CN103571411B - Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive - Google Patents
Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive Download PDFInfo
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- CN103571411B CN103571411B CN201310016053.8A CN201310016053A CN103571411B CN 103571411 B CN103571411 B CN 103571411B CN 201310016053 A CN201310016053 A CN 201310016053A CN 103571411 B CN103571411 B CN 103571411B
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- epoxy resin
- bisphenol
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- silicon rod
- type epoxy
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 85
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 85
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 32
- 239000010703 silicon Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000853 adhesive Substances 0.000 title abstract 5
- 230000001070 adhesive effect Effects 0.000 title abstract 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 20
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 17
- 150000001412 amines Chemical class 0.000 claims abstract description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 51
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 24
- -1 phenol aldehyde Chemical class 0.000 claims description 23
- 239000004484 Briquette Substances 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 20
- 238000006116 polymerization reaction Methods 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 13
- 229930185605 Bisphenol Natural products 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 8
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 6
- 229960000892 attapulgite Drugs 0.000 claims description 3
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- 229910052625 palygorskite Inorganic materials 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- 239000000945 filler Substances 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 10
- 239000011863 silicon-based powder Substances 0.000 description 10
- 239000005995 Aluminium silicate Substances 0.000 description 6
- 150000008431 aliphatic amides Chemical class 0.000 description 6
- 235000012211 aluminium silicate Nutrition 0.000 description 6
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 238000004513 sizing Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 150000003573 thiols Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 229940100630 metacresol Drugs 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007634 remodeling Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- RHAXKFFKGZJUOE-UHFFFAOYSA-N 7-acetyl-6-ethyl-3,5,8-trihydroxy-9,10-dioxoanthracene-1,2-dicarboxylic acid Chemical compound O=C1C2=CC(O)=C(C(O)=O)C(C(O)=O)=C2C(=O)C2=C1C(O)=C(CC)C(C(C)=O)=C2O RHAXKFFKGZJUOE-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001684 chronic effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a dual-component epoxy resin adhesive for splicing a silicon block or a silicon rod and a preparation method of the dual-component epoxy resin adhesive. The dual-component epoxy resin adhesive for splicing the silicon block or the silicon rod consists of a component A and a component B in ratio of 1: 1, wherein the component A comprises the following materials by mass percent: 30 to 60% of epoxy resin, 10 to 30% of formaldehyde modified epoxy resin, 1 to 5% of thixotropic agent, and 20 to 50% of filling agent; and the component B comprises the following materials by mass percent: 20 to 50% of modified amine curing agent, 10 to 40% of polymeric mercaptan, 3 to 5% of accelerant, 1 to 5% of thixotropic agent, and 20 to 60% of filling agent. By adopting the preparation method, the primary curing time is decreased, and the process requirements are met.
Description
Technical field
The present invention relates to a kind of bicomponent epoxy resin glue and preparation method thereof, particularly relate to a kind of bicomponent epoxy resin glue and preparation method thereof for silico briquette or silicon rod splicing.
Background technology
In recent years, along with the rise of clean energy, solar photovoltaic industry is also started upsurge, the time domestic solar silicon wafers cutting enterprise of a few years surges to family more than 300 by tens, thus improve the usage quantity of various auxiliary material, and sizing agent is also one of indispensable auxiliary material in silicon chip cutting technique, different technique needs the sizing agent of different performance, wherein a kind of sizing agent is then need vertical surface to construct, high rigidity and the heat-resisting feature of height could meet its technique, because crystalline silicon is in growth, the number of charging capacity, the control of crystal diameter, the control of flavoring food all has an impact to the growth of crystal, thus produce the different silico briquette (silicon rod) of length, as follows to the method for the process of those stubs: one is again melted down, a kind of is the size adjusting wire-electrode cutting device, a kind of is connect silico briquette (silicon rod) different in size directly upper machine cutting with splicing.Two kinds of methods add loss above, consume the energy, increase cost, cause and bring very large inconvenience in silicon chip cutting; Same for this glue silico briquette (silicon rod) effectively, simply, directly together can be participated in cutting, thus ensure that the consistence of line cutting machine device parameter, simplify wire cutting technology by the latter's method.Now, sizing agent needs high thixotropic, the normal wire cutting technology of feature guarantee of high rigidity and thermotolerance to a certain degree.
