CN104040709A - Suction pad - Google Patents
Suction pad Download PDFInfo
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- CN104040709A CN104040709A CN201280065051.1A CN201280065051A CN104040709A CN 104040709 A CN104040709 A CN 104040709A CN 201280065051 A CN201280065051 A CN 201280065051A CN 104040709 A CN104040709 A CN 104040709A
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- mentioned
- cushion part
- semiconductor crystal
- crystal wafer
- cushion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Provided is a suction pad, which can suck, without using complicated equipment, subjects to be sucked, such as semiconductor wafers, without breaking the subjects to be sucked. A suction pad (1) is provided with: a porous pad section (7), which has an upper surface (7a), on which a semiconductor wafer (5) is to be placed, and a lower surface (7b); and a holding section (9) for holding the pad section (7). The pad section (7) has: a first portion (L), which is formed of a first porous material having a predetermined gas transmission quantity in the direction from the upper surface (7a) to the lower surface (7b) of the pad section (7); and a second portion (H), which is formed of a second porous material, which has a gas transmission quantity more than that of the first porous material, said gas transmission quantity being in the direction from the upper surface (7a) to the lower surface (7b) of the pad section (7). The holding section (9) directly connects pores in the first portion (L) and the pores in the second portion (H), said first portion and the second portion forming the pad section (7).
Description
Technical field
The present invention relates to a kind of suction tray, particularly relate to a kind of being configured to and be connected with vacuum source and by making this vacuum source work adsorb the suction tray of tabular absorbate.
Background technology
In the past, in the equipment that semiconductor crystal wafer is carried to ensuing treatment process from certain treatment process, used and adsorb and fix the suction tray as the semiconductor crystal wafer of object conveyor.Such suction tray has the workbench that porous body that utilization distributes porose equably forms.When semiconductor crystal wafer being adsorbed and being fixed on workbench, first make semiconductor crystal wafer contact with the flat upper surface of this workbench, thereby next utilize vacuum pump to make in the hole of porous body evacuation semiconductor crystal wafer be adsorbed and be fixed on suction tray at the flat upper surface of workbench.
But, in recent years, maximize along with semiconductor crystal wafer advances, slimming, for suction tray as described above, also expect suitably to adsorb, fixing maximize, slimming semiconductor crystal wafer.Conventionally, if semiconductor crystal wafer maximizes, slimming, semiconductor crystal wafer becomes easy deflection, and in the case of use suction tray in the past, semiconductor crystal wafer is likely damaged.
; using the absorption of common suction tray, fixingly maximize, slimming semiconductor die bowlder; owing to being distributed with equably the hole of porous body in suction tray; therefore in the time of the vacuum pump work that makes to be connected with suction tray, porose middle simultaneously beginning of institute of the contact-making surface opening between suction tray and porous body adsorbed.
At this, the semiconductor crystal wafer particularly maximizing is difficult to load on suction tray with the state of not deflection, and therefore semiconductor crystal wafer loads on suction tray with the state of deflection.And then, in the time that semiconductor crystal wafer loads on suction tray with the state of deflection, in semiconductor crystal wafer, there is the part contacting with suction tray and the part not contacting with suction tray.
If make vacuum pump work under this state, in all holes of the contact-making surface opening between suction tray and porous body, start the attraction of air simultaneously, adsorb the part contacting with suction tray from semiconductor crystal wafer and start to carry out.Thus, make the external force of the semiconductor crystal wafer distortion of deflection because attracting the difference of speed to produce, the internal stress of semiconductor crystal wafer produces significant uneven, and result semiconductor crystal wafer occurs damaged.
As the damaged technology for preventing such semiconductor crystal wafer, the device that known patent documentation 1 is recorded.
Prior art document
Patent documentation
Patent documentation 1: Japanese kokai publication hei 7-58191 communique
The device of this patent documentation 1 comprises: workbench, and it is for loading semiconductor crystal wafer; Multiple through holes, it is formed at workbench; Electromagnetically operated valve, it is disposed at respectively each stream linking between each through hole and vacuum pump; And control part, it is for controlling electromagnetically operated valve.In the device of patent documentation 1, thereby utilize control part independently to control each electromagnetically operated valve according to the warpage situation of semiconductor crystal wafer and control independently the attraction speed to semiconductor crystal wafer effect from through hole for each through hole, prevent from thus occurring damaged at absorption, fixing semiconductor die bowlder semiconductor crystal wafer.
