CN103695846A - Vacuum coating device and method - Google Patents
Vacuum coating device and method Download PDFInfo
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- CN103695846A CN103695846A CN201310701253.7A CN201310701253A CN103695846A CN 103695846 A CN103695846 A CN 103695846A CN 201310701253 A CN201310701253 A CN 201310701253A CN 103695846 A CN103695846 A CN 103695846A
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Abstract
The invention discloses a vacuum coating device and a method. The method comprises the following steps: step 1, oppositely arranging the membrane surface of a basal plate to be coated in an evaporation mode and a mask plate, wherein the membrane surface of the basal plate to be coated in the evaporation mode comprises at least one evaporation coating area, and the size of a graphic area of the mask plate is less than the size of any one evaporation coating area; step 2, enabling the mask plate to be opposite to the first evaporation coating area; step 3, oppositely arranging the graphic area of the mask plate and an evaporation source; and correspondingly arranging evaporation coating baffle plates between the mask plate and the evaporation source so as to drive relative motions to be performed between the basal plate to be coated in the evaporation mode and the mask plate, thereby finishing the coating of the first evaporation coating area. The mask plate, the size of which is less than the size of one evaporation coating area, is adopted, so that the evaporation coating of one evaporation coating area is finished step by step by controlling the relative motions the mask plate and the evaporation coating area. Thus, the small size of the mask plate required for the vacuum evaporation coating is ensured; the production requirement of a large-size display module is satisfied at the same time.
Description
Technical field
The present invention relates to film and form technical field, particularly a kind of vacuum deposition apparatus and method.
Background technology
At present, in photoelectricity and demonstration field, Organic Light Emitting Diode (Organic Light-Emitting Diode particularly, OLED), OTFT (Organic Thin Film Transistor, OTFT) etc. device is manufactured field, and the factors such as requirement of the ununiformity of organic molecule vacuum evaporation, deposition mask plate (Mask) intensity and tolerance range have restricted the development of OLED technique of display toward large size direction.In the vacuum deposition apparatus of prior art, no matter evaporation source adopts an evaporation source, line evaporation source or face evaporation source etc., is generally single step vacuum evaporation, each layer film all disposable evaporation to whole substrate.
Fig. 1 is the cross-sectional view of the vacuum deposition apparatus of prior art, comprising: for the base plate driving mechanism (not shown) of mobile and bearing substrate 1; For mask plate driving mechanism (not shown) mobile and carrying mask plate 3; For the contraposition mechanism (not shown) that substrate 1 and mask plate 3 are carried out to contraposition; Evaporation source 4.Wherein, down, mask plate 3 is positioned at substrate 1 below to substrate 1 face to be deposited, and evaporation source 4 is positioned at mask plate 3 belows.Substrate 1 surface is formed with graph area 2;
Fig. 2 is the vertical view of the board structure of prior art, comprising: substrate 1; Be formed on the graph area 2 on substrate 1 surface; Alignment mark on substrate (Mark) 5.Wherein, on substrate, alignment mark 5 is positioned at graph area 2 outsides.
Fig. 3 is the vertical view of the mask structure being of prior art, comprising: mask plate graph area 6; Mask plate rim area 7; On mask plate, alignment mark 8.Wherein, on mask plate, alignment mark 8 is positioned at mask plate rim area 7, and mask plate graph area 6 is measure-alike with substrate graph area 2.
During evaporation, base plate driving mechanism moves to mask plate 3 tops by substrate 1; On mask plate, on alignment mark 8 and substrate, alignment mark 5 carries out contraposition by contraposition mechanism; Open evaporation source 4, evaporation gas is upwards evaporated to substrate 1 surface, and is deposited as the film consistent with mask plate open region figure.
Mainly there is following defect in the single step vacuum deposition apparatus of prior art:
In large size along with substrate, single step vacuum evaporation is difficult to guarantee the homogeneity of film thickness within the scope of large size;
Single step vacuum evaporation requires the graph area consistent size of mask plate graph area and substrate, due to the requirement of mask plate intensity and tolerance range, and in large size along with substrate, the manufacture difficulty of mask plate continues to increase.
