CN110722464B - Manufacturing process of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle - Google Patents
Manufacturing process of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle Download PDFInfo
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- CN110722464B CN110722464B CN201910998021.XA CN201910998021A CN110722464B CN 110722464 B CN110722464 B CN 110722464B CN 201910998021 A CN201910998021 A CN 201910998021A CN 110722464 B CN110722464 B CN 110722464B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/02—Wheels in one piece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with cooling provisions, e.g. with radial slots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/123—Cut-off wheels having different cutting segments
Abstract
The invention discloses a manufacturing process of a PCD grinding wheel with an ordered microgroove structure and capable of machining a positive rake angle, which is characterized in that a layer of polycrystalline diamond film, namely a PCD film, is deposited on the outer circumferential surface of a grinding wheel hub, and a large number of micro grinding units with positive rake angles and microgrooves with high depth-to-width ratios are machined on the outer circumferential surface of the whole PCD film and are arranged in order, wherein the manufacturing method comprises the following steps: a PCD film is deposited on the outer circumferential surface of a grinding wheel hub by hot wire chemical vapor deposition (HFCVD), a micro water-jet guided laser processing technology is adopted to process a large number of high-aspect-ratio microgrooves with the axial length equal to the thickness of the grinding wheel, the circumferential width of only dozens of microns and the depth of hundreds of microns on the outer circumferential surface of the whole PCD film, a large number of micro grinding units with positive rake angles are formed, and the micro grinding units and the microgrooves are arranged in order. The grinding wheel can realize positive rake angle processing, obviously reduce the grinding force ratio, improve the grinding performance, increase the holding force of the grinding wheel on the miniature grinding unit and effectively prolong the service life of the grinding wheel.
Description
Technical Field
The invention relates to a grinding wheel, in particular to a manufacturing process of a PCD grinding wheel with an ordered microgroove structure and capable of machining a positive rake angle.
Background
Grinding is used as a precision machining technology, has the characteristics of high machining precision and good surface quality, and is widely applied to the field of precision machining and manufacturing. However, in the traditional grinding process, the abrasive particles are irregularly arranged on the working surface of the grinding wheel, and the geometric shapes and the sizes of the abrasive particles are inconsistent, so that the situation that the abrasive particles cut the surface of a workpiece with a large negative rake angle often occurs in the grinding process, the grinding force ratio is increased, the grinding energy is converted into the grinding heat energy at an accelerated speed, the grinding temperature is increased, and the quality and the grinding efficiency of the processed surface are affected; meanwhile, the space for containing chips of the grinding wheel is small, the abrasive particles have low cutting degree and are easy to fall off, the grinding wheel is easy to block, local high temperature is generated to damage the surface of a workpiece, and the service life of the grinding wheel can be also reduced.
In order to improve the grinding efficiency and the service life of the grinding wheel, the patent with the publication number of CN107962510A 'a CVD diamond grinding wheel with ordered and micro-structured surface', a layer of diamond film is deposited on the outer circumferential surface of the grinding wheel hub by a chemical vapor deposition method, then a pulse laser beam is adopted to process a large number of grinding units with staggered and orderly arranged microgrooves and waist-shaped top surfaces on the outer circumferential surface of the whole diamond film, the removal rate and the grinding efficiency of processed surface materials are improved, the holding force of the grinding wheel hub on the grinding units is increased, the service life of the grinding wheel is prolonged, but the single grinding unit is still processed with a zero front angle in the grinding process, therefore, the grinding efficiency and the quality of the processed surface cannot be improved better, and meanwhile, the circumferential spacing of the grinding units which are orderly arranged in the grinding process is up to 1mm, which belongs to typical intermittent grinding, so that the generated periodic vibration also influences the integrity of the processed surface.
