CN104062857A - Developing method and developing device - Google Patents
Developing method and developing device Download PDFInfo
- Publication number
- CN104062857A CN104062857A CN201410258414.4A CN201410258414A CN104062857A CN 104062857 A CN104062857 A CN 104062857A CN 201410258414 A CN201410258414 A CN 201410258414A CN 104062857 A CN104062857 A CN 104062857A
- Authority
- CN
- China
- Prior art keywords
- substrate
- described substrate
- control
- angle
- multiple nozzles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides a developing method and a developing device. The method comprises the following steps of controlling a base plate to incline for a first angle theta 1 towards a first direction relative to a developing machine table, controlling a plurality of spray nozzles to be on the first plane parallel to the base plate, uniformly spraying developing liquid on the base plate for developing; controlling the base plate to incline for a second angle theta 2 towards a second direction relative to the developing machine table, controlling the plurality of the spray nozzles to be on a second plane parallel to the base plate, and uniformly spraying the developing liquid on the base plate for developing; controlling the base plate to incline for a third angle theta 3 towards a third direction relative to the developing machine table, controlling the plurality of the spray nozzles to be on the third plane parallel to the base plate, uniformly spraying the developing liquid on the base plate for developing; and controlling the base plate to incline for a fourth angle theta 4 towards a fourth direction relative to the developing machine table, controlling the plurality of the spray nozzles to be on a fourth plane parallel to the base plate, and uniformly spraying the developing liquid on the base plate for developing. According to the scheme, the linear width uniformity of a developed photoetching pattern can be improved.
Description
Technical field
The present invention relates to developing technique field, relate in particular to a kind of developing method and developing apparatus.
Background technology
In TFT-LCD (Thin Film Transistor (TFT) liquid crystal display) production run, be coated on photoresist on glass substrate needs to develop and just can obtain the litho pattern of needs after exposure.
As shown in Figure 1, in prior art, be applied to a kind of developing method that advanced lines produces line, glass substrate 2 moves along the developing machine platform 1 of horizontal positioned with inclination angle theta, inclination angle theta between glass substrate 2 and developing machine platform 1 remains constant, multiple nozzles 3 are fixed on plate shaped injection nozzle carrier 4 equably, and injection nozzle carrier 4 is arranged at the top of glass substrate 2, and injection nozzle carrier 4 is parallel with glass substrate 2.In developing process, developer solution is sprayed onto on glass substrate 2 by nozzle 3, the upper side edge that is wherein sprayed onto glass substrate 2 is that after the developer solution of a side and photoresist generation chemical reaction, concentration reduces, and the developer solution that concentration reduces is that b side flows to the lower side of glass substrate 2, the developer solution of the b side that is directly sprayed onto glass substrate 2 is diluted, thereby causes reducing with the solution level of the photoresist generation chemical reaction of the b side of glass substrate 2.Adopt the live width of litho pattern prepared by this kind of developing method inhomogeneous, by a side of glass substrate 2, to its b side, the live width of litho pattern broadens gradually.For the higher rete of live width uniformity requirement, just need the better developing method of a kind of homogeneity; In addition, current developing method can not be realized the development of local modulation live width.
Summary of the invention
The object of this invention is to provide a kind of developing method and developing apparatus, can improve the live width homogeneity of the litho pattern obtaining after developing, realize local modulation live width and develop.
Technical scheme provided by the present invention is as follows:
A kind of developing method, comprises the steps:
Control substrate with respect to developing machine platform to the first direction first angle θ that tilts
1the first side that makes described substrate upwards, the second side relative with position, described first side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
1;
Control substrate with respect to developing machine platform to the second direction second angle θ that tilts
2three side adjacent with described first side that makes described substrate upwards, the four side relative with described the 3rd lateral location be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
2;
Control substrate with respect to developing machine platform to third direction tilt the 3rd angle θ
3the described second side that makes described substrate upwards, the described first side relative with position, described second side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
3;
Control substrate with respect to developing machine platform to fourth direction tilt the 4th angle θ
4the described four side that makes described substrate upwards, described three side relative with described four side position be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
4.
