CN104031598A - High-thermal-conductivity LED sealant - Google Patents
High-thermal-conductivity LED sealant Download PDFInfo
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- CN104031598A CN104031598A CN201410307718.5A CN201410307718A CN104031598A CN 104031598 A CN104031598 A CN 104031598A CN 201410307718 A CN201410307718 A CN 201410307718A CN 104031598 A CN104031598 A CN 104031598A
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Abstract
The invention relates to the technical field of LED packaging, in particular to a type of high-thermal-conductivity LED sealant. The high-thermal-conductivity LED sealant is made of urethane acrylate, epoxy resin acrylate, reactive diluent, photoinitiator, flatting agents, nanometer metal powder and antifoaming agents. According to the high-thermal-conductivity LED sealant, UV photocuring is adopted, the curing speed is high, the high-thermal-conductivity LED sealant is filled with the nanometer metal powder, and therefore size shrinkage generated after the sealant is solidified can be effectively reduced, the adhesive property is effectively improved after solidification, the high-thermal-conductivity LED sealant has a good dredging effect on heat energy, local overheating caused by heat accumulation of a chip can be effectively prevented from influencing work of the chip, and the thermal aging process of the product is delayed.
Description
Technical field
The present invention relates to LED encapsulation technology field, refer in particular to a kind of high thermal conductivity LED seal gum.
Background technology
LED is a kind of solid-state semiconducter device that can be visible ray by electric energy conversion, and it can be directly luminous energy electric energy conversion.LED is being widely used as a kind of new lighting source material.And LED encapsulation technology has played a very crucial effect to the light extraction efficiency of photodiode.
The feature of ultraviolet light polymerization (UV solidifies) technology is environmental protection and quick, and with respect to thermofixation technology, the advantage of UV curing technology is fast and less energy-consumption.Solvent-based adhesive needs inert solvent conventionally, and it is volatile organic compounds, and curing reaction speed is slow at normal temperatures, although can shorten set time during heating, energy consumption is larger.UV cured adhesive is to utilize rayed to make tackiness agent reach bonding, sealing, fixing etc. object by free radical reaction fast setting.Different from general tackiness agent, it is transparent that UV cured adhesive general requirement base material has one side at least, generally allows exposure light see through and causes the polymerizing curable of tackiness agent.Photoresist is the main part of photocuring (UV solidifies) binding agent (UV binding agent), and it determines the fundamental property of UV binding agent.In numerous photosensitivity oligopolymer, bisphenol A type epoxy resin is be most widely used in radiation curable adhesive industry a kind of, formed cured film hardness is high, glossiness is high, tensile strength is large, chemical proofing is excellent, but also has the shortcomings such as fragility and poor in flexibility and viscosity height simultaneously.The advantages such as epoxy resin has resist chemical, strong adhesion, hardness is high, price is suitable; Can there is photopolymerization or photo-crosslinking in the tackiness agent of preparing as prepolymer with it, not only curing speed is fast for it, and film performance is good under UV-irradiation, and development in recent years is rapid, is day by day subject to people's favor in photocuring system.Due to shortcomings such as fragility and poor in flexibility and viscosity height, make its range of application be subject to certain restriction.
Existing LED internal structure has generally comprised a plurality of parts such as lens, internal lead, insulation formed material, outer lead, crystal-bonding adhesive, LED wafer, lens filling glue, heating column, heat-radiating substrate, phosphor powder layer.In the LED of prior art encapsulation, how in LED encapsulation process, to dispel the heat and become a technical barrier.
Summary of the invention
The technical problem to be solved in the present invention is: in order to overcome in prior art the low problem of radiating efficiency in LED encapsulation process, a kind of high thermal conductivity LED seal gum is provided, in composition, added nano metal powder, make LED seal gum there is good elicitation effect to heat energy, effectively prevent from gathering and causing chip operation that local superheating affects because of chip heat, and delayed product Heat Ageing.
The technical solution adopted for the present invention to solve the technical problems is: a kind of high thermal conductivity LED seal gum, comprises following component:
Urethane acrylate
Epoxy Resin Acrylate
Reactive thinner
Light trigger
Flow agent
Nano metal powder
Defoamer.
A high thermal conductivity LED seal gum, each component and each component weight percent content are:
Urethane acrylate 20-40%
Epoxy Resin Acrylate 30-60%
Reactive thinner 10-30%
Light trigger 3-5%
Flow agent 0.5-3%
Nano metal powder 5-10%
Defoamer 0.5-3%.