In order to improve the integrity of the machined surface and realize positive rake angle grinding machining, a patent with publication number CN105728961A, "a method for manufacturing a novel positive rake angle diamond grinding tool based on pulse laser machining", proposes a method for laser machining the positive rake angle of diamond abrasive particles. The single-layer large-particle diamond abrasive particles which are orderly arranged on the working surface of the grinding wheel are ablated by adopting a laser processing technology, so that the vertex angle of the diamond abrasive particles is smaller than 90 degrees, the grinding process is changed into positive rake angle grinding, the problem that the surface of a workpiece is cut by the traditional diamond abrasive particles with a large negative rake angle is effectively solved, the processing efficiency is improved, the damage to the processed surface is reduced, and the integrity of the processed surface is improved. However, in the process of laser processing of the large-particle diamond abrasive particles, due to the fact that the laser ablation temperature is too high, the large-particle diamond abrasive particles are partially graphitized inevitably, so that the abrasive particles are influenced to cut the surface of a workpiece at a positive rake angle, the quality of the processed surface is reduced, and meanwhile, once the stress of a single large-particle diamond abrasive particle is too large or concentrated, the whole large-particle diamond abrasive particle may fall off, the grinding efficiency is influenced, and even the service life of the grinding wheel is shortened.
In order to further improve the quality of a machined surface and improve the grinding efficiency, the patent of publication No. CN107243848A entitled "helical orderly-arranged fiber cutter capable of machining a positive rake angle and a preparation method thereof" prepares a matrix on a grinding wheel hub by pressing and sintering, machines orderly-arranged small holes on the matrix by adopting a drill bit, and then consolidates fibers of the positive rake angle in the small holes by epoxy resin, thereby realizing the cutting machining of the positive rake angle, further improving the quality of the machined surface and improving the machining precision; however, since the cross-sectional size of the fiber is as high as 0.8mm × 0.8mm, and the number of fibers per square centimeter on the surface of the tool is only 14.26, the cutting depth of the single fiber is very large, which makes it difficult to ensure the machining precision, and the single fiber is inevitably broken once the stress is too large or concentrated, which affects the service life of the grinding wheel, and the difficulty of the preparation process of inserting all the fibers into the pores one by one and consolidating the fibers is also not negligible.
Disclosure of Invention
In order to solve the problems of the grinding wheel and the prior art, the invention provides the PCD grinding wheel with the ordered micro-groove structure, which can be used for machining a positive rake angle. The diamond grinding wheel prepared by the method is characterized in that a layer of polycrystalline diamond film, namely a PCD film, is deposited on the outer circumferential surface of a grinding wheel hub, microgrooves with the axial length equal to the thickness of the grinding wheel, the circumferential width of only dozens of micrometers, the depth of hundreds of micrometers and the depth-to-width ratio of dozens of micrometers are processed on the outer circumferential surface of the PCD film, a micro grinding unit with a positive rake angle is arranged between every two adjacent microgrooves, the microgrooves and the micro grinding unit are arranged in order, and the microgrooves and the micro grinding unit are connected into a whole by the PCD film, so that the holding force of the grinding wheel on the micro grinding unit can be greatly improved, the micro grinding unit is prevented from falling off singly due to overlarge stress or concentrated stress, and the service life of the grinding wheel is prolonged; meanwhile, the micro grinding units with positive rake angles and the micro grooves with high depth-to-width ratios are arranged in order on the working surface of the grinding wheel, so that the grinding force ratio can be reduced, the chip removal capacity is increased, the chip containing space is increased, the grinding fluid is promoted to effectively enter a grinding area, the cooling effect of the grinding area is remarkably improved, the surface thermal damage is reduced, and the grinding quality is effectively improved.
In order to achieve the purpose, the invention adopts the technical scheme that: and (4) manufacturing the grinding wheel hub by adopting a machining method. Depositing a layer of polycrystalline diamond film (PCD film) with the thickness of 1-2 mm on the outer circumferential surface of the hub by a hot wire chemical vapor deposition (HFCVD) method, and then polishing the outer circumferential surface of the diamond film by an ion beam polishing technology to ensure that the surface roughness of the diamond film reaches 0.15-0.2 mu m; processing the outer circumferential surface of the PCD film by adopting a micro-water-jet guided laser processing technology, focusing a laser beam emitted by a laser head in a nozzle through a glass window above a water cavity, and leading a water jet to be emitted from the nozzle and guide the laser beam to be transmitted to the outer circumferential surface of the PCD film by the pressure of the water cavity; the grinding wheel is offset by a certain angle, and a single microgroove with the axial length equal to the thickness of the grinding wheel, the circumferential width of only dozens of micrometers, the depth of hundreds of micrometers and the depth-to-width ratio of dozens is processed by changing the relative motion track of the water jet and the hub; indexing the grinding wheel, enabling the outer circumference of the PCD membrane to rotate by the circumferential width of one micro grinding unit, and processing the next micro groove, wherein the micro grinding unit with a positive rake angle is formed between the two micro grooves; then processing the micro grinding unit and forming a back angle; repeating the steps until a large number of microgrooves with high depth-to-width ratios are processed on the outer circumferential surface of the whole PCD membrane, a large number of micro grinding units with positive rake angles and arranged in order are formed, and all the micro grinding units are guaranteed to have the same geometric size; and carrying out acid washing treatment on the prepared grinding wheel, and then putting the grinding wheel into deionized water to carry out ultrasonic cleaning to form the ordered micro-groove structure PCD grinding wheel capable of machining the front corner.
