JP2010118584A5 - - Google Patents

Description

Wafer mounting device

  The present invention relates to a wafer mounting apparatus for mounting a wafer on a dicing frame via a dicing tape. More specifically, the present invention relates to a wafer mounting apparatus for mounting a wafer having one surface thereof having an uneven shape on a dicing frame via a dicing tape.

Conventionally, in a general semiconductor manufacturing process, after sticking a protective tape on the pattern formation surface of the wafer (surface), thin turned into thick by grinding the back surface of the wafer, then pasted on the protective tape It mounted on a dicing frame state of the wafer through the dicing tape, after stripping the protective tape with a release tape, Rukoto to chips by dicing is performed.

Meanwhile, the diode, in the wafer manufacturing process for a single-function semiconductor (discrete) of the transistor or the like, for forming electrodes on the wafer back surface, forming a metal thin film metal deposition or the like to the wafer backside is performed. In order to form a metal thin film on the backside of the wafer in this way, processing at a high temperature such as sputtering or vapor deposition is required, and the protective tape attached to the pattern forming surface of the wafer cannot withstand the processing temperature, so that it is peeled off. There is a need to. Further, even when the treatment is performed at a low temperature, the protective tape is peeled off before the treatment such as vapor deposition from the side where impurities such as an adhesive used for the protective tape are mixed. Such a wafer for a single function semiconductor is then mounted on a dicing frame via a dicing tape, and is formed into a chip through a dicing process.

  However, due to recent demands for miniaturization of portable devices, the thickness of wafers has been reduced to less than 100 μm, and those with a thickness of 50 μm or less are also being used. It is becoming.

  Therefore, in order to prevent the wafer from warping and chipping and to facilitate handling, an uneven wafer having a ring-shaped rib on the outer periphery of the wafer back surface and an inner peripheral portion ground has also come out (for example, Patent Documents). 1).

  According to this method, the ring-shaped ribs on the outer periphery of the wafer are configured to be thicker than the thickness of the inner peripheral portion, so that chipping of the outer peripheral portion and warpage of the wafer can be prevented and handling becomes easy.

  The wafer forming method will be described with reference to FIGS. 24 (a) to 24 (g) and FIG.

As shown in FIG. 24A, first, a wafer 1 having a circuit pattern formed on the surface is prepared, and then a protective tape is attached to the pattern forming surface of the wafer 1 as shown in FIG. 24A to 24G, the pattern forming surface (front surface) of the wafer 1 is drawn on the lower side in the drawing for convenience of explanation.

  Subsequently, as shown in FIG. 24C, the inner peripheral portion is ground to a predetermined thickness, leaving a ring-shaped rib on the outer periphery of the back surface of the wafer 1 having the protective tape 2 attached to the front surface, and finished with the outer peripheral rib 62. An uneven wafer 1 having a polished surface 61 is formed.

As shown in FIG. 25, the inner peripheral portion is usually ground by grinding the inner peripheral portion of the wafer 1 to some extent with a rough grindstone, and then finish polishing with a fine grindstone. For this reason, a rough grinding surface 63 (thickness d2 is about 100 μm, width L2 is about 0.5 to 0.8 mm) and a finish polishing surface 61 (thickness) are obtained by changing the grinding wheel in the middle of grinding on the inner peripheral grinding portion of the wafer 1. For example, d3 is 50 μm). Note that the thickness d1 of the outer peripheral rib 62 formed in a ring shape is, for example, 725 μm, and the width L1 is, for example, 2.5 mm. Further, the thickness d4 of the protective tape 2 is, for example, 130 μm.

Subsequently the protective tape 2 as shown in FIG. 24 (d) is peeled off by the peeling tape, the metal film 60 is formed by vapor deposition or sputtering or the like on the wafer 1 back surface as shown in FIG. 24 (e), followed by 24 As shown in FIG. 24F, the wafer 1 on which the metal film 60 is formed is again attached to the pattern forming surface, and the wafer 1 is attached to the dicing frame 3 via the dicing tape 4 as shown in FIG. Mounted. The mounted wafer 1 is subjected to a dicing process after the protective tape 2 on the surface is peeled off.

Mount the wafer 1 to the dicing frame 3 is to the wafer 1 rear surface of uneven surface line Nau must have been made, for example, as FIG. 23 (a) and (b).

Figure 23 the wafer 1 on the sticking table 71 as in (a) with its uneven surface on leave placed and held, on the frame base 7 2 provided on the outer periphery outside the whole area of the sticking table 7 1 The dicing frame 3 to which the dicing tape 4 is attached is held in an inclined state.

Then swing the dicing tape 4 with bonding roller 7 4 As shown by the arrow so that the frame stand 7 2 by gradually pressed against the wafer 1 is horizontal against the spring 7 5 which is urged upward Then, the dicing tape 4 is attached to the wafer 1. Frame stand 7 2 became horizontal state is fixed in a horizontal state by an appropriate mechanism.

Wafer 1 as shown in FIG. 23 (b) is mounted on a dicing frame 3, the joining roller 7 4 returns to the initial position.

Thus, the wafer 1 rear surface of uneven surfaces is held on the sticking table 71 the wafer 1 so that the upper surface, the method paste while pressing the dicing tape 4 to the wafer 1 in the bonding roller 74, the wafer 1 can not completely pressed the inner circumferential grinding surface, in particular leaving a periphery ribs 62, the inner peripheral portion has a problem that bubbles are generated at the boundary between the inner peripheral grinding portion and the outer peripheral rib 62 in the wafer 1 is ground .

  Therefore, in order to solve this problem, the outer peripheral rib is left and the dicing tape is pressed and pasted on the wafer with a member fitted inside the outer peripheral rib in a vacuum on the wafer whose inner peripheral portion is ground, A dicing tape is pressed and pasted in a spiral shape with a brush from the center to the outside of the inner peripheral grinding portion (for example, Patent Document 2).

