CN104022211A - LED module packaging method - Google Patents
LED module packaging method Download PDFInfo
- Publication number
- CN104022211A CN104022211A CN201410307446.9A CN201410307446A CN104022211A CN 104022211 A CN104022211 A CN 104022211A CN 201410307446 A CN201410307446 A CN 201410307446A CN 104022211 A CN104022211 A CN 104022211A
- Authority
- CN
- China
- Prior art keywords
- led
- support
- encapsulation method
- thorn sheet
- led assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 238000000016 photochemical curing Methods 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 11
- 238000005538 encapsulation Methods 0.000 claims description 28
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 239000011863 silicon-based powder Substances 0.000 claims description 8
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 150000005846 sugar alcohols Polymers 0.000 claims description 4
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 claims description 4
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 3
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims description 3
- 229940051250 hexylene glycol Drugs 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- -1 isoamyl glycol Chemical compound 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000001723 curing Methods 0.000 abstract 2
- 238000012858 packaging process Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Silicon Polymers (AREA)
Abstract
The invention relates to the technical field of LED packaging and in particular relates to an LED module packaging method which is short in production time and very high in production efficiency. The method comprises the following steps: (1) performing glue dispensing; (2) performing chip pricking; (3) performing UV (ultraviolet) photo-curing; (4) performing pressure welding; and (5) packaging, wherein all curing operations in the process adopt UV photo-curing. According to the method, the UV photo-curing is adopted for performing glue dispensing, chip pricking, curing and packaging in the whole LED packaging process, so that the process time is greatly shortened, the production efficiency is improved, the power consumption is low, and the production cost is reduced; the method has relatively large development space and the market competitiveness of the method is improved.
Description
Technical field
The present invention relates to LED encapsulation technology field, refer in particular to a kind of LED assembly encapsulation method that a kind of production time is short, production efficiency is high.
Background technology
LED is a kind of solid-state semiconductor device that can be visible ray by electric energy conversion, and it can be directly luminous energy electric energy conversion.LED is being widely used as a kind of new lighting source material.And LED encapsulation technology has played a very crucial effect to the light extraction efficiency of light-emitting diode.
Traditional LED packaging technology heat reactive resin used in die bond step, it at least toasts 60 minutes in oven heat (temperature is 150 ℃), just can make heat reactive resin solidify; Moreover, silica gel used in a glue step, it toasts 120～300 minutes in oven heat (temperature is 150 ℃), just can make silica gel solidify.Therefore, the time that traditional LED packaging technology need to be longer, production efficiency is low, and power consumption is large, and production cost is high, is unfavorable for automated production, is difficult to meet demand and the market competitiveness of development.
Summary of the invention
The technical problem to be solved in the present invention is: in order to overcome the time that in prior art, LED packaging technology need to be longer, production efficiency is low, power consumption is large, production cost is high, be unfavorable for automated production, be difficult to meet the demand of development and the problem of the market competitiveness, a kind of LED assembly encapsulation method is provided, and in whole LED encapsulation process, employing UV photocuring carries out a glue, thorn sheet solidifies and encapsulation, greatly reduced the process time, improved production efficiency, low in energy consumption, reduced production cost, there is larger development space, improved its market competitiveness.
The technical solution adopted for the present invention to solve the technical problems is: a kind of LED assembly encapsulation method, comprises the steps:
(1) some glue: UV optic-solidified adhesive is filled on the relevant position point of LED support;
(2) thorn sheet: LED chip is fixing on thorn sheet platform, and LED support is placed under thorn sheet platform, with pin, LED chip is stung on corresponding location point one by one under the microscope;
(3) UV photocuring: the good LED support of thorn sheet is placed under UV light source and is cured 5-8 minute;
(4) pressure welding: the two ends of plain conductor are welded in respectively on the electrode of crystal grain and the electrode of support, crystal grain and support are electrically conducted;
(5) encapsulation: inject photocuring LED fluid sealant in LED shaping mold cavity, then insert the LED support that pressure welding is good, UV-irradiation is solidified, and it is moulding that LED is deviate from from die cavity.
As preferably, the plain conductor in described pressure welding step is aluminium wire.
As preferably, described UV optic-solidified adhesive represents with percentage, and it consists of:
Epoxy resin is 20～45%,
Polyalcohol is 13～25%,
Silicon powder is 30～60%,
Silicone coupling agent is 0.5～2%,
Light trigger is 0.1～0.9%.