The hub is made of titanium alloy, the diameter of the hub is phi 100-200 mm, and the thickness of the hub is 6-20 mm.
The axial length of each micro groove is equal to the thickness of the grinding wheel, the circumferential width is only 20-50 micrometers, the depth is 500-800 micrometers, and the depth-to-width ratio is 10-40.
The axial length of each micro grinding unit is equal to the thickness of the grinding wheel, the circumferential width is 80-150 micrometers, the radial height is 500-800 micrometers, and the circumferential distance is only 100-200 micrometers.
The offsetting of the grinding wheel by a certain angle in the third step means that the micro grinding unit formed after the PCD film is processed by the laser beam has a positive rake angle of 10 to 40 degrees and a back angle of 20 to 50 degrees.
The laser device in the micro-water-jet guided laser processing technology is ND YAG pulse laser, the laser wavelength is 532nm, and the focal spot diameter is phi 30-100 mu m.
In the micro water-jet guided laser processing technology, the pressure of a water cavity is 2-4 MPa, and the diameter of a water jet is phi 20-50 mu m.
Compared with the prior art, the invention has the following beneficial effects.
The grinding performance and the grinding efficiency are greatly improved. The outer circumferential working surface of the grinding wheel is provided with a large number of micro grinding units with positive rake angles, so that the micro grinding units are machined with the positive rake angles in the machining process of the grinding wheel, the grinding force ratio and the grinding temperature are reduced, the generation of surface damage is effectively reduced, and the grinding performance and the grinding efficiency are greatly improved.
The chip containing space and the chip removal capacity are obviously increased. A large number of microgrooves with high depth-to-width ratios are arranged on the outer circumferential working surface of the grinding wheel, so that the chip containing space of the grinding wheel is greatly improved; meanwhile, the miniature grinding units are arranged in order, so that an ordered chip removal path is formed in the grinding process of the grinding wheel, the chip removal capacity is greatly enhanced, the grinding wheel is not easy to block, grinding fluid can be effectively promoted to enter a grinding area, the cooling effect of the grinding area is obviously improved, the surface thermal damage of a workpiece is reduced, and the grinding quality is further improved.
And the graphitization of the miniature grinding unit is effectively prevented, and the service life of the grinding wheel is greatly prolonged. When the micro grinding unit is machined by adopting a micro water-jet guided laser machining technology, a laser beam is focused in the nozzle through a glass window above the water cavity, the water cavity is pressed to enable a water jet to be emitted from the nozzle and guide the laser beam, and the laser beam is transmitted along the water jet in a total reflection mode in the water jet. In the machining process, laser is guided to the surface of the PCD film by water jet, the PCD film is ablated by the laser, the ablated PCD film is taken away by water flow, and meanwhile, the water flow cools the surface of the PCD film, so that graphitization of the micro grinding unit is effectively prevented, the micro grinding unit can better grind workpiece materials, and the quality of the machined surface is greatly improved.
And fourthly, the service life of the grinding wheel is obviously prolonged. The PCD film on the outer circumferential surface of the grinding wheel prepared by adopting a hot wire chemical vapor deposition method, namely an HFCVD technology, is a whole, and each micro grinding unit is a part of the PCD film, so that the holding force of the grinding wheel on the micro grinding units is greatly improved, the micro grinding units are prevented from falling off singly due to overlarge stress or concentrated stress, and the service life of the grinding wheel is remarkably prolonged.