In addition to the above, in order to simplify the wiring operation, a wafer having a bump electrode on the back surface is mounted on a dicing frame via a dicing tape, and then dicing is performed.
JP-A-5-121384 JP 2008-4416 A

However, a method of pressing the inner fitting member Deda Lee single tape into the wafer peripheral grinding portion as in Patent Document 2, in accordance with the inner diameter of the outer peripheral rib of the wafer, fitted member so as to be fitted in the inner fitting member Since the inner fitting member is formed slightly smaller than the inner diameter of the outer peripheral rib, the boundary between the wafer inner peripheral grinding part and the outer peripheral rib cannot be completely pressed. There is a problem that air bubbles are generated.

Further, when the inner fitting member is formed larger than the inner diameter of the outer peripheral rib of the wafer, there is a problem that the inner fitting member and the outer peripheral rib interfere with each other and the wafer is damaged or bubbles are generated.

Further, even if the inner diameter of the inner fitting member and the outer peripheral rib of the wafer is the same diameter, precise positioning is required at the time of the inner fitting, and the control becomes complicated, or the inner peripheral grinding portion and the outer peripheral rib as shown in FIG. There is a step between the roughened surface 63 and the finished polished surface 61 generated at the time of inner circumference grinding at the boundary with 62, and there is a problem that the dicing tape cannot be pressed uniformly over the entire surface.

Furthermore, the method of spirally pressing the dicing tape from the center to the outside of the wafer inner peripheral grinding part with a brush is because the dicing tape is sequentially pressed outward by the spiral motion, so that the dicing tape is rotated in the rotation direction. There is also a problem that wrinkles of the dicing tape are stretched.

In addition, in order to attach the dicing tape along the uneven shape on the back surface of the wafer, the surface of the pressing member needs to have a hardness that does not lose its rigidity. In particular, the dicing tape has a rigidity that supports the wafer. Therefore, a hardness that can overcome this is required.

However, if the hardness of the inner fitting member is increased as in Patent Document 2, the wafer is damaged when the wafer and the inner fitting member are in contact with each other, or if the positioning accuracy is poor, the outer peripheral rib of the wafer and the inner fitting member are in contact with each other. As a result, the wafer may be damaged.

Also, as in Patent Document 2, when the brush is pressed and attached spirally from the center toward the outer periphery, the hardness of the brush overcomes the rigidity of the dicing tape. There is a problem that damages. Conversely, if the internal fitting member or brush is made flexible so as to follow the uneven shape on the back surface of the wafer, the rigidity of the dicing tape is lost, and it becomes difficult to make the dicing tape adhere along the uneven shape on the back surface of the wafer. is there.

Therefore, the difference in height between the wafer in peripheral grinding portion and the outer peripheral ribs, a dicing tape is completely attached in intimate wear on the inner wall of the wafer peripheral grinding portion and the outer peripheral rib Orazu, inner peripheral grinding portion and the outer peripheral There is a problem that chips are scattered during dicing due to poor adhesion at the boundary between ribs. In addition, unless bonding is performed so as to overcome the rigidity of the dicing tape, there is a problem in that the dicing tape is peeled off due to the rigidity over time, and bubbles are spread.

  Even when the inner fitting member is heated and the dicing tape is softened and pasted as in Patent Document 2, it is difficult to make the inner fitting member and the unevenness of the wafer completely adhere to each other. When it does, there exists a problem which a chip | tip peels and scatters from a dicing tape.

It is an object of the present invention, together with paste wrinkles or bubbles without the dicing tape along the wafer backside of the uneven shape formed on the uneven, even so dicing tape does not peel off over time, scattering chips during dicing It is an object of the present invention to provide a wafer mounting apparatus that does not allow the wafer to be mounted.

The bump electrodes or the like on a wafer back surface stuck embedded well dicing tape along the uneven shape of the wafer formed provided et Re concave convex shape is to provide a wafer mounting apparatus which does not scatter the chips during dicing .

Accordingly, the invention of claim 1 is directed to a wafer mounting apparatus for mounting a wafer having one surface formed in a concavo-convex shape on a dicing frame via a dicing tape, and a pair of upper and lower upper frame bodies and lower lower parts supported so as to be movable up and down. consists of a frame, the adhesion of these upper frame and lower frame, while configured such that the inside thereof sealed, the the upper frame is breathable made of an elastic deformable material on its lower surface A member is mounted, and compressed air is introduced to the entire area of the breathable member through a vent hole formed in the upper frame, and a wafer is placed and held on the upper surface of the lower frame. A table surface is formed, and a frame base for holding a dicing frame to which a dicing tape is attached is provided on the entire outer periphery of the lower frame body, The dicing tape is pushed down through the air-permeable member by the lowering movement of the body, and then the wafer held on the table surface of the lower frame body is elastically deformed by the upward movement of the lower frame body. The dicing tape is pressed along the uneven shape and the inside of the upper and lower frames is kept in a sealed state by the close contact between the upper and lower frames, and then the compressed air is introduced from the vents of the upper frame. Is a wafer mounting device in which a dicing tape is attached along the shape of the concavo-convex surface of the wafer by spraying the air from the entire area of the air-permeable member.

  According to a second aspect of the present invention, there is provided the wafer according to the first aspect, wherein the pressing surface of the breathable member is formed in a conical shape so as to press the dicing tape from the central portion toward the outer periphery of the wafer. It is a mounting device.

According to a third aspect of the present invention, in the first or second aspect of the invention, the pair of upper and lower upper frames, a lower frame, and a frame base are provided in a vacuum chamber, and a dicing tape is attached to a wafer . This is a wafer mounting apparatus which is performed in a reduced pressure atmosphere.

