CN206200777U - A kind of skive - Google Patents
A kind of skive Download PDFInfo
- Publication number
- CN206200777U CN206200777U CN201621155930.5U CN201621155930U CN206200777U CN 206200777 U CN206200777 U CN 206200777U CN 201621155930 U CN201621155930 U CN 201621155930U CN 206200777 U CN206200777 U CN 206200777U
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- Prior art keywords
- location hole
- grinding
- abrasive
- sandwich
- annular sheet
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Abstract
The utility model discloses a kind of arrangement of abrasive particle multilayer order and bond strength is high, a kind of skive for being easily repaired after abrasion, it includes grinding wheel base body, the abrasive material on grinding wheel base body, and abrasive material is successively sintered and formed by " sandwich " structure；" sandwich " structure includes 2 annular sheet metals, the location hole of regular array is offered on annular sheet metal, offered between the gap in adjacent positioned hole on the annular sheet metal and put powder hole, be located between two annular sheet metals at corresponding location hole and be folded with diamond abrasive grain；Particle diameter of the aperture of location hole less than diamond abrasive grain；The utility model is sintered using " sandwich " structure, and ensures that diamond abrasive grain height of protrusion is consistent, realizes the ordered arrangement of diamond abrasive grain, bigger chip space can be provided during grinding, reduce grinding force, reduce grinding temperature, grinding efficiency is improved, improves grinding surface quality；It is continuing with after can " successively " being repaired after abrasion, finishing is convenient, long service life.
Description
Technical field
The utility model is related to a kind of grinding materials and grinding tool, concretely relates to a kind of skive.
Background technology
With diamond abrasive as raw material, make bonding agent with metal powder, resin-oatmeal, ceramics and plating metal respectively, be made
There is the circular bonded abrasive tool referred to as skive of through hole in center.(hardness is high, resistance to compression for the characteristic having by diamond abrasive
Intensity is high, wearability is good), diamond abrasive tool is turned into the preferable work of grinding hard brittle material and hard alloy in grinding
Have, not only efficiency high, high precision, and roughness is good, grinding tool is consumed less, long service life, while can also improve working conditions.
Therefore metal and hard brittle materia that bonded abrasive products are difficult to the low iron content of processing, such as hard alloy, high alumina are widely used in
Porcelain, optical glass, agate jewel, semi-conducting material, stone material etc..
Superhard abrasive material grinding tool（Diamond, cubic boron nitride abrasive wheel etc.）Due to good characteristics such as its high rigidity, high-wearing features,
The fields such as high efficient grinding and accurate grinding in hard brittle materials such as engineering ceramics, hard alloy have incomparable advantage, should
With extremely extensive.Traditional skive can be divided into by production technology：Sintered type skive (resin bonding agent diamond sand
Wheel；Technique of Vitrified Diamond Wheels；Metal anchoring agent diamond wheel)；Plated diamond grinding wheel；Soldering skive.
Super-abrasive grinding wheel its abrasive particle shape for being prepared with the technique such as plating, position, distribution are sintered using conventional thermocompression close
Degree and abrasive particle projecting height etc. all have very big randomness, and wheel face diverse location Effective grains' number, single abrasive particle bear to carry
Lotus, chip flow direction etc. all exist greatly uncertain.It is additionally, since bond strength between bonding agent and abrasive particle relatively low, ties
Mixture is smaller to the hold of abrasive particle, and so as to cause that grinding force is big, grinding temperature is too high, in grinding process, abrasive particle is easy to fall off, mill
Grain low a series of problems of effective rate of utilization, has a strong impact on the surface quality and wheel grinding efficiency of workpiece.
A large amount of theoretical and experimental studies show that making the arrangement of abrasive particle in emery wheel manufacturing process has certain order, can
To provide bigger chip space in grinding, reduce grinding force, reduce grinding temperature, improve grinding efficiency, effectively change
Kind grinding surface quality.
Since the early 1990s in last century, external and China's Taiwan priority researching high-temperature soldering prepares novel adamantine
The new technology of lapicide's tool, the enhanced primary treatment on bonding agent and abrasive particle interface is realized using high temperature brazing technique, while realizing
The ordered arrangement of single layer of abrasive particles.For example, the invention disclosed patent on the 15th of September in 2004 " has the single layer soldering gold of optimization landforms
The process of hard rock concretion abrasive instrument（Publication number：CN 1528565A）" disclose a kind of individual layer pricker with optimization landforms
The preparation method for welding diamond concretion abrasive instrument, high holding intensity and the abrasive material of combining that the invention has that soldering provides simultaneously
Preferentially arrange offer optimal landforms double dominant, shown in the efficient heavy load processing of fragility difficult-to-machine material high hard
Excellent processing characteristics.And for example, invention disclosed patent " a kind of making of Furnace Brazing of Diamond Grinding Wheel With Ni of on May 14th, 2014
Method（Publication number：CN 103786100A）" a kind of preparation method of Furnace Brazing of Diamond Grinding Wheel With Ni is also disclosed that, made
With long lifespan, the skive with preferably grinding and cutting power.
