CN107057366B - UV-curable organopolysiloxane composition and application thereof in preparation of semiconductor electronic device - Google Patents
UV-curable organopolysiloxane composition and application thereof in preparation of semiconductor electronic device Download PDFInfo
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- CN107057366B CN107057366B CN201710016779.XA CN201710016779A CN107057366B CN 107057366 B CN107057366 B CN 107057366B CN 201710016779 A CN201710016779 A CN 201710016779A CN 107057366 B CN107057366 B CN 107057366B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The inventionDisclosed is a UV-curable organopolysiloxane composition comprising: (A) (meth) acryloxyalkylated linear polyorganosiloxanes; (B) branched polyorganosiloxanes having siloxane units of the general formula: (RSiO)3/2)a(R2SiO2/2)b(R3SiO1/2)c(SiO4/2)d(XO1/2)eWherein R is independently selected from substituted or unsubstituted monovalent hydrocarbon groups, and wherein at least two of R are (meth) acryloyloxyalkyl groups, X is hydrogen or an alkyl group, a>0, b is more than or equal to 0, c is more than or equal to 0, d is more than or equal to 0, e is more than or equal to 0, b/a is more than or equal to 0 and less than or equal to 5, c/a is more than or equal to 0 and less than or equal to 0.5, d/(a + b + c + d) is more than or equal to 0 and less than or equal to 0.2, and e/(a + b + c + d) is more than or equal to 0 and less; wherein the weight ratio of the component (B) to the component (A) is 1/99-99/1; (C) a UV curing photoinitiator; (D) a polymerization inhibitor; according to the invention, the component (A) and the component (B) are matched, and the polymer with good mechanical property, light transmittance and yellowing resistance is obtained by using a UV curing mode, so that the polymer can be applied to the packaging process of optical device elements and has a great application prospect.
Description
Technical Field
The invention belongs to the technical field of organic silicon high polymer materials, and particularly relates to a UV-curable polyorganosiloxane composition and application thereof in preparation of semiconductor electronic devices.
Background
In recent years, silicone materials have been rapidly developed as encapsulating materials for optical device elements because of their excellent resistance to heat aging and ultraviolet radiation, and the conventional encapsulating materials of organopolysiloxane compositions have been mostly used to obtain protective coatings and sealants for optical device elements by heating to promote hydrosilylation curing. However, the curing is carried out by heating, on one hand, the curing time is long, generally several hours, so the production period is long; on the other hand, high-temperature long-time curing also adversely affects the reliability of electronic components. UV curing is a low temperature, fast curing method that allows manufacturers to produce a large number of cured parts in a short time, greatly improves production efficiency, consumes less energy, and does not negatively affect the reliability of electronic components.
The vinyl and the silicon hydrogen bond are subjected to a cross-linking reaction under the action of a transition metal catalyst to form an elastomer curing piece, which is the main curing form of the current organic silicon LED packaging adhesive, and the vinyl and the silicon hydrogen bond are promoted to be subjected to an addition reaction in a UV light radiation mode to form the cross-linked body curing piece, which is reported in practical application. In Japanese patent application laid-open No. 2010-47646, a photocurable polyorganosiloxane composition is reported which is crosslinked and cured by accelerating hydrosilylation of (methylcyclopentadienyl) trimethylplatinum having ultraviolet light activity under irradiation of light having a wavelength of 200nm to 400 nm. However, the overall effect is not ideal due to the slow speed of curing by ultraviolet radiation and the problem of surface tack-back after curing.
The acrylic resin or polyurethane acrylic system has the advantages of high activity, high curing speed, low price and the like, and has wide application in the aspects of being used as dustproof and moistureproof coating on photosensitive ink and printed circuit boards, manufacturing photoresists of high-density printed electronic circuit boards and electronic wafers and the like. For example, patent CN101665561B discloses a siloxane modified urethane acrylate hyperbranched polymer, and as a multi-curing coating, the siloxane modified urethane acrylate hyperbranched polymer has good adhesion, and better water resistance, solvent resistance and friction resistance. However, these materials themselves generally have a certain yellow color and are not desirable in terms of heat resistance and aging resistance, and thus, their application to optical device elements is greatly limited.