Further, the invention of claim 4 is a wafer mounting device for mounting a wafer having one surface of a concavo-convex shape on a dicing frame via a dicing tape, and then re-pressing the dicing tape on the wafer. The upper frame is composed of a pair of upper and lower upper and lower frames that are supported so as to be able to move up and down. The upper frame and the lower frame are in close contact with each other by the close contact between the upper and lower frames. Is configured to install a breathable member made of an elastically deformable material on the lower surface thereof and introduce compressed air to the entire area of the breathable member through a vent formed in the upper frame. A table surface is formed on the upper surface of the lower frame so that the dicing frame on which the wafer is mounted is placed and held so that the wafer is on the lower surface. A frame base for holding the dicing frame portion of the dicing frame on which the wafer is mounted is provided on the entire outer area, and the wafer portion of the dicing frame on which the wafer is mounted is held on the table surface of the lower frame and the dicing frame. Hold the part on the frame base, and then hold the dicing tape on the table surface of the lower frame while elastically deforming the breathable member by pressing the dicing tape through the breathable member by the downward movement of the upper frame The dicing tape is pressed along the uneven shape of the wafer, and the inside of the upper and lower frames is held in a sealed state by the close contact of the upper and lower frames, and then compressed air is introduced from the vent holes of the upper frame. by allowed to inject compressed air from the entire region of the air-permeable member, the irregular surface of the wafer dicing tape A mounting device of the wafer was pasted along the shape.

Further, the invention of claim 5 is a wafer mounting device for remounting the dicing tape on the wafer after mounting the wafer, one surface of which has an uneven shape, on the dicing frame via the dicing tape, A dicing frame comprising a pair of upper and lower upper and lower frames that can be opened and closed. The upper frame is provided with a vent hole for introducing compressed air, and a wafer is mounted inside the lower frame. A table surface on which the wafer is placed on the lower surface, a dicing frame on which the wafer is mounted is placed on the table surface of the lower frame, and the upper frame and the lower frame are brought into close contact with each other. after allowed inside the closed state, brought pressing the wafer dicing tape with compressed air by introducing compressed air through the vent holes of the upper frame da A mounting device of a wafer so as to paste it into along the single tape shape of the uneven surface of the wafer.

In the wafer mounting apparatus, a breathable member made of an elastically deformable material attached to the lower surface of the upper frame body, and the breathable member is pushed down by pressing the wafer against the dicing tape with the lower frame body. while elastically deformed along the uneven shape of the wafer, aeration adhesion of upper and lower frames, after holding its inside a sealed state, and introducing compressed air from the ventilation holes in the upper frame, the introduced compressed air Because the air-permeable member is elastically deformed along the concave and convex shape of the wafer, the dicing tape is pressed by the pressure applied by the compressed air that does not lose the rigidity of the dicing tape. The wafer can be attached in close contact with the concave and convex shape of the wafer, and the wafer is placed on the dicing frame without generating wrinkles or bubbles on the entire surface. It is possible to count.

In addition, if the pressing surface of the air-permeable member is formed in a conical shape so as to press the dicing tape from the central portion of the wafer toward the outer periphery, it can be sequentially pressed outward from the central portion of the wafer. Air bubbles and wrinkles do not enter the tape application surface.

Furthermore, if the upper frame, the lower frame, and the frame base are provided in the vacuum chamber and the wafer and the dicing tape are attached in a reduced pressure atmosphere, further bubbles and wrinkles are generated when the dicing tape is pressed against the wafer. Is unlikely to occur.

Further, by adopting the above configuration, it is possible to retain the rigidity to overcome flexibility and dicing tape stiffness you deformation along the uneven shape of the wafer breathable member, various irregularities It is possible to mount the wafer having a good dicing frame on the wafer.

In addition, a dicing frame on which a wafer is mounted is sealed with an upper chamber and a lower chamber after a dicing tape is pressed and pasted on the wafer with a conventional application roller, brush, internal fitting member, or the like. housed in the chamber, allowed to press the wafer dicing tape with compressed air by introducing compressed air through vents in this state, if as stuck on along the dicing tape to the concavo-convex shape of the wafer, the conventional apparatus The dicing tape that could not be completely attached in step 1 can be further pressed along the concavo-convex shape with compressed air, and mounting along the concavo-convex shape of the wafer can be performed. In addition, a conventional wafer mounting apparatus can be used, and the wafer can be accurately mounted on the dicing frame without cost.

In addition, the wafer mounted on the dicing frame is held on the table surface of the lower frame and the dicing is performed after the dicing tape is pressed and pasted to the wafer with a conventional application roller, brush, internal fitting member or the like. A wafer held on a table surface of the lower frame while holding the frame on a frame base and then elastically deforming the air permeable member by pressing a dicing tape through the air permeable member with the upper frame. while pressing the dicing tape along the uneven shape of the adhesion of these upper and lower frames, the compression thereof after allowed held within a sealed state, and introducing compressed air from the ventilation holes in the upper frame, which is the introduction Because the dicing tape is attached along the shape of the uneven surface of the wafer by spraying air from the entire area of the breathable member You can mount wafer along the shape of the uneven surface of the high adhesion wafer further dicing tape.

  In addition, when applying to a wafer whose inner peripheral portion is ground with the outer peripheral rib remaining, if a breathable member is formed with a diameter larger than the inner peripheral grinding surface of the wafer and reaching the outer peripheral rib, the inner fit is achieved. It is not necessary to increase the positioning accuracy as in the case of making it, and since the flexible air-permeable member is used, the wafer is not damaged.

  Furthermore, since it is mounted on the dicing frame without applying a force in the rotational direction, the dicing tape can be mounted without generating wrinkles or bubbles.

  Further, since the pressing is performed so as to overcome the rigidity of the dicing tape, it is difficult for the dicing tape to be peeled off from the wafer after the pasting, and the time until the dicing tape is used is reduced.

  A wafer mounting apparatus according to a first embodiment of the present invention will be described below with reference to FIGS. 1 to 25 show the wafer, dicing frame, protective tape, and dicing tape in a slightly exaggerated shape and thickness for easy understanding. In addition, the same reference numerals are given to those common to the reference numerals shown in the conventional example.