Further, described method also comprises:
Repeating said steps " control substrate with respect to developing machine platform to the first direction first angle θ that tilts
1the first side that makes described substrate upwards, the second side relative with position, described first side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
1;
Control substrate with respect to developing machine platform to the second direction second angle θ that tilts
2three side adjacent with described first side that makes described substrate upwards, the four side relative with described the 3rd lateral location be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
2;
Control substrate with respect to developing machine platform to third direction tilt the 3rd angle θ
3the described second side that makes described substrate upwards, the described first side relative with position, described second side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
3;
Control substrate with respect to developing machine platform to fourth direction tilt the 4th angle θ
4the described four side that makes described substrate upwards, described three side relative with described four side position be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
4.”。
Further, described step " control substrate with respect to developing machine platform to the first direction first angle θ that tilts
1the first side that makes described substrate upwards, the second side relative with position, described first side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
1",
Described step " control substrate with respect to developing machine platform to the second direction second angle θ that tilts
2three side adjacent with described first side that makes described substrate upwards, the four side relative with described the 3rd lateral location be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
2",
Described step " control substrate with respect to developing machine platform to third direction tilt the 3rd angle θ
3the described second side that makes described substrate upwards, the described first side relative with position, described second side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
3",
And, described step " control substrate with respect to developing machine platform to fourth direction tilt the 4th angle θ
4the described four side that makes described substrate upwards, described three side relative with described four side position be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
4" carry out successively.
Further, described the first angle θ
1, described the second angle θ
2, described the 3rd angle θ
3and described the 4th angle θ
4be the acute angle that is greater than 0 °, is less than 90 °.
Further, described the first angle θ
1, described the second angle θ
2, described the 3rd angle θ
3and described the 4th angle θ
4equate.
Further, described development time t
1, described development time t
2, described development time t
3and described development time t
4equate.
A kind of developing apparatus, comprising:
For the developing machine platform of bearing substrate;
For multiple nozzles of spray developing liquid, multiple nozzles are positioned at the top of described developing machine platform;
First substrate control gear, for control described substrate with respect to described developing machine platform to the first direction first angle θ that tilts
1, and to maintain the inclination time be development time t
1, so that the first side of described substrate upwards, the second side relative with position, described first side develop downwards;
Second substrate control gear, for control described substrate with respect to described developing machine platform to the second direction second angle θ that tilts
2, and to maintain the inclination time be development time t
2, with three side adjacent with described first side of described substrate upwards, the four side relative with described the 3rd lateral location develop downwards;
The 3rd substrate control gear, for control described substrate with respect to described developing machine platform to third direction tilt the 3rd angle θ
3, and to maintain the inclination time be development time t
3, so that the described second side of described substrate upwards, the described first side relative with position, described second side develop downwards;
Tetrabasal control gear, for control described substrate with respect to described developing machine platform to fourth direction tilt the 4th angle θ
4, and to maintain the inclination time be development time t
4, so that the described four side of described substrate upwards, described three side relative with described four side position develop downwards;
The first Jet control mechanism, at described substrate with respect to described developing machine platform to the first direction first angle θ that tilts
1time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate;
Second nozzle control gear, at described substrate with respect to described developing machine platform to the second direction second angle θ that tilts
2time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate;
The 3rd Jet control mechanism, for described substrate with respect to described developing machine platform to third direction tilt the 3rd angle θ
3time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate;
The 4th Jet control mechanism, for described substrate with respect to described developing machine platform to fourth direction tilt the 4th angle θ
4time, described multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate.
Further, described first substrate control gear comprises: be arranged on the first Lift Part on development base station, described the first Lift Part is arranged on the described first side correspondence position of described substrate, for driving the described first side lifting of described substrate;
Described second substrate control gear comprises: be arranged on the second Lift Part on development base station, described the second Lift Part is arranged on described the 3rd side correspondence position of described substrate, for driving described the 3rd side lifting of described substrate;
Described the 3rd substrate control gear comprises: be arranged on the 3rd Lift Part on development base station, described the 3rd Lift Part is arranged on the described second side correspondence position of described substrate, for driving the described second side lifting of described substrate;
Described tetrabasal control gear comprises: be arranged on the 4th Lift Part on development base station, described the 4th Lift Part is arranged on the described four side correspondence position of described substrate, for driving the described four side lifting of described substrate.
Further, described multiple nozzle is distributed on a plate shaped injection nozzle carrier;
Described the first Jet control mechanism comprises: the 5th Lift Part being connected with described injection nozzle carrier, described the 5th Lift Part is arranged on the described first side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the first side lifting in described first side described substrate;
Described second nozzle control gear comprises: the 6th Lift Part being connected with described injection nozzle carrier, described the 6th Lift Part is arranged on described the 3rd side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the 3rd side lifting of described the 3rd side described substrate;
Described the 3rd Jet control mechanism comprises: the 7th Lift Part being connected with described injection nozzle carrier, described the 7th Lift Part is arranged on the described second side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the second side lifting in described second side described substrate;
Described the 4th Jet control mechanism comprises: the 8th Lift Part being connected with described injection nozzle carrier, described the 8th Lift Part is arranged on the described four side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the 4th side lifting of described four side described substrate.