Disclosure of Invention
In order to solve the problem of fast packaging of semiconductor electronic elements and ensure that packaged element devices still have good performance and reliable stability, the invention adopts the acryloxy alkylated polyorganosiloxane which has the advantages of both acrylate and organic siloxane materials as the main material of the semiconductor electronic element packaging material for the first time. The material has the advantages of high photocuring rate, no color and transparency, excellent performance in UV aging and thermal aging, difficult yellowing in long-term use and the like, and is suitable for the packaging process of semiconductor electronic elements, particularly Light Emitting Diodes (LEDs).
Accordingly, it is an object of the present invention to provide a UV-curable acryloxyalkylated polyorganosiloxane composition comprising:
a UV light-curable polyorganosiloxane composition comprising the following components:
(A) (meth) acryloxyalkylated linear polyorganosiloxanes;
(B) a polyorganosiloxane having the general formula: (RSiO)3/2)a(R2SiO2/2)b(R3SiO1/2)c(SiO4/2)d(XO1/2)eWherein R is independently selected from substituted or unsubstituted monovalent hydrocarbon groups, and wherein at least two of R are (meth) acryloyloxyalkyl groups, X is hydrogen or an alkyl group, a>0, b is more than or equal to 0, c is more than or equal to 0, d is more than or equal to 0, e is more than or equal to 0, b/a is more than or equal to 0 and less than or equal to 5, c/a is more than or equal to 0 and less than or equal to 0.5, d/(a + b + c + d) is more than or equal to 0 and less than or equal to 0.2, and e/(a + b + c + d) is more than or equal to 0 and less;
(C) UV curing photoinitiator: in an amount sufficient to promote complete curing of the composition;
(D) polymerization inhibitor: in an amount sufficient to ensure that the composition does not undergo any physical or chemical change during storage;
the (A) is a linear polyorganosiloxane with at least 3 (methyl) acryloyloxyalkyl directly connected with Si atoms in each molecule, and the structure is shown as a formula I:
wherein the group MA is independently selected from acryloxyalkyl or methacryloxyalkyl;
the group R1Is a linear or branched or cyclic monovalent hydrocarbon radical of 1 to 12C atoms;
the group R2Is a linear or branched or cyclic monovalent hydrocarbon radical of 1 to 12C atoms; or-OH, -OCH3、-OCH2CH3、-OCH2CH2CH3、-OCH(CH3)2or-OCH2CH2CH2CH3；
m is a positive integer selected from 10-10000;
n is a positive integer selected from 1 to 50;
wherein the weight ratio of the component (B) to the component (A) is 1/99-99/1.
Preferably, the viscosity of the (A) component is 1000 to 25000 cps.
Preferably, the (A) component is one or more selected from 3-methacryloxypropylmethoxy-terminated 3-methacryloxypropylmethylpolysiloxane having a viscosity of 1000 to 25000 cps.
Preferably, the component (B) is
{CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525、{CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45
One or two of them.
Preferably, when the (A) component is a 3-methacryloxypropylmethoxy-terminated 3-methacryloxypropylmethylpolysiloxane having a viscosity of 3000cps used in an amount of 100 parts, the (B) component is
{CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525And { CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45And the sum of the using amounts of the components (B) is 80 parts.
Preferably, the (A) component is 3-methacryloxypropylmethoxy-terminated 3-methacryloxypropylmethylpolysiloxane having a viscosity of 1000cps and 20000cps, respectively, and the sum of the amounts of the (A) components is 100 parts, and the (B) component is
{CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525And { CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45And the sum of the using amounts of the components (B) is 80 parts.
Preferably, the component (C) is benzophenone, 4-chlorobenzophenone, 4-methylbenzophenone, 4-phenylbenzophenone, methyl o-benzoylbenzoate, methyl benzoylformate, 2,4,6- (trimethylbenzoyl) diphenylphosphine oxide, ethyl 2,4,6- (trimethylbenzoyl) phenylphosphonate, phenyl-bis (2,4, 6-trimethylbenzoyl) phosphine oxide, α -diethoxyacetophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone, 2-methyl-1- (4-methylthiophenyl) -2-morpholino-1-propanone, 2-hydroxy-2-methyl-1-phenylpropanone, or a mixture thereof, 1-hydroxycyclohexyl benzophenone, 2-hydroxy-4' - (2-hydroxyethoxy) -2-methyl propiophenone, benzoin dimethyl ether and one or more kinds of benzoin.