In order to address the above problem, the Chinese utility model patent that a application number of applicant's application is 201120238890.1 provides a kind of vacuum deposition apparatus, can carry out multiple step format vacuum evaporation to large-size substrate, has dwindled deposition mask board size.Although this patent is divided into several evaporation subregions by the evaporation region of large-size substrate when vacuum evaporation, carry out multiple step format vacuum evaporation to dwindle deposition mask board size, within the scope of large size, guarantee the homogeneity of film thickness, but still the size of the evaporation subregion corresponding with it is identical for evaporation mask plate size when each evaporation subregion is carried out to evaporation, the size of evaporation subregion is subject to the restriction of evaporation mask plate size, and then limited can be corresponding indicating meter module size, because mask plate size is dwindled, to define evaporation subregion also less, therefore the vacuum deposition apparatus that this patent provides is difficult to meet the production requirement of large-sized monitor module.
Summary of the invention
The problem existing for prior art, the object of the present invention is to provide the size in a kind of evaporation region not to be subject to mask plate area constraints, can meet vacuum coater and the method for the production requirement of large-sized monitor module.
For achieving the above object, vacuum coating method of the present invention, comprising:
Further, on the face of described substrate to be deposited, comprise a plurality of evaporations region, after step 3, also comprise and step 4 repeat the plated film that above-mentioned step 2, three completes other evaporation regions.
Further, in described step 3, drive between described substrate to be deposited and described mask plate and relatively move and be specially: drive described substrate to be deposited to move along the first direction that is parallel to described mask plate place plane.
Further, the graph area of described mask plate is less than described the first evaporation region along the size of described first direction along the size of described first direction, the graph area of described mask plate equals described the first evaporation region along the size of described second direction along the size of second direction, and described first direction is perpendicular to described second direction.
Further, in described step 3, drive between described substrate to be deposited and described mask plate and relatively move and be specially: drive described substrate to be deposited to move along the first direction and the second direction that are parallel to described mask plate place plane, described first direction is perpendicular to described second direction.
Further, the graph area of described mask plate is less than described the first evaporation region along the size of described first direction along the size of described first direction, and the graph area of described mask plate is also less than described the first evaporation region along the size of described second direction along the size of described second direction.
Further, in described step 3, drive between described substrate to be deposited and described mask plate and relatively move and be specially: drive described evaporation source and described mask plate to move along the first direction that is parallel to described substrate place plane.
Further, the graph area of described mask plate is less than described the first evaporation region along the size of described first direction along the size of described first direction, the graph area of described mask plate equals described the first evaporation region along the size of described second direction along the size of second direction, and described first direction is perpendicular to described second direction.
Further, in described step 3, drive between described substrate to be deposited and described mask plate and relatively move and be specially: drive described evaporation source and described mask plate to move along the first direction and the second direction that are parallel to described substrate place plane, described first direction is perpendicular to described second direction.
Further, the graph area of described mask plate is less than described the first evaporation region along the size of described first direction along the size of described first direction, and the graph area of described mask plate is also less than described the first evaporation region along the size of described second direction along the size of described second direction.
Further, described step 3 also comprises: between described substrate to be deposited and described mask plate, relatively moves in process, and the graph area relative position of the first evaporation region and described mask plate described in real time correction in the direction that relatively moves between perpendicular to described substrate to be deposited and described mask plate.
Further, on described mask plate and described substrate to be deposited, be provided with the calibration marker in described mask plate and described first alignment mark in evaporation region and the graph area of described mask plate and described the first evaporation region.
Vacuum coater of the present invention, comprise evaporation source, mask plate, evaporation baffle plate and driving mechanism, substrate to be deposited, described mask plate, described evaporation baffle plate and described evaporation source are oppositely arranged successively, the surface of described substrate comprises at least one evaporation region, described evaporation source is relative fixing with the position between mask plate, the graph area size of described mask plate is less than arbitrary described evaporation area size, described driving mechanism is for driving between described substrate to be deposited and described mask plate and relatively move in vacuum plating process, make the continuous inswept whole described evaporation of the vaporised gas region through the graph area of described mask plate, form the film that covers described evaporation region.
