CN107057366A - A kind of organopolysiloxane composition of UV-curable and its application in semi-conductor electronic device is prepared - Google Patents

A kind of organopolysiloxane composition of UV-curable and its application in semi-conductor electronic device is prepared Download PDF

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CN107057366A
CN107057366A CN201710016779.XA CN201710016779A CN107057366A CN 107057366 A CN107057366 A CN 107057366A CN 201710016779 A CN201710016779 A CN 201710016779A CN 107057366 A CN107057366 A CN 107057366A
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CN107057366B (en
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康润华
许静文
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Silicon Times Material Technology Co.,Ltd.
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Guangdong Xinyi Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Abstract

The invention discloses it is a kind of can UV photocurings organopolysiloxane composition, comprising：(A) the straight chain polysiloxane of (methyl) acryloxyalkyl；(B) the side chain polysiloxane of the siloxane unit with following formulas：(RSiO3/2)a(R2SiO2/2)b(R3SiO1/2)c(SiO4/2)d(XO1/2)e, wherein R is independently selected from substituted or unsubstituted univalence hydrocarbyl, and wherein at least two R is (methyl) acryloxyalkyl, and X is hydrogen or alkyl, a>0, b >=0, c >=0, d >=0, e >=0 and 0≤b/a≤5,0≤c/a≤0.5,0≤d/ (a+b+c+d)≤0.2,0≤e/ (a+b+c+d)≤0.2；Wherein, the weight of component (B) is 1/99~99/1 relative to the ratio of the weight of component (A)；(C) UV solidifies light trigger；(D) polymerization inhibitor；The present invention arranges in pairs or groups above-mentioned (A) component and (B) component, good mechanical properties have been obtained using UV curing modes, and translucency and anti-yellowing property good polymer, in the packaging technology that can be applied to optics elements, possess great application prospect.