Preferably, the component (D) is one or more of p-methoxyphenol, p-hydroxyanisole, hydroquinone, 2, 5-dimethyl hydroquinone, 2, 6-di-tert-butylphenol, phenothiazine and 2,2,6, 6-tetramethyl-4-hydroxypiperidine-1-oxyl.
Depending on the requirements, adhesion promoters may be added to the compositions of the invention to enhance their adhesive properties. Such adhesion promoters generally structurally contain alkoxy, epoxyalkyl or 3-methacryloxypropyl organosilicon compounds or organosilicon oligomers. Such alkoxy groups include, but are not limited to: methoxy, ethoxy, propoxy, butoxy and methoxyethoxy or similar alkoxy groups, with methoxy being most preferred. Alkylene oxide groups include, but are not limited to: 3-glycidoxypropyl group, 4-glycidoxybutyl group, 2- (3, 4-epoxycyclohexyl) ethyl group, 3- (3, 4-epoxycyclohexyl) propyl group, 4-epoxybutyl group or similar epoxyalkyl groups. The silicone oligomers may have straight-chain, branched, cyclic, and network molecular structures. The following are examples of the above-mentioned organosilicon compounds: 3-glycidoxypropyltrimethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, or similar silane compounds; silicone oligomers include, but are not limited to, the following structural units:
The amount of the adhesion promoter to be added to the composition is not particularly restricted, and it is recommended to add 0.001 to 10 parts by weight per 100 parts by weight of the sum of the amounts of the components (A) and (B) in view of the adhesion promoting effect and the overall properties of the final cured product, and the addition ratio is optimized.
Since the UV-curable organopolysiloxane composition is liquid at room temperature when uncured, it can be easily filled in a semiconductor holder such as an LED wafer, and it can be cured quickly by using a UV light source, and therefore it is easy to handle. Furthermore, when the UV-curable organopolysiloxane composition comprises the fluorescent powder, the UV curing speed is high, so that the problem of sedimentation of the fluorescent powder in the high-temperature curing process of the addition type LED packaging adhesive can be avoided, the fluorescent powder can be uniformly dispersed in the cured substance of the filling adhesive, and the LED light-emitting efficiency is remarkably improved.
The ultraviolet light source used in the present invention includes, but is not limited to: UV-LED lamps, high-pressure mercury lamps, metal halide lamps, xenon lamps, and the like. Can be used forSo that one of the light sources can be used or a combination of several light sources can be used. The radiation wavelength may be a single wavelength or a continuous wavelength. The curing energy is cumulatively 100mj/cm2～200,000mj/cm2Preferably 200mj/cm2～20,000mj/cm2More preferably 400mj/cm2～10,000mj/cm2。
The cured piece obtained by UV curing the composition has good weather resistance and light transmittance, and the light transmittance of visible light (420nm) passing through the cured piece with the thickness of 1mm is more than 85 percent.
The composition of the present invention is particularly suitable for use as an adhesive, a protective agent, a coating agent, a sealing agent in the production of electronic and electric appliances. Therefore, another object of the present invention is to use the above-mentioned organopolysiloxane composition having a rapid ultraviolet light curing characteristic in a process for encapsulating a semiconductor device requiring a high light transmission requirement, and to use it together with a semiconductor device. The semiconductor device includes, but is not limited to, a diode, a transistor, a Light Emitting Diode (LED), a photo coupler, and the like, and is particularly suitable for a semiconductor device such as a Light Emitting Diode (LED), a photo coupler, and the like.
Compared with the prior art, the invention has the following advantages and beneficial effects:
according to the invention, the component (A) and the component (B) are matched, and the polymer with good mechanical property, light transmittance and yellowing resistance is obtained by using UV curing, so that the polymer has a great application prospect when being applied to the packaging process of optical device elements.
Detailed Description
The present invention is further illustrated by the following specific examples, which are not intended to limit the invention in any way. Reagents, methods and apparatus used in the present invention are conventional in the art unless otherwise indicated.
Unless otherwise indicated, reagents and materials used in the present invention are commercially available.
Example 1:
3-methacryloxypropyl methoxy terminated 3-methacryloxypropyl methyl polysiloxane having a viscosity of 3000 cps: 100 parts of (A);
solid resin 1
{CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525: 60 parts;
solid resin 2
{CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45: 20 parts of (1);
mixture of 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone and 2-hydroxy-2-methyl-1-phenylpropanone: 8.5 parts;
p-methoxyphenol: 0.7 part.