Further, described vacuum coater is also included in perpendicular to relatively move in the direction aligning gear of the graph area relative position in evaporation region and described mask plate described in real time correction of described substrate to be deposited and described mask plate.
Further, on described mask plate and described substrate to be deposited, be provided with the graph area of described mask plate and the calibration marker in described evaporation region.
Further, described vacuum coater also comprises the contraposition mechanism that contraposition is carried out in described mask plate and described evaporation region.
Further, on described mask plate and described substrate to be deposited, be provided with the alignment mark that contraposition is carried out in described mask plate and described evaporation region.
Use size of the present invention is less than the mask plate in an evaporation region of substrate surface, by controlling between mask plate and evaporation region, relatively move, substep completes the evaporation in an evaporation region, make the continuous inswept whole evaporation of the vaporised gas region through the graph area of mask plate, form the film that covers this evaporation region.Both can guarantee the small size of the mask plate that vacuum evaporation is used, be applicable to the very large evaporation situation in each evaporation region on substrate simultaneously, and can meet the production requirement of large-sized monitor module.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the vacuum deposition apparatus of prior art;
Fig. 2 is the vertical view of the board structure of prior art;
Fig. 3 is the vertical view of the mask structure being of prior art;
Fig. 4 is the schematic flow sheet of the vacuum coating method of the embodiment of the present invention;
Fig. 5 is the cross-sectional view of the vacuum deposition apparatus of the embodiment of the present invention;
Fig. 6 is the vertical view of evaporation baffle arrangement in the embodiment of the present invention;
Fig. 7 is the vertical view of board structure in the embodiment of the present invention;
Fig. 8 is the vertical view of mask structure being in the embodiment of the present invention;
Fig. 9 is the structural representation of the embodiment of the present invention linear pixel that evaporation forms on substrate.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, describe the present invention below in conjunction with the accompanying drawings and the specific embodiments.
Fig. 4 is the schema of the vacuum coating method of the embodiment of the present invention.With reference to Fig. 4, described vacuum coating method, comprising:
The number in the evaporation region arranging on the face of substrate to be deposited in the present embodiment can be selected arbitrarily according to practical situation, when if the evaporation region on the face of substrate to be deposited is a plurality of, after step 3, also comprise step 4, repeat the plated film that above-mentioned step 2, three completes other evaporation regions.
In step 2 by the alignment mark that arranges on mask plate and the first evaporation region whether overlapping judge mask plate whether with the first contraposition of evaporation region.If the first corresponding alignment mark in evaporation region of the alignment mark on mask plate and substrate is overlapping, mask plate with the first evaporation region contraposition, can carry out vacuum plating; Otherwise mask plate does not have and the first evaporation region contraposition, continue to carry out mask plate and the first evaporation region to bit manipulation, until carry out again vacuum plating after mask plate and the first evaporation region contraposition.
In step 3, drive between described substrate to be deposited and described mask plate and relatively move and specifically can comprise following four kinds of forms:
1, drive described substrate to be deposited to move along the first direction that is parallel to described mask plate place plane;
2, drive described substrate to be deposited to move along the first direction and the second direction that are parallel to described mask plate place plane, described first direction is perpendicular to described second direction;
3, drive described evaporation source and described mask plate to move along the first direction that is parallel to described substrate place plane;
4, drive described evaporation source and described mask plate to move along the first direction and the second direction that are parallel to described substrate place plane, described first direction is perpendicular to described second direction.
In vacuum plating process, preferably employing first and the third type of drive, because these two kinds of type of drive all only need to just move and can complete the plated film in the first evaporation region in a direction, implements more simple.In addition, the first type of drive is compared with the third type of drive, due to demand motive substrate to be deposited only, can simplify corresponding driving mechanism.When employing first and the third type of drive, the graph area of mask plate is less than described the first evaporation region along the size of described first direction in the size of first direction (driving direction), and the graph area of mask plate equals described the first evaporation region along the size of described second direction in the size of second direction (perpendicular to first direction).