As preferably, described polyalcohol is for being one or more in ethylene glycol, propylene glycol, butanediol, isoamyl glycol, hexylene glycol or glycerol.
As preferably, described silicone coupling agent is one or more in glycidyl ether oxygen propyl trimethoxy silicane, (3,4-epoxycyclohexyl) ethyl trimethoxy silane or aminopropyl trimethoxysilane.
As preferably, described light trigger is 1173,184,2959, a kind of in TPO or 910.
As preferably, the particle diameter of described silicon powder is 100-1000nm.
The invention has the beneficial effects as follows: a kind of LED assembly encapsulation method provided by the invention, in whole LED encapsulation process, employing UV photocuring carries out a glue, thorn sheet solidifies and encapsulation, greatly reduced the process time, improved production efficiency, low in energy consumption, reduced production cost, there is larger development space, improved its market competitiveness.
Embodiment
Below in conjunction with specific embodiment, further the present invention is set forth, should be understood that and quote embodiment only for the present invention is described, and be not used in, limit the scope of the invention.
Embodiment 1
A LED assembly encapsulation method, is characterized in that comprising the steps:
(1) some glue: UV optic-solidified adhesive is filled on the relevant position point of LED support;
(2) thorn sheet: LED chip is fixing on thorn sheet platform, and LED support is placed under thorn sheet platform, with pin, LED chip is stung on corresponding location point one by one under the microscope;
(3) UV photocuring: the good LED support of thorn sheet is placed under UV light source and is cured 5-8 minute;
(4) pressure welding: the two ends of aluminium wire are welded in respectively on the electrode of crystal grain and the electrode of support, crystal grain and support are electrically conducted;
(5) encapsulation: inject photocuring LED fluid sealant in LED shaping mold cavity, then insert the LED support that pressure welding is good, UV-irradiation is solidified, and it is moulding that LED is deviate from from die cavity,
UV optic-solidified adhesive represents with percentage, and it consists of:
Epoxy resin 45%,
Ethylene glycol 13%,
Particle diameter is that the silicon powder of 100nm is 39.1%,
Glycidyl ether oxygen propyl trimethoxy silicane 2%,
1173?0.9％。
Embodiment 2
A LED assembly encapsulation method, is characterized in that comprising the steps:
(1) some glue: UV optic-solidified adhesive is filled on the relevant position point of LED support;
(2) thorn sheet: LED chip is fixing on thorn sheet platform, and LED support is placed under thorn sheet platform, with pin, LED chip is stung on corresponding location point one by one under the microscope;
(3) UV photocuring: the good LED support of thorn sheet is placed under UV light source and is cured 5-8 minute;
(4) pressure welding: the two ends of aluminium wire are welded in respectively on the electrode of crystal grain and the electrode of support, crystal grain and support are electrically conducted;
(5) encapsulation: inject photocuring LED fluid sealant in LED shaping mold cavity, then insert the LED support that pressure welding is good, UV-irradiation is solidified, and it is moulding that LED is deviate from from die cavity,
UV optic-solidified adhesive represents with percentage, and it consists of:
Epoxy resin 20%,
Propylene glycol 25%,
Particle diameter is that the silicon powder of 1000nm is 54.4%,
(3,4-epoxycyclohexyl) ethyl trimethoxy silane 0.5%,
184?0.1％。
Embodiment 3
A LED assembly encapsulation method, is characterized in that comprising the steps:
(1) some glue: UV optic-solidified adhesive is filled on the relevant position point of LED support;
(2) thorn sheet: LED chip is fixing on thorn sheet platform, and LED support is placed under thorn sheet platform, with pin, LED chip is stung on corresponding location point one by one under the microscope;
(3) UV photocuring: the good LED support of thorn sheet is placed under UV light source and is cured 5-8 minute;
(4) pressure welding: the two ends of aluminium wire are welded in respectively on the electrode of crystal grain and the electrode of support, crystal grain and support are electrically conducted;
(5) encapsulation: inject photocuring LED fluid sealant in LED shaping mold cavity, then insert the LED support that pressure welding is good, UV-irradiation is solidified, and it is moulding that LED is deviate from from die cavity,
UV photocuring represents with percentage, and it consists of:
Epoxy resin 43.5%,
Butanediol 25%,
Particle diameter is that the silicon powder of 500m is 30%,
Aminopropyl trimethoxysilane 1%,
2959?0.5％。
Embodiment 4
A LED assembly encapsulation method, is characterized in that comprising the steps:
(1) some glue: UV optic-solidified adhesive is filled on the relevant position point of LED support;