Summary of the invention
the problem that invention will solve
But, in the device of above-mentioned patent documentation 1, there is such problem: each through hole for the multiple through holes that are formed at workbench arranges electromagnetically operated valve, and then in order individually to control each electromagnetically operated valve, need complicated equipment.This problem becomes remarkable especially in the situation that semiconductor crystal wafer is maximized.
In addition, for example also there is same problem in the case of processing the so large-scale thin plate of the glass plate of FPD (Flat Panel Display) use.
Therefore, the present invention completes in order to solve the above problems a little, and it is a kind of without using complicated equipment just can make the absorbates such as glass plate that semiconductor crystal wafer, FPD use that damaged the suction tray being adsorbed does not occur that its object is to provide.
for the scheme of dealing with problems
In order to address the above problem, the present invention relates to a kind of suction tray, it is configured to vacuum source and is connected, this suction tray is used for by making this vacuum source work adsorb tabular absorbate, it is characterized in that, comprise: the cushion part of porous, it has lower surface and the upper surface for absorbate mounting; And maintaining part, it is for keeping cushion part, and cushion part has: part 1, it utilizes along the 1st porous material of the Air permenbility to the direction of lower surface from the upper surface of cushion part with regulation and forms; And part 2, it utilizes and is forming to 2nd porous material more than this Air permenbility of the 1st porous material of the Air permenbility in the direction of lower surface from the upper surface of cushion part, and maintaining part comprises the stream for the pore of the 1st porous material of formation cushion part and the pore of the 2nd porous material are directly connected in to vacuum source from the lower face side of cushion part.
Adopt the present invention who so forms, there is different Air permenbilities for the cushion part that loads absorbate in the part corresponding from part 1 with the corresponding part of part 2.Thereby if at the upper surface mounting absorbate of such suction tray and be connected evacuation in lower face side starts to make the pore of cushion part with vacuum source, compare with the part 1 of utilizing relative less the 1st porous material of Air permenbility to form, utilize the adsorption rate of the part 2 that the 2nd porous material that Air permenbility is relatively many forms very fast.Therefore,, in the time starting evacuation, first, the part contacting with the part corresponding to part 2 in upper surface cushion part absorbate is adsorbed in cushion part.Subsequently, the part contacting with the part corresponding to part 1 in upper surface cushion part absorbate is adsorbed in cushion part.Like this, utilize two kinds of porous materials with different Air permenbilities to form cushion part, thus the part corresponding with part 1 that can be in the upper surface of cushion part and and the corresponding part of part 2 between produce the poor of adsorption rate.Thus, can absorbate be adsorbed and be fixed on cushion part through two stages, therefore can prevent exceedingly deflection of absorbate, thus, can prevent from concentrating at the excessive stress of the inner generation of absorbate.
In addition, adopt the present invention who forms in this way, can the pore of the 2nd porous material of the pore of the 1st porous material of part 1 relatively slow formation attraction speed and the comparatively faster part 2 of formation attraction speed be directly connected in to vacuum source via stream.Thus, if make the part corresponding from part 1 that vacuum source work just can be in the upper surface of cushion part and and the corresponding part of part 2 between produce different adsorption rate.In this case, owing to not needing to use control valve etc., therefore can prevent absorbate breakage simply to construct.
Adopt other preferred technical schemes of the present invention,
Above-mentioned cushion part has rectangular shape, and above-mentioned part 2 is positioned the bight of this cushion part.
Adopt such structure, the thin plate of rectangle can be positioned to the assigned position in cushion part exactly.
Adopt other preferred technical schemes of the present invention,
Above-mentioned cushion part has round-shaped, and above-mentioned part 2 is positioned the central authorities of this cushion part.
Adopt other preferred technical schemes of the present invention,
Area Ratio between above-mentioned part 1 and the above-mentioned part 2 of the upper surface of above-mentioned cushion part is 5:1～100:1.
the effect of invention
As described above, adopt the present invention, without using complicated equipment just can make the absorbates such as glass plate that semiconductor crystal wafer, FPD use that damaged being adsorbed do not occur.
Brief description of the drawings
Fig. 1 is the stereogram that represents the adsorption system of the suction tray that comprises embodiments of the present invention.
Fig. 2 is the cutaway view of the suction tray of embodiments of the present invention.