Description

A kind of organopolysiloxane composition of UV-curable and its preparing semiconductor electronic Application in device
Technical field
The invention belongs to organosilicon macromolecule field of material technology, more particularly, to a kind of the poly- organic of UV-curable Silicone composition and its application in semi-conductor electronic device is prepared.
Background technology
In recent years, because organosilicon material has outstanding heat-proof aging with ultraviolet light resistant ability as optics The encapsulating material of element is developed rapidly, and common organopolysiloxane composition encapsulating material is mostly by heating The mode for promoting Si―H addition reaction to solidify obtains the protective coating and sealant of optics elements.But, it is solid by mode of heating Change, on the one hand, hardening time is long, typically wants several hours, therefore the production cycle is long；On the other hand, high temperature solidifies for a long time Harmful effect can be produced to the reliability of electronic component.And UV solidifications are a kind of low temperature, quick curing mode, it allows production Business produces substantial amounts of solidification part in a short time, greatly improves production efficiency, and it is also low to consume energy, to the reliability of electronic component Also it will not have a negative impact.
It is to work as that with si-h bond cross-linking reaction formation elastomer curative part occurs under transition-metal catalyst effect for vinyl The primary curing form of preceding organosilicon LED packaging plastics, and promote vinyl to occur addition with si-h bond by UV light radiation modes It is to report for work that reaction, which forms crosslinked solidification part then fresh in actual applications,.In patent Japanese Unexamined Patent Publication 2010-47646 publications report A kind of photo curable constituent polyorganosiloxane composition, it is by with ultraviolet photoactive (methyl cyclopentadienyl) three Methyl platinum promotes it to occur Si―H addition reaction and crosslinking curing under the light irradiation of 200nm~400nm wavelength.But it is due to by purple Speed is slower during outer light radiation solidification, adds surface after solidification and the problem of after-tacking occurs, general effect is unsatisfactory.
Acrylic resin or the active high, curing rate of polyurethane acroleic acid system it is fast, it is cheap the advantages of in sense Ink, printed substrate on be used as dust and moisture coating and manufacture high density printed electronic circuit board and electronic wafer light Cause that all there is extensive use in terms of resist.As patent CN101665561B discloses a kind of silicone-modified polyurethane third Olefin(e) acid ester dissaving polymer, and its there is as multi-curing coating good adhesive force, more preferably water-fast, solvent resistant and resistance to Frictional force.But, these usual materials have certain yellow in itself and heat-resisting and anti-aging aspect is unsatisfactory, therefore, in light The application learned in components is very limited.
The content of the invention
To solve semiconductor electronic component fast packing, and ensure that the component devices after encapsulation still have good performance And reliable stability, first using the acryloyl-oxy with acrylate and organosiloxane material advantages in the present invention Base is alkylated polysiloxane as the material of main part of semiconductor electronic component encapsulating material.Material has photo-curing rate High, itself water white transparency, while the excellent performance in terms of UV agings and heat ageing, is not easy to occur during long-time use The advantages of xanthochromia, therefore suitable for the packaging technology of semiconductor electronic component particularly light emitting diode (LED).
Therefore, an object of the present invention is just to provide a kind of acryloxyalkyl poly organo of UV-curable Alkane composition, including：
It is a kind of can UV photocurings constituent polyorganosiloxane composition, including following component：
(A) the straight chain polysiloxane of (methyl) acryloxyalkyl；
(B) there is the polysiloxane of following formulas：(RSiO3/2)a(R2SiO2/2)b(R3SiO1/2)c(SiO4/2)d (XO1/2)e, wherein R is independently selected from substituted or unsubstituted univalence hydrocarbyl, and wherein at least two R is (methyl) acryloyl-oxy Base alkyl, X is hydrogen or alkyl, a>0, b >=0, c >=0, d >=0, e >=0 and 0≤b/a≤5,0≤c/a≤0.5,0≤d/ (a+b+c + d)≤0.2,0≤e/ (a+b+c+d)≤0.2；
(C) UV solidifies light trigger：Consumption is enough to promote said composition completion of cure；
(D) polymerization inhibitor：Consumption is enough to ensure that composition does not occur any physically or chemically to change in storage process；
Described (A) is (methyl) acryloxyalkyl that there is each molecule at least three to be joined directly together with Si atoms Straight chain polysiloxane, structure is shown in formula I：
Wherein, described group MA is independently selected from acryloxyalkyl or methacryloxyalkyl；
Described group R1For the straight or branched or cyclic monovalent alkyl of 1 to 12 C atom；
Described group R2For the straight or branched or cyclic monovalent alkyl of 1 to 12 C atom；Or-OH ,-OCH3、- OCH2CH3、-OCH2CH2CH3、-OCH(CH3)2Or-OCH2CH2CH2CH3；
M is the positive integer in 10~10000；
N is the positive integer in 1~50；
