition can obtain higher flatness, flatness and conforming surperficial flat-top like this;
(6) use pulse laser (nanosecond) to carry out controlled lithography at product surface, at the micropore 401 of a series of orthogonal arrays of topside etch of diamond particles 301, the diameter of micropore 401 and the degree of depth are 0.025～0.035mm, and the spacing that micropore is 401 is 0.1mm;
(7) micropore 401 etchings are arranged on each matrix 201 on pedestal 101 after completing, and make the product surface of each matrix 201 correspondences coplanar or roughly coplanar, thereby form the grinding face with micro-sword.
Emery wheel as shown in Figure 4, is the order number of diamond particles and the form of microdefect with the difference among the first embodiment.In this embodiment, diamond particles 302 is 30/35 order, microdefect is crisscross microflute 501, microflute 501 is formed by pulse laser (psec) etching, each microflute 501 width are 0.02～0.025mm, and the degree of depth is 0.02～0.025mm, and microflute 501 is roughly " V " type, cell wall angle angle is 25o～80o, as shown in Figure 6.
Emery wheel as shown in Figure 5, is the order number of diamond particles and the form of microdefect with the difference among the first embodiment.In this embodiment, diamond particles 303 is 40/50～70/80 order, microdefect is that crisscross microflute 502 combines with the micropore 402 of orthogonal array, micropore 402 and microflute 502 are formed by pulse laser (femtosecond) etching, each microflute 502 width are 0.015～0.018mm, the degree of depth is 0.015～0.018mm, and microflute is roughly " V " type, cell wall angle angle be 10o～80o(as shown in Figure 6), the diameter of micropore 402 and the degree of depth are 0.02～0.025mm, and the spacing that micropore is 402 is 0.05mm.
Grinding wheel dressing pen as shown in Figure 7 and Figure 8, comprises penholder 1, is connected to matrix 2 and the diamond particles 304 of soldering on matrix of pen arm end, and the manufacture method of this grinding wheel dressing pen is as follows:
(1) select common iron as matrix 2, by smooth matrix 2 Surface Machining, make it to become a plane;
(2) use binding agent to be evenly coated with one deck nickel-based brazing alloy powder on matrix 2 surfaces;
(3) use the method for ordered arrangement artificial diamond's stone granulate 304 of complete crystal formation to be evenly distributed on to the surface of matrix 1;
(4) the goods soldering after (1) (2) (3) are handled well.Thereby the diamond particles 304 of complete the crystal formation coplanar or coplanar formation product surface roughly of the end face of matrix 2 dorsad after soldering, this product surface is parallel with matrix surface or approximate parallel;
(5) attrition process is carried out on the diamond composition surface after using diamond lap dish to soldering, and the diamond composition of the flat-top of acquisition can obtain higher flatness, flatness and conforming surperficial flat-top like this.
(6) use pulse laser to carry out controlled lithography at product surface, at the micropore of a series of orthogonal arrays of topside etch of diamond particles 304 and crisscross microflute, form structure as shown in Figure 5;
(7) matrix 2 is arranged on penholder 1, makes product surface form the finishing face contacting with emery wheel.
The above is the preferred embodiment of the present invention, and it does not form limiting the scope of the invention.
Claims (10)
1. a micro-sword grinding product, comprises diamond particles, it is characterized in that: one of them plane of described diamond particles is provided with some recessed microdefects, thereby forms the micro-sword of grinding in this plane.
2. micro-sword grinding product according to claim 1, it is characterized in that: thus some uniform solderings of diamond particles with complete crystal formation form the diamond particles structure of individual layer at matrix surface, the plane that each diamond particles is provided with microdefect matrix and at grade or roughly at grade dorsad, thereby formation product surface, described product surface or almost parallel parallel with matrix surface.
3. micro-sword grinding product according to claim 1 and 2, is characterized in that: described microdefect comprises uniform micropore.
4. micro-sword grinding product according to claim 1 and 2, is characterized in that: described microdefect comprises uniform microflute.
5. micro-sword grinding product according to claim 4, it is characterized in that: described microflute is roughly " V " type, and cell wall angle angle is 10o～80o.
6. micro-sword grinding product according to claim 1 and 2, is characterized in that: described microdefect is the combination of micropore and microflute.
7. a preparation method for the micro-sword grinding product described in any one in claim 1 to 6, is characterized in that: use pulse laser to etch recessed microdefect in a plane of diamond particles, make this plane form micro-sword that grinding is used.
8. preparation method according to claim 7, it is characterized in that: some diamond particles are distributed in then soldering of matrix surface by the mode with ordered arrangement, the plane that makes to need in diamond particles etching microdefect at grade or roughly at grade, thereby form the product surface of flat-top, and product surface is parallel with matrix surface or almost parallel.
9. an emery wheel, is characterized in that: comprise the goods as described in any one in claim 1 to 6, the plane that is provided with microdefect in goods forms grinding face.
10. a grinding wheel dressing pen, is characterized in that: the finishing face contacting with emery wheel is the plane that is provided with microdefect in claim 1 to 6 described in any one in goods.