Increase the effective number of grinding edges in the grinding process and reduce the periodic vibration in the grinding process. The circumferential width of the microgrooves obtained by processing through the micro water-guided laser processing technology is only 20 micrometers, the circumferential spacing of the micro grinding units is only 100 micrometers, the number of the micro grinding units participating in grinding in a unit area in the grinding process is remarkably increased, and periodic vibration in the grinding process is greatly reduced; the micro grinding units processed by the method have the characteristics of high edge emergence degree and good consistency, and the grinding edge of each micro grinding unit can participate in grinding, so that the effective grinding edge number in the grinding process is greatly increased, the cutting depth of a single grinding edge is reduced, and the grinding precision and the grinding efficiency are effectively improved.
Sixthly, the preparation process is simple and the manufacturing cost is low. The size and the shape of the miniature grinding unit on the outer circumferential surface of the grinding wheel have good periodicity, so that the relative motion relationship between the miniature water-guide laser processing equipment and the grinding wheel to be processed can be controlled by adopting a numerical control technology in the preparation process, the preparation difficulty of the grinding wheel is greatly reduced, and the manufacturing cost is obviously reduced.
Drawings
Fig. 1 is a perspective view of the outer circumferential surface of the grinding wheel hub after a polycrystalline diamond film is deposited.
FIG. 2 is a schematic view of micro-grooves machined by micro-water guided laser machining.
FIG. 3 is a schematic view of the outer circumferential surface of the grinding wheel with microgrooves and a partial enlarged view thereof.
Fig. 4 is a schematic view of a grinding wheel machining a workpiece and a partially enlarged view of a contact area thereof with the workpiece.
The labels in the above fig. 1 to 4 are: 1. hub, 2, PCD film, 3, laser head, 4, glass window, 5, water cavity, 6, nozzle, 7, laser beam, 8, water jet, 9, micro grinding unit, 10, micro groove, 11, positive rake angle, 12, workpiece, 13, relief angle.
Detailed Description
The following further describes the embodiments of the present invention with reference to the drawings.
Referring to fig. 1 to 4, the PCD grinding wheel with the ordered micro-groove structure capable of positive rake angle machining is characterized in that: the grinding wheel consists of a hub 1, a PCD membrane 2, a large number of miniature grinding units 9 with positive rake angles 11 and microgrooves 10 with high depth-to-width ratios; a PCD film 2 with the thickness of 1-2 mm is deposited on the outer circumferential surface of the hub 1; the outer circumferential surface of the PCD membrane 2 is processed with a large number of microgrooves 10 which have the axial length equal to the thickness of the grinding wheel, the circumferential width of dozens of micrometers, the depth of hundreds of micrometers and the depth-to-width ratio of dozens, a micro grinding unit 9 with a positive front angle 11 is arranged between two adjacent microgrooves 10, and the microgrooves 10 and the micro grinding units 9 are arranged in order; when the grinding wheel grinds the workpiece 12, the micro grinding unit 9 is in contact with the workpiece 12 at a positive front angle 11, so that the micro grinding unit 9 can machine at the positive front angle 11, and the micro grooves 10 mainly play roles in accommodating chips and storing liquid. The micro grinding unit 9 with the positive rake angle 11 is processed with the positive rake angle in the processing process, so that the grinding force ratio and the grinding temperature are reduced, the generation of surface processing damage is effectively reduced, and the cutting performance and the grinding efficiency are greatly improved.
The preparation method of the ordered micro-groove structure PCD grinding wheel capable of machining the positive rake angle comprises the following steps:
the method comprises the following steps: the method comprises the steps of manufacturing a hub 1 which is made of titanium alloy, has the diameter of phi 100mm and the thickness of 12mm by adopting a machining method, depositing a polycrystalline diamond film, namely a PCD film 2, with the thickness of 2mm on the outer circumferential surface of the titanium alloy hub 1 by a hot wire chemical vapor deposition method, namely HFCVD technology, and then grinding and polishing the outer circumferential surface of the PCD film 2 by adopting an ion beam grinding and polishing technology, wherein the surface roughness of the PCD film 2 reaches 0.2 mu m. The PCD film 2 prepared in the way is a whole, can be better combined with a grinding wheel hub, bears larger grinding force and is less prone to peeling off, so that the service life of the grinding wheel is prolonged.