Fig. 3 is the vertical view of the maintaining part of the suction tray of embodiments of the present invention.
Fig. 4 is the vertical view that represents an example of the cushion part of embodiments of the present invention.
Fig. 5 is the vertical view of the cushion part of variation of the present invention.
Embodiment
Below, with reference to accompanying drawing, the suction tray of embodiments of the present invention is described.
Fig. 1 is the stereogram that represents the adsorption system of the suction tray that comprises embodiments of the present invention, and Fig. 2 is the cutaway view of the suction tray of embodiments of the present invention.
As shown in Figure 1 and Figure 2, adsorption system comprises suction tray 1 and the pump 3 as vacuum source being connected with suction tray.Suction tray 1 comprises for loading as the cushion part 7 of the semiconductor crystal wafer 5 of absorbate with for keeping the maintaining part 9 of cushion part 7.This suction tray 1 is connected with pump 3 by the connecting pieces such as flexible pipe 11.
Cushion part 7 has the circular plate shape using two smooth circular face as upper surface 7a and lower surface 7b respectively, can load semiconductor crystal wafer 5 at the upper surface of cushion part 7.In the present embodiment, the size shape of the upper surface 7a of cushion part 7 be set to as the roughly the same size shape of the circular semiconductor crystal wafer 5 of absorbate.And as described later, cushion part 7 comprises the surrounding and the relatively many part 2 H of Air permenbility that are disposed at central part and the relatively less part 1 L of Air permenbility and are disposed at part 1 L.
In addition, maintaining part 9 is the circular plate shape of the heavy wall that diameter is larger than the diameter of cushion part 7, is included in the recess of mediad upper opening.Specifically, maintaining part 9 has the 1st circular depressions 13, in the upper surface storage cushion part of the 1st circular depressions 13.The 1st circular depressions 13 is by forming rectangular the inner circumferential side of the sidewall 9a of maintaining part 9 shape cutting.The 1st circular depressions 13 has the diameter roughly the same with the external diameter of cushion part 7, in the time of storage cushion part 7, between cushion part 7 and the sidewall of the 1st circular depressions 13, does not form gap.
Fig. 3 is the vertical view of the maintaining part 9 of the suction tray of embodiments of the present invention.
As shown in FIG. 2 and 3, maintaining part 9 comprises below and diameter 2nd circular depressions 15 less than the diameter of the 1st circular depressions 13 of being located at continuously the 1st circular depressions 13.In the time that cushion part 7 is embedded in to the 1st circular depressions 13, the 2nd circular depressions 15 is covered by cushion part 7, and the ceiling in the space 17 being formed by the 2nd circular depressions 15 and cushion part 7 utilizes the lower surface 7b of cushion part 7 to form.
In addition, be formed with the opening 15a linking for connecting piece 11 in the bottom surface of the 2nd circular depressions 15.Adopt such structure, in maintaining part 9, via the space 17 that utilizes the lower surface 7b of the 2nd circular depressions 15 and cushion part 7 to form, fluid between the pore of cushion part 7 and pump 3 is communicated with.
Fig. 4 is the vertical view that represents an example of cushion part 7.Cushion part 7 utilizes the complex of porous carbon to form.Particularly, cushion part 7 forms by part 1 L and part 2 H are formed as one, and this part 1 L utilizes the 1st porous carbon of the Air permenbility with regulation to form, and this part 2 H utilizes the 2nd porous carbon that Air permenbility is more than the Air permenbility of the 1st porous carbon to form.
The part 1 L that utilizes the 1st porous carbon to form has while overlooking the annular shape that the part 2 H of central circle (specifically cylindric) that is disposed at cushion part 7 is fenced up.And part 2 H is disposed in the central opening of annular part 1 L.
The gamut of such cushion part 7 between upper surface 7a and lower surface 7b have identical horizontal cross sectional geometry, at the cross sectional shape of the central configuration part 2 H of annular part 1 L.The cushion part 7 forming the like this Air permenbility that the performance of the direction to lower surface 7b the 1st porous carbon has from upper surface 7a on edge, part 1 L region, at the edge, region at the part 2 H place Air permenbility that the performance of the direction to lower surface 7b the 2nd porous carbon has from upper surface 7a.
Next, describe the Air permenbility of cushion part in detail.