However, due to the limitation of soldering processes feature, can only typically prepare the soldering boart boart with single layer of abrasive particles
Wheel, cannot be continuing with after causing abrasion of grinding wheel by finishing, and emery wheel service life is extremely limited.Additionally, brazing process is real
Existing metallic bond and the metallurgical binding of diamond abrasive grain, generally require persistently to be placed in emery wheel under hot environment, so as to cause
Diamond abrasive grain produces graphitization and fire damage.
Laser processing technology is to project workpiece surface using laser beam to be processed, not directly contact processing work
Part, it is to avoid the mechanically deform that machining is caused to workpiece to be machined, improves machining accuracy, realize conventional mechanical processing with
Before can not or be difficult complete processing technology.Optical focus mirror can be added when being laser machined to be focused laser beam,
Reduce the facula area that laser beam is projected on workpiece to be machined surface, can further improve machining accuracy and processing matter
Amount.Processing object is cut using the laser beam of high-energy-density, is punched, processing efficiency is conventional mechanical process technology
Several times of processing efficiency times even hundreds of times.
Increasing material manufacturing (Additive Manufacturing, AM) technology is that the method gradually added up using material manufactures real
The technology of body part, is the manufacture method of a kind of " from bottom to top " relative to traditional material removal-Machining Technology for Cutting.Swash
Light increases material manufacturing technology is, using the high-energy-density of laser beam, powder to be heated and is melted and molded, and is swashed by computer controls
Light increasing material manufacturing device is realized successively sintering by specified path, so as to realize gradually adding up for material, manufactures entity component.Part
Forming Theory for high power laser light by focusing on after one less hot spot of formation act on matrix and form on matrix one
Individual less molten bath, while be transported in molten bath after powder transfer system collects metal dust by nozzle, powder through fusing,
A metal dots for densification are formed after solidification.Moved on part with laser, gradually form line and face, finally by the cumulative of face
Form 3-dimensional metal part.
Laser truing and dressing is that laser beam focus are acted on boart boart wheel surface into minimum hot spot using optical system,
The metallic bond material of emery wheel local surfaces is set to be removed in the form of evaporating gasification and melting sputtering within the extremely short time,
By controlling laser processing parameter, it is selectively removed and combines agent material, without damaging super-hard abrasive, protrudes abrasive particle,
Wheel face forms chip space, so as to reach the purpose of finishing.When using Dressing of Diamond Grinding Wheels by Nd: YAG Lasers, if laser power is close
Degree is sufficiently high, can simultaneously remove skive table and diamond abrasive grain and combine agent material, reach the mesh of shaping emery wheel
's；The opposing party and, diamond abrasive with combine agent material optics and thermophysical property differ larger, using laser controllability
Good the characteristics of, by Reasonable adjustment laser processing parameter, the combination agent material of wheel face can be optionally removed, make Buddha's warrior attendant
Stone mill grain has certain height of protrusion, reaches the purpose of dressing emery wheel.
The content of the invention
The purpose of this utility model is to provide a kind of arrangement of abrasive particle multilayer order and bond strength is high, be easily repaired after abrasion
A kind of skive.
The utility model is adopted the following technical scheme that realizes its goal of the invention, a kind of skive, and it includes sand
Wheel matrix, the abrasive material on grinding wheel base body, described abrasive material are successively sintered and formed by " sandwich " structure；Described
" sandwich " structure includes 2 annular sheet metals, the location hole of regular array is offered on annular sheet metal, in annular sheet metal
Offered between the gap in upper adjacent positioned hole and put powder hole, be located between two annular sheet metals at corresponding location hole and be folded with gold
Hard rock abrasive particle；The aperture of described location hole is slightly less than the particle diameter of diamond abrasive grain, the geometry point for limiting diamond abrasive grain
Cloth.
Diamond abrasive grain described in the utility model is that granularity is 40 mesh（0.42 ㎜~0.45 ㎜）Rescinded angle it is octahedra single
Diamond.
The utility model is used for convenience, the superiors of the abrasive material of described grinding wheel base body（Working face）Buddha's warrior attendant stone mill
Grain place is in the same plane and height of protrusion is consistent, and height of protrusion is 50 ﹪~60 ﹪ of height of grain.
In order to sinter more firmly, the described aperture for putting powder hole is more than the aperture of location hole to the utility model.
The utility model for bonded-abrasive, be easy to sintering, the thickness of described annular sheet metal is the ﹪ of Abrasive Particle Size 35
~45 ﹪；Described location hole a diameter of ﹪~85 ﹪ of Abrasive Particle Size 75, the 3 of the described a diameter of location hole aperture for putting powder hole
~5 times.