FIG. 1 is a longitudinal front view of a wafer mounting apparatus 5 according to the first embodiment, in which an upper frame body 6 that presses the dicing tape 4 against the wafer is formed at the upper part, and an uneven shape of the wafer 1 is formed at the lower part. The lower frame 7 that holds the dicing tape attached surface as the upper surface is provided with a frame base 22 that holds the dicing frame 3 with the dicing tape 4 attached to the entire outer periphery of the lower frame 7. Is provided.

The upper frame 6 is provided in parallel with the support frame 15 below a support frame 15 provided horizontally on a machine base (not shown ). On the support frame 15, an elevating cylinder 16 is provided so that its axis can extend downward, and guides 17, 17 are provided on both sides along the elevating cylinder 16. Wherein the lower end of the shaft of the lifting cylinder 16 is the upper frame 6 is fixed, by the action of the upper frame 6 is elevating cylinder 16, the lifting of the position from the upper end position to depress the dicing tape 4 becomes freely ing. The upper frame body 6 has a circular holding frame 8 formed with a concave inner peripheral portion, a circular air-permeable member 13 made of an elastically deformable member, and the air-permeable member 13 by bonding or the like. The breathable member 13 is fixedly supported by the support plate 12 and fixedly supported by the support plate 12 and is fitted and fixed to the concave portion of the holding frame 8 by adhesion or the like.

  Further, as shown in FIG. 2 and FIG. 3, the holding frame 8 is internally provided with a ventilation hole 9 formed in a cross shape toward the concave portion, and has five locations on a support plate 12 that supports the breathable member 13. It is formed so as to communicate with the air-permeable member 13 through an opening 29 provided in the air. Further, a vent pipe 10 for introducing compressed air into the vent hole 9 is provided on the side surface of the holding frame 8, and a valve (not shown) and a pump for sending the compressed air are connected to one end thereof. In addition, a heater 11 for heating the compressed air and the air permeable member 13 is embedded in the holding frame 8 so as to have substantially the same diameter as the air permeable member 13. In addition, a seal 14 such as a rubber ring is provided on the outer periphery of the air-permeable member 13 attached to the holding frame 8.

  The breathable member 13 is preferably one in which a flexible elastic member such as polyurethane foam is elastically deformable along the concave and convex shape of the wafer 1 and each cell communicates so as to be breathable. Can be used.

  Further, the size of the air-permeable member 13 is preferably one that can cover the uneven bonding surface of the wafer 1, and the shape of the air-permeable member 13 is flat on the surface that presses the dicing tape 4. As long as it is elastically deformed along the concavo-convex shape surface of the wafer 1 such as an object having a rounded shape so that the center is convex, or having a conical center part protruding, it can be used without particular limitation. . If this elastic deformation does not completely elastically deform along the concavo-convex shape surface of the wafer 1, if it is elastically deformed to some extent along the concavo-convex shape surface, Since the dicing tape 4 is pressed by the introduction and deforms following the shape of the uneven surface, it can be used without any problem. In addition, when the one with a rounded shape so that the center is convex or the one with a conical center protruding is used, the dicing tape 4 is sequentially pressed from the center toward the outer periphery when pressed against the wafer 1. Therefore, it is preferable in terms of preventing generation of bubbles and wrinkles.

  Next, the lower frame 7 will be described with reference to FIG.

  The lower frame 7 is formed with a circular and concave table surface 20 so as to place and hold the wafer 1 on the upper surface, and a heater 21 is embedded in the lower frame 7 so as to have substantially the same diameter as the table surface 20. Has been. The lower frame body 7 is provided on a support frame 18 provided on a machine base (not shown), and a guide 28 is connected to the lower portion of the lower frame body 7 so as to be movable up and down with respect to the support frame 18.

The guide 28 is fixed on a support plate 27, and a nut member 26 is provided on the support plate 27 so as to be screwed with the ball screw 25. The ball screw 25 is connected to a shaft of a motor 24 fixed to a fixed frame 23 provided below the support frame 18, and the lower frame 7 is supported through the support plate 27 by driving the motor 24. 18 is movable up and down. Further, the lower frame body 7 is raised toward the upper frame body 6 positioned at the descending end where the dicing tape 4 is pushed down, and is in close contact with the upper frame body 6 with the dicing tape 4 interposed therebetween.

Further, a frame base 22 is provided on the support frame 18 so as to surround the lower frame 7 around the entire outer periphery of the lower frame 7 so that the dicing frame 3 is sucked or fixed by an appropriate fixing means. It has become. Dicing frame 3 dicing tape 4 is adhered, the adhesive surface of the dicing tape 4 is fixed so as to lower.

  The above is the configuration of the first embodiment of the present invention. Next, the wafer mounting operation of the first embodiment will be described with reference to FIGS. 4 to 9 and FIG.

Located in the raised position the upper frame 6 as shown in FIG. 4, the lower frame 7 is located in the lowered position, irregularities in an appropriate conveying means (not shown) on the table surface 20 of the lower frame 7 in this state the wafer 1 was on a shaped surface to feed transportable.

Next, the dicing frame 3 to which the dicing tape 4 is bonded is transferred onto the frame base 22 by an appropriate transfer means (not shown) so that the adhesive surface of the dicing tape 4 faces the bonding surface of the wafer 1. Note that the wafer 1 and the dicing frame 3 may be positioned by appropriate positioning means in advance.

The wafer 1 conveyed as shown in FIG. 5 is placed and held on the table surface 20 of the lower frame 7 so that the upper surface thereof substantially coincides with the outer peripheral upper surface of the table surface 20, and the wafer 1 is heated by the heater 21. You may make it hold | maintain the said wafer 1 by adsorption | suction etc. suitably. In addition, the heating with the heater 21 can adjust a heating temperature according to the characteristic of the dicing tape 4, and can also be not heated. Further, the dicing frame 3 to which the dicing tape 4 is attached is placed and fixed on the frame base 22 by an appropriate means such as suction or a fixing claw so that the adhesive surface of the dicing tape 4 and the wafer 1 are not in contact with each other. .