Although also have this type of epoxy adhesive at present, but for reaching high rigidity and thermotolerance, then need heating cure or self-vulcanizing chronic, spelling sticklac as Lord Corp. of the U.S. needs heating cure, though the capable company in Hangzhou is self-vulcanizing, primary solidification just needs 1 ~ 2 hour, solidifies completely, needs more than 8 hours, this also brings very big inconvenience to pipelining, and pending thing packing phenomenon is obvious.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of bicomponent epoxy resin glue and preparation method thereof for silico briquette or silicon rod splicing, and it shortens the primary solidification time, while can meet processing requirement again.
The present invention solves above-mentioned technical problem by following technical proposals: a kind of bicomponent epoxy resin glue spliced for silico briquette or silicon rod, it is characterized in that, described for silico briquette or silicon rod splicing bicomponent epoxy resin glue by ratio be 1: 1 component A and B component form;
Component A is as follows, by mass percentage: epoxy resin 30 ~ 60%, and phenol aldehyde modified epoxy resin 10 ~ 30%, thixotropic agent 1 ~ 5%, weighting agent 20 ~ 50%;
B component is as follows, by mass percentage: modified amine curing agent 20 ~ 50%, and polymerization mercaptan 10 ~ 40%, promotor 3 ~ 5%, thixotropic agent 1 ~ 5%, weighting agent 20 ~ 60%.
Preferably, described epoxy resin is bisphenol A type epoxy resin or bisphenol f type epoxy resin.
Preferably, the bisphenol A type epoxy resin that the bisphenol A type epoxy resin that described bisphenol A type epoxy resin comprises bisphenol A type epoxy resin that oxirane value is 0.44mol/100g, oxirane value is 0.51mol/100g, oxirane value are 0.54mol/100g, oxirane value are the bisphenol A type epoxy resin of 0.55mol/100g, oxirane value is any one or more than one mixture in the bisphenol A type epoxy resin of 0.56mol/100g, the bisphenol f type epoxy resin of bisphenol f type epoxy resin to be oxirane value be 0.55 ~ 0.62mol/100g.
Preferably, the mixture that described phenol aldehyde modified epoxy resin comprises novolac epoxy that oxirane value is 0.47 ~ 0.51mol/100g, oxirane value is the o-cresol formaldehyde epoxy resin any one or more than one of 0.45 ~ 0.51mol/100g.
Preferably, described thixotropic agent is the mixture of gas phase sio2, attapulgite, wilkinite, organobentonite any one or more than one.
Preferably, described weighting agent is silicon powder, active micro silicon powder, kaolin, ultrafine kaolin, one or more mixtures of silica powder.
Preferably, described modified amine curing agent comprises phenol aldehyde modified aliphatic amide, phenol aldehyde modified aliphatic cyclic amine, one or more mixtures of modification aliphatic cyclic amine.
Preferably, described polymerization mercaptan comprises on-catalytic mercaptan, pre-catalyze thiol or epoxy toughess at room temperature.
Preferably, described promotor comprises 2,4,6-tri-(dimethylamino methyl), meta-cresol, Resorcinol, phenol.
The present invention also provides a kind of preparation method of bicomponent epoxy resin glue for silico briquette or silicon rod splicing, it is characterized in that, described preparation method adopts the bicomponent epoxy resin glue as above for silico briquette or silicon rod splicing, and described preparation method comprises the steps:
Process prepared by component A is as follows: by epoxy resin, phenol aldehyde modified epoxy resin, thixotropic agent, and weighting agent is fed in reactor, vacuum stirring 1.5 ~ 3 hours;
Process prepared by B component is as follows: by modified amine curing agent, polymerization mercaptan, promotor, thixotropic agent, and weighting agent drops in reactor, vacuum stirring 1.5 ~ 3 hours.
Positive progressive effect of the present invention is: the present invention adopt polymerization mercaptan and modified amine curing agent composite, in the presence of basic-type accelerator, the thiolate ion that thiol group generates and epoxy reaction, this speed of reaction is very fast, therefore can shorten the primary solidification time through the collocation of polymerization mercaptan and promotor.The present invention shortens the primary solidification time, can meet processing requirement again simultaneously.Vertical surface application property of the present invention is convenient, and cured article hardness is high, and thermotolerance is high, can not produce steel wire breakage during cutting.Component A and B component, after mixing under room temperature, are applied in ready silico briquette (silicon rod) vertical surface, two pieces of silico briquettes (silicon rod) are vertically fixed, 15 ~ 45 minutes setting times, can cut after 3 ~ 8 hours.