In order to increase the service life, described abrasive material includes 10 layers~15 layers to the utility model（It is preferred that 10 layers）" Sanming City
Control " structure.
Due to using above-mentioned technical proposal, the utility model preferably realizes goal of the invention, and it uses " sandwich " to tie
Structure is sintered, and ensures that the height of protrusion of diamond abrasive grain is consistent substantially, realizes the regular of diamond abrasive grain
Arrangement, can provide bigger chip space when being ground, reduce grinding force, reduce grinding temperature, improve grinding efficiency, effectively
Improve grinding surface quality；It is continuing with after can " successively " being repaired after abrasion, finishing is convenient, emery wheel long service life.Can be extensive
It is applied to the efficient of hard brittle material, accurate grinding processing.
Brief description of the drawings
Fig. 1 is the structural representation of skive in the utility model；
Fig. 2 is the structural representation of the utility model medium plain emery wheel matrix 1；
Fig. 3 is the structure enlarged diagram of the abrasive material 2 of skive in the utility model；
The structural representation of annular sheet metal 7 in Fig. 4 the utility model；
Fig. 5 is the structure enlarged diagram at A in Fig. 4；
Fig. 6 is the structure enlarged diagram of " sandwich " structure before sintering in the utility model.
In figure：1st, grinding wheel base body；2nd, abrasive material；3rd, " sandwich " structure sinter layer；4th, diamond abrasive grain；5th, coaxial powder-feeding
Formula nozzle；6th, laser beam；7th, annular sheet metal；8th, metallic bond sinter layer；71st, location hole；72nd, powder hole is put.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment the utility model is described in further detail.
Embodiment 1：
From Fig. 1~Fig. 6, a kind of skive, it includes grinding wheel base body 1, the abrasive material on grinding wheel base body 1
2, described abrasive material 2 is successively sintered and formed by " sandwich " structure；Described " sandwich " structure includes 2 endless metals
Piece 7, offers the location hole 71 of regular array on annular sheet metal 7, on annular sheet metal 7 gap in adjacent positioned hole 71 it
Between offer and put powder hole 72, be located between two annular sheet metals 7 at corresponding location hole 71 and be folded with diamond abrasive grain 4；It is described
The aperture of location hole 71 be slightly less than the particle diameter of diamond abrasive grain 4, the geometry for limiting diamond abrasive grain 4 is distributed.
Diamond abrasive grain described in the utility model 4 is that granularity is 40 mesh（0.42 ㎜~0.45 ㎜）Rescinded angle it is octahedra single
Diamond（The particle diameter of the present embodiment diamond abrasive grain 4 is 0.44 ㎜）.
The utility model is used for convenience, the superiors of the abrasive material 2 of described grinding wheel base body 1（Working face）Diamond
At abrasive particle 4 in the same plane and height of protrusion is consistent, height of protrusion is 50 ﹪~60 ﹪ of height of grain（The present embodiment is
50 ﹪）.
In order to sinter more firmly, the described aperture for putting powder hole 72 is more than the aperture of location hole 71 to the utility model.
The utility model for bonded-abrasive, be easy to sintering, the thickness of described annular sheet metal 7 is the ﹪ of Abrasive Particle Size 35
~45 ﹪（The present embodiment thickness is 0.2 ㎜, is 45 ﹪ of Abrasive Particle Size）；The a diameter of ﹪ of Abrasive Particle Size 75 of described location hole 71~
85 ﹪（A diameter of 0.38 ㎜ of the present embodiment location hole 71, is 85 ﹪ of Abrasive Particle Size）, described puts a diameter of fixed of powder hole 72
3~5 times of the position aperture of hole 71（The present embodiment puts a diameter of 1.6 ㎜ in powder hole 72, is 4.2 times of the aperture of location hole 71）.
In order to increase the service life, described abrasive material 2 includes 10 layers~15 layers " sandwich " structure to the utility model
（The present embodiment is 11 layers）.
This hair utility model is constituted using the laser optical path combination of coaxial powder-feeding formula nozzle 5 and laser；LASER Light Source is adopted
Laser beam 6 is sent with continuous type optical fiber laser.Metallic bond powder is melted using laser gain material manufacture process technology
Change sintering.
When the working face of skive（The superiors）The abrasion of diamond abrasive grain 4 when cannot use, using laser reconditioning
Method removes the worn-out diamond abrasive grain 4 and metallic bond sinter layer 8 of the superiors, while ensureing new working face most top layer
Diamond abrasive grain 4 height of protrusion, can then put back into.
