CN103325918A - Packaging process of light emitting diodes - Google Patents
Packaging process of light emitting diodes Download PDFInfo
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- CN103325918A CN103325918A CN2013101145075A CN201310114507A CN103325918A CN 103325918 A CN103325918 A CN 103325918A CN 2013101145075 A CN2013101145075 A CN 2013101145075A CN 201310114507 A CN201310114507 A CN 201310114507A CN 103325918 A CN103325918 A CN 103325918A
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Abstract
The invention discloses a packaging process of light emitting diodes. Packaging glue is made of epoxy resin, positive ion photoinitiator, sensitizer, chain transfer agent, epoxy reactive diluent, solvent and addition agent; primary radiation solidification is conducted on the packaging glue through an ultraviolet light source; then, secondary radiation solidification is conducted on the packaging glue through a far-infrared heating system. By the adoption of the preparation method of the packaging process, packaging time can be shortened greatly, and production efficiency is improved by dozens of times. By the adoption of the ultraviolet-infrared double solidification mode, relative strength of two types of radiation is regulated so that glue yellowing caused by excessive ultraviolet radiation can be avoided and the solidification degree can be guaranteed. In addition, residual stress caused by ultraviolet solidification can be released through infrared secondary solidification. The hardness, the refractive index, the transmittance, the temperature resistance and the like of the solidified packaging glue can be regulated through packaging glue formulas, thereby being suitable for requirements of different LED products, beneficial to protecting luminous chips better, and suitable for new development of electronic and lighting products.
Description
Technical field
The present invention relates to a kind of method for packing of semiconductor components and devices, especially the packaging technology of light-emitting diode.
Background technology
Semiconductor light-emitting-diode (LED) illumination is considered to one of high-tech sector of tool development prospect of 21 century, and it also will be for promoting energy-saving and emission-reduction, setting up conservation-minded society and make major contribution when causing the illumination revolution.LED adopts the organic resins such as epoxy, silicon rubber to encapsulate at present, and the packaging technology of the electronic devices and components such as packaging technology and resistance, electric capacity is close, finishes the polymerization reaction of organic resin and the encapsulation link of LED in the mode that is heating and curing.
The packaging technology of hot curing, available organic resin kind is more, the excellent performance of products obtained therefrom.But required time of potting resin hot curing is longer, mostly needs 2 ~ 5 hours just can finish curing, causes the production cycle of LED longer; In addition, also higher to uniformity and the stability requirement of temperature in the long cure cycle, some packaging plastic need to solidify in the different temperatures segmentation, has more increased the difficulty of production and technology controlling and process.
Ultraviolet light polymerization is a kind of green technology that is just developing rapidly, and it is widely accepted with low energy consumption, the characteristics such as pollution-free and high-quality.Wherein, the cationic epoxy resin photocuring system have volume contraction little, be not prone to oxygen inhibition, have the characteristics such as rear curing.
But being directly applied to LED encapsulation, UV-curing technology still has many technological difficulties, incomplete such as resin solidification, residual stress is excessive, solidification process irradiation excessively causes xanthochromia etc., has greatly affected the reliability of condensate performance and packaged LED.Therefore, energy-conservation for seeking, efficient LED packaging technology is needed badly and is addressed the above problem.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of fast packing technique of light-emitting diode is provided.
The packaging technology of light-emitting diode of the present invention, its step is as follows:
(1) with epoxy resin, cation light initiator, sensitizer, chain-transferring agent, epoxy active diluent, solvent and auxiliary agent 100:0.1～5:0.1～5:0.1～20:0～20:0～30:0～5 mixing and stirring in mass ratio, obtains the packaging plastic of homogeneous phase transparent;
(2) at fixing luminescence chip, the bonding welding gold thread and put the diode semi-finished product of fluorescent material of support, with the direct embedding of packaging plastic of step (1); Perhaps at support fixedly luminescence chip, bonding welding gold thread and the diode semi-finished product of dot fluorescent powder not, put glue behind the packaging plastic mixed fluorescent powder with step (1);
(3) be 50～800mj/cm with uv energy density
2Ultraviolet light source, the packaging plastic radiation 0.1 ~ 10min to step (2) finishes primary solidification;
(4) use far infrared heating system, with the heating-up temperature of 80 ~ 180 ° of C, the packaging plastic secondary radiation 1 ~ 30min to step (3) finishes encapsulation.
Among the present invention, said epoxy resin is bisphenol A epoxide resin, cycloaliphatic epoxy resin and organic-silicon-modified one or more that change in the epoxy resins.