Air permenbility is illustrated in the amount of certain lower unit interval of pressure through the gas in unit are region.And this Air permenbility utilizes open pore rate [vol%] and the average pore diameter [μ m] of the porous carbon of Archimedes's method mensuration to decide by adjustment.In order to adjust open pore rate [vol%] and the average pore diameter [μ m] of porous carbon, in the pressurization operation in the manufacturing process of porous carbon, adjust the pressure that puts on the body that is formed.
Below, show the Production Example with the open pore rate [vol%] of different porous carbons and two kinds of porous carbons of average pore diameter [μ m].
The forming face of adjusting when the self sintering carbon of average particulate diameter 20 μ m is put into mould and pressurizeed is pressed, by the formed body of having fired with 30 DEG C/hr of programming rate, can manufacture open pore rate and average two kinds of different porous carbons of the porosity in nonoxidizing atmosphere.Forming face while shaping by adjustment presses the example of the porous carbon obtaining as shown in following table 1.
[table 1]
As shown in table 1, the forming face while shaping by increase is pressed, and can manufacture the porous carbon that open pore rate is lower and average pore diameter is less, Air permenbility is less.In addition, the forming face pressure energy when reducing to be shaped enough manufactures that open pore rate is higher and average pore diameter is large, the more porous carbon of Air permenbility.
In the example shown in above-mentioned table 1, the ratio between the Air permenbility of the 1st porous carbon and the Air permenbility of the 2nd porous carbon is about 1:20～1:300.
And, the method for the resin as the means of adjusting Air permenbility by the open pore rate of adjusting porous carbon, decompose when also existence is added on firing of formed body, gasifying.
Next, the effect of the adsorption system that comprises above-mentioned suction tray 1 is described in detail.
For semiconductor crystal wafer being adsorbed in to suction tray 1, first semiconductor crystal wafer 5 is loaded in the upper surface of the cushion part 7 of suction tray 1.Now, if the object that for example semiconductor crystal wafer 5 is circular plate shape makes the center of semiconductor crystal wafer 5 consistent with the center of cushion part 7.If make pump 3 work under this state, the air in the space 17 of maintaining part 9 is attracted to the direction of pump 3 via the connecting piece 11 linking with pump 3.
If the air in space 17 is attracted, attract air from the pore of the 1st porous carbon and the pore of the 2nd porous carbon of cushion part 7, semiconductor crystal wafer 5 starts to adsorb to cushion part 7.In the time that the absorption of semiconductor crystal wafer 5 starts, first the part that is positioned at the upper surface that utilizes the part 2 H that the 2nd more porous carbon of Air permenbility forms of semiconductor crystal wafer 5, near the center of semiconductor crystal wafer 5, be adsorbed to cushion part 7.
Now, as mentioned above, because the attraction speed of part 2 H is more faster than the attraction speed of part 1 L, even if therefore hypothesis semiconductor crystal wafer 5 does not contact with the upper surface of part 2 H, near the center of semiconductor crystal wafer 5, also attracted at first in cushion part 7.Next, start clamping of semiconductor wafers 5 at the adsorption rate part 1 L place slower than the adsorption rate of part 2 H.
Like this, first utilize near the center of part 2 H clamping of semiconductor wafers 5 and firmly fixed, the then excentral part of clamping of semiconductor wafers 5, therefore semiconductor crystal wafer 5 was adsorbed through two stages.Thus, even if load semiconductor crystal wafer 5 deflections in cushion part 7, also can prevent that stress from concentrating on the situation of a part for semiconductor crystal wafer 5.
In addition, in the time that semiconductor crystal wafer is discharged from suction tray 1, pump 3 is switched and sends into air from pump 3 to suction tray 1.Thus, first, being arranged in of semiconductor crystal wafer 5 utilized the part of the upper surface of the part 2 H that the 2nd relatively many porous carbon of Air permenbility of cushion part 7 forms, near the center of semiconductor crystal wafer 5, is released from cushion part 7.
And, if the center of semiconductor crystal wafer 5 is released from cushion part 7, can between cushion part 7 and the upper surface of part 2 H, form space, this interior volume is high pressure.And then if this interior volume becomes high pressure, under the effect of the pressure in space, the semiconductor crystal wafer 5 around space (part contacting with part 1 L) leaves cushion part 7 gradually, space starts the circumferential expansion towards cushion part 7.And then, if spatial spread, inner pressure step-down, but during spatial spread is extremely to a certain degree, air is also admitted to fully from part 1 L.Thus, the remaining part contacting with part 1 L is also released from cushion part 7 gradually.
