CN101546647B - Powder encapsulating process of capacitor - Google Patents
Powder encapsulating process of capacitor Download PDFInfo
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- CN101546647B CN101546647B CN200910098111XA CN200910098111A CN101546647B CN 101546647 B CN101546647 B CN 101546647B CN 200910098111X A CN200910098111X A CN 200910098111XA CN 200910098111 A CN200910098111 A CN 200910098111A CN 101546647 B CN101546647 B CN 101546647B
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- Prior art keywords
- capacitor
- powder encapsulating
- powder
- curing
- encapsulated layer
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- 239000003990 capacitor Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 38
- 230000008569 process Effects 0.000 title claims abstract description 37
- 239000000843 powder Substances 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000001723 curing Methods 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 238000010330 laser marking Methods 0.000 claims abstract description 14
- 238000003618 dip coating Methods 0.000 claims abstract description 8
- 238000000016 photochemical curing Methods 0.000 claims abstract description 8
- 238000005243 fluidization Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 239000006259 organic additive Substances 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 230000003760 hair shine Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000001235 sensitizing effect Effects 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 239000003153 chemical reaction reagent Substances 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 206010016256 fatigue Diseases 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 230000036632 reaction speed Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a powder encapsulating process of a capacitor, which comprises the following: a step of fluidization: putting a processed capacitor into a ventilating and dry fluidized bed with compressed air to perform heating; a step of powder encapsulation: after the capacitor is heated, performing dip coating in the fluidized bed by using a powder encapsulating material, and curing and forming the capacitor; a step of corner cut: cutting off heaves or burrs generated outside the capacitor after the dip coating by using a mechanical device or manual work; a step of levelling: putting the encapsulated capacitor into a baking box and heating the capacitor for certain period of time so that an outer encapsulated layer of the capacitor is leveled into a film; a step of photo-curing: adding a curing agent and a photo initiator to the outer encapsulated layer and irradiating the outer encapsulated layer by purple light; and a step of laser marking: using a laser marking machine to print characters with a light color developing reagent on the surface of the cured capacitor. The all electrical properties of the finished product of the capacitor manufactured by the process can reach the standard, and the process has the advantages that the processing efficiency is high, the manpower and energy sources are saved, and the production cost is reduced.
Description
Technical field
The present invention relates to the production technology of electronic component, is a kind of powder encapsulating process of capacitor specifically.
Background technology
The fuse of existing capacitor need externally be wrapped one deck envelope material after making, machining, be not only fuse is played a protective role, and also can make the electrical property of capacitor obtain certain change simultaneously.Traditional powder encapsulating process is broadly divided into fluidisation, seals, corner cut, levelling and curing, marking, pack at last, the mode that curing process all adopts tunnel cave to solidify, the main feature of tunnel cave be temperature evenly, save manpower, homogeneity of product is strong.But 150 degree, curing time reach 2 hours characteristic because tunnel cave need heat up in advance, on the one hand, cause sealing material in the process of solidifying, and need to consume a large amount of electric energy, have increased the production cost of manufacturing enterprise; On the other hand, in the process of producing in batches, all need every batch curing time about 2 hours, the production process time is longer, causes production efficiency lower.When laser marking,, attractive in appearance inadequately clear and energy consumption is excessive owing to the reason of the mark material that adopts makes the black that is labeled as that prints.In the levelling process, to be product sealing the rear surface when being hair side to so-called levelling process, be placed on the process that keeps the stipulated time in the baking oven of design temperature, because the softening point height of the epoxy resin that adds, levelling temperature height in the levelling process causes product sagging phenomenon easily, and loss of energy is big, the easy checking of product collapses angular deformation.
In sum, traditional powder encapsulating process not only efficient is low, and power consumption is big, and the every performance of the finished product of producing is very difficult up to standard, and disqualification rate is higher.
Summary of the invention
Problem to be solved by this invention just provides the powder encapsulating process of a kind of production efficiency height, free of contamination capacitor, has accelerated curing rate, the finished product anti-flammability height of producing, good looking appearance.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme: a kind of powder encapsulating process of capacitor comprises the steps:
The fluidisation step is put into the compressed-air actuated fluid bed of aeration-drying with processed capacitor, heats;
The powder encapsulating step, capacitor heating back uses the powder encapsulating material to carry out dip-coating in fluid bed, and curing molding so just forms the outer encapsulated layer that one deck has electrical properties such as protection against the tide, mechanical strength height, electrical apparatus insulation at capacitor surface;
The corner cut step uses plant equipment or artificial projection or the burr that capacitor outside after the dip-coating is produced to cut away;
The levelling process is put into baking oven with the capacitor after sealing and is heated certain hour, makes the outer encapsulated layer levelling film forming of capacitor;
The photocuring step adds curing agent and light trigger outside, and shines under purple light in the encapsulated layer.
The laser marking step uses the surface of the capacitor of laser marking machine after curing to print literal with the light developer.