(2) thorn sheet: LED chip is fixing on thorn sheet platform, and LED support is placed under thorn sheet platform, with pin, LED chip is stung on corresponding location point one by one under the microscope;
(3) UV photocuring: the good LED support of thorn sheet is placed under UV light source and is cured 5-8 minute;
(4) pressure welding: the two ends of aluminium wire are welded in respectively on the electrode of crystal grain and the electrode of support, crystal grain and support are electrically conducted;
(5) encapsulation: inject photocuring LED fluid sealant in LED shaping mold cavity, then insert the LED support that pressure welding is good, UV-irradiation is solidified, and it is moulding that LED is deviate from from die cavity,
UV photocuring represents with percentage, and it consists of:
Epoxy resin 25.6%,
The mixture 13% of isoamyl glycol, hexylene glycol or glycerol,
Particle diameter is that the silicon powder of 600nm is 60%,
The mixture 1% of glycidyl ether oxygen propyl trimethoxy silicane and (3,4-epoxycyclohexyl) ethyl trimethoxy silane,
910?0.4％。
The above-mentioned foundation desirable embodiment of the present invention of take is enlightenment, and by above-mentioned description, relevant staff can, within not departing from the scope of this invention technological thought, carry out various change and modification completely.The technical scope of this invention is not limited to the content on specification, must determine its technical scope according to claim scope.
Claims (7)
1. a LED assembly encapsulation method, is characterized in that comprising the steps:
(1) some glue: UV optic-solidified adhesive is filled on the relevant position point of LED support;
(2) thorn sheet: LED chip is fixing on thorn sheet platform, and LED support is placed under thorn sheet platform, with pin, LED chip is stung on corresponding location point one by one under the microscope;
(3) UV photocuring: the good LED support of thorn sheet is placed under UV light source and is cured 5-8 minute;
(4) pressure welding: the two ends of plain conductor are welded in respectively on the electrode of crystal grain and the electrode of support, crystal grain and support are electrically conducted;
(5) encapsulation: inject photocuring LED fluid sealant in LED shaping mold cavity, then insert the LED support that pressure welding is good, UV-irradiation is solidified, and it is moulding that LED is deviate from from die cavity.
2. LED assembly encapsulation method as claimed in claim 1, is characterized in that: the plain conductor in described pressure welding step is aluminium wire.
3. LED assembly encapsulation method as claimed in claim 1, is characterized in that: described UV optic-solidified adhesive represents with percentage, and it consists of:
Epoxy resin is 20～45%,
Polyalcohol is 13～25%,
Silicon powder is 30～60%,
Silicone coupling agent is 0.5～2%,
Light trigger is 0.1～0.9%.
4. LED assembly encapsulation method as claimed in claim 3, is characterized in that: described polyalcohol is for being one or more in ethylene glycol, propylene glycol, butanediol, isoamyl glycol, hexylene glycol or glycerol.
5. LED assembly encapsulation method as claimed in claim 3, it is characterized in that: described silicone coupling agent is one or more in glycidyl ether oxygen propyl trimethoxy silicane, (3,4-epoxycyclohexyl) ethyl trimethoxy silane or aminopropyl trimethoxysilane.
6. LED assembly encapsulation method as claimed in claim 3, is characterized in that: described light trigger is 1173,184,2959, a kind of in TPO or 910.
7. LED assembly encapsulation method as claimed in claim 3, is characterized in that: the particle diameter of described silicon powder is 100-1000nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410307446.9A CN104022211A (en) | 2014-06-30 | 2014-06-30 | LED module packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410307446.9A CN104022211A (en) | 2014-06-30 | 2014-06-30 | LED module packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104022211A true CN104022211A (en) | 2014-09-03 |
Family
ID=51438868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410307446.9A Pending CN104022211A (en) | 2014-06-30 | 2014-06-30 | LED module packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104022211A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107123728A (en) * | 2017-07-06 | 2017-09-01 | 庞绮琪 | The LED encapsulation structure of high transmission rate |
-
2014
- 2014-06-30 CN CN201410307446.9A patent/CN104022211A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107123728A (en) * | 2017-07-06 | 2017-09-01 | 庞绮琪 | The LED encapsulation structure of high transmission rate |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140903 |
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| RJ01 | Rejection of invention patent application after publication |