Beneficial effect of the present invention is as follows:
Developing method provided by the invention, four sides of substrate can be tilted to and develop successively, thereby the degree of the developer solution of substrate all directions and photoresist generation chemical reaction is basic identical, realizing omnibearing tilt develops, improve the homogeneity of developer solution and photoresist generation chemical reaction, thereby improve the live width homogeneity of the litho pattern of acquisition afterwards of developing; And inclination angle and development time can adjust each side inclination according to live width distribution time, obtain and distribute more uniform live width or carry out the development of local modulation live width, further to meet process requirements.
Brief description of the drawings
Fig. 1 is the structural representation of developing method in prior art;
The process flow diagram that Fig. 2 is the developing method that provides in the present invention;
Fig. 3 is the structural representation that in developing method of the present invention, develop in the first side to substrate;
Fig. 4 is the structural representation that in developing method of the present invention, the 3rd side to substrate develops;
Fig. 5 is the structural representation that in developing method of the present invention, develop in the second side to substrate;
Fig. 6 is the structural representation that in developing method of the present invention, the four side to substrate develops.
Embodiment
Below in conjunction with accompanying drawing, principle of the present invention and feature are described, example, only for explaining the present invention, is not intended to limit scope of the present invention.
As shown in Figure 2, the invention provides a kind of developing method, comprise the steps:
Step S1, as shown in Figure 3, control substrate 100 with respect to developing machine platform 200 to the first direction first angle θ that tilts
1the first side a that makes described substrate 100 upwards, the second side b relative with a position, first side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto to described substrate 100 equably from substrate 100 tops and develops, development time is t
1;
Step S2, as shown in Figure 4, control substrate 100 with respect to developing machine platform 200 to the second direction second angle θ that tilts
2three side adjacent with first side a that makes described substrate 100 upwards, the four side relative with the 3rd lateral location be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto to described substrate 100 equably from substrate 100 tops and develops, development time is t
2;
Step S3, as shown in Figure 5, control substrate 100 with respect to developing machine platform 200 to third direction the 3rd angle θ that tilts
3the second side b that makes described substrate 100 upwards, the first side a relative with b position, second side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto to described substrate 100 equably from substrate 100 tops and develops, development time is t
3;
Step S4, as shown in Figure 6, control substrate 100 with respect to developing machine platform 200 to fourth direction the 4th angle θ that tilts
4the four side that makes described substrate 100 upwards, three side relative with four side position be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto to described substrate 100 equably from substrate 100 tops and develops, development time is t
4.
In such scheme, four sides of substrate can be tilted to and develop respectively, thereby the degree of the developer solution in substrate all directions and photoresist generation chemical reaction is basic identical, realizing omnibearing tilt develops, improve the homogeneity of developer solution and photoresist generation chemical reaction, thereby improve the live width homogeneity of the litho pattern of acquisition afterwards of developing; And in developing method of the present invention, inclination angle and development time can distribute each side inclination of adjustment according to live width time, to obtain distribution live width more uniformly, or carry out the development of local modulation live width.
In the present invention, preferably, above-mentioned steps S1, step S2, step S3, step S4 can be used as a process cycles cycle, when process requirements cycle period is during at least two, complete all after dates of a process cycles, can repeat above-mentioned steps S1, step S2, step S3, step S4, carry out the next process cycles cycle, until complete developing process.
In addition, also it should be noted that, in the preferred embodiments of the present invention, above-mentioned steps S1, step S2, step S3, step S4 carry out successively, that is, in the time developing, four sides of substrate develop successively by circumferential order.
What certainly can understand is, in actual applications, above-mentioned steps S1, step S2, step S3, step S4 carry out according to other orders according to demand, for example: can be after carrying out above-mentioned steps S1, carry out above-mentioned steps S3, and then carry out above-mentioned steps S2, finally carry out above-mentioned steps S4; At this for the execution order of above-mentioned steps S1, step S2, step S3, step S4 and be not construed as limiting.