As preferably, described nano metal powder is one or more in copper nanoparticle, nano-silver powder, nanometer aluminium powder, nano-nickel powder.
As preferably, the particle diameter of described nano metal powder is at 50-200nm.
As preferably; described light trigger is 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-acetone, 2,4,6-trimethylbenzoyl-diphenyl phosphine oxide, phenyl two (2; 4,6-trimethylbenzoyl) phosphine oxide or st-yrax methyl-phenoxide.
As preferably, described defoamer is polydimethyl siloxane fluid, modified polyorganosiloxane, polyethers or polyacrylic ester.
As preferably, described flow agent be in organic silicon modified by polyether, polyester resin change properties of organic silicon, polyacrylic ester, acrylated polyurethane resin, polydimethylsiloxane, PSI, organic radical modified polyorganosiloxane one or more.
As preferably, described reactive thinner is (methyl) Hydroxyethyl acrylate, (methyl) Propylene glycol monoacrylate, ethoxylation hydroxyethyl (methyl) acrylate, (methyl) lauryl acrylate, (methyl) propyl acrylate, (methyl) butyl acrylate, the just own ester of (methyl) vinylformic acid, (methyl) Isooctyl acrylate monomer, (methyl) cyclohexyl acrylate, (methyl) octadecyl acrylate, (methyl) isobornyl acrylate, (methyl) vinylformic acid tetrahydrofurfural ester, (methyl) glycidyl acrylate, (methyl) vinylformic acid-2-phenoxy ethyl, one or both in alkoxide nonylphenol (methyl) acrylate.
The invention has the beneficial effects as follows: a kind of high thermal conductivity LED seal gum provided by the invention, adopt UV photocuring, solidification rate is high, filled nano metal powder, can effectively reduce the volumetric shrinkage after sealing glue solidifying, effectively improve the adhesive property after solidifying, also make LED seal gum there is good elicitation effect to heat energy, effectively prevent from gathering and causing chip operation that local superheating affects because of chip heat, and delayed product Heat Ageing.
Embodiment
Below in conjunction with specific embodiment, further the present invention is set forth, should be understood that and quote embodiment only for the present invention is described, and be not used in, limit the scope of the invention.
Embodiment 1
A high thermal conductivity LED seal gum, each component and each component weight percent content are:
Urethane acrylate 40%
Epoxy Resin Acrylate 30%
(methyl) Hydroxyethyl acrylate 21%
1-hydroxy-cyclohexyl phenyl ketone 3%
Organic silicon modified by polyether 0.5%
Particle diameter is at the copper nanoparticle 5% of 50nm
Polydimethyl siloxane fluid 0.5%.
Embodiment 2
A high thermal conductivity LED seal gum, each component and each component weight percent content are:
Urethane acrylate 20%
Epoxy Resin Acrylate 60%
(methyl) Propylene glycol monoacrylate 10%
2-hydroxy-2-methyl-1-phenyl-1-acetone 4%
Polyester resin change properties of organic silicon 0.5%
Particle diameter is at the nano-silver powder 5% of 200nm
Modified polyorganosiloxane 0.5%.
Embodiment 3
A high thermal conductivity LED seal gum, each component and each component weight percent content are:
Urethane acrylate 20%
Epoxy Resin Acrylate 31%
Ethoxylation hydroxyethyl (methyl) acrylate and (methyl) lauryl acrylate 30%
2,4,6-trimethylbenzoyl-diphenyl phosphine oxide 5%
Polyacrylic ester 3%
Particle diameter is at the nanometer aluminium powder 8% of 100nm
Polyethers 3%.
Embodiment 4
A high thermal conductivity LED seal gum, each component and each component weight percent content are:
Urethane acrylate 22%
Epoxy Resin Acrylate 36%
(methyl) vinylformic acid-2-phenoxy ethyl and alkoxide nonylphenol (methyl) acrylate 28%
Two (2,4, the 6-trimethylbenzoyl) phosphine oxides 4% of phenyl
Polydimethylsiloxane and PSI 2%
Particle diameter is at the nano-nickel powder 6% of 150nm
Polyacrylic ester 2%.
Embodiment 5
A high thermal conductivity LED seal gum, each component and each component weight percent content are:
Urethane acrylate 23%
Epoxy Resin Acrylate 37%
The just own ester of (methyl) vinylformic acid and (methyl) Isooctyl acrylate monomer 25%
St-yrax methyl-phenoxide 4%
PSI and organic radical modified polyorganosiloxane 2%
Particle diameter is at the nano-nickel powder 6% of 100nm
Polyacrylic ester 3%.