The components are fully stirred and uniformly mixed, and the composition is radiated by a UV-mercury lamp at 3000mj/cm2The cured parts were tested for performance characteristics after energy. The test results are shown in table 1.
Example 2:
3-methacryloxypropyl methoxy terminated 3-methacryloxypropyl methyl polysiloxane having a viscosity of 3000 cps: 100 parts of (A);
solid resin 1
{CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525: 100 parts of (A);
mixture of 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone and 2-hydroxy-2-methyl-1-phenylpropanone: 8.5 parts;
p-methoxyphenol: 0.7 part.
The components are fully stirred and uniformly mixed, and the composition is radiated by a UV-mercury lamp at 3000mj/cm2The cured parts were tested for performance characteristics after energy. The test results are shown in table 1.
Example 3
3-methacryloxypropyl methoxy terminated 3-methacryloxypropyl methyl polysiloxane having a viscosity of 3000 cps: 100 parts of (A);
solid resin 2
{CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45: 50 parts of a mixture;
mixture of 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone and 2-hydroxy-2-methyl-1-phenylpropanone: 8.5 parts;
p-methoxyphenol: 0.7 part.
Example 4
3-methacryloxypropyl methoxy terminated 3-methacryloxypropyl methylpolysiloxane with a viscosity of 1000 cps: 40 parts of a mixture;
3-methacryloxypropyl methoxy terminated 3-methacryloxypropyl methylpolysiloxane having a viscosity of 20000 cps: 60 parts;
solid resin 1
{CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525: 60 parts;
solid resin 2
{CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45: 20 parts of (1);
mixture of 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone and 2-hydroxy-2-methyl-1-phenylpropanone: 8.5 parts;
p-methoxyphenol: 0.7 part.
The components are fully stirred and uniformly mixed, and the composition is radiated by a UV-mercury lamp at 3000mj/cm2The cured parts were tested for performance characteristics after energy. The test results are shown in table 1.
Example 5
3-methacryloxypropyl methoxy terminated 3-methacryloxypropyl methylpolysiloxane with a viscosity of 1000 cps: 40 parts of a mixture;
3-methacryloxypropyl methoxy terminated 3-methacryloxypropyl methylpolysiloxane having a viscosity of 20000 cps: 60 parts;
solid resin 1
{CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525: 100 parts of (A);
mixture of 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone and 2-hydroxy-2-methyl-1-phenylpropanone: 8.5 parts;
p-methoxyphenol: 0.7 part.
The components are fully stirred and uniformly mixed, and the composition is radiated by a UV-mercury lamp at 3000mj/cm2The cured parts were tested for performance characteristics after energy. The test results are shown in table 1.
The properties of the cured products obtained in the above examples and comparative examples were systematically evaluated by the conventional techniques, and the results are shown in table 1 below.
TABLE 1 Properties of cured products obtained in examples 1 to 5
Claims (9)
1. A UV-light curable polyorganosiloxane composition characterized by comprising the following components:
(A) (meth) acryloxyalkylated linear polyorganosiloxanes;
(B) polyorganosiloxane, the polyorganosiloxane being { CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525Or { CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45One or two of them;
(C) UV curing photoinitiator: in an amount sufficient to promote complete curing of the composition;
(D) polymerization inhibitor: in an amount sufficient to ensure that the composition does not undergo any physical or chemical change during storage;
the (A) is a linear polyorganosiloxane with at least 3 (methyl) acryloyloxyalkyl directly connected with Si atoms in each molecule, and the structure is shown as a formula I:
wherein the group MA is independently selected from acryloxyalkyl or methacryloxyalkyl;
the group R1Is a linear or branched or cyclic monovalent hydrocarbon radical of 1 to 12C atoms;
the group R2Is a linear or branched or cyclic monovalent hydrocarbon radical of 1 to 12C atoms; or-OH, -OCH3、-OCH2CH3、-OCH2CH2CH3、-OCH(CH3)2or-OCH2CH2CH2CH3；
m is a positive integer selected from 10-10000;
n is a positive integer selected from 1 to 50;
wherein the weight ratio of the component (B) to the component (A) is 1/99-99/1.
2. The UV-curable polyorganosiloxane composition according to claim 1, wherein the viscosity of the (A) component is 1000 to 25000 cps.