In addition, in a preferred embodiment of the invention, as shown in Figures 3 to 6, in above-mentioned steps S1, step S2, step S3, step S4, described developer solution can be sprayed on described substrate 100 by the multiple nozzles 300 that are arranged at substrate top, and described multiple nozzle 300 is evenly distributed in the plane parallel with described substrate 100 all the time.Particularly, multiple nozzles 300 can be arranged on an injection nozzle carrier 400 parallel with substrate 100.By the angle of inclination of Control Nozzle frame 400, make multiple nozzles 300 in the time carrying out each step, the distribution plane of multiple nozzles 300 is all parallel with substrate 100, thereby ensures that the developer solution spraying from nozzle 300 is sprayed at substrate 100 equably.
In addition, it should be noted that, in the present invention, preferred, described development time t1, described development time t2, described development time t3 and described development time t4 equate.Certainly, the distinct device property of there are differences, still there is relatively large deviation in the figure live width likely obtaining, therefore, can require to adjust according to live width distribution the development time of each step, obtain and distribute more uniform live width or carry out the development of local modulation live width, that is to say, development time in above-mentioned steps S1, step S2, step S3, step S4 can be identical, also can be different, specifically can set according to needs of production.
In addition, in the present invention, preferred, described the first angle θ
1, described the second angle θ
2, described the 3rd angle θ
3and described the 4th angle θ
4be the acute angle that is greater than 0 °, is less than 90 °.It is further preferred,, described the first angle θ
1, described the second angle θ
2, described the 3rd angle θ
3and described the 4th angle θ
4equate.Certainly, the distinct device property of there are differences, can be according to the inclination angle of substrate and developing machine platform in each step of live width distribution requirement adjustment, distribute more uniform live width or carry out the development of local modulation live width to obtain, that is to say, the substrate in above-mentioned steps S1, step S2, step S3, step S4 and the inclination angle of developing machine platform, can be identical, also can be different, specifically can set according to needs of production.
An also object of the present invention is to provide a kind of developing apparatus that can realize above-mentioned developing method, and described developing apparatus comprises:
For the developing machine platform of bearing substrate;
For multiple nozzles of spray developing liquid, multiple nozzles are positioned at the top of described developing machine platform;
First substrate control gear, for control described substrate with respect to described developing machine platform to the first direction first angle θ that tilts
1, and to maintain the inclination time be development time t
1, so that the first side of described substrate upwards, the second side relative with position, described first side develop downwards;
Second substrate control gear, for control described substrate with respect to described developing machine platform to the second direction second angle θ that tilts
2, and to maintain the inclination time be development time t
2, with three side adjacent with described first side of described substrate upwards, the four side relative with described the 3rd lateral location develop downwards;
The 3rd substrate control gear, for control described substrate with respect to described developing machine platform to third direction tilt the 3rd angle θ
3, and to maintain the inclination time be development time t
3, so that the described second side of described substrate upwards, the described first side relative with position, described second side develop downwards;
Tetrabasal control gear, for control described substrate with respect to described developing machine platform to fourth direction tilt the 4th angle θ
4, and to maintain the inclination time be development time t
4, so that the described four side of described substrate upwards, described three side relative with described four side position develop downwards;
The first Jet control mechanism, at described substrate with respect to described developing machine platform to the first direction first angle θ that tilts
1time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate;
Second nozzle control gear, at described substrate with respect to described developing machine platform to the second direction second angle θ that tilts
2time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate;
The 3rd Jet control mechanism, for described substrate with respect to described developing machine platform to third direction tilt the 3rd angle θ
3time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate;
The 4th Jet control mechanism, for described substrate with respect to described developing machine platform to fourth direction tilt the 4th angle θ
4time, described multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate.Developing apparatus provided by the present invention, can pass through first substrate control gear, second substrate control gear, the 3rd substrate control gear and tetrabasal control gear control substrate with respect to developing machine platform respectively to four side directions predetermined oblique angle in the given time of substrate, thus, can make four sides of substrate to be tilted to and to develop respectively, and by the first Jet control mechanism, second nozzle control gear, the 3rd Jet control mechanism and the 4th Jet control mechanism make in the time that substrate tilts a predetermined angular to a direction, control multiple nozzles to same direction inclination equal angular, with the distribution plane that makes multiple nozzles all the time with substrate keeping parallelism, and then ensure that developer solution can evenly spray on substrate.
Developing apparatus provided by the present invention, four sides can realizing substrate can be tilted to and develop respectively, thereby the degree of the developer solution in substrate all directions and photoresist generation chemical reaction is basic identical, realizing omnibearing tilt develops, improve the homogeneity of developer solution and photoresist generation chemical reaction, thereby improve the live width homogeneity of the litho pattern of acquisition afterwards of developing; And in developing method of the present invention, inclination angle and development time can distribute each side inclination of adjustment according to live width time, to obtain distribution live width more uniformly, or carry out the development of local modulation live width.