Step two: the outer circumferential surface of the PCD membrane 2 is processed by adopting a micro-water-jet guided laser processing technology, a laser head 3 emits a laser beam 7 and focuses the laser beam on a nozzle 6 through a glass window 4 above a water cavity 5, and the water cavity 5 is pressurized to enable a water jet 8 to be emitted from the nozzle 6 and guide the laser beam 7 to be transmitted to the outer circumferential surface of the PCD membrane 2; offsetting the grinding wheel by a certain angle, and processing to obtain a single microgroove 10 with the axial length of 12mm, the thickness of the grinding wheel equal to that of the grinding wheel, the circumferential width of 20 microns, the depth of 500 microns and the depth-to-width ratio of 25 by changing the relative motion of the water jet 8 and the grinding wheel hub 1; after the processing is finished, indexing the grinding wheel, enabling the outer circumference of the PCD membrane 2 to rotate by 100 micrometers, namely the circumferential width of one micro grinding unit 9, and processing the next micro groove 10, wherein a micro grinding unit 9 with a positive rake angle 11 of 30 degrees is formed between the two micro grooves 10; then, the micro grinding unit 9 is processed to form a back angle 13 of 40 degrees; the micro grinding unit 9 can cut a workpiece with a positive rake angle in the grinding process, can reduce the grinding force ratio and the grinding temperature, effectively reduces the generation of surface microcracks, and greatly improves the cutting performance and the grinding efficiency; meanwhile, the micro-water-guide laser processing technology can effectively prevent the micro-grinding unit 9 from graphitizing, so that the micro-grinding unit 9 can better cut the processed surface, the service life of the grinding wheel is greatly prolonged, and the quality of the processed surface is improved.
Step three: repeating the second step until a large number of microgrooves 10 with high depth-to-width ratio are processed on the outer circumferential surface of the whole PCD membrane 2, a large number of micro grinding units 9 which are provided with positive rake angles 11 and are arranged in order are formed, and all the micro grinding units 9 are ensured to have the same geometric size; the microgrooves 10 and the miniature grinding units 9 which are orderly arranged in this way can obviously increase the chip containing space, and enable the grinding wheel to form an ordered chip removal path in the grinding process, thereby greatly enhancing the chip removal capacity, enabling the grinding wheel to be more difficult to block, enabling the grinding fluid to effectively enter a grinding area, obviously improving the cooling effect of the grinding area, reducing the surface thermal damage and greatly improving the grinding quality and the precision of the processed surface; meanwhile, the geometric shapes and the sizes of the micro grinding units are kept consistent, so that the number of the micro grinding units participating in grinding in a unit area in the grinding process is obviously increased, the grinding edge of each micro grinding unit can participate in grinding, the effective grinding edge number in the grinding process is greatly increased, the cutting depth of each grinding edge is reduced, and the grinding precision and the grinding efficiency are effectively improved.
Step four: and carrying out acid washing treatment on the prepared grinding wheel, and putting the grinding wheel into deionized water to carry out ultrasonic cleaning for 15 minutes to form the ordered microgroove structure PCD grinding wheel capable of machining the front rake angle.
The foregoing examples are set forth to illustrate the present invention more clearly and are not to be construed as limiting the scope of the invention, which is defined in the appended claims to which the invention pertains, as will be apparent to those skilled in the art, after reading the present invention.