Among the present invention, said cation light initiator is aromatic diazo salt, fragrant salt compounded of iodine, aromatic sulfonium salts, fragrant luxuriant molysite, fragrant microcosmic salt, fragrant pyridiniujm, organic aluminium compound
/In silane systems and the hydrazine one or more.
Among the present invention, said sensitizer can be benzophenone and derivative, acetophenone and derivative, propiophenone, benzaldehyde, fluorenes, anthracene, carbazole, N-vinylcarbazole, triphenylamine, benzoin dimethylether, in diacetyl benzene, methyl benzoylformate, benzyl methoxyl group ketal, two (4-dimethylamino phenyl) ketone and 2-methyl isophthalic acid-[4-methyl sulfenyl phenyl]-2-morpholine acetone one or more.
Among the present invention, said chain-transferring agent is one or more in single methanol, glycol, polyalcohol and the mercaptan compound.
Among the present invention, said epoxy active diluent is one or more in fragrance or aliphatic glycidyl ether type epoxy compounds, fragrance or aliphatic glycidyl ester type epoxy compounds, fragrance or aliphatic glycidyl amine type epoxy compounds and the alicyclic epoxide compound.
Among the present invention, said solvent is one or more in hydrocarbon, ester, ketone and the ether.
Among the present invention, said auxiliary agent is one or more in defoamer, light diffusing agent, thickener, tackifier and the dyestuff.
Among the present invention, said ultraviolet light source is high-pressure mercury lamp, Non-polarized lamp or Ultra-Violet Laser.
Compared with prior art, the invention has the beneficial effects as follows:
Adopt the inventive method technique simple, equipment investment is lower, can be used for the production of various light-emitting diodes (direct insertion Lamp, SMD Top), can significantly reduce the encapsulation time, and the decades of times of enhancing productivity is to hundred times.Adopt ultraviolet-infrared double curing mode can prevent that ultraviolet irradiation from excessively causing the colloid xanthochromia, can guarantee curing degree again simultaneously.In addition, infrared regelate can also discharge the residual stress of ultra-violet curing.
Embodiment
Below the present invention is further described by example.
Embodiment 1
(1) with bisphenol A epoxide resin DER-332 80g, cycloaliphatic epoxy resin ERL-4211 20g, diphenyl iodine hexafluorophosphate 1g, N-vinylcarbazole 2g, glycerol 5g mixing and stirring are made into the packaging plastic of homogeneous phase transparent;
(2) at fixing luminescence chip, the bonding welding gold thread and put the LED semi-finished product of fluorescent material of support, with the packaging plastic embedding of step (1);
(3) high-pressure mercury lamp of employing 5kw is with 800mj/cm
2Ultraviolet (UV) energy density, the packaging plastic irradiation 90s in the step (2) finishes one-step solidification;
(4) use far infrared heating system, under 130 ° of C, the packaging plastic in the step (3) is carried out secondary irradiation 10 min, finish the encapsulation of LED.
Hardness was 84 (shore hardness, shore D) after packaging plastic solidified, light transmittance (2mm, 400nm)＞95%, refractive index approximately 1.54.
Comparative Examples 1
Adopt embodiment 1 described packaging technology, but the exposure time in the step (3) is extended to 5min, remove step (4).
Hardness was 70 (shore hardness, shore D) after packaging plastic solidified, light transmittance (2mm, 400nm)＜90%, refractive index approximately 1.54.Compare with embodiment 1, Comparative Examples 1 is owing to irradiation under ultraviolet light is excessive, and yellow has to a certain degree occured colloid.
Comparative Examples 2
Adopt embodiment 1 described packaging technology, but the curing of step (3) and step (4) is made into 130 ° of C oven for baking 5 hours.
Hardness was 82 (shore hardness, shore D) after packaging plastic solidified, light transmittance (2mm, 400nm)＞95%, refractive index approximately 1.54.Compare with embodiment 1, the encapsulation time of Comparative Examples 2 is super embodiment 1 far.
Embodiment 2
(1) with cycloaliphatic epoxy resin ERL-4211 70g, hydrogenated bisphenol A epoxy EP-4080E 20g, neopentylglycol diglycidyl ether 10g, triphenyl sulphur hexafluoro antimonate 3g, benzophenone 2g, trimethylolpropane 5g, KH560 1g mixing and stirring is made into the packaging plastic of homogeneous phase transparent;
(2) at fixing luminescence chip, the bonding welding gold thread and put the LED semi-finished product of fluorescent material of support, with the packaging plastic embedding in the step (1);
(3) Non-polarized lamp of employing 500w is with 50mj/cm
2The UV energy density, the packaging plastic irradiation 5min in the step (2) finishes one-step solidification;
(4) use far infrared heating system, under 150 ° of C, the packaging plastic in the step (3) is carried out secondary irradiation 15 min, finish the encapsulation of LED.