Wherein, the weight of component (B) is 1/99~99/1 relative to the ratio of the weight of component (A).
Preferably, the viscosity of (A) component is 1000~25000cps.
Preferably, (A) component is the 3- methacryloxypropyl methoxyl groups in 1000~25000cps selected from viscosity One or more in the 3- methacryloyloxypropyl methyl polysiloxanes of end-blocking.
Preferably, (B) component is
{CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525、{CH3)3SiO1/2}0.3{CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45
One or both of.
Preferably, the 3- for the 3- methacryloxypropyl methoxy groups for being 3000cps when the viscosity of (A) component Methacryloyloxypropyl methyl polysiloxanes, when consumption is 100 parts, (B) component is
{CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525{ CH3)3SiO1/2}0.3{CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45, and above-mentioned (B) The consumption sum of component is 80 parts.
Preferably, (A) component is respectively 1000cps and 20000cps 3- methacryloxypropyl methoxies for viscosity Base end-blocking 3- methacryloyloxypropyl methyl polysiloxanes, and above-mentioned (A) component consumption sum be 100 parts when, (B) Component is
{CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525{ CH3)3SiO1/2}0.3{CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45, and above-mentioned (B) The consumption sum of component is 80 parts.
Preferably, described component (C) is benzophenone, 4- chlorobenzophenones, 4- methyl benzophenones, 4- phenyl hexichol Ketone, o-benzoyl yl benzoic acid methyl esters, methyl benzoylformate, the oxidation of 2,4,6- (trimethylbenzoyl) diphenyl Phosphine, 2,4,6- (trimethylbenzoyl) phenyl-phosphonic acids ethyl ester, phenyl-bis- (2,4,6- trimethylbenzoyls) phosphine oxide, α, α-diethoxy acetophenone, 2- benzyl -2- dimethylaminos -1- (4- morpholinyl phenyls) butanone, 2- methyl isophthalic acids-(4- methylthio phenyls Base) -2- morpholinyl -1- acetone, 2- hydroxy-2-methyl -1- phenylacetones, 1- hydroxy cyclohexyl phenylketones, 2- hydroxyl -4'- (2- Hydroxy ethoxy) -2- methyl phenyl ketones, benzoin dimethylether, the one or more in styrax.
Preferably, described component (D) is p methoxy phenol, MEHQ, hydroquinones, 2,5- dimethyl pair It is a kind of or many in benzenediol, 2,6 di t butyl phenol, phenthazine, 2,2,6,6- tetramethyl -4- hydroxy piperidine -1- oxygen Kind.
The need for according to difference, adhesive accelerant can be added in the composition of the present invention to strengthen its adhesive property. This adhesive accelerant usually contains the organosilicon of alkoxy, epoxy alkyl or 3- methacryloxypropyls in structure Compound or silicone oligomer.The alkoxy includes but is not limited to：Methoxyl group, ethyoxyl, propoxyl group, butoxy and methoxy Base oxethyl or similar alkoxy grp, most preferably methoxyl group.Epoxy alkyl includes but is not limited to：3- glycidoxypropyl groups, 4- Glycidoxy butyl, 2- (3,4- expoxycyclohexyls) ethyl, 3- (3,4- expoxycyclohexyls) propyl group, 4- epoxy radicals butyl Or similar epoxy alkyl.Silicone oligomer can have direct-connected, side chain, ring-type and netted molecular structure.Have the following is above-mentioned The example of organic silicon compound：3- glycidoxypropyltrime,hoxysilanes, 2- (3,4- expoxycyclohexyls) ethyl trimethoxy Base silane, 3- methacryloxypropyl trimethoxy silanes or similar silane compound；Silicone oligomer is included but not It is limited to following construction unit：
The silicone oil silicon resin copolymer of construction unit, content ratio to constituted above unit and The viscosity value of adhesive accelerant product is not limited strictly, but need to make necessary adjustment optimization ensure its with other (A), (B), (C), the intermiscibility of (D) component, with ensure final composition solidify through UV after light transmittance be more than or equal to 85%.
The addition of adhesive accelerant is not limited strictly in composition, depending on lifting effect to caking property and to final solidification Part combination property, optimizes additional proportion, it is proposed that calculated with every 100 parts by weight of component (A) and (B) consumption sum, adds 0.001 ~10 parts by weight.
By the organopolysiloxane composition of above-mentioned UV-curable, due to it is uncured under normal temperature when be liquid, it is easy to fill out Fill in the semi-conductive supports such as LED wafer, by using UV light sources, can be solidified rapidly, therefore easily operation.And then, when When the organopolysiloxane composition of the UV-curable of the present invention includes fluorescent material, because UV curing rates are fast, therefore it can keep away Exempt from the problem of fluorescent material is settled in add-on type LED packaging plastic high temperature cure process so that fluorescent material can equably divide Dissipate inside filling adhesive curing thing, be obviously improved LED luminous efficiencies.
As ultraviolet light source used in the present invention, include but is not limited to：UV-LED lamps, high-pressure sodium lamp, metal halide Lamp, xenon lamp etc..The combination that a kind of light source therein can also be several light sources can be used.Radiation wavelength can be Single wavelength Or continuous wavelength.Solidification energy adds up as 100mj/cm2~200,000mj/cm2, preferably 200mj/cm2~20,000mj/ cm2, more preferably 400mj/cm2~10,000mj/cm2。
