CN103571411A - Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive - Google Patents
Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive Download PDFInfo
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- CN103571411A CN103571411A CN201310016053.8A CN201310016053A CN103571411A CN 103571411 A CN103571411 A CN 103571411A CN 201310016053 A CN201310016053 A CN 201310016053A CN 103571411 A CN103571411 A CN 103571411A
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- Prior art keywords
- epoxy resin
- silicon rod
- bisphenol
- component
- silico briquette
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 89
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 89
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 36
- 239000010703 silicon Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000853 adhesive Substances 0.000 title abstract 5
- 230000001070 adhesive effect Effects 0.000 title abstract 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 38
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 17
- 150000001412 amines Chemical class 0.000 claims abstract description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 51
- 239000004484 Briquette Substances 0.000 claims description 26
- -1 phenol aldehyde Chemical class 0.000 claims description 26
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 15
- 238000006116 polymerization reaction Methods 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 14
- 239000011863 silicon-based powder Substances 0.000 claims description 12
- 229930185605 Bisphenol Natural products 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 9
- 239000005995 Aluminium silicate Substances 0.000 claims description 8
- 235000012211 aluminium silicate Nutrition 0.000 claims description 8
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 8
- 150000008431 aliphatic amides Chemical class 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 6
- 238000006555 catalytic reaction Methods 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229960000892 attapulgite Drugs 0.000 claims description 3
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims description 3
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 3
- 229940100630 metacresol Drugs 0.000 claims description 3
- 238000012986 modification Methods 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- 229910052625 palygorskite Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- 239000000945 filler Substances 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 10
- 238000004513 sizing Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007634 remodeling Methods 0.000 description 2
- RHAXKFFKGZJUOE-UHFFFAOYSA-N 7-acetyl-6-ethyl-3,5,8-trihydroxy-9,10-dioxoanthracene-1,2-dicarboxylic acid Chemical compound O=C1C2=CC(O)=C(C(O)=O)C(C(O)=O)=C2C(=O)C2=C1C(O)=C(CC)C(C(C)=O)=C2O RHAXKFFKGZJUOE-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001684 chronic effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a dual-component epoxy resin adhesive for splicing a silicon block or a silicon rod and a preparation method of the dual-component epoxy resin adhesive. The dual-component epoxy resin adhesive for splicing the silicon block or the silicon rod consists of a component A and a component B in ratio of 1: 1, wherein the component A comprises the following materials by mass percent: 30 to 60% of epoxy resin, 10 to 30% of formaldehyde modified epoxy resin, 1 to 5% of thixotropic agent, and 20 to 50% of filling agent; and the component B comprises the following materials by mass percent: 20 to 50% of modified amine curing agent, 10 to 40% of polymeric mercaptan, 3 to 5% of accelerant, 1 to 5% of thixotropic agent, and 20 to 60% of filling agent. By adopting the preparation method, the primary curing time is decreased, and the process requirements are met.
Description
Technical field
The present invention relates to a kind of bicomponent epoxy resin glue and preparation method thereof, particularly relate to a kind of bicomponent epoxy resin glue for silico briquette or silicon rod splicing and preparation method thereof.
Background technology
In recent years, rise along with clean energy, photovoltaic industry is also to have started upsurge, domestic solar silicon wafers cutting of the time enterprise of a few years surges to family more than 300 by tens, thereby improved the usage quantity of various auxiliary materials, and sizing agent is also one of indispensable auxiliary material in silicon chip cutting technique, different technique needs the sizing agent of different performance, wherein a kind of sizing agent is to need vertical surface construction, high rigidity and high heat-resisting feature could meet its technique, because crystalline silicon is in growth, the number of charging capacity, the control of crystal diameter, the control of flavoring food all exerts an influence to the growth of crystal, thereby produce the different silico briquette (silicon rod) of length, method to the processing of those stubs is as follows: a kind of is again to melt down, a kind of is the size of adjusting wire-electrode cutting device, a kind of is with splicing, to connect silico briquette different in size (silicon rod) directly to go up machine cutting.Before two kinds of methods increased loss, consume the energy, increase cost, cause in silicon chip cutting and brought very large inconvenience; The latter's method can effectively, simply directly together participate in the same silico briquette of this glue (silicon rod) cutting, thereby guarantee the consistence of line cutting machine device parameter, has simplified wire cutting technology.Now, sizing agent needs high thixotropic, high rigidity and the normal wire cutting technology of stable on heating feature guarantee to a certain degree.