In specific embodiments of the invention, described the first control gear can adopt the jacking gear being arranged on developing machine platform to realize, preferably, described first substrate control gear comprises: be arranged on the first Lift Part on development base station, described the first Lift Part is arranged on the described first side correspondence position of described substrate, for driving the described first side lifting of described substrate;
Described second substrate control gear comprises: be arranged on the second Lift Part on development base station, described the second Lift Part is arranged on described the 3rd side correspondence position of described substrate, for driving described the 3rd side lifting of described substrate;
Described the 3rd substrate control gear comprises: be arranged on the 3rd Lift Part on development base station, described the 3rd Lift Part is arranged on the described second side correspondence position of described substrate, for driving the described second side lifting of described substrate;
Described tetrabasal control gear comprises: be arranged on the 4th Lift Part on development base station, described the 4th Lift Part is arranged on the described four side correspondence position of described substrate, for driving the described four side lifting of described substrate.
In such scheme, on developing machine platform, with four side correspondence positions of substrate, the Lift Part that can realize lifting is set respectively, the Lift Part of a certain position rises and keeps the schedule time, drive a corresponding side substrate side upwards, by controlling the climb of each Lift Part, can control the angle of inclination in one direction of substrate, rise to the retention time behind precalculated position by controlling each Lift Part, the development time can control the tilting in one direction of substrate time simultaneously.Certainly can understand, in actual applications, the structure of described first substrate control gear, second substrate control gear, the 3rd substrate control gear and tetrabasal control gear is also not only confined to this.
In specific embodiments of the invention, described the first Jet control mechanism, described second nozzle control gear, described the 3rd Jet control mechanism and described the 4th Jet control mechanism can adopt jacking gear to realize equally, preferably, described the first Jet control mechanism comprises: the 5th Lift Part being connected with described injection nozzle carrier, described the 5th Lift Part is arranged on the described first side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the first side lifting in described first side described substrate;
Described second nozzle control gear comprises: the 6th Lift Part being connected with described injection nozzle carrier, described the 6th Lift Part is arranged on described the 3rd side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the 3rd side lifting of described the 3rd side described substrate;
Described the 3rd Jet control mechanism comprises: the 7th Lift Part being connected with described injection nozzle carrier, described the 7th Lift Part is arranged on the described second side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the second side lifting in described second side described substrate;
Described the 4th Jet control mechanism comprises: the 8th Lift Part being connected with described injection nozzle carrier, described the 8th Lift Part is arranged on the described four side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the 4th side lifting of described four side described substrate.
In such scheme, multiple nozzles are distributed on a plate shaped injection nozzle carrier, under injection nozzle carrier can with four side correspondence positions of substrate on Lift Part is set, the Lift Part of a certain position rises and keeps the schedule time, drive in injection nozzle carrier one side direction of a corresponding side, by controlling the climb of each Lift Part, get final product the angle of inclination of Control Nozzle frame, the distribution plane of controlling multiple nozzles angle of inclination in one direction, rise to the retention time behind precalculated position by controlling each Lift Part simultaneously, can control the spraying time of multiple nozzles on this angle of inclination.Certainly can understand, in actual applications, the structure of described the first Jet control mechanism, described second nozzle control gear, described the 3rd Jet control mechanism and described the 4th Jet control mechanism is also not only confined to this.
In addition, also it should be noted that, synchronize with substrate in order to make injection nozzle carrier, preferably, described first substrate control gear and described the first Jet control mechanism can adopt same Lift Part, described second substrate control gear and described second nozzle control gear can adopt same Lift Part, described the 3rd substrate control gear and described the 3rd Jet control mechanism can adopt same Lift Part, described tetrabasal control gear and described the 4th Jet control mechanism can adopt same Lift Part, to drive substrate and nozzle to tilt to homonymy simultaneously.Certainly, first substrate control gear, second substrate control gear, the 3rd substrate control gear and tetrabasal control gear also can adopt separately respectively different Lift Parts from the first Jet control mechanism, described second nozzle control gear, described the 3rd Jet control mechanism and described the 4th Jet control mechanism.
In addition, also it should be noted that, only provide a kind of developing apparatus that can developing method of the present invention above, in actual production, also can adopt the developing apparatus of other structures to realize this developing method, for example:
Developing apparatus comprises: four development chambers that set gradually; And, conveying device; Wherein between four development chambers, pass through conveying device conveying substrate, multiple nozzles are set in each development chamber and are positioned at the developing machine platform of nozzle below, and the developing machine platform in four development chambers respectively can be to first direction, second direction, third direction and the fourth direction described substrate that tilts, and multiple nozzles in four development chambers are evenly arranged in and are positioned in developing machine platform top the plane parallel with developing machine platform.