The solidification part that the present composition is obtained after solidifying through UV, with good weatherability and light transmittance, it is seen that light The light transmittance of (420nm) through the 1mm thickness solidification part is more than 85%.
In the manufacture of electronic apparatus, composition of the invention is particularly suited for use as adhesive, protective agent, smears, close Seal agent.Therefore another object of the present invention is by the above-mentioned organopolysiloxane composition with ultraviolet light fast solidification characteristic In the packaging technology of semiconductor devices for needing high printing opacity requirement, and it is used together with semiconductor devices.Above-mentioned semiconductor device Part includes but is not limited to diode, transistor, light emitting diode (LED), photo-coupler etc., and be particularly suitable for use in light emitting diode (LED), the semiconductor devices such as photo-coupler.
Compared with prior art, the present invention has advantages below and beneficial effect：
The present invention arranges in pairs or groups above-mentioned (A) component and (B) component, and good mechanical properties, and printing opacity have been obtained using UV solidifications Property and anti-yellowing property good polymer, applied in the packaging technology of optics elements, possessing before greatly application Scape.
Embodiment
The present invention is further illustrated below in conjunction with specific embodiment, but embodiment does not do any type of to the present invention Limit.Unless stated otherwise, the reagent of the invention used, method and apparatus is the art conventional reagent, methods and apparatus.
Unless stated otherwise, agents useful for same and material of the present invention are purchased in market.
Embodiment 1：
Viscosity is the 3- methacryloxypropyl first of 3000cps 3- methacryloxypropyl methoxy groups Based polysiloxane：100 parts；
Hard resin 1
{CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525：60 parts；
Hard resin 2
{CH3)3SiO1/2}0.3{CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1 (SiO4/2)0.45：20 parts；
2- methyl isophthalic acids-(4- methyl mercaptos phenyl) -2- morpholinyl -1- acetone and 2- hydroxy-2-methyl -1- phenylacetones it is mixed Compound：8.5 part；
P methoxy phenol：0.7 part.
After said components are thoroughly mixed uniformly, composition radiates 3000mj/cm through UV- mercury lamps2Tested after energy The performance characteristic of the solidification part.Test result is as shown in table 1.
Embodiment 2：
Viscosity is the 3- methacryloxypropyl first of 3000cps 3- methacryloxypropyl methoxy groups Based polysiloxane：100 parts；
Hard resin 1
{CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525：100 parts；
2- methyl isophthalic acids-(4- methyl mercaptos phenyl) -2- morpholinyl -1- acetone and 2- hydroxy-2-methyl -1- phenylacetones it is mixed Compound：8.5 part；
P methoxy phenol：0.7 part.
After said components are thoroughly mixed uniformly, composition radiates 3000mj/cm through UV- mercury lamps2Tested after energy The performance characteristic of the solidification part.Test result is as shown in table 1.
Embodiment 3
Viscosity is the 3- methacryloxypropyl first of 3000cps 3- methacryloxypropyl methoxy groups Based polysiloxane：100 parts；
Hard resin 2
{CH3)3SiO1/2}0.3{CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1 (SiO4/2)0.45：50 parts；
2- methyl isophthalic acids-(4- methyl mercaptos phenyl) -2- morpholinyl -1- acetone and 2- hydroxy-2-methyl -1- phenylacetones it is mixed Compound：8.5 part；
P methoxy phenol：0.7 part.
Embodiment 4
Viscosity is the 3- methacryloxypropyl first of 1000cps 3- methacryloxypropyl methoxy groups Based polysiloxane：40 parts；
Viscosity is the 3- methacryloxypropyls of 20000cps 3- methacryloxypropyl methoxy groups Methyl polysiloxane：60 parts；
Hard resin 1
{CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525：60 parts；
Hard resin 2
{CH3)3SiO1/2}0.3{CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1 (SiO4/2)0.45：20 parts；
2- methyl isophthalic acids-(4- methyl mercaptos phenyl) -2- morpholinyl -1- acetone and 2- hydroxy-2-methyl -1- phenylacetones it is mixed Compound：8.5 part；
P methoxy phenol：0.7 part.
After said components are thoroughly mixed uniformly, composition radiates 3000mj/cm through UV- mercury lamps2Tested after energy The performance characteristic of the solidification part.Test result is as shown in table 1.
Embodiment 5
Viscosity is the 3- methacryloxypropyl first of 1000cps 3- methacryloxypropyl methoxy groups Based polysiloxane：40 parts；
Viscosity is the 3- methacryloxypropyls of 20000cps 3- methacryloxypropyl methoxy groups Methyl polysiloxane：60 parts；
Hard resin 1
{CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525：100 parts；
2- methyl isophthalic acids-(4- methyl mercaptos phenyl) -2- morpholinyl -1- acetone and 2- hydroxy-2-methyl -1- phenylacetones it is mixed Compound：8.5 part；
P methoxy phenol：0.7 part.
After said components are thoroughly mixed uniformly, composition radiates 3000mj/cm through UV- mercury lamps2Tested after energy The performance characteristic of the solidification part.Test result is as shown in table 1.
Using existing conventional technical means, the performance to the cured product obtained by above-described embodiment and its comparative example is entered Row system evaluation, its result is as shown in table 1 below.
The cured product performance table that the above-described embodiment 1~5 of table 1. is obtained