Further, described powder encapsulating material is the halogen powder encapsulating material that contains boron, zinc, aluminium complex type material.
Further, also be added with low-molecular-weight epoxy resin as organic additive in the described powder encapsulating material, greatly reduce the temperature of product in the levelling process, shortened flow time, improved the production efficiency of product at solidification process; Simultaneously, epoxy resin increases the toughness of outer encapsulated layer, and corner cut is more prone to, and percent defective reduces greatly.
Further, in the photocuring step, described curing agent is an amine curing agent.
Further, in the photocuring step, also added sensitising agent, make product under the ultraviolet light irradiation, can thoroughly solidify in 30 minutes, and better than performance behind the products solidifying in the past, improve product moisture resistance and solvent resistance, thereby changed the cooperation of curing agent and initator, saved time, manpower and the energy greatly.
Further, described smooth developer is that white light shows agent.The required mark temperature of this developer is low, after meeting heat, make skin-material reach instant vaporization, can become true qualities rapidly, thereby become present white by former black after making the product laser marking, etch the literal of certain depth, pattern etc., thereby stay permanent marker at object surface, never wornout, pollution-free, more clear attractive in appearance.
The advantage of production technology of the present invention: adopt halogen powder encapsulating material package envelope, pollution-free and anti-flammability is better; Adopt the advanced optical curing process, accelerated curing and hastened, saved process time, improved production efficiency; Adopt white light to show agent, be product when laser marking, literal is more clear, and never wornout, pollution-free, specious; The improvement of a whole set of technology greatly reduces process time, saves the manpower and the energy, has reduced production cost, and every performance index of product all can be up to standard.
Embodiment
Production technology of the present invention comprises the steps:
The fluidisation step is put into the compressed-air actuated fluid bed of aeration-drying with processed capacitor, heats.
The powder encapsulating step, capacitor heating back uses the powder encapsulating material to carry out dip-coating in fluid bed, curing molding, so just form the outer encapsulated layer that one deck has electrical properties such as protection against the tide, mechanical strength height, electrical apparatus insulation at capacitor surface, the powder encapsulating material is the halogen powder encapsulating material that contains boron, zinc, aluminium complex type material.Employing contains boron material can play expansion in fire-retardant process, can expand rapidly when meeting fire or meeting high temperature, produces the anoxybiotic effect; Adopt alumina-bearing material can play the raising ignition point, prolong the effect of time on fire; Employing contains Zinc material when meeting fire or high temperature, and auxiliary boron and aluminium tell on, and its reaction speed of catalysis has the function that suppresses the smog generation and is accelerated into charcoal, generates harmless residue.Product is when meeting fire, and it is slow to produce self heat absorption, react slow effect, reaches behind certain high temperature i.e. expansion, oxygen barrier; In the combustion process, improved the product carbon forming rate, protected lower floor's high polymer after generating carbon, generated water simultaneously, steam with can dilute fuel gas, thereby reach flame retardant effect, and not halogen-containing.Simultaneously in the powder encapsulating material, also add low-molecular-weight epoxy resin, increased the toughness of encapsulated layer as organic additive.
The corner cut step, the projection or the burr that use plant equipment or manually capacitor outside after the dip-coating is produced cut away, because add low-molecular-weight epoxy resin in the powder encapsulating step as organic additive, have increased the toughness of encapsulated layer, therefore when corner cut was operated, percent defective reduced greatly.
The levelling process is put into baking oven with the capacitor after sealing and is heated certain hour, makes the outer encapsulated layer levelling film forming of capacitor.To be exactly product sealing the rear surface when being hair side to so-called levelling process, is placed in the baking oven of design temperature to keep the process of stipulated time to be the levelling process, and the levelling temperature i.e. stationary temperature in the levelling process.Aspect capacitor powder levelling temperature, selected novel low molecular weight amount epoxy resin for use, low 60-68 ℃ of low softening point, the whole software point of product has been reduced 10-12 ℃, make client's serviceability temperature by former 120-150 ℃, became 80-105 ℃, 8-10 minute in 25-30 minute, easy to operate in the levelling process, save the energy, levelability is better, and has excellent mechanical property, good alkali resistance, acid resistance and solvent resistance are arranged, stablize chemical property.
The photocuring step adds amine crosslinking agent and light trigger outside, and shines under purple light in the encapsulated layer.And for fast reaction speed, on former basis, added a kind of photosensitive sensitising agent, behind the absorbed radiation energy energy is transferred to the material of light trigger, after accepting the absorption portion energy itself chemical change takes place, be decomposed into free radical or cation, thereby initiated polymerization, and energy delivery is returned to initial condition after giving light trigger, and its chemical property does not change, and makes product under the ultraviolet light irradiation, can thoroughly solidify in 30 minutes, saved the time and the energy, and better than performance behind the products solidifying in the past, improve product moisture resistance and solvent resistance, thereby changed the cooperation of encapsulation agent and promoter, saved the time greatly, the manpower and the energy.
