CN104517733A - Electronic microcrystalline wax encapsulation process for thin film capacitor - Google Patents
Electronic microcrystalline wax encapsulation process for thin film capacitor Download PDFInfo
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- CN104517733A CN104517733A CN201310455159.8A CN201310455159A CN104517733A CN 104517733 A CN104517733 A CN 104517733A CN 201310455159 A CN201310455159 A CN 201310455159A CN 104517733 A CN104517733 A CN 104517733A
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Abstract
The invention discloses an electronic microcrystalline wax encapsulation process for a thin film capacitor and belongs to the thin film capacitor technical field. The process includes the following steps that: the first step: preheating and moisture elimination is performed on a thin film capacitor product requiring encapsulation for 2.5 to 3.5 hours at 100 DEG C, so that preparation can be made for wax immersion; the second step: wax immersion is performed and includes the step that the thin film capacitor which has been subjected to the preheating and moisture eliminating is subjected to wax immersion inner encapsulation in a wax immersion machine for one to two minutes under the conditions that vacuum degree is larger than or equal to 0.08MPa, temperature ranges from 115 to 125 DEG C, and electronic microcrystalline wax is arranged in the wax immersion machine; the third step: wax residue dipping; and the fourth step: powder encapsulation is performed. With the electronic microcrystalline wax encapsulation process for the thin film capacitor of the invention adopted, problems of long production cycle, high production cost and low efficiency of a traditional thin film capacitor can be solved.
Description
Technical field
The present invention relates to film capacitor technical field, be specifically related to the process of film capacitor encapsulating.
Background technology
The requirement of illuminating industry to film capacitor is more and more harsher, and production cost is also more and more higher simultaneously, and the friendship phase of client is also shorter and shorter.Particularly film capacitor is excessively the encapsulating of epoxy powder solid by the epoxy liquid envelope in past gradually in recent years, has had the breakthrough of an obvious matter in appearance.Present Ge great producer, in order to cost squeeze, shortens the production cycle, looks for break-through point again on interior envelope material.Therefore, electronics microwax package has just put on the application schedule of film capacitor.
Summary of the invention
The invention provides film capacitor electronics microwax packaging technique, the present invention solves that production cycle of conventional films capacitor is long, production cost is high and inefficient problem.
For solving the problem, the present invention adopts following technical scheme: film capacitor electronics microwax packaging technique, and processing step is as follows:
The first step: preheating, prepares waxdip by needing the thin-film capacitor article of package after the preheating humidity discharging of 100 DEG C in 2.5-3.5 hour;
Second step: waxdip, by the film capacitor after preheating humidity discharging in waxdip machine, carries out encapsulating in waxdip under the condition of vacuum degree >=0.08MPa, temperature 115 DEG C-125 DEG C, time 1-2 minute; Electronics microwax is adopted in above-mentioned waxdip machine;
3rd step: dip in wax tailings, is placed directly in the product after waxdip on toilet paper platform, gently dips in wax tailings, dips in by unnecessary wax;
4th step: powder coating, directly puts into powder coating machine carry out automatic Powder encapsulating, powder coating temperature 125 DEG C-145 DEG C, 90 ± 30 seconds time by dipping in the product after wax tailings.
Advantage of the present invention: production procedure is short, the artificial used time is low, and production efficiency is high, and energy consumption is low, and qualification rate is high, and production cost is low.Shorten to present preheating, waxdip by past traditional preheating, batching, deaeration, leaching epoxy, some material, solidification, powder bag seven stations, dip in wax tailings, powder bag four stations.Shorten production procedure greatly, accelerate the manufacturing schedule of about 5 hours.Thus also saved production cost greatly, bring the powerful motive force of development to company.
The present invention, with dystectic electronics microwax, does the interior encapsulating of film capacitor, then does outer encapsulating with solid epoxy powder materials.It is high that this kind of novel process has production efficiency, and save artificial, shorten the production cycle, energy consumption is low, and waste is few, and electric property is good, is easy to use, safety and environmental protection, the advantage that overall expenses is low.The film capacitor long-life that the present invention produces, be mainly used in high tension illumination rectifier start-up capacitance device and LED electrical appearance.
Embodiment
by best embodiment, the present invention is described in detail below
.
Film capacitor electronics microwax packaging technique, processing step is as follows:
The first step: preheating, prepares waxdip by needing the thin-film capacitor article of package after the preheating humidity discharging of 100 DEG C in 3 hours;
Second step: waxdip, by the film capacitor after preheating humidity discharging in waxdip machine, carries out encapsulating in waxdip under vacuum degree >=0.08MPa, temperature 120 DEG C, the condition of 1.5 minutes time; Electronics microwax is adopted in above-mentioned waxdip machine;
3rd step: dip in wax tailings, is placed directly in the product after waxdip on toilet paper platform, gently dips in wax tailings, dips in by unnecessary wax;
4th step: powder coating, directly puts into powder coating machine carry out automatic Powder encapsulating, powder coating temperature 135 DEG C, 90 ± 30 seconds time by dipping in the product after wax tailings.
Above-mentioned microwax (Microcrystalline wax): be the colorless and odorless solid fraction saturability hydrocarbon mixture refined from crude cut.Its component content molecular size, integral hardness and fusing point are all high than vaseline.Microwax except n-alkane and isoparaffin form except saturability hydrocarbon also containing many band long-chain branch and ring-type.So after the fusing point of microwax, molecular weight and fusing, viscosity is all also high than pertroleum wax, and lower not easy fracture of fragility.