Claims (10)

1. it is a kind of can UV photocurings constituent polyorganosiloxane composition, it is characterised in that including following component：
(A) the straight chain polysiloxane of (methyl) acryloxyalkyl；
(B) there is the polysiloxane of following formulas：(RSiO3/2)a(R2SiO2/2)b(R3SiO1/2)c(SiO4/2)d(XO1/2)e, Wherein R is independently selected from substituted or unsubstituted univalence hydrocarbyl, and wherein at least two R is (methyl) acryloxyalkyl, X For hydrogen or alkyl, a>0, b >=0, c >=0, d >=0, e >=0 and 0≤b/a≤5,0≤c/a≤0.5,0≤d/ (a+b+c+d)≤ 0.2,0≤e/ (a+b+c+d)≤0.2；
(C) UV solidifies light trigger：Consumption is enough to promote said composition completion of cure；
(D) polymerization inhibitor：Consumption is enough to ensure that composition does not occur any physically or chemically to change in storage process；
Described (A) is the straight of (methyl) acryloxyalkyl that each molecule has that at least three is joined directly together with Si atoms Chain polysiloxane, structure is shown in formula I：
Wherein, described group MA is independently selected from acryloxyalkyl or methacryloxyalkyl；
Described group R1For the straight or branched or cyclic monovalent alkyl of 1 to 12 C atom；
Described group R2For the straight or branched or cyclic monovalent alkyl of 1 to 12 C atom；Or-OH ,-OCH3、-OCH2CH3、- OCH2CH2CH3、-OCH(CH3)2Or-OCH2CH2CH2CH3；
M is the positive integer in 10~10000；
N is the positive integer in 1~50；
Wherein, the weight of component (B) is 1/99~99/1 relative to the ratio of the weight of component (A).
2. it is according to claim 1 can UV photocurings constituent polyorganosiloxane composition, it is characterised in that (A) component Viscosity is 1000~25000cps.
3. it is according to claim 2 can UV photocurings constituent polyorganosiloxane composition, it is characterised in that (A) component select From 3- methacryloxy third of the viscosity for the 3- methacryloxypropyl methoxy groups in 1000~25000cps One or more in ylmethyl polysiloxanes.
4. it is according to claim 3 can UV photocurings constituent polyorganosiloxane composition, it is characterised in that (B) component is {CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525、{CH3)3SiO1/2}0.3 {CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45One or both of.
5. it is according to claim 4 can UV photocurings constituent polyorganosiloxane composition, it is characterised in that when (A) component Viscosity for 3000cps 3- methacryloxypropyl methoxy groups 3- methacryloyloxypropyl methyls gather Siloxanes, when consumption is 100 parts,
(B) component is { CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525With
{CH3)3SiO1/2}0.3{CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45, And the consumption sum of above-mentioned (B) component is 80 parts.
6. it is according to claim 4 can UV photocurings constituent polyorganosiloxane composition, it is characterised in that
(A) component is respectively the 3- of 1000cps and 20000cps 3- methacryloxypropyl methoxy groups for viscosity Methacryloyloxypropyl methyl polysiloxanes, and above-mentioned (A) component consumption sum be 100 parts when,
(B) component is { CH3)3SiO1/2}0.4{CH2=C (CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525With
{CH3)3SiO1/2}0.3{CH2=C (CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45, And the consumption sum of above-mentioned (B) component is 80 parts.
7. the organopolysiloxane composition of UV-curable according to claim 1, it is characterised in that described component (C) it is benzophenone, 4- chlorobenzophenones, 4- methyl benzophenones, 4- phenyl benzophenones, o-benzoyl yl benzoic acid first Ester, methyl benzoylformate, 2,4,6- (trimethylbenzoyl) diphenyl phosphine oxide, 2,4,6- (trimethylbenzoyl) Phenyl-phosphonic acid ethyl ester, phenyl-bis- (2,4,6- trimethylbenzoyls) phosphine oxide, α, α-diethoxy acetophenone, 2- benzyls -2- Dimethylamino -1- (4- morpholinyl phenyls) butanone, 2- methyl isophthalic acids-(4- methyl mercaptos phenyl) -2- morpholinyl -1- acetone, 2- hydroxyls - 2- methyl isophthalic acids-phenylacetone, 1- hydroxy cyclohexyl phenylketones, 2- hydroxyls -4'- (2- hydroxy ethoxies) -2- methyl phenyl ketones, rest in peace One or more in fragrant double methyl ether, styraxes.
8. the organopolysiloxane composition of UV-curable according to claim 1, it is characterised in that described component (D) for p methoxy phenol, MEHQ, hydroquinones, 2,5- dimethyl hydroquinones, 2,6 di t butyl phenol, One or more in phenthazine, 2,2,6,6- tetramethyl -4- hydroxy piperidine -1- oxygen.
9. a kind of organopolysiloxane composition of any described UV-curable of claim 1~8 is preparing semiconductor devices In application.
10. application according to claim 9, it is characterised in that the organopolysiloxane composition of the UV-curable should Encapsulation for semiconductor devices.
CN201710016779.XA 2017-01-10 2017-01-10 UV-curable organopolysiloxane composition and application thereof in preparation of semiconductor electronic device Active CN107057366B (en)