As shown in FIGS. 6 and 18A, the upper frame 6 heated by the heater 11 is lowered by the action of the elevating cylinder 16, and the air-permeable member 13 attached to the lower surface of the upper frame 6 is attached to the dicing tape 4. Press from the non-adhesive surface side and push down the dicing tape 4.
When the dicing tape 4 is pushed down, slack and wrinkles of the dicing tape 4 that are generated by heating, tension at the time of pasting, and the like are stretched, and the dicing tape 4 is stretched. Thus, wrinkles and bubbles are not generated when the dicing tape 4 comes into contact with the wafer 1. The heating with the heater 11 may be performed without adjusting the heating temperature according to the characteristics of the dicing tape 4 or without using the heater 11.

Next, as shown in FIG. 7 and FIG. 18B, the lower frame 7 is raised by driving the motor 24, and the uneven surface of the wafer 1 is pressed against the dicing tape 4, so that the air-permeable member 13 is uneven on the wafer 1. The upper frame body 6 and the lower frame body 7 are brought into close contact with each other by elastically deforming along the shape and holding the dicing tape 4 between the seal 14 of the upper frame body 6 and the outer peripheral upper surface of the lower frame body 7. Keep it sealed. The elastic deformation of the air-permeable member 13 can press the dicing tape 4 against the wafer 1 even if it does not completely follow the uneven shape of the wafer 1 as shown in FIG. It may be deformed along.

  7 and 18 (c), the air-permeable member 13 is elastically deformed along the uneven shape of the wafer 1, and compressed air (for example, a pressure of 0.1 to 0.5 MPa) is air-permeable. The pipe is introduced into the vent hole 9 of the upper frame 7 through the pipe 10, and the compressed air is sent from the opening 29 of the support plate 12 to the breathable member 13 so that the compressed air is directed from the entire area of the breathable member 13 toward the dicing tape 4. Let spray. As a result, the pressure of the compressed air sprayed through the air-permeable member 13 overcomes the rigidity of the dicing tape 4 and further pushes the dicing tape 4 along the uneven shape of the wafer 1, and the dicing tape 4 along the uneven shape of the wafer 1. Is in close contact. The time for introducing and pressurizing this compressed air is preferably about 30 to 90 seconds, and more preferably about 60 seconds from the viewpoint of adhesion and mass productivity (this time is the material of the dicing tape 4 and the uneven shape of the wafer 1, In consideration of mass productivity, it can be appropriately selected without being limited to the above).

  In the above description, the concave / convex shape of the wafer 1 is such that a ring-shaped outer peripheral rib 62 is left on the outer periphery of the wafer 1 and the inner peripheral portion thereof is ground, but the wafer is used as shown in FIGS. The present invention can be applied to a substrate and wafer having various uneven shapes such as a wafer having an uneven shape in which bumps 38 are provided on the back surface of 1 and a substrate of a MEMS (micro electro mechanical system).

  In the above, the dicing tape 4 is pushed down by the upper frame 6 and then the lower frame 7 is pushed up for mounting. However, the dicing tape 4 is pushed down and the lower frame 7 is pushed up continuously. May be.

Also in the case of the wafer 1 having the bumps 38, the dicing tape 4 is pressed and pushed down by the air-permeable member 13 as shown in FIG. Next, as shown in FIG. 19B, the lower frame 6 is pushed up to hold the dicing tape 4 so that the upper frame 6 and the lower frame 7 are brought into close contact with each other so that the inside thereof is hermetically sealed and the air-permeable member 13 is placed. Are elastically deformed along the uneven shape of the wafer 1.

  In this state, as shown in FIG. 19C, compressed air is introduced through the vent hole 9 so that the compressed air is jetted from the breathable member 13 to the entire area, and the dicing tape 4 is moved along the shape of the bump 38 of the wafer 1. Press to adhere.

Thereafter, as shown in FIG. 8, after the compressed air is stopped from flowing and released to the atmosphere, the upper frame 6 is raised by the action of the elevating cylinder 16 to release the close contact with the lower frame 7.

  The dicing frame 3 on which the mounting of the wafer 1 is completed is taken out by an appropriate conveying means (not shown) as shown in FIG. 9 and used for the next dicing process.

  The first embodiment of the first wafer mounting apparatus according to the present invention has been described above. Next, the second embodiment of the wafer mounting apparatus will be described with reference to FIGS. In addition, about the same member, the same thing as the code | symbol of 1st Embodiment is used.

  FIG. 10 is a longitudinal front view of the wafer mounting apparatus according to the second embodiment of the present invention, and the configuration of the upper frame body 6 and the lower frame body 7 is the same as that of the first embodiment, and the description thereof is omitted. To do.

An upper chamber 30a is provided so as to surround the upper frame body 6. The upper chamber 30a is supported by an elevating cylinder 37 provided on a support plate 36, and the support plate 36 is fixed to a column on a machine base (not shown). ing. The upper chamber 30a is adapted to allow lifting up mates with the lower chamber 30b to be described later.

Further, a support frame 34 is erected on the upper portion of the upper chamber 30a, and two elevating cylinders 35, 35 are provided on the upper portion of the support frame 34. The cylinder shafts of the elevating cylinders 35, 35 are in the center. The support plate 33 can be moved up and down by being fixed to a donut-shaped support plate 33 having an opening in the part.

In addition, a guide 32 is attached to the upper chamber 30a, and the lower end of the shaft of the guide 32 is connected to the upper frame 6. The upper end of the shaft of the guide 32 is fixed to the support plate 33. The upper frame 6 is moved up and down with respect to the upper chamber 30 a together with the support plate 33 by the action of the lifting cylinders 35 and 35.

The upper chamber 30a is provided with a vacuum adapter 31 and connected to an appropriate vacuum pump (not shown ). The upper chamber 30a is combined with the lower chamber 30b to form a vacuum chamber, and when the vacuum chamber is formed, the inside of the vacuum chamber can be made a reduced pressure atmosphere through the vacuum adapter 31. . The upper chamber 30a is provided with a ventilation pipe 10 for introducing compressed air into the upper frame 6 from the outside.