Claims (1)
1. The utility model provides a but manufacturing process of ordered microgroove structure PCD emery wheel of positive rake angle processing, utilizes the system of processing emery wheel which characterized in that: the processing system comprises a laser head (3), a glass window (4), a water cavity (5), a nozzle (6), a laser beam (7) and a water jet (8), wherein the water cavity (5) comprises a rectangular cross section, and the water cavity (5) is arranged between the laser head (3) and the nozzle (6); the grinding wheel consists of a hub (1), a PCD film (2), a large number of miniature grinding units (9) with positive rake angles (11) and microgrooves (10) with high depth-width ratios; a PCD film (2) with the thickness of 1-2 mm is deposited on the outer circumferential surface of the hub (1); the outer circumferential surface of the PCD membrane (2) is processed with a large number of microgrooves (10) which have the axial length equal to the thickness of the grinding wheel, the circumferential width of only 20 microns, the depth of 500-800 microns and the depth-to-width ratio of 10-40, a micro grinding unit (9) with a positive rake angle (11) is arranged between every two adjacent microgrooves (10), and meanwhile, the microgrooves (10) and the micro grinding units (9) are arranged in order; when the grinding wheel grinds the workpiece (12), the micro grinding unit (9) is in contact with the workpiece (12) in a positive rake angle (11), so that the micro grinding unit (9) can process the positive rake angle (11), and the angle of the positive rake angle (11) is 10-40 degrees; the angle of a back angle (13) formed by the back tool face and the machined surface is 20-50 degrees, and the micro-groove (10) mainly plays a role in accommodating scraps and storing liquid; the axial length of each micro grinding unit (9) is equal to the thickness of the grinding wheel, the circumferential width is 80-150 micrometers, the radial height is 500-800 micrometers, and the circumferential distance is 100 micrometers; the microgrooves (10) and the micro grinding units (9) are connected into a whole by the PCD film (2); depositing the PCD film (2) on the outer circumferential surface of the hub (1) by a hot wire chemical vapor deposition method, and then carrying out polishing treatment on the outer circumferential surface of the PCD film (2) by using an ion beam polishing technology, so that the surface roughness of the PCD film (2) reaches 0.15-0.2 mu m; the outer circumferential surface of the PCD film (2) is processed by adopting a micro-water-jet guided laser processing technology, a laser head (3) emits a laser beam (7) and focuses on a nozzle (6) through a glass window (4) above a water cavity (5), and the water cavity (5) is pressed to enable a water jet (8) to be emitted from the nozzle (6) and guide the laser beam (7) to be transmitted to the outer circumferential surface of the PCD film (2); offsetting the grinding wheel by a certain angle, and machining to obtain a single microgroove (10) by changing the relative motion of the water jet (8) and the grinding wheel hub (1); after the machining is finished, indexing the grinding wheel, enabling the outer circumference of the PCD film (2) to rotate by 100 microns, and machining the next micro groove (10), wherein a micro grinding unit (9) with a positive rake angle of 30 degrees is formed between the two micro grooves (10); then processing the micro grinding unit (9) to form a back angle of 40 degrees; the micro grinding unit (9) can cut a workpiece with a positive rake angle in the grinding process, can reduce the grinding force ratio and the grinding temperature, and effectively reduces the generation of surface microcracks.
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| CN201910998021.XA CN110722464B (en) | 2018-06-13 | 2018-06-13 | Manufacturing process of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
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| CN201810608183.3A CN108747858B (en) | 2018-06-13 | 2018-06-13 | Preparation method of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
| CN201910998021.XA CN110722464B (en) | 2018-06-13 | 2018-06-13 | Manufacturing process of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
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| CN201810608183.3A Division CN108747858B (en) | 2018-06-13 | 2018-06-13 | Preparation method of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
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| CN201810608183.3A Active CN108747858B (en) | 2018-06-13 | 2018-06-13 | Preparation method of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
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| CN110722464B (en) * | 2018-06-13 | 2022-01-18 | 长沙理工大学 | Manufacturing process of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
| CN109570746A (en) * | 2018-12-13 | 2019-04-05 | 郑州元素工具技术有限公司 | A kind of method of laser roughening diamond |
| US20230106068A1 (en) | 2020-03-02 | 2023-04-06 | Conopco, Inc., D/B/A Unilever | An effective anti-acne personal care composition |
| CN111451952B (en) * | 2020-06-15 | 2021-11-05 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method of electroplating grinding wheel with micro-size cold water tank |
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2018
- 2018-06-13 CN CN201910998021.XA patent/CN110722464B/en active Active
- 2018-06-13 CN CN201810608183.3A patent/CN108747858B/en active Active
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2019
- 2019-06-11 WO PCT/CN2019/090698 patent/WO2019238040A1/en active Application Filing
- 2019-11-07 US US16/677,635 patent/US20200070313A1/en not_active Abandoned
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108747858A (en) | 2018-11-06 |
| US20200070313A1 (en) | 2020-03-05 |
| WO2019238040A1 (en) | 2019-12-19 |
| CN110722464A (en) | 2020-01-24 |
| CN108747858B (en) | 2020-04-03 |
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