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CN110396391A (en) * 2019-08-02 2019-11-01 郝建强 Ultraviolet light/moisture/hot triple curable organic silicon adhesive
CN110713818A (en) * 2019-11-11 2020-01-21 王安 Ultraviolet/moisture dual fast-curing polysiloxane adhesive composition
CN113025052A (en) * 2019-12-25 2021-06-25 新特能源股份有限公司 UV-curable silicone composition, preparation method and application thereof
CN113185911A (en) * 2021-04-30 2021-07-30 武汉理工大学 Low-viscosity photocuring hyperbranched coating containing organic silicon/modified boron nitride powder and preparation method and application thereof

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CN104610696A (en) * 2015-01-05 2015-05-13 烟台德邦先进硅材料有限公司 Organic silicon composition for UV curing
CN105524589A (en) * 2016-01-18 2016-04-27 矽时代材料科技股份有限公司 LOCA (Liquid Optical Clear Adhesive) and preparation method thereof

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CN104610696A (en) * 2015-01-05 2015-05-13 烟台德邦先进硅材料有限公司 Organic silicon composition for UV curing
CN105524589A (en) * 2016-01-18 2016-04-27 矽时代材料科技股份有限公司 LOCA (Liquid Optical Clear Adhesive) and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110396391A (en) * 2019-08-02 2019-11-01 郝建强 Ultraviolet light/moisture/hot triple curable organic silicon adhesive
CN110713818A (en) * 2019-11-11 2020-01-21 王安 Ultraviolet/moisture dual fast-curing polysiloxane adhesive composition
CN113025052A (en) * 2019-12-25 2021-06-25 新特能源股份有限公司 UV-curable silicone composition, preparation method and application thereof
CN113185911A (en) * 2021-04-30 2021-07-30 武汉理工大学 Low-viscosity photocuring hyperbranched coating containing organic silicon/modified boron nitride powder and preparation method and application thereof

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