Next, the part that is arranged in the upper surface that utilizes the part 1 L that the 1st relatively less porous carbon of the Air permenbility of cushion part 7 forms of semiconductor crystal wafer 5, the periphery of semiconductor crystal wafer 5 is released from cushion part 7.Finally, under the compressed-air actuated effect of sending from the upper surface of cushion part 7, semiconductor crystal wafer 5 becomes the state floating from the upper surface of cushion part 7.Thus, also can semiconductor crystal wafer be discharged gradually towards periphery from the center of semiconductor crystal wafer at release semiconductor die bowlder, also can in the time discharging semiconductor crystal wafer 5, prevent semiconductor crystal wafer 5 breakages.
As above, adopt embodiments of the present invention, utilize the 2nd porous carbon that Air permenbility is relatively many to form the position of wanting to start attraction, utilize the 1st relatively less porous carbon of Air permenbility to form other part, can independently start from desired position to attract with the shape of the deflection that loads the semiconductor crystal wafer 5 on cushion part 7 thus.Thus, can prevent from adsorbing time, semiconductor crystal wafer 5 occurs damaged.
The present invention is not limited to above-mentioned execution mode, carries out various changes, distortion in the scope of the technical conceive that can record at claims.
In the above-described embodiment, as mentioned above, the size of the upper surface 7a of cushion part 7, shape and roughly the same as the adsorption plane of the semiconductor crystal wafer 5 of absorbate.But size, the shape of the upper surface 7a of cushion part 7 can suitably change according to the size of the adsorbates such as semiconductor crystal wafer, characteristic or desired adsorption conditions etc.
For example, also can make size that cushion part 7 is formed as its upper surface 7a than the size of the adsorption plane of semiconductor crystal wafer 5 absorbates such as grade greatly, i.e. the diameter of the upper surface 7a toroidal larger than the diameter of circular semiconductor crystal wafer 5.Now, the part 2 H of cushion part 7 is located at the part being covered by semiconductor crystal wafer 5.
By forming by this way cushion part 7, poor with in the upper surface 7a of cushion part 7 and between the adsorption rate of the corresponding part of part 2 H of the adsorption rate that can effectively apply part corresponding with part 1 L in the upper surface 7a of cushion part 7, therefore can prevent the breakage of semiconductor crystal wafer more reliably.
In addition, also can suitably change shape, size, the allocation position of part 2 H.For example, as shown in Fig. 5 (a), also part 2 H can be set as to diameter larger than the diameter in above-mentioned execution mode.And the ratio of the size (area while overlooking) between part 1 L and part 2 H is preferably suitably set in the scope of 5:1～100:1.
And, as shown in Fig. 5 (b), can be also such structure: cushion part is made as to rectangle, circular part 2 H is set in the central, other part is set to part 1 L.In this case, maintaining part etc. also match with the shape of cushion part be made as rectangular-shaped.
And, as shown in Fig. 5 (c), also can make circular part 2 H be configured to the off-centring from the cushion part of rectangle.These examples for example in the case of the such rectangular absorbate of the glass plate used of absorption FPD effectively.
And, as shown in Fig. 5 (d), also can be such structure: the bight that foursquare part 2 H is roughly disposed to the cushion part of rectangle, other part is set to part 1 L, or, as shown in Fig. 5 (e), can be also such structure: foursquare part 2 H is roughly disposed at along the middle position on the long limit of the cushion part of rectangle, and other part is set to part 1 L.
By in this way part 2 H is disposed at rectangle cushion part bight or along on one side configuring part 2 H, can make the location of absorbate easy.For example, in the case of the such relatively large-scale absorbate of glass plate that FPD is used positions, make the bight of cushion part and the bight contraposition of glass plate, keep glass plate and make pump work in this position.Thus, can prevent reliably in absorption in the time that attraction acts on glass plate, glass plate departs from respect to cushion part.The arbitrary position of periphery that is positioned at cushion part at part 2 H, all can reach such effect, effect.
And, as shown in Fig. 5 (f) or Fig. 5 (g), can be also such structure: along one side of the cushion part of rectangle or adjacent both sides configuration part 2 H, other part is set to part 1 L.Adopt such structure also can reach same effect, the effect of structure of (d) with Fig. 5 etc.