Although also there is this type of epoxy adhesive at present, but for reaching high rigidity and thermotolerance, need heating cure or self-vulcanizing chronic, as the spelling sticklac of U.S. Lord Corp. needs heating cure, though the capable company in Hangzhou is self-vulcanizing, primary solidification just needs 1～2 hour, completely solidifies and needs more than 8 hours, this also brings very big inconvenience to pipelining, and pending thing packing phenomenon is obvious.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of bicomponent epoxy resin glue for silico briquette or silicon rod splicing and preparation method thereof, and it shortens the primary solidification time, can meet processing requirement again simultaneously.
The present invention solves above-mentioned technical problem by following technical proposals: a kind of bicomponent epoxy resin glue for silico briquette or silicon rod splicing, it is characterized in that, described the A component and the B component that for the bicomponent epoxy resin glue of silico briquette or silicon rod splicing, by ratio, are 1: 1 form;
A component is as follows, by mass percentage: epoxy resin 30～60%, phenol aldehyde modified epoxy resin 10～30%, thixotropic agent 1～5%, weighting agent 20～50%;
B component is as follows, by mass percentage: modified amine curing agent 20～50%, polymerization mercaptan 10～40%, promotor 3～5%, thixotropic agent 1～5%, weighting agent 20～60%.
Preferably, described epoxy resin is bisphenol A type epoxy resin or bisphenol f type epoxy resin.
Preferably, described bisphenol A type epoxy resin comprises any one or more than one mixture in oxirane value is the bisphenol A type epoxy resin of 0.44mol/100g, bisphenol A type epoxy resin that oxirane value is 0.51mol/100g, oxirane value is 0.54mol/100g bisphenol A type epoxy resin, bisphenol A type epoxy resin that oxirane value is 0.55mol/100g, bisphenol A type epoxy resin that oxirane value is 0.56mol/100g, and bisphenol f type epoxy resin is that oxirane value is the bisphenol f type epoxy resin of 0.55～0.62mol/100g.
Preferably, described phenol aldehyde modified epoxy resin comprises that oxirane value is the novolac epoxy of 0.47～0.51mol/100g, the mixture of o-cresol formaldehyde epoxy resin any one or more than one that oxirane value is 0.45～0.51mol/100g.
Preferably, described thixotropic agent is the mixture of gas phase sio2, attapulgite, wilkinite, organobentonite any one or more than one.
Preferably, described weighting agent is silicon powder, active micro silicon powder, kaolin, ultrafine kaolin, one or more mixtures of silica powder.
Preferably, described modified amine curing agent comprises phenol aldehyde modified aliphatic amide, phenol aldehyde modified aliphatic cyclic amine, one or more mixtures of modification aliphatic cyclic amine.
Preferably, described polymerization mercaptan comprises on-catalytic mercaptan, pre-catalysis mercaptan or epoxy self-vulcanizing agent.
Preferably, described promotor comprises 2,4,6-tri-(dimethylamino methyl), meta-cresol, Resorcinol, phenol.
The present invention also provides a kind of preparation method of the bicomponent epoxy resin glue for silico briquette or silicon rod splicing, it is characterized in that, described preparation method adopts the bicomponent epoxy resin glue for silico briquette or silicon rod splicing as above, and described preparation method comprises the steps:
Process prepared by A component is as follows: by epoxy resin, and phenol aldehyde modified epoxy resin, thixotropic agent, weighting agent is fed in reactor, vacuum stirring 1.5～3 hours;
Process prepared by B component is as follows: by modified amine curing agent, and polymerization mercaptan, promotor, thixotropic agent, weighting agent drops in reactor, vacuum stirring 1.5～3 hours.
Positive progressive effect of the present invention is: the present invention adopt polymerization mercaptan and modified amine curing agent composite, in the presence of basic-type accelerator, thiolate ion and epoxy reaction that thiol group generates, this speed of reaction is very fast, therefore can shorten the primary solidification time through the collocation of polymerization mercaptan and promotor.The present invention shortens the primary solidification time, can meet processing requirement again simultaneously.Vertical surface application property of the present invention is convenient, and cured article hardness is high, and thermotolerance is high, during cutting, can not produce steel wire breakage.A component and B component, after mixing under room temperature, are applied in ready silico briquette (silicon rod) vertical surface, and two silico briquettes (silicon rod) are vertically fixing, 15～45 minutes setting times, after 3～8 hours, can cut.