By limiting the graph area of mask plate, in the size of both direction, the size of mask plate can be further dwindled, for example, the length of mask plate graph area and length and the width that width is less than the first evaporation region respectively can be made.If adopt above-mentioned smaller szie mask plate in vacuum plating process, only in a direction, move the All Ranges that cannot realize in the first evaporation region and carry out plated film.In order to complete plated film by the All Ranges in the first evaporation region, need to adopt second and the 4th kind of type of drive, and control substrate or mask plate moves by snakelike route at both direction, make to see through the vaporised gas All Ranges in inswept described the first evaporation region continuously of the graph area of mask plate.
In vacuum plating process, adopt above-mentioned any type of drive, can select arbitrarily according to actual needs.If the simple realization consider driving can adopt first and the third type of drive, if in order to make mask plate make more simply, can adopt second and the 4th kind of type of drive.
Between substrate to be deposited and described mask plate, relatively move in process, with the perpendicular direction of the direction that relatively moves on, between described substrate and described mask plate, may be offset by occurrence positions, can have influence on the plated film precision in the first evaporation region of substrate to be deposited.In order further to improve the precision of plated film, can be the relatively moving in process of described substrate to be deposited and described mask plate, the relative position that the graph area of the first evaporation region and described mask plate relatively moves in direction between perpendicular to described substrate to be deposited and described mask plate described in real time correction.Whether overlapping by judge the calibration marker of first calibration marker in evaporation region and the graph area of described mask plate in moving process, can verify whether the graph area relative position in the first evaporation region and described mask plate departs from the direction vertical with the direction that relatively moves.For example, when the calibration marker of first calibration marker in evaporation region and the graph area of mask plate is not overlapping, with the perpendicular direction of the direction that relatively moves on finely tune mask plate or substrate is proofreaied and correct.
The relative position relation that it should be noted that substrate to be deposited in the present embodiment, mask plate, evaporation baffle plate and evaporation source be not limited to upper and lower as above to, when the working-surface of substrate to be deposited, mask plate, evaporation baffle plate and evaporation source arranges along vertical direction, between substrate to be deposited, mask plate, evaporation baffle plate and evaporation source, along left and right direction, set gradually.
The graph area size that the vacuum coating method of the present embodiment limits mask plate is less than arbitrary described evaporation area size, in vacuum plating process, control between mask plate and substrate and relatively move simultaneously, substep completes the evaporation in an evaporation region, make the continuous inswept whole evaporation of the vaporised gas region through the graph area of mask plate, form the film that covers this evaporation region.Both can guarantee the small size of the mask plate that vacuum evaporation is used, and make the size of plated film in evaporation region not be subject to the restriction of mask plate graph area size, and can meet again the production requirement of large-sized monitor module.
The cross-sectional view of the vacuum deposition apparatus of the embodiment of the present invention.With reference to Fig. 5, described vacuum coater, comprise mask plate 2, evaporation baffle plate 3, evaporation source 4 and driving mechanism (not shown), substrate 1 to be deposited, mask plate 2, evaporation baffle plate 3 and evaporation source 4 from top to bottom set gradually, the surface of substrate 1 comprises at least one evaporation region 11, evaporation source 4 is relative fixing with the position of 2 of mask plates, graph area 21 sizes of mask plate are less than evaporation region 11 sizes, described driving mechanism is for driving between substrate 1 and mask plate 2 and relatively move in vacuum plating process, make the continuous inswept whole evaporation of the vaporised gas region 11 through the graph area 21 of mask plate, form the film that covers evaporation region.
The relative position relation that it should be noted that substrate to be deposited in the present embodiment, mask plate, evaporation baffle plate and evaporation source be not limited to upper and lower as above to, when the working-surface of substrate to be deposited, mask plate, evaporation baffle plate and evaporation source arranges along vertical direction, between substrate to be deposited, mask plate, evaporation baffle plate and evaporation source, along left and right direction, set gradually.
Fig. 6 is the vertical view of evaporation baffle arrangement in the embodiment of the present invention.With reference to Fig. 6, in the present embodiment, evaporation baffle plate 3 comprise 4 can independent drive sub-baffle plate, described 4 sub-baffle plates can surround described evaporation gas permeation district.It should be noted that, the number of sub-baffle plate can arrange as required, for example, can also be set to 1 or 2 etc.