  The lower chamber 30b is provided so as to face the upper chamber 30b, and the lower frame 7 is provided in the inside thereof so as to be movable up and down with respect to the lower chamber 30b as in the first embodiment. Further, a frame base 22 is fixedly provided so as to surround the lower frame body 7 in the entire outer periphery of the lower frame body 7.

  The above is the embodiment of the wafer mounting apparatus according to the second embodiment, and the wafer mounting apparatus of the first embodiment is housed in the upper chamber 30a and the lower chamber 30b.

  Next, the mounting operation of the wafer mounting apparatus according to the second embodiment will be described with reference to FIGS.

  As shown in FIG. 11, the wafer 1 positioned on the table surface 20 of the lower frame 7 with the upper chamber 30a opened is transferred by an appropriate transfer means (not shown), and the wafer 1 is placed and held on the table surface 20. To do. In addition, the dicing frame 3 with the dicing tape 4 attached is conveyed onto the frame base 22 by an appropriate means (not shown) so that the adhesive surface of the dicing tape 4 and the uneven surface of the wafer 1 face each other and the wafer 1. Then, the dicing frame 3 is fixed to the frame base 22 by an appropriate means with an interval to the extent that the dicing tape 4 does not adhere.

The upper chamber 30a is lowered by the action of the lifting cylinder 37 as shown in FIG. 12, to form a vacuum chamber in close contact with the lower chamber 30b, evacuated from the vacuum adapter 31 by the action of a vacuum pump (not shown), a vacuum chamber The wafer 1 is heated by the heater 21 while the atmosphere is reduced in pressure (for example, 100 to 1000 Pa). The heating by the heater 21 can be appropriately adjusted according to the material of the dicing tape 4 and may be performed without heating.

  Next, as shown in FIG. 13 and FIG. 18A, the upper frame 6 is lowered by the action of the elevating cylinders 35, 35 while maintaining the reduced pressure atmosphere, and is diced by the air-permeable member 13 while being appropriately heated by the heater 11. Press the tape 4 down.

  As shown in FIGS. 14, 18 (b) and 18 (c), the lower frame body 7 is raised by driving the motor 24 to press the wafer 1 against the dicing tape 4 so that the air-permeable member 13 is brought into the uneven surface of the wafer 1. And compressed air (for example, a pressurizing force of 0.1 to 0.5 MPa) is introduced from the air permeable pipe 10 through the air holes 9 and the openings 29 of the support plate 12 from the entire area of the air permeable member 13. Compressed air is jetted toward the dicing tape 4. The time for introducing and compressing the compressed air may be the same as in the first embodiment.

  As a result, the elastic force of the air-permeable member 13 overcomes the rigidity of the dicing tape 4 by the subsequent jet of pressurized air, and further pushes the dicing tape 4 along the uneven shape of the wafer 1. Is in close contact. Further, since the dicing tape 4 and the wafer 1 are bonded together under a reduced pressure atmosphere, no bubbles are generated.

  As shown in FIG. 15, after the compressed air is stopped from flowing and released to the atmosphere, the reduced pressure atmosphere is released by introducing the atmosphere from the vacuum adapter 31.

  Subsequently, the upper chamber 30a is lifted by the action of the elevating cylinder 37 as shown in FIG. 16, and the dicing frame 4 on which the wafer 1 is mounted by an appropriate transfer mechanism (not shown) as shown in FIG. 17 is subjected to the next dicing process.

  The above is the embodiment of the wafer mounting apparatus according to the second embodiment of the present invention.

  Next, a wafer mounting apparatus according to a third embodiment will be described with reference to FIGS. 20, 22 and 23. FIG.

  In the third embodiment, the wafer 1 is mounted with good adhesion along the uneven surface of the wafer 1 while using a conventional wafer mounting apparatus.

  As a conventional wafer mounting apparatus, for example, the apparatus shown in FIG. 23 described in the background art can be used.

  Further, another apparatus for mounting a wafer as shown in FIG. 22 described below can be used.

  As shown in FIG. 22A, an upper chamber 52a and a lower chamber 52b that can be opened and closed by an appropriate opening and closing mechanism (not shown) are provided. The upper chamber 52a can be rotated by a motor 51 and can be rotated by an outer peripheral rib and inner periphery of the wafer 1. An elastic roller 58 that is elastically deformed along the uneven shape of the boundary between the portions is provided. A plurality of elastic rollers 58 may be arranged in the circumferential direction as appropriate.

  Further, a circular sticking table 55 is provided inside the lower chamber 52b, and the wafer 1 is placed and held on the upper surface thereof. The sticking table 55 can be moved up and down by an appropriate mechanism.

  In addition, a frame base 53 for mounting and fixing the dicing frame 3 to which the dicing tape 4 is attached is provided on the entire outer periphery of the attaching table 55 and can be moved up and down by a cylinder 56.

  Next, the operation of the wafer mounting apparatus will be described. As shown in FIG. 22A, the wafer 1 is placed on the sticking table 55 and the dicing frame 3 on which the dicing tape 4 is stuck is placed on the frame base 53. In addition to mounting and fixing, the upper chamber 52a is closed and a vacuum chamber is formed with the lower chamber 52b.

  As shown in FIG. 22B, the sticking table 55 and the frame base 53 are raised and the elastic roller 58 is pressed so as to straddle the outer peripheral rib and the inner peripheral grinding portion of the wafer 1 to make the elastic roller 58 into the shape of the uneven portion. Elastically deform along. In this state, the motor 51 is driven to rotate the elastic roller 58, and the entire outer peripheral portion of the wafer 1 is pressed to attach the dicing tape 4.

  Thereafter, although not shown, the reduced pressure state is released, the atmosphere is introduced from the vacuum adapter 57, and the inner peripheral grinding part of the wafer 1 is also brought into close contact with the pressure by the atmosphere. The wafer 1 mounted on the dicing frame 3 in this way is used for the wafer mounting apparatus according to the third embodiment of the present invention.