Embodiment
A component and B component that the present invention is 1: 1 for the bicomponent epoxy resin glue of silico briquette or silicon rod splicing by ratio form;
A component is as follows, by mass percentage: epoxy resin 30～60%, phenol aldehyde modified epoxy resin 10～30%, thixotropic agent 1～5%, weighting agent 20～50%;
B component is as follows, by mass percentage: modified amine curing agent 20～50%, polymerization mercaptan 10～40%, promotor 3～5%, thixotropic agent 1～5%, weighting agent 20～60%.
Wherein, epoxy resin is bisphenol A type epoxy resin or bisphenol f type epoxy resin.Bisphenol A type epoxy resin comprises any one or more than one mixture in oxirane value is the bisphenol A type epoxy resin of 0.44mol/100g, bisphenol A type epoxy resin that oxirane value is 0.51mol/100g, oxirane value is 0.54mol/100g bisphenol A type epoxy resin, bisphenol A type epoxy resin that oxirane value is 0.55mol/100g, bisphenol A type epoxy resin that oxirane value is 0.56mol/100g, and bisphenol f type epoxy resin is that oxirane value is the bisphenol f type epoxy resin of 0.55～0.62mol/100g.Phenol aldehyde modified epoxy resin comprises that oxirane value is the novolac epoxy of 0.47～0.51mol/100g, the mixture of o-cresol formaldehyde epoxy resin any one or more than one that oxirane value is 0.45～0.51mol/100g.Thixotropic agent is the mixture of gas phase sio2, attapulgite, wilkinite, organobentonite any one or more than one.Weighting agent is silicon powder, active micro silicon powder, kaolin, ultrafine kaolin, one or more mixtures of silica powder.Modified amine curing agent comprises phenol aldehyde modified aliphatic amide, phenol aldehyde modified aliphatic cyclic amine, one or more mixtures of modification aliphatic cyclic amine.Promotor comprises 2,4,6-tri-(dimethylamino methyl), meta-cresol, Resorcinol, phenol.Described polymerization mercaptan comprises on-catalytic mercaptan, pre-catalysis mercaptan or epoxy self-vulcanizing agent, specifically comprise following type product: Capcure3-800 (the peaceful on-catalytic mercaptan of section), Capcure3830-81 (the peaceful 3830-81 of section), Capcure40secHV (the peaceful pre-catalysis mercaptan of section), CapcureLOF (the peaceful on-catalytic mercaptan of section), Capcure WR-6 (pre-catalysis mercaptan), Epomate QX-lO (epoxy self-vulcanizing agent), EPomate qx-40 (epoxy self-vulcanizing agent), MP-gg90 (Polymercaptan curing agent), EH-316 (Polymercaptan curing agent), EH-317 (Polymercaptan curing agent, Japan's trade mark).
The preparation method who is used for the bicomponent epoxy resin glue of silico briquette or silicon rod splicing comprises the steps:
Process prepared by A component is as follows: by epoxy resin, and phenol aldehyde modified epoxy resin, thixotropic agent, weighting agent is fed in reactor, vacuum stirring 1.5～3 hours;
Process prepared by B component is as follows: by modified amine curing agent, and polymerization mercaptan, promotor, thixotropic agent, weighting agent drops in reactor, vacuum stirring 1.5～3 hours.
Embodiment 1
A component preparation: epoxy resin, phenol aldehyde modified epoxy resin, gas phase sio2, silicon powder are fed in reactor by mass percentage to vacuum stirring 1.5 hours.
The preparation of B component: by phenol aldehyde modified aliphatic amide, polymerization mercaptan, 2,4,6-tri-(dimethylamino methyl), gas phase sio2, silicon powder drops in reactor by mass percentage, vacuum stirring 1.5 hours.
Embodiment 2
Process prepared by A component is as follows: epoxy resin, phenol aldehyde modified epoxy resin, wilkinite, silicon powder are fed in reactor by mass percentage to vacuum stirring 3 hours.
Process prepared by B component is as follows: by phenol aldehyde modified aliphatic amide, polymerization mercaptan, 2,4, and 6-tri-(dimethylamino methyl), gas phase sio2, silicon powder drops in reactor by mass percentage, vacuum stirring 3 hours.
Embodiment 3
Process prepared by A component is as follows: epoxy resin, phenol aldehyde modified epoxy resin, wilkinite, silicon powder are fed in reactor by mass percentage to vacuum stirring 3 hours.
Process prepared by B component is as follows: by phenol aldehyde modified aliphatic amide, polymerization mercaptan, 2,4, and 6-tri-(dimethylamino methyl), wilkinite, silicon powder drops in reactor by mass percentage, vacuum stirring 3 hours.