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| CN201410279777.6A CN104070467B (en) | 2014-06-20 | 2014-06-20 | Micro-sword grinding product and its preparation method and application |
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| CN201410279777.6A CN104070467B (en) | 2014-06-20 | 2014-06-20 | Micro-sword grinding product and its preparation method and application |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378813A (en) * | 2017-09-08 | 2017-11-24 | 广东工业大学 | A kind of emery wheel processing method |
| CN107775193A (en) * | 2017-10-24 | 2018-03-09 | 长沙理工大学 | Method and system for brazing diamond by double-beam laser |
| CN108188945A (en) * | 2018-03-12 | 2018-06-22 | 桂林创源金刚石有限公司 | A kind of thin slice tooth split type skive and production method |
| CN109894989A (en) * | 2019-04-10 | 2019-06-18 | 贵州大学 | New pattern laser structuring diamond abrasive grain polishing pad and its grinding grain structure method |
| CN110561272A (en) * | 2019-10-23 | 2019-12-13 | 无锡市兰天金刚石有限责任公司 | Superhard tool for dressing grinding wheel and preparation method thereof |
| CN110722464A (en) * | 2018-06-13 | 2020-01-24 | 长沙理工大学 | Ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
| CN111962118A (en) * | 2020-07-09 | 2020-11-20 | 中南大学 | High-performance electroplated diamond tool and preparation method and application thereof |
| CN113618648A (en) * | 2021-08-18 | 2021-11-09 | 全立传感科技(南京)有限公司 | Preparation method of regular fine diamond particle grinding tool |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87105216A (en) * | 1986-07-30 | 1988-03-23 | 厄恩斯特·温特和索恩有限公司 | Method for processing diamond particles |
| US5997382A (en) * | 1997-01-23 | 1999-12-07 | Toyota Jidosha Kabushiki Kaisha | Method of processing sealing surface of casting and grindstone suitable for use therein |
| US6818029B2 (en) * | 1999-10-12 | 2004-11-16 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
| CN1193863C (en) * | 1999-10-12 | 2005-03-23 | 杭纳科技股份有限公司 | Conditioner for polishing pad and method for manufacturing the same |
| JP2008006507A (en) * | 2006-06-26 | 2008-01-17 | Ebara Corp | Diamond polishing tool, method for preparing diamond polishing tool and method for reproducing diamond polishing tool |
| CN101274423A (en) * | 2007-03-30 | 2008-10-01 | 张小军 | Improved structure of brazing diamond tool |
| CN102470463A (en) * | 2009-07-31 | 2012-05-23 | 戴蒙得创新股份有限公司 | Precision wire including surface modified abrasive particles |
-
2014
- 2014-06-20 CN CN201410279777.6A patent/CN104070467B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87105216A (en) * | 1986-07-30 | 1988-03-23 | 厄恩斯特·温特和索恩有限公司 | Method for processing diamond particles |
| US5997382A (en) * | 1997-01-23 | 1999-12-07 | Toyota Jidosha Kabushiki Kaisha | Method of processing sealing surface of casting and grindstone suitable for use therein |
| US6818029B2 (en) * | 1999-10-12 | 2004-11-16 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
| CN1193863C (en) * | 1999-10-12 | 2005-03-23 | 杭纳科技股份有限公司 | Conditioner for polishing pad and method for manufacturing the same |
| JP2008006507A (en) * | 2006-06-26 | 2008-01-17 | Ebara Corp | Diamond polishing tool, method for preparing diamond polishing tool and method for reproducing diamond polishing tool |
| CN101274423A (en) * | 2007-03-30 | 2008-10-01 | 张小军 | Improved structure of brazing diamond tool |
| CN102470463A (en) * | 2009-07-31 | 2012-05-23 | 戴蒙得创新股份有限公司 | Precision wire including surface modified abrasive particles |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378813A (en) * | 2017-09-08 | 2017-11-24 | 广东工业大学 | A kind of emery wheel processing method |
| CN107775193A (en) * | 2017-10-24 | 2018-03-09 | 长沙理工大学 | Method and system for brazing diamond by double-beam laser |
| CN107775193B (en) * | 2017-10-24 | 2019-07-19 | 长沙理工大学 | Method and system for brazing diamond by double-beam laser |
| CN108188945A (en) * | 2018-03-12 | 2018-06-22 | 桂林创源金刚石有限公司 | A kind of thin slice tooth split type skive and production method |
| CN108188945B (en) * | 2018-03-12 | 2023-08-01 | 桂林创源金刚石有限公司 | Slice tooth split type diamond grinding wheel and manufacturing method |
| CN110722464A (en) * | 2018-06-13 | 2020-01-24 | 长沙理工大学 | Ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
| CN110722464B (en) * | 2018-06-13 | 2022-01-18 | 长沙理工大学 | Manufacturing process of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
| CN109894989A (en) * | 2019-04-10 | 2019-06-18 | 贵州大学 | New pattern laser structuring diamond abrasive grain polishing pad and its grinding grain structure method |
| CN110561272A (en) * | 2019-10-23 | 2019-12-13 | 无锡市兰天金刚石有限责任公司 | Superhard tool for dressing grinding wheel and preparation method thereof |
| CN111962118A (en) * | 2020-07-09 | 2020-11-20 | 中南大学 | High-performance electroplated diamond tool and preparation method and application thereof |
| CN111962118B (en) * | 2020-07-09 | 2023-02-17 | 中南大学 | High-performance electroplated diamond tool and preparation method and application thereof |
| CN113618648A (en) * | 2021-08-18 | 2021-11-09 | 全立传感科技(南京)有限公司 | Preparation method of regular fine diamond particle grinding tool |
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