Embodiment
The present invention be used for silico briquette or silicon rod splicing bicomponent epoxy resin glue by ratio be 1: 1 component A and B component form;
Component A is as follows, by mass percentage: epoxy resin 30 ~ 60%, and phenol aldehyde modified epoxy resin 10 ~ 30%, thixotropic agent 1 ~ 5%, weighting agent 20 ~ 50%;
B component is as follows, by mass percentage: modified amine curing agent 20 ~ 50%, and polymerization mercaptan 10 ~ 40%, promotor 3 ~ 5%, thixotropic agent 1 ~ 5%, weighting agent 20 ~ 60%.
Wherein, epoxy resin is bisphenol A type epoxy resin or bisphenol f type epoxy resin.The bisphenol A type epoxy resin that the bisphenol A type epoxy resin that bisphenol A type epoxy resin comprises bisphenol A type epoxy resin that oxirane value is 0.44mol/100g, oxirane value is 0.51mol/100g, oxirane value are 0.54mol/100g, oxirane value are the bisphenol A type epoxy resin of 0.55mol/100g, oxirane value is any one or more than one mixture in the bisphenol A type epoxy resin of 0.56mol/100g, the bisphenol f type epoxy resin of bisphenol f type epoxy resin to be oxirane value be 0.55 ~ 0.62mol/100g.The mixture that phenol aldehyde modified epoxy resin comprises novolac epoxy that oxirane value is 0.47 ~ 0.51mol/100g, oxirane value is the o-cresol formaldehyde epoxy resin any one or more than one of 0.45 ~ 0.51mol/100g.Thixotropic agent is the mixture of gas phase sio2, attapulgite, wilkinite, organobentonite any one or more than one.Weighting agent is silicon powder, active micro silicon powder, kaolin, ultrafine kaolin, one or more mixtures of silica powder.Modified amine curing agent comprises phenol aldehyde modified aliphatic amide, phenol aldehyde modified aliphatic cyclic amine, one or more mixtures of modification aliphatic cyclic amine.Promotor comprises 2,4,6-tri-(dimethylamino methyl), meta-cresol, Resorcinol, phenol.Described polymerization mercaptan comprises on-catalytic mercaptan, pre-catalyze thiol or epoxy toughess at room temperature, specifically comprise following type product: Capcure3-800 (the peaceful on-catalytic mercaptan of section), Capcure3830-81 (the peaceful 3830-81 of section), Capcure40secHV (the peaceful pre-catalyze thiol of section), CapcureLOF (the peaceful on-catalytic mercaptan of section), Capcure WR-6 (pre-catalyze thiol), Epomate QX-lO (epoxy toughess at room temperature), EPomate qx-40 (epoxy toughess at room temperature), MP-gg90 (Polymercaptan curing agent), EH-316 (Polymercaptan curing agent), EH-317 (Polymercaptan curing agent, Japan's trade mark).
The preparation method of bicomponent epoxy resin glue for silico briquette or silicon rod splicing comprises the steps:
Process prepared by component A is as follows: by epoxy resin, phenol aldehyde modified epoxy resin, thixotropic agent, and weighting agent is fed in reactor, vacuum stirring 1.5 ~ 3 hours;
Process prepared by B component is as follows: by modified amine curing agent, polymerization mercaptan, promotor, thixotropic agent, and weighting agent drops in reactor, vacuum stirring 1.5 ~ 3 hours.
Embodiment 1
Prepared by component A: epoxy resin, phenol aldehyde modified epoxy resin, gas phase sio2, silicon powder are fed into by mass percentage in reactor, vacuum stirring 1.5 hours.
Prepared by B component: by phenol aldehyde modified aliphatic amide, polymerization mercaptan, 2,4,6-tri-(dimethylamino methyl), gas phase sio2, silicon powder drops in reactor by mass percentage, vacuum stirring 1.5 hours.