The laser marking step uses the surface of the capacitor of laser marking machine after curing to print literal with the light developer.Laser marking is that product is met high temperature a kind of physical change of generation rapidly after curing, can demonstrate the numeral or the pattern that configure in advance in the laser marking machine after the variation.Technology of the present invention changed to a kind of white light with former cupric oxalate and shows agent, the required mark temperature of this developer is low, after meeting heat, make skin-material reach instant vaporization, can become true qualities rapidly, thereby became present white by former black after making the product laser marking, etch the literal of certain depth, pattern etc., thus stay permanent marker at object surface, never wornout, pollution-free, more clear attractive in appearance.
By above-mentioned powder encapsulating process step, every electrical property of the finished product capacitor of making such as levelability, anti-flammability, moisture resistance and solidification intensity high-low temperature resistant impact all can be up to standard, and processes efficient height is saved the manpower and the energy, has reduced production cost.
Claims (5)
1. the powder encapsulating process of a capacitor is characterized in that: comprise the steps:
(1) fluidisation step is put into the compressed-air actuated fluid bed of aeration-drying with processed capacitor, heats;
(2) powder encapsulating step, capacitor heating back uses the powder encapsulating material to carry out dip-coating, curing molding in fluid bed; Described powder encapsulating material is the halogen powder encapsulating material that contains boron, zinc, aluminium complex type material;
(3) corner cut step uses plant equipment or artificial projection or the burr that capacitor outside after the dip-coating is produced to cut away;
(4) levelling process is put into baking oven with the capacitor after sealing and is heated, and makes the outer encapsulated layer levelling film forming of capacitor;
(5) photocuring step adds curing agent and light trigger outside, and shines under purple light in the encapsulated layer;
(6) laser marking step uses the surface of the capacitor of laser marking machine after curing to print literal with the light developer.
2. the powder encapsulating process of a kind of capacitor according to claim 1 is characterized in that: also be added with low-molecular-weight epoxy resin as organic additive in the described powder encapsulating material.
3. the powder encapsulating process of a kind of capacitor according to claim 1, it is characterized in that: in the photocuring step, described curing agent is an amine curing agent.
4. the powder encapsulating process of a kind of capacitor according to claim 1 is characterized in that: in the photocuring step, also added sensitising agent.
5. the powder encapsulating process of a kind of capacitor according to claim 1 is characterized in that: described smooth developer is that white light shows agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910098111XA CN101546647B (en) | 2009-04-30 | 2009-04-30 | Powder encapsulating process of capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910098111XA CN101546647B (en) | 2009-04-30 | 2009-04-30 | Powder encapsulating process of capacitor |
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| Publication Number | Publication Date |
|---|---|
| CN101546647A CN101546647A (en) | 2009-09-30 |
| CN101546647B true CN101546647B (en) | 2011-01-05 |
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| CN200910098111XA Active CN101546647B (en) | 2009-04-30 | 2009-04-30 | Powder encapsulating process of capacitor |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104517733A (en) * | 2013-09-29 | 2015-04-15 | 佛山市南海区欣源电子有限公司 | Electronic microcrystalline wax encapsulation process for thin film capacitor |
| CN110125500A (en) * | 2018-02-02 | 2019-08-16 | 东莞碧克电子有限公司 | Foot new process is cut in encapsulating |
| CN112820541B (en) * | 2020-12-29 | 2022-09-30 | 广东南方宏明电子科技股份有限公司 | Full-connection production process of ceramic capacitor |
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| Publication number | Publication date |
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Owner name: ZHEJIANG QIXING CAPACITOR CO., LTD. Free format text: FORMER OWNER: YANG WENRONG Effective date: 20110420 |
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Free format text: CORRECT: ADDRESS; FROM: 313119 CHANGXING QIXING CAPACITOR CO., LTD., NO. 50, FAZHAN AVENUE, INDUSTRIAL ZONE, HUAIKAN TOWNSHIP, CHANGXING COUNTY, ZHEJIANG PROVINCE TO: 313119 NO. 50, FAZHAN AVENUE, INDUSTRIAL ZONE, HUAIKAN TOWNSHIP, CHANGXING COUNTY, ZHEJIANG PROVINCE |
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Effective date of registration: 20110420 Address after: 313119, No. 50, development zone, industrial zone, Huai village, Zhejiang, Changxing County Patentee after: Zhejiang Qixing Capacitor Co.,Ltd. Address before: 313119 Changxing County Seven Star capacitor Co., Ltd., No. 50, development zone, Huai village, Changxing County, Zhejiang Patentee before: Yang Wenrong |
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| CP03 | Change of name, title or address |
Address after: 313117 No. 50 Development Avenue, Meishan Town, Changxing County, Huzhou City, Zhejiang Province Patentee after: Zhejiang Qixing Electronics Co., Ltd. Address before: 313119 No. 50 Development Avenue, Huaikan Township Industrial District, Changxing County, Zhejiang Province Patentee before: Zhejiang Qixing Capacitor Co.,Ltd. |
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