In addition, in the above-described embodiment, adopt the structure that forms discoideus space 17 between the 2nd circular depressions 15 of cushion part 7 and support 9, but also can be configured to: change the shape of the circular depressions of support, the space between cushion part 7 and support forms the concentric multiple ring-type streams that are communicated with pump 3 fluids via connecting piece 11.
For example, in the above-described embodiment, as forming the materials'use porous carbon of cushion part, but also can use other the poromeric material such as porous ceramic.
description of reference numerals
1 suction tray; 3 pumps; 5 semiconductor crystal wafers; 7 cushion part; 9 maintaining parts; 13 the 1st circular depressions; 15 the 2nd circular depressions; L part 1; H part 2.
Claims (4)
1. a suction tray, it is configured to vacuum source and is connected, and this suction tray by making this vacuum source work adsorb tabular absorbate, is characterized in that, comprising:
The cushion part of porous, it has lower surface and the upper surface for above-mentioned absorbate mounting; With
Maintaining part, it is for keeping above-mentioned cushion part,
Above-mentioned cushion part has: part 1, and it utilizes along the 1st porous material of the Air permenbility to the direction of above-mentioned lower surface from the above-mentioned upper surface of above-mentioned cushion part with regulation and forms; And part 2, it utilizes at the above-mentioned upper surface from above-mentioned cushion part and forms to the 2nd porous material more than this Air permenbility of above-mentioned the 1st porous material of the Air permenbility in the direction of above-mentioned lower surface,
Above-mentioned maintaining part is directly connected in above-mentioned vacuum source by the pore of above-mentioned the 1st porous material and the pore of above-mentioned the 2nd porous material that form above-mentioned cushion part from the above-mentioned lower face side of above-mentioned cushion part.
2. suction tray according to claim 1, wherein,
Above-mentioned cushion part has rectangular shape, and above-mentioned part 2 is positioned the bight of this cushion part.
3. suction tray according to claim 1, wherein,
Above-mentioned cushion part has round-shaped, and above-mentioned part 2 is positioned the central authorities of this cushion part.
4. suction tray according to claim 1, wherein,
Area Ratio between above-mentioned part 1 and the above-mentioned part 2 of the upper surface of above-mentioned cushion part is 5:1～100:1.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-287381 | 2011-12-28 | ||
| JP2011287381A JP6010811B2 (en) | 2011-12-28 | 2011-12-28 | Suction board |
| PCT/JP2012/084109 WO2013100134A1 (en) | 2011-12-28 | 2012-12-28 | Suction pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104040709A true CN104040709A (en) | 2014-09-10 |
| CN104040709B CN104040709B (en) | 2016-08-24 |
Family
ID=48697611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280065051.1A Active CN104040709B (en) | 2011-12-28 | 2012-12-28 | Suction tray |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6010811B2 (en) |
| KR (1) | KR20140117413A (en) |
| CN (1) | CN104040709B (en) |
| TW (1) | TWI571350B (en) |
| WO (1) | WO2013100134A1 (en) |
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| TWI730150B (en) * | 2016-09-06 | 2021-06-11 | 日商迪思科股份有限公司 | Working clamp table, manufacturing method of porous ceramic suction plate and suction holding system |
| CN113130368A (en) * | 2021-04-13 | 2021-07-16 | 南京中安半导体设备有限责任公司 | Air floatation chuck and wafer geometric parameter measuring device |
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| CN114857172A (en) * | 2022-05-30 | 2022-08-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Air supporting mechanism |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015136754A (en) * | 2014-01-22 | 2015-07-30 | 日立金属株式会社 | Porous sinter plate, vacuum suction pad using the same, and production method of porous sinter plate |