Fig. 7 is the vertical view of board structure in inventive embodiments.On the surface of substrate 1, be divided into the evaporation region 11 that at least one size is identical, alignment mark 12 and the calibration marker 13 in each outside, evaporation region.In the present embodiment, the surface of substrate 1 is divided into four evaporation regions 11, and each 11 outside, evaporation region includes symmetrical two alignment marks 12.The size in the evaporation region 11 of dividing on substrate 1 need to pre-determine according to actual plated film, for example, produces 55 cun of indicating meter modules and the size in each evaporation region 11 on substrate is set as to 55 cun.The size in each evaporation region 11 of dividing on substrate 1 in addition, can be the same or different.
Fig. 8 is the vertical view of mask structure being in inventive embodiments.Mask plate 2 comprises mask plate graph area 21, mask plate rim area 22, alignment mark 23 and calibration marker 24.Wherein, have two alignment marks 23 and two calibration markers 24 on mask plate, it is the symmetrical mask plate rim area 22 that is arranged on respectively.The size of mask plate graph area 21 is less than the size in an evaporation region 11, and in the present embodiment, the lateral dimension of mask plate graph area 21 equals the horizontal size in evaporation region 11, and the longitudinal size of mask plate graph area 21 is less than evaporation region 11 longitudinal sizes.The size of mask plate graph area 21 is not limited to mode in the present embodiment, also can be less than for the lateral dimension of mask plate graph area 21 the horizontal size in evaporation region 11, the longitudinal size of mask plate graph area 21 equals evaporation region 11 longitudinal sizes, or the horizontal stroke of mask plate graph area 21, longitudinal size are all less than evaporation region 11 horizontal strokes, longitudinal size.
The contraposition mechanism (not shown) arranging on vacuum coater is carried out contraposition by 23 pairs of described mask plates of alignment mark on alignment mark on substrate 12 and mask plate and evaporation region to be deposited, concrete alignment mode is introduced in detail in above-mentioned vacuum coating method, at this, no longer repeats.
The relative position that the graph area of the aligning gear (not shown) arranging on vacuum coater by 24 pairs of described the first evaporation regions of calibration marker on calibration marker on substrate 13 and mask plate and described mask plate relatively moves in direction between perpendicular to described substrate to be deposited and described mask plate is proofreaied and correct, concrete correcting mode is introduced in detail in above-mentioned vacuum coating method, at this, no longer repeats.
Adopt the structure of above-mentioned vacuum coater and the vacuum coating method linear pixel that evaporation forms on substrate as shown in Figure 9.
Finally should be noted that, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, those of ordinary skill in the art is to be understood that, can modify or be equal to replacement technical scheme of the present invention, and not departing from the spiritual scope of technical solution of the present invention, it all should be encompassed in the middle of claim scope of the present invention.
Claims (17)
1. a vacuum coating method, is characterized in that, comprising:
Step 1, is oppositely arranged the face of substrate to be deposited and mask plate, wherein on the face of substrate to be deposited, comprises that at least one evaporation region, the graph area size of mask plate are less than arbitrary described evaporation area size;
Step 2, makes described mask plate and the first evaporation region contraposition;
Step 3, the graph area of mask plate and evaporation source are oppositely arranged, between described mask plate and described evaporation source, correspondence arranges evaporation baffle plate, drive between described substrate to be deposited and described mask plate and relatively move, make continuous inswept whole described the first evaporation region of vaporised gas through the graph area of mask plate, complete the plated film in described the first evaporation region.
2. vacuum coating method as claimed in claim 1, it is characterized in that, on the face of described substrate to be deposited, comprise a plurality of evaporations region, after step 3, also comprise step 4, repeat the plated film that above-mentioned step 2, three completes other evaporation regions except described the first evaporation region.
3. vacuum coating method as claimed in claim 1, it is characterized in that, in described step 3, drive between described substrate to be deposited and described mask plate and relatively move and be specially: drive described substrate to be deposited to move along the first direction that is parallel to described mask plate place plane.