Embodiment 4
Process prepared by A component is as follows: by epoxy resin, phenol aldehyde modified epoxy resin, gas phase SiO
2, kaolin is fed in reactor by mass percentage, vacuum stirring 3 hours.
Process prepared by B component is as follows: by phenol aldehyde modified aliphatic amide, polymerization mercaptan, 2,4, and 6-tri-(dimethylamino methyl), gas phase sio2, kaolin drops in reactor by mass percentage, vacuum stirring 3 hours.
For the characteristic of the bicomponent epoxy resin glue of silico briquette or silicon rod splicing, be (test condition: 25 ℃, relative humidity 50%) shown in table 1:
Table 1
Those skilled in the art can carry out various remodeling and change to the present invention.Therefore, the present invention has covered various remodeling and the change in the scope that falls into appending claims and equivalent thereof.
Claims (10)
1. for a bicomponent epoxy resin glue for silico briquette or silicon rod splicing, it is characterized in that, described the A component and the B component that for the bicomponent epoxy resin glue of silico briquette or silicon rod splicing, by ratio, are 1: 1 form;
A component is as follows, by mass percentage: epoxy resin 30～60%, phenol aldehyde modified epoxy resin 10～30%, thixotropic agent 1～5%, weighting agent 20～50%;
B component is as follows, by mass percentage: modified amine curing agent 20～50%, polymerization mercaptan 10～40%, promotor 3～5%, thixotropic agent 1～5%, weighting agent 20～60%.
2. the bicomponent epoxy resin glue for silico briquette or silicon rod splicing as claimed in claim 1, is characterized in that, described epoxy resin is bisphenol A type epoxy resin or bisphenol f type epoxy resin.
3. the bicomponent epoxy resin glue for the splicing of silico briquette or silicon rod as claimed in claim 2, it is characterized in that, described bisphenol A type epoxy resin comprises that oxirane value is the bisphenol A type epoxy resin of 0.44mol/100g, oxirane value is the bisphenol A type epoxy resin of 0.51mol/100g, oxirane value is the bisphenol A type epoxy resin of 0.54mol/100g, oxirane value is the bisphenol A type epoxy resin of 0.55mol/100g, oxirane value is any one or more than one mixture in the bisphenol A type epoxy resin of 0.56mol/100g, bisphenol f type epoxy resin is that oxirane value is the bisphenol f type epoxy resin of 0.55～0.62mol/100g.
4. the bicomponent epoxy resin glue for the splicing of silico briquette or silicon rod as claimed in claim 1, it is characterized in that, described phenol aldehyde modified epoxy resin comprises that oxirane value is the novolac epoxy of 0.47～0.51mol/100g, the mixture of o-cresol formaldehyde epoxy resin any one or more than one that oxirane value is 0.45～0.51mol/100g.
5. the bicomponent epoxy resin glue for silico briquette or silicon rod splicing as claimed in claim 1, is characterized in that, described thixotropic agent is the mixture of gas phase sio2, attapulgite, wilkinite, organobentonite any one or more than one.
6. the bicomponent epoxy resin glue for silico briquette or silicon rod splicing as claimed in claim 1, is characterized in that, described weighting agent is silicon powder, active micro silicon powder, kaolin, ultrafine kaolin, one or more mixtures of silica powder.
7. the bicomponent epoxy resin glue for silico briquette or silicon rod splicing as claimed in claim 1, is characterized in that, described modified amine curing agent comprises phenol aldehyde modified aliphatic amide, phenol aldehyde modified aliphatic cyclic amine, one or more mixtures of modification aliphatic cyclic amine.
8. the bicomponent epoxy resin glue for silico briquette or silicon rod splicing as claimed in claim 1, is characterized in that, described polymerization mercaptan comprises on-catalytic mercaptan, pre-catalysis mercaptan or epoxy self-vulcanizing agent.
9. the bicomponent epoxy resin glue for silico briquette or silicon rod splicing as claimed in claim 1, is characterized in that, described promotor comprises 2,4,6-tri-(dimethylamino methyl), meta-cresol, Resorcinol, phenol.