The above-mentioned foundation desirable embodiment of the present invention of take is enlightenment, and by above-mentioned description, relevant staff can, within not departing from the scope of this invention technological thought, carry out various change and modification completely.The technical scope of this invention is not limited to the content on specification sheets, must determine its technical scope according to claim scope.
Claims (8)
1. a high thermal conductivity LED seal gum, is characterized in that comprising following component:
Urethane acrylate
Epoxy Resin Acrylate
Reactive thinner
Light trigger
Flow agent
Nano metal powder
Defoamer.
2. high thermal conductivity LED seal gum as claimed in claim 1, is characterized in that each component and each component weight percent content are:
Urethane acrylate 20-40%
Epoxy Resin Acrylate 30-60%
Reactive thinner 10-30%
Light trigger 3-5%
Flow agent 0.5-3%
Nano metal powder 5-10%
Defoamer 0.5-3%.
3. high thermal conductivity LED seal gum as claimed in claim 1 or 2, is characterized in that: described nano metal powder is one or more in copper nanoparticle, nano-silver powder, nanometer aluminium powder, nano-nickel powder.
4. high thermal conductivity LED seal gum as claimed in claim 3, is characterized in that: the particle diameter of described nano metal powder is at 50-200nm.
5. high thermal conductivity LED seal gum as claimed in claim 1 or 2; it is characterized in that: described light trigger is 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-acetone, 2; 4; 6-trimethylbenzoyl-diphenyl phosphine oxide, phenyl two (2; 4,6-trimethylbenzoyl) phosphine oxide or st-yrax methyl-phenoxide.
6. high thermal conductivity LED seal gum as claimed in claim 1 or 2, is characterized in that: described defoamer is polydimethyl siloxane fluid, modified polyorganosiloxane, polyethers or polyacrylic ester.
7. high thermal conductivity LED seal gum as claimed in claim 1 or 2, is characterized in that: described flow agent be in organic silicon modified by polyether, polyester resin change properties of organic silicon, polyacrylic ester, acrylated polyurethane resin, polydimethylsiloxane, PSI, organic radical modified polyorganosiloxane one or more.
8. high thermal conductivity LED seal gum as claimed in claim 1 or 2, it is characterized in that: described reactive thinner is (methyl) Hydroxyethyl acrylate, (methyl) Propylene glycol monoacrylate, ethoxylation hydroxyethyl (methyl) acrylate, (methyl) lauryl acrylate, (methyl) propyl acrylate, (methyl) butyl acrylate, the just own ester of (methyl) vinylformic acid, (methyl) Isooctyl acrylate monomer, (methyl) cyclohexyl acrylate, (methyl) octadecyl acrylate, (methyl) isobornyl acrylate, (methyl) vinylformic acid tetrahydrofurfural ester, (methyl) glycidyl acrylate, (methyl) vinylformic acid-2-phenoxy ethyl, one or both in alkoxide nonylphenol (methyl) acrylate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410307718.5A CN104031598A (en) | 2014-06-30 | 2014-06-30 | High-thermal-conductivity LED sealant |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410307718.5A CN104031598A (en) | 2014-06-30 | 2014-06-30 | High-thermal-conductivity LED sealant |
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| CN104031598A true CN104031598A (en) | 2014-09-10 |
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| CN201410307718.5A Pending CN104031598A (en) | 2014-06-30 | 2014-06-30 | High-thermal-conductivity LED sealant |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559811A (en) * | 2015-01-13 | 2015-04-29 | 武汉长盈通光电技术有限公司 | Radiation-curable fiber-optic ring tail fiber packaging adhesive |
| CN105860907A (en) * | 2016-04-14 | 2016-08-17 | 宏齐光电子(深圳)有限公司 | Packaging glue for LED packaging |
| CN106065299A (en) * | 2016-07-26 | 2016-11-02 | 刘睿璇 | A kind of preparation method of conductive pressure sensitive adhesive |
| CN106280999A (en) * | 2016-08-29 | 2017-01-04 | 无锡市宝来电池有限公司 | A kind of weather-proof aging-resistant cell panel dirt resistance coatings |