3. The UV-curable polyorganosiloxane composition according to claim 2, wherein the component (A) is one or more selected from 3-methacryloxypropylmethoxy-terminated 3-methacryloxypropylmethylpolysiloxane having a viscosity of 1000 to 25000 cps.
4. The UV-curable polyorganosiloxane composition according to claim 1, wherein when the (A) component has a viscosity of 3000cps of 3-methacryloxypropylmethoxy-terminated 3-methacryloxypropylmethylpolysiloxane in an amount of 100 parts, the (B) component is { CH3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525And { CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45And the sum of the using amounts of the components (B) is 80 parts.
5. The UV-curable polyorganosiloxane composition according to claim 1, wherein the component (A) is a 3-methacryloxypropylmethoxy-terminated 3-methacryloxypropylmethylpolysiloxane having a viscosity of 1000cps and 20000cps, respectively, and the component (B) is { CH, when the components (A) are used in a total amount of 100 parts3)3SiO1/2}0.4{CH2＝C(CH3)COO-(CH2)3-Si(CH3)2O1/2}0.075(SiO4/2)0.525And { CH3)3SiO1/2}0.3{CH2＝C(CH3)COO-(CH2)3-Si(CH3)O2/2}0.15{CH3)2SiO2/2}0.1(SiO4/2)0.45And the sum of the using amounts of the components (B) is 80 parts.
6. The UV-curable organopolysiloxane composition according to claim 1, wherein component (C) is benzophenone, 4-chlorobenzophenone, 4-methylbenzophenone, 4-phenylbenzophenone, methyl o-benzoylbenzoate, methyl benzoylformate, 2,4,6- (trimethylbenzoyl) diphenylphosphine oxide, ethyl 2,4,6- (trimethylbenzoyl) phenylphosphonate, phenyl-bis (2,4, 6-trimethylbenzoyl) phosphine oxide, α -diethoxyacetophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone, 2-methyl-1- (4-methylthiophenyl) -2-morpholino-1-propanone, or a mixture thereof, 2-hydroxy-2-methyl-1-phenyl acetone, 1-hydroxycyclohexyl benzophenone, 2-hydroxy-4' - (2-hydroxyethoxy) -2-methyl propiophenone, benzoin dimethyl ether and one or more kinds of benzoin.
7. The UV-curable organopolysiloxane composition according to claim 1, wherein component (D) is one or more of p-methoxyphenol, p-hydroxyanisole, hydroquinone, 2, 5-dimethylhydroquinone, 2, 6-di-t-butylphenol, phenothiazine, and 2,2,6, 6-tetramethyl-4-hydroxypiperidine-1-oxyl.
8. Use of a UV-curable organopolysiloxane composition according to any one of claims 1 to 7 for the production of a semiconductor device.
9. Use according to claim 8, wherein the UV-curable organopolysiloxane composition is used for the encapsulation of semiconductor devices.
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| CN110396391A (en) * | 2019-08-02 | 2019-11-01 | 郝建强 | Ultraviolet light/moisture/hot triple curable organic silicon adhesive |
| CN110713818B (en) * | 2019-11-11 | 2021-11-26 | 王安 | Ultraviolet/moisture dual fast-curing polysiloxane adhesive composition |
| CN113025052B (en) * | 2019-12-25 | 2023-03-21 | 新特能源股份有限公司 | UV-curable silicone composition, preparation method and application thereof |
| CN113185911B (en) * | 2021-04-30 | 2022-08-05 | 武汉理工大学 | Low-viscosity photocuring hyperbranched coating containing organic silicon/modified boron nitride powder and preparation method and application thereof |
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| CN104610696A (en) * | 2015-01-05 | 2015-05-13 | 烟台德邦先进硅材料有限公司 | Organic silicon composition for UV curing |
| CN105524589A (en) * | 2016-01-18 | 2016-04-27 | 矽时代材料科技股份有限公司 | LOCA (Liquid Optical Clear Adhesive) and preparation method thereof |
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| CN104610696A (en) * | 2015-01-05 | 2015-05-13 | 烟台德邦先进硅材料有限公司 | Organic silicon composition for UV curing |
| CN105524589A (en) * | 2016-01-18 | 2016-04-27 | 矽时代材料科技股份有限公司 | LOCA (Liquid Optical Clear Adhesive) and preparation method thereof |
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