10. the preparation method for the bicomponent epoxy resin glue of silico briquette or silicon rod splicing, it is characterized in that, described preparation method's employing is as claimed in any one of claims 1-9 wherein for the bicomponent epoxy resin glue of silico briquette or silicon rod splicing, and described preparation method comprises the steps:
Process prepared by A component is as follows: epoxy resin, phenol aldehyde modified epoxy resin, thixotropic agent, weighting agent are fed in reactor to vacuum stirring 1.5～3 hours;
Process prepared by B component is as follows: modified amine curing agent, polymerization mercaptan, promotor, thixotropic agent, weighting agent are dropped in reactor to vacuum stirring 1.5～3 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016053.8A CN103571411B (en) | 2013-01-16 | 2013-01-16 | Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016053.8A CN103571411B (en) | 2013-01-16 | 2013-01-16 | Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive |
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| Publication Number | Publication Date |
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| CN103571411A true CN103571411A (en) | 2014-02-12 |
| CN103571411B CN103571411B (en) | 2015-05-27 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105022119A (en) * | 2015-08-07 | 2015-11-04 | 中时讯通信建设有限公司 | Optical fiber fusion splicing method |
| CN106753130A (en) * | 2016-12-23 | 2017-05-31 | 上海康达化工新材料股份有限公司 | A kind of modified epoxy for diamond wire cutting silicon rod glue |
| CN112793021A (en) * | 2019-10-28 | 2021-05-14 | 洛阳阿特斯光伏科技有限公司 | Silicon rod splicing method, spliced silicon rod and cutting method of spliced silicon rod |
| CN112852367A (en) * | 2021-03-08 | 2021-05-28 | 南宁珀源能源材料有限公司 | Double-component silicon rod splicing adhesive and preparation method thereof |
| CN112940658A (en) * | 2021-02-01 | 2021-06-11 | 南宁珀源能源材料有限公司 | Stick glue and preparation method and application thereof |
| CN113604183A (en) * | 2021-08-20 | 2021-11-05 | 杭州固安科技有限公司 | Rigid epoxy glue solution |
| CN114276765A (en) * | 2021-12-27 | 2022-04-05 | 句容协鑫光伏科技有限公司 | Rod adhesive for improving cutting edge breakage rate of thin wire thin sheet large-size silicon rod and preparation method thereof |
| CN114921210A (en) * | 2022-06-17 | 2022-08-19 | 宜春宇泽新能源有限公司 | Adhesive for solar-grade silicon wafer suitable for large-size flaking and preparation process and use method thereof |
| CN117247756A (en) * | 2023-08-23 | 2023-12-19 | 广东金湾高景太阳能科技有限公司 | Silicon rod joint glue and preparation method and application thereof |
| CN117247756B (en) * | 2023-08-23 | 2024-05-28 | 广东金湾高景太阳能科技有限公司 | Silicon rod joint glue and preparation method and application thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105022119A (en) * | 2015-08-07 | 2015-11-04 | 中时讯通信建设有限公司 | Optical fiber fusion splicing method |
| CN106753130A (en) * | 2016-12-23 | 2017-05-31 | 上海康达化工新材料股份有限公司 | A kind of modified epoxy for diamond wire cutting silicon rod glue |
| CN112793021A (en) * | 2019-10-28 | 2021-05-14 | 洛阳阿特斯光伏科技有限公司 | Silicon rod splicing method, spliced silicon rod and cutting method of spliced silicon rod |
| CN112940658A (en) * | 2021-02-01 | 2021-06-11 | 南宁珀源能源材料有限公司 | Stick glue and preparation method and application thereof |
| CN112852367A (en) * | 2021-03-08 | 2021-05-28 | 南宁珀源能源材料有限公司 | Double-component silicon rod splicing adhesive and preparation method thereof |
| CN113604183A (en) * | 2021-08-20 | 2021-11-05 | 杭州固安科技有限公司 | Rigid epoxy glue solution |
| CN114276765A (en) * | 2021-12-27 | 2022-04-05 | 句容协鑫光伏科技有限公司 | Rod adhesive for improving cutting edge breakage rate of thin wire thin sheet large-size silicon rod and preparation method thereof |
| CN114921210A (en) * | 2022-06-17 | 2022-08-19 | 宜春宇泽新能源有限公司 | Adhesive for solar-grade silicon wafer suitable for large-size flaking and preparation process and use method thereof |
| CN117247756A (en) * | 2023-08-23 | 2023-12-19 | 广东金湾高景太阳能科技有限公司 | Silicon rod joint glue and preparation method and application thereof |
| CN117247756B (en) * | 2023-08-23 | 2024-05-28 | 广东金湾高景太阳能科技有限公司 | Silicon rod joint glue and preparation method and application thereof |
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