| CN106867440A (en) * | 2016-12-29 | 2017-06-20 | 芜湖研高粘胶新材料有限公司 | A kind of shrinkproof radiating polyurethane sealant |
| CN107108772A (en) * | 2015-04-17 | 2017-08-29 | 积水化学工业株式会社 | Firming body, electronic unit, display element and light wet-cured type resin combination |
| DE202017100766U1 (en) * | 2017-02-13 | 2018-05-15 | Kds Holding Gmbh | Jointing tool and joint material |
| DE202017100765U1 (en) * | 2017-02-13 | 2018-05-15 | Kds Holding Gmbh | Use of a material as joint material and joint material |
| CN109134825A (en) * | 2018-07-18 | 2019-01-04 | 广州市白云化工实业有限公司 | Modified epoxy and its preparation and application |
| CN109306260A (en) * | 2018-08-31 | 2019-02-05 | 江苏京展能源科技有限公司 | Solar energy evacuated effective glazing compound of one kind and preparation method thereof |
| WO2019037805A1 (en) * | 2017-08-22 | 2019-02-28 | Kds Holding Gmbh | Joint sealant, use of the joint sealant, and method for joint sealing |
| CN110291121A (en) * | 2017-02-13 | 2019-09-27 | Kds控股有限公司 | Gap filler, the tool for processing gap filler and external member and illuminating device |
| CN110534632A (en) * | 2019-08-30 | 2019-12-03 | 芯耀光电(深圳)有限公司 | A kind of UV LED packaging technology |
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| CN102719210A (en) * | 2011-03-30 | 2012-10-10 | 中国科学院理化技术研究所 | Insulating heat-conducting adhesive for ultralow temperature |
| CN104046315A (en) * | 2014-06-11 | 2014-09-17 | 深圳职业技术学院 | Ultraviolet dual-curing conductive adhesive and preparation method thereof |
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2014
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Patent Citations (4)
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| CN101392152A (en) * | 2008-09-28 | 2009-03-25 | 广东恒大新材料科技有限公司 | Photo-setting adhesive |
| CN102485822A (en) * | 2010-12-02 | 2012-06-06 | 武汉驿路通光讯有限公司 | Photocuring adhesive and its preparation method |
| CN102719210A (en) * | 2011-03-30 | 2012-10-10 | 中国科学院理化技术研究所 | Insulating heat-conducting adhesive for ultralow temperature |
| CN104046315A (en) * | 2014-06-11 | 2014-09-17 | 深圳职业技术学院 | Ultraviolet dual-curing conductive adhesive and preparation method thereof |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559811A (en) * | 2015-01-13 | 2015-04-29 | 武汉长盈通光电技术有限公司 | Radiation-curable fiber-optic ring tail fiber packaging adhesive |
| CN107108772A (en) * | 2015-04-17 | 2017-08-29 | 积水化学工业株式会社 | Firming body, electronic unit, display element and light wet-cured type resin combination |
| CN105860907A (en) * | 2016-04-14 | 2016-08-17 | 宏齐光电子(深圳)有限公司 | Packaging glue for LED packaging |
| CN106065299A (en) * | 2016-07-26 | 2016-11-02 | 刘睿璇 | A kind of preparation method of conductive pressure sensitive adhesive |
| CN106280999A (en) * | 2016-08-29 | 2017-01-04 | 无锡市宝来电池有限公司 | A kind of weather-proof aging-resistant cell panel dirt resistance coatings |
| CN106867440A (en) * | 2016-12-29 | 2017-06-20 | 芜湖研高粘胶新材料有限公司 | A kind of shrinkproof radiating polyurethane sealant |
| DE202017100766U1 (en) * | 2017-02-13 | 2018-05-15 | Kds Holding Gmbh | Jointing tool and joint material |
| DE202017100765U1 (en) * | 2017-02-13 | 2018-05-15 | Kds Holding Gmbh | Use of a material as joint material and joint material |
| CN110291121A (en) * | 2017-02-13 | 2019-09-27 | Kds控股有限公司 | Gap filler, the tool for processing gap filler and external member and illuminating device |
| WO2019037805A1 (en) * | 2017-08-22 | 2019-02-28 | Kds Holding Gmbh | Joint sealant, use of the joint sealant, and method for joint sealing |
| CN109134825A (en) * | 2018-07-18 | 2019-01-04 | 广州市白云化工实业有限公司 | Modified epoxy and its preparation and application |
| CN109306260A (en) * | 2018-08-31 | 2019-02-05 | 江苏京展能源科技有限公司 | Solar energy evacuated effective glazing compound of one kind and preparation method thereof |
| CN110534632A (en) * | 2019-08-30 | 2019-12-03 | 芯耀光电(深圳)有限公司 | A kind of UV LED packaging technology |
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Application publication date: 20140910 |