Embodiment 2
Process prepared by component A is as follows: epoxy resin, phenol aldehyde modified epoxy resin, wilkinite, silicon powder are fed into by mass percentage in reactor, vacuum stirring 3 hours.
Process prepared by B component is as follows: by phenol aldehyde modified aliphatic amide, polymerization mercaptan, 2,4,6-tri-(dimethylamino methyls), gas phase sio2, silicon powder drops in reactor by mass percentage, vacuum stirring 3 hours.
Embodiment 3
Process prepared by component A is as follows: epoxy resin, phenol aldehyde modified epoxy resin, wilkinite, silicon powder are fed into by mass percentage in reactor, vacuum stirring 3 hours.
Process prepared by B component is as follows: by phenol aldehyde modified aliphatic amide, polymerization mercaptan, 2,4,6-tri-(dimethylamino methyls), wilkinite, silicon powder drops in reactor by mass percentage, vacuum stirring 3 hours.
Embodiment 4
Process prepared by component A is as follows: by epoxy resin, phenol aldehyde modified epoxy resin, gas phase SiO
2, kaolin is fed in reactor by mass percentage, vacuum stirring 3 hours.
Process prepared by B component is as follows: by phenol aldehyde modified aliphatic amide, polymerization mercaptan, 2,4,6-tri-(dimethylamino methyls), gas phase sio2, kaolin drops in reactor by mass percentage, vacuum stirring 3 hours.
The characteristic of bicomponent epoxy resin glue for silico briquette or silicon rod splicing is shown in table 1 (test condition: 25 DEG C, relative humidity 50%):
Table 1
Those skilled in the art can carry out various remodeling and change to the present invention.Therefore, present invention covers the various remodeling in the scope falling into appending claims and equivalent thereof and change.
Claims (6)
1. for a bicomponent epoxy resin glue for silico briquette or silicon rod splicing, it is characterized in that, the described bicomponent epoxy resin glue for silico briquette or silicon rod splicing is that the component A of 1:1 and B component form by ratio;
Component A is as follows, by mass percentage: epoxy resin 30 ~ 60%, and phenol aldehyde modified epoxy resin 10 ~ 30%, thixotropic agent 1 ~ 5%, weighting agent 20 ~ 50%;
B component is as follows, by mass percentage: modified amine curing agent 20 ~ 50%, and polymerization mercaptan 10 ~ 40%, promotor 3 ~ 5%, thixotropic agent 1 ~ 5%, weighting agent 20 ~ 60%.
2., as claimed in claim 1 for the bicomponent epoxy resin glue that silico briquette or silicon rod splice, it is characterized in that, described epoxy resin is bisphenol A type epoxy resin or bisphenol f type epoxy resin.
3. the bicomponent epoxy resin glue spliced for silico briquette or silicon rod as claimed in claim 2, it is characterized in that, described bisphenol A type epoxy resin comprises the bisphenol A type epoxy resin that oxirane value is 0.44mol/100g, oxirane value is the bisphenol A type epoxy resin of 0.51mol/100g, oxirane value is the bisphenol A type epoxy resin of 0.54 mol/100g, oxirane value is the bisphenol A type epoxy resin of 0.55 mol/100g, oxirane value is any one or more than one mixture in the bisphenol A type epoxy resin of 0.56 mol/100g, the bisphenol f type epoxy resin of bisphenol f type epoxy resin to be oxirane value be 0.55 ~ 0.62mol/100g.
4. the bicomponent epoxy resin glue spliced for silico briquette or silicon rod as claimed in claim 1, it is characterized in that, described phenol aldehyde modified epoxy resin comprises novolac epoxy that oxirane value is 0.47 ~ 0.51mol/100g, mixture that oxirane value is the o-cresol formaldehyde epoxy resin any one or more than one of 0.45 ~ 0.51 mol/100g.
5., as claimed in claim 1 for the bicomponent epoxy resin glue that silico briquette or silicon rod splice, it is characterized in that, described thixotropic agent is gas phase SiO
2, attapulgite, wilkinite, organobentonite any one or more than one mixture.