Substrate is delivered on the developing machine platform in the first development chamber, tilts to first direction, utilizes multiple nozzles in the first development chamber to develop to spray developing liquid on substrate; After the first development chamber has developed, substrate is transferred on the developing machine platform that device is delivered to the second development chamber, tilts to second direction, utilizes multiple nozzles in the second development chamber to develop to spray developing liquid on substrate; After the second development chamber has developed, substrate is transferred on the developing machine platform that device is delivered to the 3rd development chamber, tilts to third direction, utilizes multiple nozzles in the 3rd development chamber to develop to spray developing liquid on substrate; After the 3rd development chamber has developed, substrate is transferred on the developing machine platform that device is delivered to the 4th development chamber, tilts to fourth direction, utilizes multiple nozzles in the 4th development chamber to develop to spray developing liquid on substrate.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (9)
1. a developing method, is characterized in that, comprises the steps:
Control substrate with respect to developing machine platform to the first direction first angle θ that tilts
1the first side that makes described substrate upwards, the second side relative with position, described first side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
1;
Control substrate with respect to developing machine platform to the second direction second angle θ that tilts
2three side adjacent with described first side that makes described substrate upwards, the four side relative with described the 3rd lateral location be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
2;
Control substrate with respect to developing machine platform to third direction tilt the 3rd angle θ
3the described second side that makes described substrate upwards, the described first side relative with position, described second side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
3;
Control substrate with respect to developing machine platform to fourth direction tilt the 4th angle θ
4the described four side that makes described substrate upwards, described three side relative with described four side position be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
4.
2. developing method according to claim 1, is characterized in that, described method also comprises:
Repeating said steps " control substrate with respect to developing machine platform to the first direction first angle θ that tilts
1the first side that makes described substrate upwards, the second side relative with position, described first side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
1;
Control substrate with respect to developing machine platform to the second direction second angle θ that tilts
2three side adjacent with described first side that makes described substrate upwards, the four side relative with described the 3rd lateral location be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
2;
Control substrate with respect to developing machine platform to third direction tilt the 3rd angle θ
3the described second side that makes described substrate upwards, the described first side relative with position, described second side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
3;
Control substrate with respect to developing machine platform to fourth direction tilt the 4th angle θ
4the described four side that makes described substrate upwards, described three side relative with described four side position be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
4.”。
3. developing method according to claim 1, is characterized in that,
Described step " control substrate with respect to developing machine platform to the first direction first angle θ that tilts
1the first side that makes described substrate upwards, the second side relative with position, described first side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
1",
Described step " control substrate with respect to developing machine platform to the second direction second angle θ that tilts
2three side adjacent with described first side that makes described substrate upwards, the four side relative with described the 3rd lateral location be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
2",
Described step " control substrate with respect to developing machine platform to third direction tilt the 3rd angle θ
3the described second side that makes described substrate upwards, the described first side relative with position, described second side be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
3",
And, described step " control substrate with respect to developing machine platform to fourth direction tilt the 4th angle θ
4the described four side that makes described substrate upwards, described three side relative with described four side position be downward, multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate, and by described multiple nozzles, developer solution is sprayed onto equably on described substrate and is developed, development time is t
4" carry out successively.
4. developing method according to claim 1, is characterized in that,
Described the first angle θ
1, described the second angle θ
2, described the 3rd angle θ
3and described the 4th angle θ
4be the acute angle that is greater than 0 °, is less than 90 °.
5. developing method according to claim 1, is characterized in that,
Described the first angle θ
1, described the second angle θ
2, described the 3rd angle θ
3and described the 4th angle θ
4equate.
6. developing method according to claim 1, is characterized in that,
Described development time t
1, described development time t
2, described development time t
3and described development time t
4equate.