Embodiment 2：
Diamond abrasive grain 4 is that the particle diameter of granularity is 0.42 ㎜ in the present embodiment；The superiors' diamond abrasive grain 4 of abrasive material 2
Height of protrusion for height of grain 55 ﹪；The thickness of annular sheet metal 7 is the ﹪ of Abrasive Particle Size 35；The a diameter of abrasive particle of location hole 71
The ﹪ of particle diameter 75；Put the aperture of a diameter of location hole 71 in powder hole 72 3 times；Abrasive material 2 includes 10 layers of " sandwich " structure.
Remaining same embodiment 1.
Embodiment 3：
Diamond abrasive grain 4 is that the particle diameter of granularity is 0.45 ㎜ in the present embodiment；The superiors' diamond abrasive grain 4 of abrasive material 2
Height of protrusion for height of grain 60 ﹪；The thickness of annular sheet metal 7 is the ﹪ of Abrasive Particle Size 40；The a diameter of abrasive particle of location hole 71
The ﹪ of particle diameter 80；Put the aperture of a diameter of location hole 71 in powder hole 72 5 times；Abrasive material 2 includes 15 layers of " sandwich " structure.
Remaining same embodiment 1.
Claims (7)
1. a kind of skive, it includes grinding wheel base body, the abrasive material on grinding wheel base body, it is characterized in that described abrasive material
Layer is successively sintered and formed by " sandwich " structure；Described " sandwich " structure includes 2 annular sheet metals, annular sheet metal
On offer the location hole of regular array, offered between the gap in adjacent positioned hole on the annular sheet metal and put powder hole, two rings
It is located between shape sheet metal at corresponding location hole and is folded with diamond abrasive grain；The aperture of described location hole is less than Buddha's warrior attendant stone mill
The particle diameter of grain.
2. a kind of skive according to claim 1, it is characterized in that the abrasive material of described grinding wheel base body is most gone up
At layer diamond abrasive grain in the same plane and height of protrusion is consistent, height of protrusion is 50 ﹪~60 ﹪ of height of grain.
3. a kind of skive according to claim 1, it is characterized in that the described aperture for putting powder hole is more than location hole
Aperture.
4. a kind of skive according to claim 2, it is characterized in that the described aperture for putting powder hole is more than location hole
Aperture.
5. a kind of skive according to claim 1 or 2 or 3 or 4, it is characterized in that the thickness of described annular sheet metal
It is ﹪~45 ﹪ of Abrasive Particle Size 35 to spend；A diameter of ﹪~85 ﹪ of Abrasive Particle Size 75 of described location hole, described puts the straight of powder hole
Footpath is 3~5 times of location hole aperture.
6. a kind of skive according to claim 1 or 2 or 3 or 4, it is characterized in that described abrasive material includes 10 layers
~15 layers of " sandwich " structure.
7. a kind of skive according to claim 5, it is characterized in that described abrasive material includes 10 layers~15 layers
" sandwich " structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621155930.5U CN206200777U (en) | 2016-10-31 | 2016-10-31 | A kind of skive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621155930.5U CN206200777U (en) | 2016-10-31 | 2016-10-31 | A kind of skive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206200777U true CN206200777U (en) | 2017-05-31 |
Family
ID=58756741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621155930.5U Withdrawn - After Issue CN206200777U (en) | 2016-10-31 | 2016-10-31 | A kind of skive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206200777U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312843A (en) * | 2016-10-31 | 2017-01-11 | 湖南城市学院 | Diamond grinding wheel and production method thereof |
| CN115026730A (en) * | 2022-07-11 | 2022-09-09 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
| EP4169666A1 (en) * | 2021-10-21 | 2023-04-26 | Jakob Lach GmbH & Co. KG | Use of a grinding tool, grinding tool and method for producing same |
| WO2023076960A1 (en) * | 2021-10-26 | 2023-05-04 | Baker Hughes Oilfield Operations Llc | Methods of making a cutting element for an earth-boring tool, methods of reprocessing cutting elements, and associated cutting elements |
-
2016
- 2016-10-31 CN CN201621155930.5U patent/CN206200777U/en not_active Withdrawn - After Issue
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312843A (en) * | 2016-10-31 | 2017-01-11 | 湖南城市学院 | Diamond grinding wheel and production method thereof |
| EP4169666A1 (en) * | 2021-10-21 | 2023-04-26 | Jakob Lach GmbH & Co. KG | Use of a grinding tool, grinding tool and method for producing same |
| WO2023076960A1 (en) * | 2021-10-26 | 2023-05-04 | Baker Hughes Oilfield Operations Llc | Methods of making a cutting element for an earth-boring tool, methods of reprocessing cutting elements, and associated cutting elements |
| CN115026730A (en) * | 2022-07-11 | 2022-09-09 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
| CN115026730B (en) * | 2022-07-11 | 2024-03-01 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170531 Effective date of abandoning: 20180501 |
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| AV01 | Patent right actively abandoned |