6. the preparation method of the bicomponent epoxy resin glue spliced for silico briquette or silicon rod, it is characterized in that, described preparation method adopts the bicomponent epoxy resin glue spliced for silico briquette or silicon rod according to any one of claim 1 to 5, and described preparation method comprises the steps:
Process prepared by component A is as follows: be fed in reactor by epoxy resin, phenol aldehyde modified epoxy resin, thixotropic agent, weighting agent, vacuum stirring 1.5 ~ 3 hours;
Process prepared by B component is as follows: drop in reactor by modified amine curing agent, polymerization mercaptan, promotor, thixotropic agent, weighting agent, vacuum stirring 1.5 ~ 3 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016053.8A CN103571411B (en) | 2013-01-16 | 2013-01-16 | Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016053.8A CN103571411B (en) | 2013-01-16 | 2013-01-16 | Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive |
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| Publication Number | Publication Date |
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| CN103571411A CN103571411A (en) | 2014-02-12 |
| CN103571411B true CN103571411B (en) | 2015-05-27 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105022119B (en) * | 2015-08-07 | 2018-07-31 | 中时讯通信建设有限公司 | A kind of optical fiber splicing method |
| CN106753130A (en) * | 2016-12-23 | 2017-05-31 | 上海康达化工新材料股份有限公司 | A kind of modified epoxy for diamond wire cutting silicon rod glue |
| CN112793021A (en) * | 2019-10-28 | 2021-05-14 | 洛阳阿特斯光伏科技有限公司 | Silicon rod splicing method, spliced silicon rod and cutting method of spliced silicon rod |
| CN112940658A (en) * | 2021-02-01 | 2021-06-11 | 南宁珀源能源材料有限公司 | Stick glue and preparation method and application thereof |
| CN112852367B (en) * | 2021-03-08 | 2023-05-12 | 广西珀源新材料有限公司 | Double-component silicon rod splicing adhesive and preparation method thereof |
| CN113604183A (en) * | 2021-08-20 | 2021-11-05 | 杭州固安科技有限公司 | Rigid epoxy glue solution |
| CN114276765A (en) * | 2021-12-27 | 2022-04-05 | 句容协鑫光伏科技有限公司 | Rod adhesive for improving cutting edge breakage rate of thin wire thin sheet large-size silicon rod and preparation method thereof |
| CN114921210A (en) * | 2022-06-17 | 2022-08-19 | 宜春宇泽新能源有限公司 | Adhesive for solar-grade silicon wafer suitable for large-size flaking and preparation process and use method thereof |
| CN117247756B (en) * | 2023-08-23 | 2024-05-28 | 广东金湾高景太阳能科技有限公司 | Silicon rod joint glue and preparation method and application thereof |
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| CN102120925A (en) * | 2011-02-14 | 2011-07-13 | 上海康达化工新材料股份有限公司 | Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof |
| CN102627931A (en) * | 2012-03-23 | 2012-08-08 | 烟台德邦科技有限公司 | Pre-catalytic bonding glue and preparation method thereof |
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- 2013-01-16 CN CN201310016053.8A patent/CN103571411B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102120925A (en) * | 2011-02-14 | 2011-07-13 | 上海康达化工新材料股份有限公司 | Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof |
| CN102627931A (en) * | 2012-03-23 | 2012-08-08 | 烟台德邦科技有限公司 | Pre-catalytic bonding glue and preparation method thereof |
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Inventor after: Xu Qibin Inventor after: Zhang Lifang Inventor after: Yang Liyan Inventor before: Xu Qibin Inventor before: Zhang Lifang |
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Effective date of registration: 20150421 Address after: 201199, room 4999, 1221 middle spring road, Shanghai, Minhang District Applicant after: Shanghai Dou Wei Electronics Co., Ltd. Applicant after: Shanghai Dou Wei photovoltaic Science and Technology Ltd. Address before: 201199, room 4999, 1221 middle spring road, Shanghai, Minhang District Applicant before: Shanghai Dou Wei Electronics Co., Ltd. |
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Effective date of registration: 20180508 Address after: 201108 2 floor, 2 building, 1358 Xiangyang Road, Minhang District, Shanghai. Patentee after: Shanghai Yu Xin Mstar Technology Ltd Address before: Room 1221, No. 4999, Zhong Chun Road, Minhang District, Shanghai Co-patentee before: Shanghai Dou Wei photovoltaic Science and Technology Ltd. Patentee before: Shanghai Dou Wei Electronics Co., Ltd. |