7. a developing apparatus, is characterized in that, comprising:
For the developing machine platform of bearing substrate;
For multiple nozzles of spray developing liquid, multiple nozzles are positioned at the top of described developing machine platform;
First substrate control gear, for control described substrate with respect to described developing machine platform to the first direction first angle θ that tilts
1, and to maintain the inclination time be development time t
1, so that the first side of described substrate upwards, the second side relative with position, described first side develop downwards;
Second substrate control gear, for control described substrate with respect to described developing machine platform to the second direction second angle θ that tilts
2, and to maintain the inclination time be development time t
2, with three side adjacent with described first side of described substrate upwards, the four side relative with described the 3rd lateral location develop downwards;
The 3rd substrate control gear, for control described substrate with respect to described developing machine platform to third direction tilt the 3rd angle θ
3, and to maintain the inclination time be development time t
3, so that the described second side of described substrate upwards, the described first side relative with position, described second side develop downwards;
Tetrabasal control gear, for control described substrate with respect to described developing machine platform to fourth direction tilt the 4th angle θ
4, and to maintain the inclination time be development time t
4, so that the described four side of described substrate upwards, described three side relative with described four side position develop downwards;
The first Jet control mechanism, at described substrate with respect to described developing machine platform to the first direction first angle θ that tilts
1time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the first plane parallel with described substrate;
Second nozzle control gear, at described substrate with respect to described developing machine platform to the second direction second angle θ that tilts
2time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the second plane parallel with described substrate;
The 3rd Jet control mechanism, for described substrate with respect to described developing machine platform to third direction tilt the 3rd angle θ
3time, described multiple nozzles that control is arranged at described substrate top are evenly arranged in the 3rd plane parallel with described substrate;
The 4th Jet control mechanism, for described substrate with respect to described developing machine platform to fourth direction tilt the 4th angle θ
4time, described multiple nozzles that control is arranged at described substrate top are evenly arranged on Siping City's face parallel with described substrate.
8. developing apparatus according to claim 7, is characterized in that,
Described first substrate control gear comprises: be arranged on the first Lift Part on development base station, described the first Lift Part is arranged on the described first side correspondence position of described substrate, for driving the described first side lifting of described substrate;
Described second substrate control gear comprises: be arranged on the second Lift Part on development base station, described the second Lift Part is arranged on described the 3rd side correspondence position of described substrate, for driving described the 3rd side lifting of described substrate;
Described the 3rd substrate control gear comprises: be arranged on the 3rd Lift Part on development base station, described the 3rd Lift Part is arranged on the described second side correspondence position of described substrate, for driving the described second side lifting of described substrate;
Described tetrabasal control gear comprises: be arranged on the 4th Lift Part on development base station, described the 4th Lift Part is arranged on the described four side correspondence position of described substrate, for driving the described four side lifting of described substrate.
9. developing apparatus according to claim 7, is characterized in that,
Described multiple nozzle is distributed on a plate shaped injection nozzle carrier;
Described the first Jet control mechanism comprises: the 5th Lift Part being connected with described injection nozzle carrier, described the 5th Lift Part is arranged on the described first side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the first side lifting in described first side described substrate;
Described second nozzle control gear comprises: the 6th Lift Part being connected with described injection nozzle carrier, described the 6th Lift Part is arranged on described the 3rd side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the 3rd side lifting of described the 3rd side described substrate;
Described the 3rd Jet control mechanism comprises: the 7th Lift Part being connected with described injection nozzle carrier, described the 7th Lift Part is arranged on the described second side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the second side lifting in described second side described substrate;
Described the 4th Jet control mechanism comprises: the 8th Lift Part being connected with described injection nozzle carrier, described the 8th Lift Part is arranged on the described four side correspondence position with described substrate, for driving described injection nozzle carrier and corresponding the 4th side lifting of described four side described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410258414.4A CN104062857A (en) | 2014-06-11 | 2014-06-11 | Developing method and developing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410258414.4A CN104062857A (en) | 2014-06-11 | 2014-06-11 | Developing method and developing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104062857A true CN104062857A (en) | 2014-09-24 |