FIG. 20 shows a wafer mounting apparatus according to the third embodiment of the present invention. As shown in FIG. 20A, the upper chamber 47a that can be moved up and down by an appropriate driving means (not shown) is combined with the upper chamber 47a. The lower chamber 47b forms a sealed chamber by being in close contact with each other.

The upper chamber 47a is provided with a ventilation pipe 50, and is connected to a compression pump (not shown) so that compressed air can be vented.

The lower chamber 47b is formed with a table surface 48 for mounting and holding the dicing frame 3 on which the wafer 1 is mounted. Since the illustration is exaggerated for easy understanding, the mounting surface of the wafer 1 on the table surface 48 is formed in a concave shape, but the mounted dicing frame 3 can be mounted flat on the mounting surface. What is necessary is just to comprise. Further, a seal 49 is provided in a portion that is in close contact with the upper chamber 47a of the lower chamber 47b.

  Next, a third embodiment of the present invention will be described.

As shown in FIG. 20A, the mounted dicing frame 3 of the wafer 1 mounted by an appropriate means on the table surface 48 of the lower chamber 47b in the open state is placed so that the dicing tape 4 is the upper surface.

As shown in FIG. 20B, the upper chamber 47a is closed to form a sealed chamber.

  As shown in FIG. 20 (c), compressed air (for example, 0.1 to 0.5 MPa) is introduced into the sealed chamber through the ventilation pipe 50, and the compressed air is jetted toward the dicing tape 4 so that the dicing tape 4 is transferred to the wafer. 1 is pressed along the uneven shape. By doing so, the conventional mounting apparatus can be used effectively, and the dicing tape 4 that has been insufficient with the conventional mounting apparatus can be adhered in close contact with the concave and convex shape of the wafer 1 with higher accuracy. It becomes possible to attach. Further, the wafer 1 and the compressed air may be appropriately heated.

The above is the third embodiment of the present invention. Next, a wafer mounting apparatus 70 according to the fourth embodiment will be described with reference to FIG.

After the dicing tape 4 is attached to the wafer 1 and mounted by the conventional wafer mounting apparatus 70 as shown in FIG. 23 as in the third embodiment, the wafer mounting apparatus of the first embodiment is applied. The dicing tape 4 is pressed and pasted along the concavo-convex shape of the wafer 1, and common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 21A, the upper frame 6 is positioned at the raised position and the lower frame 7 is positioned at the raised position, and the dicing frame 3 on which the wafer 1 is mounted is placed and fixed on the frame base 22. At this time, the upper surface of the dicing frame 3 and the outer peripheral upper surface of the lower frame 7 are set to be substantially flush with each other. In this state, the dicing frame 3 on which the wafer 1 is mounted is placed and fixed on the frame base 22 and the wafer 1 is placed and held on the table surface 20 of the lower frame 7.

As shown in FIG. 21B, the upper frame 6 is lowered by the action of the elevating cylinder 16, the dicing tape 4 is pressed against the wafer 1 by the air permeable member 13, and the air permeable member 13 is moved along the uneven shape of the wafer 1. The upper frame body 6 and the lower frame body 7 are brought into close contact with each other while sandwiching the dicing tape 4 to form a sealed state. At this time, the heater 11 and the heater 21 may be appropriately heated.

  As shown in FIG. 21 (c), compressed air is introduced into the upper frame 6 through the breathable pipe 10 and compressed over the entire area of the breathable member 13 while maintaining the sealed state between the upper frame 6 and the lower frame 7. Air is injected and the dicing tape 4 is pressed along the uneven shape of the wafer 1.

  The above is the embodiment of the present invention, but can be appropriately changed within the scope of the invention. For example, in the first and second embodiments of the present invention, the upper frame body 6 and the lower frame body 7 are provided so as to be movable up and down, but the upper frame body 6 is fixed, and the frame base 22 and the lower frame body 7 May be configured to be movable up and down, and can be applied as long as the same action and effect can be obtained by relative operations. In each embodiment, the wafer 1 with the protective tape 2 attached thereto is used. However, the present invention can be similarly applied to the wafer 1 without the protective tape 2 attached. In this case, the wafer 1 is placed. A protective sheet may be laid on the table surface.

  Moreover, when using a fixed mount wafer in the fourth embodiment, the lower frame 7 may be fixed at an appropriate position.

  The heating of the upper frame 6 by the heater 11 and the heating of the lower frame 7 by the heater 21 can be performed without changing the heating temperature according to the characteristics of the applied dicing tape 4 or using the heater 11 and the heater 21. It can also be pasted.

  In each of the embodiments described above, a circular wafer has been described. However, if the shape of the air-permeable member 13 is changed, it can be used for various rectangular substrates. Further, the thickness of the air-permeable member 13 may be appropriately selected according to the depth of the unevenness of the various substrates.

  When the protective tape 2 is peeled from the mounted wafer 1, the inner peripheral grinding portion of the wafer 1 is concave via the dicing tape 4, so that the inner peripheral grinding surface is convex. Hold it with appropriate means, such as holding the outer peripheral rib and inner peripheral grinding surface with a table that can be controlled independently, or holding the inner peripheral grinding surface part with air pressure Just do it.