| JP2016012600A (en) * | 2014-06-27 | 2016-01-21 | 京セラ株式会社 | Absorption member |
| CN105081971A (en) * | 2015-08-31 | 2015-11-25 | 平凉市老兵科技研发有限公司 | Transfer sucker for thinning machine |
| GB2557866A (en) * | 2015-10-19 | 2018-07-04 | Advanced Mfg Sheffield Limited | Apparatus and method for machining a thin-walled component |
| CN111874623B (en) * | 2020-07-17 | 2022-08-26 | 苏州精濑光电有限公司 | Adsorption device and carrying device |
| WO2023106859A1 (en) * | 2021-12-08 | 2023-06-15 | 주식회사 기공기술 | Vacuum chuck |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61252632A (en) * | 1985-05-02 | 1986-11-10 | Hitachi Electronics Eng Co Ltd | Close-contacting method for wafer and mask |
| US20030201549A1 (en) * | 2002-03-12 | 2003-10-30 | Tomoyuki Shindo | Pickup apparatus, pickup method and method for manufacturing semiconductor device |
| JP2004014603A (en) * | 2002-06-04 | 2004-01-15 | Ngk Spark Plug Co Ltd | Suction chuck |
| CN1543612A (en) * | 2001-08-13 | 2004-11-03 | ��ʽ����ַ֪21 | Method and system for registering and searching user position information |
| JP2005050855A (en) * | 2003-07-29 | 2005-02-24 | Lintec Corp | Suction transport device |
| JP4423357B1 (en) * | 2008-10-24 | 2010-03-03 | 株式会社タンケンシールセーコウ | Vacuum adsorption device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004319885A (en) * | 2003-04-18 | 2004-11-11 | Disco Abrasive Syst Ltd | Chuck table, and method for grinding semiconductor wafer |
| TWM276650U (en) * | 2005-04-25 | 2005-10-01 | Grain Electronics Inc | Vacuum pad |
| JP4703590B2 (en) * | 2007-03-13 | 2011-06-15 | 京セラ株式会社 | Vacuum adsorption apparatus and adsorption method using the same |
| CN201346752Y (en) * | 2009-01-22 | 2009-11-18 | 华中科技大学 | Special vacuum chuck for flexible printed circuit (FPC) board |
| JP5297823B2 (en) * | 2009-01-27 | 2013-09-25 | 日東電工株式会社 | Adsorption fixing sheet and manufacturing method thereof |
-
2011
- 2011-12-28 JP JP2011287381A patent/JP6010811B2/en active Active
-
2012
- 2012-12-28 WO PCT/JP2012/084109 patent/WO2013100134A1/en active Application Filing
- 2012-12-28 CN CN201280065051.1A patent/CN104040709B/en active Active
- 2012-12-28 TW TW101150931A patent/TWI571350B/en active
- 2012-12-28 KR KR1020147019782A patent/KR20140117413A/en not_active Application Discontinuation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61252632A (en) * | 1985-05-02 | 1986-11-10 | Hitachi Electronics Eng Co Ltd | Close-contacting method for wafer and mask |
| CN1543612A (en) * | 2001-08-13 | 2004-11-03 | ��ʽ����ַ֪21 | Method and system for registering and searching user position information |
| US20030201549A1 (en) * | 2002-03-12 | 2003-10-30 | Tomoyuki Shindo | Pickup apparatus, pickup method and method for manufacturing semiconductor device |
| JP2004014603A (en) * | 2002-06-04 | 2004-01-15 | Ngk Spark Plug Co Ltd | Suction chuck |
| JP2005050855A (en) * | 2003-07-29 | 2005-02-24 | Lintec Corp | Suction transport device |
| JP4423357B1 (en) * | 2008-10-24 | 2010-03-03 | 株式会社タンケンシールセーコウ | Vacuum adsorption device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI730150B (en) * | 2016-09-06 | 2021-06-11 | 日商迪思科股份有限公司 | Working clamp table, manufacturing method of porous ceramic suction plate and suction holding system |
| CN108247139A (en) * | 2018-01-10 | 2018-07-06 | 宁波海蔓汽车科技有限公司 | Transmission gear burr remover |
| CN113130368A (en) * | 2021-04-13 | 2021-07-16 | 南京中安半导体设备有限责任公司 | Air floatation chuck and wafer geometric parameter measuring device |
| CN114147504A (en) * | 2021-12-14 | 2022-03-08 | 江苏集萃精凯高端装备技术有限公司 | Lens fixing device and ultra-precise turning method of lens |
| CN114857172A (en) * | 2022-05-30 | 2022-08-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Air supporting mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI571350B (en) | 2017-02-21 |
| TW201343317A (en) | 2013-11-01 |
| CN104040709B (en) | 2016-08-24 |
| WO2013100134A1 (en) | 2013-07-04 |
| JP6010811B2 (en) | 2016-10-19 |
| KR20140117413A (en) | 2014-10-07 |
| JP2013138056A (en) | 2013-07-11 |
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