Waxdip Track character of the present invention is: repack the charging tray of vacuum waxdip machine into Automatic-heating and can remain the controllable type waxdip equipment of constant temperature 100 DEG C ~ 140 DEG C.Product after being coated with silicone oil is placed in the pre-furnace set of regulation, after preliminary drying time reaches, starts waxdip, after having dipped in wax tailings, directly carry out powder coating.
The feature of present invention process:
1, production procedure is short, and the artificial used time is few;
2, manufacturing schedule is accelerated, and energy consumption reduces;
3, electronics microwax can be recycled, without waste;
4, product without hanging one's head, the defective products such as bubble, qualification rate improves;
5, greatly reduce floor space, economize on resources;
6, improve production efficiency, save production cost.
The meaning of present invention process:
Easy to operate, production efficiency is high, and material is without waste, with short production cycle, and overall manufacturing cost is low; In performance test, capacity, loss, withstand voltage, four aspects that insulate all with in traditional liquid-state epoxy resin are encapsulated and are not had difference, especially also more superior than encapsulating in liquid-state epoxy resin in high-frequency loss.Therefore, do encapsulating in film capacitor with electronics microwax and be undoubtedly the first-selection of each capacitor producer, thus the development space that the larger market share that can win is more wide with expansion!
Last it is noted that obviously, above-described embodiment is only for example of the present invention is clearly described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of amplifying out or variation be still among protection scope of the present invention.
Claims (1)
1. film capacitor electronics microwax packaging technique, it is characterized in that, processing step is as follows:
The first step: preheating, prepares waxdip by needing the thin-film capacitor article of package after the preheating humidity discharging of 100 DEG C in 2.5-3.5 hour;
Second step: waxdip, by the film capacitor after preheating humidity discharging in waxdip machine, carries out encapsulating in waxdip under the condition of vacuum degree >=0.08MPa, temperature 115 DEG C-125 DEG C, time 1-2 minute; Electronics microwax is adopted in above-mentioned waxdip machine;
3rd step: dip in wax tailings, is placed directly in the product after waxdip on toilet paper platform, gently dips in wax tailings, dips in by unnecessary wax;
4th step: powder coating, directly puts into powder coating machine carry out automatic Powder encapsulating, powder coating temperature 125 DEG C-145 DEG C, 90 ± 30 seconds time by dipping in the product after wax tailings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310455159.8A CN104517733A (en) | 2013-09-29 | 2013-09-29 | Electronic microcrystalline wax encapsulation process for thin film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310455159.8A CN104517733A (en) | 2013-09-29 | 2013-09-29 | Electronic microcrystalline wax encapsulation process for thin film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104517733A true CN104517733A (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310455159.8A Pending CN104517733A (en) | 2013-09-29 | 2013-09-29 | Electronic microcrystalline wax encapsulation process for thin film capacitor |
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| CN (1) | CN104517733A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109545554A (en) * | 2018-11-05 | 2019-03-29 | 铜陵市超越电子有限公司 | A kind of pulse energy storage capacitor special-purpose metal film |
| CN109545556A (en) * | 2018-11-05 | 2019-03-29 | 铜陵市超越电子有限公司 | A kind of ultra-quiet type new energy thin film capacitor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87201134U (en) * | 1987-03-12 | 1987-12-02 | 铜陵市无线电元件二厂 | Dry-type power-saving low-voltage phase-shifting condenser |
| CN101546647A (en) * | 2009-04-30 | 2009-09-30 | 杨文荣 | Powder encapsulating process of capacitor |
| CN201673816U (en) * | 2010-05-10 | 2010-12-15 | 佛山市南海区欣源电子有限公司 | Sealing axial capacitor |
| CN202650843U (en) * | 2012-05-15 | 2013-01-02 | 铜陵市铜新电气有限责任公司 | Internally connected in series metallized film capacitor |
-
2013
- 2013-09-29 CN CN201310455159.8A patent/CN104517733A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87201134U (en) * | 1987-03-12 | 1987-12-02 | 铜陵市无线电元件二厂 | Dry-type power-saving low-voltage phase-shifting condenser |
| CN101546647A (en) * | 2009-04-30 | 2009-09-30 | 杨文荣 | Powder encapsulating process of capacitor |
| CN201673816U (en) * | 2010-05-10 | 2010-12-15 | 佛山市南海区欣源电子有限公司 | Sealing axial capacitor |
| CN202650843U (en) * | 2012-05-15 | 2013-01-02 | 铜陵市铜新电气有限责任公司 | Internally connected in series metallized film capacitor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109545554A (en) * | 2018-11-05 | 2019-03-29 | 铜陵市超越电子有限公司 | A kind of pulse energy storage capacitor special-purpose metal film |
| CN109545556A (en) * | 2018-11-05 | 2019-03-29 | 铜陵市超越电子有限公司 | A kind of ultra-quiet type new energy thin film capacitor |
| CN109545554B (en) * | 2018-11-05 | 2020-10-27 | 铜陵市超越电子有限公司 | Metallized film substitute special for pulse energy storage capacitor |
| CN109545556B (en) * | 2018-11-05 | 2020-11-10 | 铜陵市超越电子有限公司 | Ultra-silent type new forms of energy film capacitor |
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Application publication date: 20150415 |
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