4. vacuum coating method as claimed in claim 3, it is characterized in that, the graph area of described mask plate is less than described the first evaporation region along the size of described first direction along the size of described first direction, the graph area of described mask plate equals described the first evaporation region along the size of described second direction along the size of second direction, and described first direction is perpendicular to described second direction.
5. vacuum coating method as claimed in claim 1, it is characterized in that, in described step 3, drive between described substrate to be deposited and described mask plate and relatively move and be specially: drive described substrate to be deposited to move along the first direction and the second direction that are parallel to described mask plate place plane, described first direction is perpendicular to described second direction.
6. vacuum coating method as claimed in claim 5, it is characterized in that, the graph area of described mask plate is less than described the first evaporation region along the size of described first direction along the size of described first direction, and the graph area of described mask plate is also less than described the first evaporation region along the size of described second direction along the size of described second direction.
7. vacuum coating method as claimed in claim 1, it is characterized in that, in described step 3, drive between described substrate to be deposited and described mask plate and relatively move and be specially: drive described evaporation source and described mask plate to move along the first direction that is parallel to described substrate place plane.
8. vacuum coating method as claimed in claim 7, it is characterized in that, the graph area of described mask plate is less than described the first evaporation region along the size of described first direction along the size of described first direction, the graph area of described mask plate equals described the first evaporation region along the size of described second direction along the size of second direction, and described first direction is perpendicular to described second direction.
9. vacuum coating method as claimed in claim 1, it is characterized in that, in described step 3, drive between described substrate to be deposited and described mask plate and relatively move and be specially: drive described evaporation source and described mask plate to move along the first direction and the second direction that are parallel to described substrate place plane, described first direction is perpendicular to described second direction.
10. vacuum coating method as claimed in claim 9, it is characterized in that, the graph area of described mask plate is less than described the first evaporation region along the size of described first direction along the size of described first direction, and the graph area of described mask plate is also less than described the first evaporation region along the size of described second direction along the size of described second direction.
11. vacuum coating methods as described in claim 1-10 any one, it is characterized in that, described step 3 also comprises: between described substrate to be deposited and described mask plate, relatively moves in process, and the graph area relative position of the first evaporation region and described mask plate described in real time correction in the direction that relatively moves between perpendicular to described substrate to be deposited and described mask plate.
12. vacuum coating methods as claimed in claim 11, it is characterized in that, on described mask plate and described substrate to be deposited, be provided with the calibration marker in described mask plate and described first alignment mark in evaporation region and the graph area of described mask plate and described the first evaporation region.
13. 1 kinds of vacuum coaters, comprise evaporation source, mask plate, evaporation baffle plate and driving mechanism, substrate to be deposited, described mask plate, described evaporation baffle plate and described evaporation source are oppositely arranged successively, the surface of described substrate comprises at least one evaporation region, described evaporation source is relative fixing with the position between mask plate, it is characterized in that, the graph area size of described mask plate is less than arbitrary described evaporation area size, described driving mechanism is for driving between described substrate to be deposited and described mask plate and relatively move in vacuum plating process, make the continuous inswept whole described evaporation of the vaporised gas region through the graph area of described mask plate, form the film that covers described evaporation region.
14. vacuum coaters as claimed in claim 13, it is characterized in that, described vacuum coater is also included in perpendicular to relatively move in the direction aligning gear of the graph area relative position in evaporation region and described mask plate described in real time correction of described substrate to be deposited and described mask plate.
15. vacuum coaters as claimed in claim 14, is characterized in that, are provided with the graph area of described mask plate and the calibration marker in described evaporation region on described mask plate and described substrate to be deposited.
16. vacuum coaters as claimed in claim 13, is characterized in that, described vacuum coater also comprises the contraposition mechanism that contraposition is carried out in described mask plate and described evaporation region.
17. vacuum coaters as claimed in claim 16, is characterized in that, are provided with the alignment mark that contraposition is carried out in described mask plate and described evaporation region on described mask plate and described substrate to be deposited.
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