Hardness was 88 (shore hardness, shore D) after packaging plastic solidified, light transmittance (2mm, 400nm)＞95%, refractive index approximately 1.49.
Embodiment 3
(1) with cycloaliphatic epoxy resin ERL-4211 30g, cycloaliphatic epoxy resin EHPE 3150 30g, hydrogenated bisphenol A epoxy EP-4080E 10g, modifying epoxy resin by organosilicon 25g, trimethylolpropane diglycidyl ether 5g, triphenyl sulphur hexafluorophosphate 5g, benzoin dimethylether 2g, pentaerythrite 5g mixing and stirring are made into the packaging plastic of homogeneous phase transparent;
(2) at the fixing LED semi-finished product of luminescence chip, bonding welding gold thread of support, with putting glue behind the packaging plastic mixed fluorescent powder in the step (1);
(3) high-pressure mercury lamp of employing 1kw is with 100mj/cm
2The UV energy density, the packaging plastic irradiation 3min in the step (2) finishes one-step solidification;
(4) use far infrared heating system, under 160 ° of C, the packaging plastic in the step (3) is carried out secondary irradiation 5min, finish the encapsulation of LED.
Hardness was 85 (shore hardness, shore D) after packaging plastic solidified, light transmittance (2mm, 400nm)＞95%, refractive index approximately 1.50.
Method of the present invention can break through in the present LED encapsulation heat curing process to the restriction of production capacity and efficient, the packaging plastic that makes can be in several minutes to tens of minutes rapid curing, can significantly reduce the encapsulation time, the decades of times of enhancing productivity; Adopt ultraviolet-infrared double curing mode can prevent that ultraviolet irradiation from excessively causing the colloid xanthochromia, can guarantee curing degree again simultaneously.In addition, infrared regelate can also discharge the residual stress of ultra-violet curing.Hardness after packaging plastic solidifies, refractive index, transmitance, temperature tolerance etc. also can be adjusted by prescription, to adapt to the requirement of different LED product, are conducive to protect better luminescence chip, and adapt to the new development of electronics, illuminating product.
What more than enumerate only is specific embodiments of the invention.Obviously, the invention is not restricted to above examples of implementation, in the protection range of spirit of the present invention and claim, to any modification and the change that the present invention makes, all should think protection scope of the present invention.
Claims (8)
1. the packaging technology of a light-emitting diode is characterized in that step is as follows:
(1) with epoxy resin, cation light initiator, sensitizer, chain-transferring agent, epoxy active diluent, solvent and auxiliary agent 100:0.1～5:0.1～5:0.1～20:0～20:0～30:0～5 mixing and stirring in mass ratio, obtains the packaging plastic of homogeneous phase transparent;
(2) at fixing luminescence chip, the bonding welding gold thread and put the diode semi-finished product of fluorescent material of support, with the direct embedding of packaging plastic of step (1); Perhaps at support fixedly luminescence chip, bonding welding gold thread and the diode semi-finished product of dot fluorescent powder not, put glue behind the packaging plastic mixed fluorescent powder with step (1);
(3) be 50～800mj/cm with uv energy density
2Ultraviolet light source, the packaging plastic radiation 0.1 ~ 10min to step (2) finishes primary solidification;
(4) use far infrared heating system, with the heating-up temperature of 80 ~ 180 ° of C, the packaging plastic secondary radiation 1 ~ 30min to step (3) finishes encapsulation.
2. the packaging technology of light-emitting diode according to claim 1 is characterized in that said epoxy resin is bisphenol A epoxide resin, cycloaliphatic epoxy resin and organic-silicon-modified one or more that change in the epoxy resins.
3. the packaging technology of light-emitting diode according to claim 1 is characterized in that said cation light initiator is aromatic diazo salt, fragrant salt compounded of iodine, aromatic sulfonium salts, fragrant luxuriant molysite, fragrant microcosmic salt, fragrant pyridiniujm, organic aluminium compound
/In silane systems and the hydrazine one or more.
4. the packaging technology of light-emitting diode according to claim 1, it is characterized in that said sensitizer be benzophenone and derivative, acetophenone and derivative, propiophenone, benzaldehyde, fluorenes, anthracene, carbazole, N-vinylcarbazole, triphenylamine, benzoin dimethylether, in diacetyl benzene, methyl benzoylformate, benzyl methoxyl group ketal, two (4-dimethylamino phenyl) ketone and 2-methyl isophthalic acid-[4-methyl sulfenyl phenyl]-2-morpholine acetone one or more.