Family
ID=51550635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410258414.4A Pending CN104062857A (en) | 2014-06-11 | 2014-06-11 | Developing method and developing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104062857A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105116694A (en) * | 2015-09-25 | 2015-12-02 | 京东方科技集团股份有限公司 | Mask, exposure device and exposure method |
| CN105607434A (en) * | 2016-04-05 | 2016-05-25 | 京东方科技集团股份有限公司 | Developing apparatus and developing method |
| CN107179655A (en) * | 2017-07-28 | 2017-09-19 | 京东方科技集团股份有限公司 | A kind of developing method and developing apparatus |
| CN109407387A (en) * | 2018-10-29 | 2019-03-01 | 武汉华星光电技术有限公司 | Developing apparatus and substrate developing method |
| CN111458989A (en) * | 2020-04-15 | 2020-07-28 | Tcl华星光电技术有限公司 | Developing apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6381428A (en) * | 1986-09-26 | 1988-04-12 | Konica Corp | Method and device for processing photosensitive material |
| CN1722361A (en) * | 2004-06-25 | 2006-01-18 | Hoya株式会社 | Substrate processing device and method, and pattern forming method |
| US20070072092A1 (en) * | 2005-09-28 | 2007-03-29 | Tokyo Electron Limited | Rinse treatment method, developing treatment method and developing apparatus |
| CN103207543A (en) * | 2013-04-19 | 2013-07-17 | 京东方科技集团股份有限公司 | Developing method |
| CN103324038A (en) * | 2013-06-25 | 2013-09-25 | 京东方科技集团股份有限公司 | Developing device and developing method |
-
2014
- 2014-06-11 CN CN201410258414.4A patent/CN104062857A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6381428A (en) * | 1986-09-26 | 1988-04-12 | Konica Corp | Method and device for processing photosensitive material |
| CN1722361A (en) * | 2004-06-25 | 2006-01-18 | Hoya株式会社 | Substrate processing device and method, and pattern forming method |
| US20070072092A1 (en) * | 2005-09-28 | 2007-03-29 | Tokyo Electron Limited | Rinse treatment method, developing treatment method and developing apparatus |
| CN103207543A (en) * | 2013-04-19 | 2013-07-17 | 京东方科技集团股份有限公司 | Developing method |
| CN103324038A (en) * | 2013-06-25 | 2013-09-25 | 京东方科技集团股份有限公司 | Developing device and developing method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105116694A (en) * | 2015-09-25 | 2015-12-02 | 京东方科技集团股份有限公司 | Mask, exposure device and exposure method |
| US10114283B2 (en) | 2015-09-25 | 2018-10-30 | Boe Technology Group Co., Ltd. | Mask plate, exposure device, and exposure method |
| CN105607434A (en) * | 2016-04-05 | 2016-05-25 | 京东方科技集团股份有限公司 | Developing apparatus and developing method |
| CN107179655A (en) * | 2017-07-28 | 2017-09-19 | 京东方科技集团股份有限公司 | A kind of developing method and developing apparatus |
| CN109407387A (en) * | 2018-10-29 | 2019-03-01 | 武汉华星光电技术有限公司 | Developing apparatus and substrate developing method |
| CN111458989A (en) * | 2020-04-15 | 2020-07-28 | Tcl华星光电技术有限公司 | Developing apparatus |
| CN111458989B (en) * | 2020-04-15 | 2023-05-09 | Tcl华星光电技术有限公司 | Developing apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102438348B1 (en) | Liquid coating method, liquid coating apparatus, and computer-readable storage medium | |
| CN104062857A (en) | Developing method and developing device | |
| US20060292291A1 (en) | System and methods for inkjet printing for flat panel displays | |
| CN103207543A (en) | Developing method | |
| US9581939B2 (en) | Developing device and developing method | |
| JP2006031025A (en) | System and method for manufacturing flat panel display | |
| US10711338B2 (en) | Vapor deposition mask and manufacturing method for organic EL display device | |
| CN102436098A (en) | Aligning equipment and method for polymer-stabilized vertically-aligned liquid crystal panel | |
| CN103695846A (en) | Vacuum coating device and method | |
| CN103869518B (en) | Manufacturing method for liquid crystal display and product thereof | |
| CN104317110A (en) | Transfer printing plate | |
| CN104280941A (en) | Liquid crystal display substrate, liquid crystal display panel and liquid crystal display device | |
| US9474165B2 (en) | Substrate delivery device and strong acid or strong base etching adequate for wet process | |
| CN105629679B (en) | Edge exposure machine and edge exposure region code printing method | |
| CN105589266A (en) | Display panel, manufacturing method thereof and liquid crystal display screen | |
| CN102224449A (en) | Method and apparatus for dropping alignment film material | |
| KR20090074450A (en) | Liquid supply system and an apparatus for processing a substrate appling thereof | |
| CN105607434A (en) | Developing apparatus and developing method | |
| US9795988B2 (en) | Polyimide coating method and device | |
| CN102408895A (en) | Liquid-crystal active monomer for polyimide surface of alignment film and liquid crystal panel | |
| CN102969259B (en) | The device for the treatment of substrate | |
| CN202292780U (en) | Anti-skid device, robot fork and robot | |
| KR101328157B1 (en) | Coater control apparatus and method using servo motor | |
| CN102169255A (en) | OCB (Optically Compensated Birefringence) liquid crystal display panel and manufacturing method thereof as well as OCB liquid crystal display | |
| US9144134B2 (en) | Method for coating polyimide on liquid crystal display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140924 |