1 is a longitudinal sectional front view of a wafer mounting apparatus according to a first embodiment of the present invention. It is a fragmentary sectional view of the upper frame part concerning a 1st embodiment of the present invention. It is an AA direction arrow line view of FIG. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 1st Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 1st Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 1st Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 1st Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 1st Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 1st Embodiment of this invention. It is a vertical front view of the wafer mounting apparatus according to the second embodiment of the present invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 2nd Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 2nd Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 2nd Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 2nd Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 2nd Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 2nd Embodiment of this invention. It is operation | movement explanatory drawing of the wafer mounting apparatus which concerns on the 2nd Embodiment of this invention. (A) thru | or (c) is principal part expansion explanatory drawing which concerns on 1st and 2nd embodiment. (A) thru | or (c) are the principal part expansion explanatory views at the time of applying the 1st and 2nd embodiment to a bump wafer. (A) thru | or (c) is operation | movement explanatory drawing of the mounting apparatus of the wafer which concerns on 3rd Embodiment. (A) thru | or (c) is operation | movement explanatory drawing of the mounting apparatus of the wafer which concerns on 4th Embodiment. (A) And (b) is explanatory drawing showing one Embodiment of the mounting apparatus of a wafer. (A) And (b) is explanatory drawing showing an example of the pasting of the dicing tape to the conventional wafer. (A) thru | or (g) is explanatory drawing which shows an example of the manufacturing process of the conventional wafer in which the outer periphery rib was provided and the inner periphery was ground. It is a principal part expanded sectional view of the conventional wafer in which the outer periphery rib was provided and the inner periphery was ground.

DESCRIPTION OF SYMBOLS 1 Wafer 2 Protective tape 3 Dicing frame 4 Dicing tape 5 Mounting apparatus 6 Upper frame 7 Lower frame 8 Holding frame 9 Vent hole 10 Ventilation pipe 11 Heater 12 Support plate 13 Breathable member 14 Seal 15 Support frame 16 Lifting cylinder 17 Guide 18 Support frame 20 Table surface 21 Heater 22 Frame base 23 Fixed frame 24 Motor 25 Ball screw 26 Nut member 27 Support plate 28 Guide 29 Open hole 30a Upper chamber 30b Lower chamber 31 Vacuum adapter 32 Guide 33 Support plate 34 Support frame 35 Lifting cylinder 36 Support plate 37 Elevating cylinder 38 Bump 39 Mounting device
46 mount device 47a upper chamber 47b lower chamber 48 table surface 49 seal 50 vent pipe 51 motor 52a upper chamber 52b lower chamber 53 frame base 54 heater 55 application table 56 cylinder 57 vacuum adapter 58 elastic roller 60 metal film 61 finish polishing surface 62 outer periphery Rib 63 Rough surface
71 pasting table
72 frames
73 oscillating shaft
74 sticking roller
75 springs
76 units

Claims (5)

In a wafer mounting apparatus that mounts a wafer having one surface with an uneven shape on a dicing frame via a dicing tape,
Liftably consists supported a pair of upper and lower upper frame and lower frame to each other by adhesion of the upper frame and the lower frame, with a configuration such that the inside thereof sealed,
A breathable member made of an elastically deformable material is attached to the lower surface of the upper frame body, and compressed air is introduced to the entire area of the breathable member through a vent hole formed in the upper frame body. Configure
A table surface is formed on the upper surface of the lower frame so as to place and hold a wafer, and a frame base for holding a dicing frame with a dicing tape attached is provided on the entire outer periphery of the lower frame. And
The dicing tape is pushed down through the air-permeable member by the lowering movement of the upper frame, and then held by the table surface of the lower frame while the air-permeable member is elastically deformed by the upward movement of the lower frame. The dicing tape is pressed along the concave and convex shape of the wafer, and the inside of the upper and lower frames is held in a sealed state by the close contact between the upper and lower frames, and then compressed air is introduced from the vents of the upper frame. A wafer mounting apparatus, wherein the compressed air is sprayed from the entire area of the air-permeable member so that the dicing tape is attached along the shape of the uneven surface of the wafer.   2. The wafer mounting apparatus according to claim 1, wherein the pressing surface of the air-permeable member is formed in a conical shape so as to press the dicing tape from the central portion toward the outer periphery of the wafer. 3. The pair of upper and lower upper frames, a lower frame, and a frame base are provided in a vacuum chamber, and a dicing tape is attached to a wafer in a reduced pressure atmosphere. Wafer mounting device. A wafer mounting apparatus for mounting a wafer having one surface with an uneven shape on a dicing frame via a dicing tape, and then pressing the dicing tape against the wafer again.
Consists of a pair of upper and lower upper and lower frames supported so as to be able to move up and down.
A breathable member made of an elastically deformable material is attached to the lower surface of the upper frame body, and compressed air is introduced to the entire area of the breathable member through a vent hole formed in the upper frame body. Configure
A table surface is formed on the upper surface of the lower frame so that a dicing frame on which the wafer is mounted is placed and held so that the wafer is on the lower surface, and the wafer is mounted on the entire outer periphery of the lower frame. A frame base for holding a dicing frame portion of the dicing frame is provided,
The wafer portion of the dicing frame on which the wafer is mounted is held on the table surface of the lower frame body, and the dicing frame portion is held on the frame base. Thereafter, the upper frame body is moved downward through the air-permeable member. While pressing the dicing tape, the air-permeable member is elastically deformed while pressing the dicing tape along the uneven shape of the wafer held on the table surface of the lower frame, Is held in a hermetically sealed state, and then compressed air is introduced from the ventilation holes of the upper frame, and the introduced compressed air is sprayed from the entire area of the air-permeable member, so that the dicing tape is formed into the shape of the uneven surface of the wafer. A wafer mounting device characterized in that the wafer mounting device is attached along. A wafer mounting apparatus for mounting a wafer having one surface with an uneven shape on a dicing frame via a dicing tape, and then pressing the dicing tape against the wafer again .
It consists of a pair of upper and lower chambers that can be opened and closed freely, and a lower chamber,
The upper chamber is provided with a vent hole for introducing compressed air,
A table surface on which a dicing frame on which a wafer is mounted is formed inside the lower chamber,
A dicing frame on which a wafer is mounted is placed on the table surface of the lower chamber so that the wafer is on the lower surface, and the inside of the upper chamber is sealed by close contact between the upper chamber and the lower chamber. A wafer mounting apparatus, wherein a dicing tape is pressed against a wafer with compressed air by introducing compressed air through a vent hole so that the dicing tape is attached along the shape of the concave and convex surface of the wafer.

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