CN104048196B - 带有固化结构支撑的led照明装置 - Google Patents
带有固化结构支撑的led照明装置 Download PDFInfo
- Publication number
- CN104048196B CN104048196B CN201410073313.XA CN201410073313A CN104048196B CN 104048196 B CN104048196 B CN 104048196B CN 201410073313 A CN201410073313 A CN 201410073313A CN 104048196 B CN104048196 B CN 104048196B
- Authority
- CN
- China
- Prior art keywords
- led
- coating
- light
- led component
- support construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 16
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
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- 241001062009 Indigofera Species 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V1/00—Shades for light sources, i.e. lampshades for table, floor, wall or ceiling lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/051—Rolled
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/802343 | 2013-03-13 | ||
| US13/802,343 | 2013-03-13 | ||
| US13/802,343 US9528689B2 (en) | 2013-03-13 | 2013-03-13 | LED lighting device with cured structural support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104048196A CN104048196A (zh) | 2014-09-17 |
| CN104048196B true CN104048196B (zh) | 2019-01-25 |
Family
ID=50396855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410073313.XA Expired - Fee Related CN104048196B (zh) | 2013-03-13 | 2014-02-28 | 带有固化结构支撑的led照明装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9528689B2 (enExample) |
| EP (1) | EP2778503B1 (enExample) |
| JP (1) | JP6158728B2 (enExample) |
| CN (1) | CN104048196B (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9995474B2 (en) * | 2015-06-10 | 2018-06-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament, LED filament assembly and LED bulb |
| US9353932B2 (en) * | 2013-03-13 | 2016-05-31 | Palo Alto Research Center Incorporated | LED light bulb with structural support |
| US9528689B2 (en) | 2013-03-13 | 2016-12-27 | Palo Alto Research Center Incorporated | LED lighting device with cured structural support |
| US10711962B2 (en) | 2014-09-24 | 2020-07-14 | Anglers-Friend, Llc | Spiral wrap power and lighting system |
| US10317022B2 (en) * | 2014-09-24 | 2019-06-11 | Angler's-Friend, LLC | Spiral wrap lighting system |
| HK1207250A2 (en) * | 2014-10-15 | 2016-01-22 | 新照明设计有限公司 | Substrate for led package, a tridimensional led package having the substrate, a light bulb having the tridimensional led package and methods for producing the same |
| EP3249289A4 (en) * | 2014-12-26 | 2018-05-16 | Sokolov, Yuriy Borisovich | General-purpose led lamp with cast housing/radiator |
| US9523494B2 (en) * | 2015-02-17 | 2016-12-20 | Flextronics Ap, Llc | LED lighting unit |
| MX2017010279A (es) | 2015-02-27 | 2017-12-04 | Colgate Palmolive Co | Sistema para el tratamiento bucal. |
| CN106468402A (zh) * | 2015-08-07 | 2017-03-01 | 深圳市裕富照明有限公司 | Smt工艺的充气led灯泡 |
| WO2017036924A1 (en) * | 2015-09-04 | 2017-03-09 | Philips Lighting Holding B.V. | Lighting device with a flexible circuit strip wrapped around a support |
| ES2627558B1 (es) * | 2016-01-19 | 2018-06-14 | Microplus World Corporation, S.L. | Dispositivo emisor de luz para luminarias con microled de alta eficiencia. |