5. the packaging technology of light-emitting diode according to claim 1 is characterized in that said chain-transferring agent is one or more in single methanol, glycol, polyalcohol and the mercaptan compound.
6. the packaging technology of light-emitting diode according to claim 1 is characterized in that said epoxy active diluent is one or more in fragrance or aliphatic glycidyl ether type epoxy compounds, fragrance or aliphatic glycidyl ester type epoxy compounds, fragrance or aliphatic glycidyl amine type epoxy compounds and the alicyclic epoxide compound.
7. the packaging technology of light-emitting diode according to claim 1 is characterized in that said solvent is one or more in hydrocarbon, ester, ketone and the ether;
The packaging technology of light-emitting diode according to claim 1 is characterized in that said auxiliary agent is one or more in defoamer, light diffusing agent, thickener, tackifier and the dyestuff.
8. the packaging technology of light-emitting diode according to claim 1 is characterized in that said ultraviolet light source is high-pressure mercury lamp, Non-polarized lamp or Ultra-Violet Laser.
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| CN2013101145075A CN103325918A (en) | 2013-04-03 | 2013-04-03 | Packaging process of light emitting diodes |
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| CN2013101145075A CN103325918A (en) | 2013-04-03 | 2013-04-03 | Packaging process of light emitting diodes |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104448715A (en) * | 2014-12-29 | 2015-03-25 | 大连理工常熟研究院有限公司 | Photo-curing material for injection type 3D printer |
| WO2015070483A1 (en) * | 2013-11-15 | 2015-05-21 | 深圳市华星光电技术有限公司 | Uv adhesive curing method and oled packing method |
| CN107531817A (en) * | 2016-04-01 | 2018-01-02 | 株式会社大赛璐 | Resin combination |
| CN109873071A (en) * | 2019-04-03 | 2019-06-11 | 杭州杭科光电集团股份有限公司 | A kind of filament packaging method of LED filament lamp |
| CN112103254A (en) * | 2019-06-18 | 2020-12-18 | 山东元捷电子科技有限公司 | High-heat-dissipation plug-in diode packaging process |
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| CN101301806A (en) * | 2007-05-07 | 2008-11-12 | 协立化学产业株式会社 | Film sticking apparatus and manufacturing method of polaroid sheet |
| CN101692473A (en) * | 2009-09-11 | 2010-04-07 | 中蓝晨光化工研究院有限公司 | Photocuring light-emitting diode encapsulation material |
| CN102074646A (en) * | 2010-10-21 | 2011-05-25 | 电子科技大学 | Light-emitting diode (LED) and manufacturing method thereof |
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2013
- 2013-04-03 CN CN2013101145075A patent/CN103325918A/en active Pending
Patent Citations (3)
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| CN101301806A (en) * | 2007-05-07 | 2008-11-12 | 协立化学产业株式会社 | Film sticking apparatus and manufacturing method of polaroid sheet |
| CN101692473A (en) * | 2009-09-11 | 2010-04-07 | 中蓝晨光化工研究院有限公司 | Photocuring light-emitting diode encapsulation material |
| CN102074646A (en) * | 2010-10-21 | 2011-05-25 | 电子科技大学 | Light-emitting diode (LED) and manufacturing method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015070483A1 (en) * | 2013-11-15 | 2015-05-21 | 深圳市华星光电技术有限公司 | Uv adhesive curing method and oled packing method |
| US9240566B2 (en) | 2013-11-15 | 2016-01-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Method for curing UV-curable resin and method for packaging OLED |
| CN104448715A (en) * | 2014-12-29 | 2015-03-25 | 大连理工常熟研究院有限公司 | Photo-curing material for injection type 3D printer |
| CN107531817A (en) * | 2016-04-01 | 2018-01-02 | 株式会社大赛璐 | Resin combination |
| CN107531817B (en) * | 2016-04-01 | 2019-03-15 | 株式会社大赛璐 | Resin combination |
| CN109873071A (en) * | 2019-04-03 | 2019-06-11 | 杭州杭科光电集团股份有限公司 | A kind of filament packaging method of LED filament lamp |
| CN112103254A (en) * | 2019-06-18 | 2020-12-18 | 山东元捷电子科技有限公司 | High-heat-dissipation plug-in diode packaging process |
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Address after: Hangzhou City, Zhejiang province 311122 Yuhang District Xianlin Street Xian Xing Lu 31, No. 33 Applicant after: Hangzhou Hangke Photoelectric Co., Ltd. Address before: Hangzhou City, Zhejiang province 310011 Dengyun Road No. 425 Lilda Building 5 floor Applicant before: Hangzhou Hangke Photoelectric Co., Ltd. |
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Application publication date: 20130925 |