| CN106468423A (zh) * | 2016-02-03 | 2017-03-01 | 长荣科技发展（北京）有限公司 | 一种led投光灯 |
| JP6603421B2 (ja) | 2016-04-26 | 2019-11-06 | シグニファイ ホールディング ビー ヴィ | フレキシブルな固体照明ストリップ |
| WO2018001781A1 (en) * | 2016-06-28 | 2018-01-04 | Philips Lighting Holding B.V. | Lighting assembly for emitting high intensity light, a light source, a lamp and a luminaire |
| CN106151904A (zh) * | 2016-08-24 | 2016-11-23 | 胡溢文 | 一种可卷绕灯丝的led灯及其制备工艺 |
| EP3539355B1 (en) * | 2016-11-14 | 2020-03-04 | Lumileds Holding B.V. | Method of manufacturing an led lighting assembly |
| TWI607677B (zh) * | 2016-11-21 | 2017-12-01 | 同泰電子科技股份有限公司 | 可撓性線路板結構 |
| EP3649396B1 (en) | 2017-07-06 | 2022-05-11 | Schumacher Electric Corp. | Flashlight |
| US11530783B2 (en) * | 2017-11-20 | 2022-12-20 | Seoul Semiconductor Co., Ltd. | Bulb-type light source |
| KR102459144B1 (ko) * | 2017-11-20 | 2022-10-27 | 서울반도체 주식회사 | 전구형 광원 |
| US10129984B1 (en) * | 2018-02-07 | 2018-11-13 | Lockheed Martin Corporation | Three-dimensional electronics distribution by geodesic faceting |
| US11482568B2 (en) | 2018-06-28 | 2022-10-25 | Lumens Co., Ltd. | Flexible lighiing device and display panel using micro LED chips |
| US11549650B2 (en) * | 2019-01-24 | 2023-01-10 | Signify Holding B.V. | LED filament arrangement |
| US10767816B1 (en) * | 2019-04-24 | 2020-09-08 | Xiamen Eco Lighting Co. Ltd. | Light bulb apparatus |
| JP7645246B2 (ja) * | 2019-09-19 | 2025-03-13 | シグニファイ ホールディング ビー ヴィ | 少なくとも１つの屈曲ユニットを備える発光ダイオードフィラメント構成 |
| TWI687624B (zh) * | 2019-10-25 | 2020-03-11 | 液光固態照明股份有限公司 | 照明裝置 |
| CN114651532A (zh) * | 2019-11-11 | 2022-06-21 | 昕诺飞控股有限公司 | Led灯丝灯和制造螺旋led灯丝的方法 |
| EP4062093B1 (en) * | 2019-11-21 | 2023-04-05 | Signify Holding B.V. | A light emitting device |
| WO2021150462A1 (en) * | 2020-01-20 | 2021-07-29 | 1/1Leia Inc. | Micro-slit scattering element-based backlight, multiview display, and method provding light exclusion zone |
| CN116348710A (zh) * | 2020-10-15 | 2023-06-27 | 昕诺飞控股有限公司 | 照明设备和制造照明设备的方法 |
| EP4244527B1 (en) | 2020-11-10 | 2024-06-05 | Signify Holding B.V. | A led light unit |
| CN116648581A (zh) * | 2021-01-05 | 2023-08-25 | 昕诺飞控股有限公司 | Led灯丝装置 |
| US12435844B2 (en) * | 2021-10-05 | 2025-10-07 | Signify Holding B.V. | LED filament with heat sink |
| WO2023213575A1 (en) * | 2022-05-03 | 2023-11-09 | Signify Holding B.V. | A led filament |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060733A (zh) * | 2007-04-30 | 2007-10-24 | 林万炯 | 柔性条形防水led灯成型工艺 |
| CN201416866Y (zh) * | 2009-04-28 | 2010-03-03 | 林保龙 | 用于发光二极管的板型散热结构 |
| CN202419298U (zh) * | 2012-01-10 | 2012-09-05 | 深圳市科利尔照明科技有限公司 | 一种led灯带 |
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| JP2014179319A (ja) | 2014-09-25 |
| US20140268740A1 (en) | 2014-09-18 |
| US9857031B2 (en) | 2018-01-02 |
| EP2778503A3 (en) | 2015-09-02 |
| US20170089519A1 (en) | 2017-03-30 |
| CN104048196A (zh) | 2014-09-17 |
| JP6158728B2 (ja) | 2017-07-05 |
| EP2778503A2 (en) | 2014-09-17 |
| EP2778503B1 (en) | 2019-05-08 |
| US9528689B2 (en) | 2016-12-27 |
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