CN101301806A - Film sticking apparatus and manufacturing method of polaroid sheet - Google Patents
Film sticking apparatus and manufacturing method of polaroid sheet Download PDFInfo
- Publication number
- CN101301806A CN101301806A CNA2008100967103A CN200810096710A CN101301806A CN 101301806 A CN101301806 A CN 101301806A CN A2008100967103 A CNA2008100967103 A CN A2008100967103A CN 200810096710 A CN200810096710 A CN 200810096710A CN 101301806 A CN101301806 A CN 101301806A
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- Prior art keywords
- film
- heating
- lamp
- sticking apparatus
- epoxide resin
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- 238000004519 manufacturing process Methods 0.000 title claims description 52
- 238000010438 heat treatment Methods 0.000 claims abstract description 60
- 239000003822 epoxy resin Substances 0.000 claims abstract description 59
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 59
- 239000000853 adhesive Substances 0.000 claims abstract description 47
- 230000001070 adhesive effect Effects 0.000 claims abstract description 47
- 230000003287 optical effect Effects 0.000 claims abstract description 47
- 230000001681 protective effect Effects 0.000 claims abstract description 22
- 230000005855 radiation Effects 0.000 claims abstract description 15
- 125000002091 cationic group Chemical group 0.000 claims description 42
- 239000007767 bonding agent Substances 0.000 claims description 34
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 238000005286 illumination Methods 0.000 abstract description 11
- 150000001768 cations Chemical class 0.000 abstract description 6
- 230000001678 irradiating effect Effects 0.000 abstract 2
- 239000010408 film Substances 0.000 description 158
- -1 carbonium ion Chemical class 0.000 description 18
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000004593 Epoxy Substances 0.000 description 10
- 230000008859 change Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910001507 metal halide Inorganic materials 0.000 description 8
- 150000005309 metal halides Chemical class 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 description 6
- 230000001235 sensitizing effect Effects 0.000 description 6
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
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- 239000000047 product Substances 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
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- 238000000034 method Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
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- 229920001155 polypropylene Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- QUWZMFYOBQVLPQ-UHFFFAOYSA-N 1,9-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C3C(OCCCC)=CC=CC3=CC2=C1 QUWZMFYOBQVLPQ-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920006221 acetate fiber Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 238000007540 photo-reduction reaction Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1409—Visible light radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1412—Infrared [IR] radiation
- B29C65/1416—Near-infrared radiation [NIR]
Abstract
This invention provides a device using adhesives of an optical cation gel-type epoxide resin to bond a polarizer film and a protective film and/or optical compensation film without fully solidifying adhesives of an optical cation gel-type epoxide resin but irradiating the ultraviolet radiation with strong illumination intensity or heating (solidifying) after irradiating the ultraviolet radiation, which is the device bonds these films between the polarizer film and the protective film and/or optical compensation film by depending on adhesives of an optical cation gel-type epoxide resin, and is the film bonding device provided with a heating lamp for heating the adhesives of an optical cation gel-type epoxide resin existed between the films to more than 40 degrees Celsius, and a ultraviolet radiation lamp for solidifying the adhesives of an optical cation gel-type epoxide resin so as to bond the films.
Description
Technical field
The present invention relates to a kind of device that is used to utilize the bonding polariscope film of light cationic curing type epoxide resin adhesive and protective film and/or optical compensating film.
Background technology
The polarizer that uses in optical component or liquid crystal indicator is on the one side at least of polariscope film at polyvinyl alcohol (PVA) normally, makes with bonding agent applying protective film or optical compensating film.As this bonding agent, use be that water system bonding agent or organic solvent are bonding agent, to bring into use the non-solvent as non-water system, non-organic solvent system be bonding agent, particularly light cationic curing type epoxide resin adhesive but replace in recent years.
Past, in making with the manufacturing installation of light cationic curing type epoxide resin adhesive as the polarizer of bonding agent, in order to solidify light cationic curing type epoxide resin adhesive fully, thereby the ultraviolet ray that is provided for shining strong illumination is quickened the ultraviolet lamp of curing reaction with irradiation heat or reaction heat, makes curing reaction finish the heating oven etc. of (solidify the back) thereby perhaps be provided for behind irradiation ultraviolet radiation heating.If the illuminated ultraviolet ray of light cationic curing type epoxide resin adhesive, the Photoepolymerizationinitiater initiater that then wherein includes (catalyst) activation produces acid.The epoxy reaction of this acid and light cationic curing type epoxy resin, epoxy ring-opening produces carbonium ion.This carbonium ion constantly with the epoxy reaction of epoxy resin, epoxide resin adhesive is solidified.But, the reaction of carbonium ion and epoxy radicals is the reaction that is difficult to take place at normal temperatures, thus must shine the light of strong illumination for a long time or after irradiation ultraviolet radiation, utilize heating such as baking box, thus quicken or finish the reaction of carbonium ion and epoxy radicals.
If shine the ultraviolet ray of strong illumination; although the curing of light cationic curing type epoxide resin adhesive is carried out; but a ultraviolet part changes because of heat; and then from by the polyvinyl alcohol film of iodine staining (polariscope film) distillation of iodine or the discharge that segregation causes being taken place; perhaps polariscope film or protective film or optical compensating film deform, thereby degradation.
In addition, under the situation with heating such as baking boxs after ultraviolet ray irradiation, heaters such as essential heating oven, especially under the fast situation of on-line velocity (line speed), it is very long that heating oven becomes, the running expense rising, the equipment investment expense increases.
Summary of the invention
The object of the present invention is to provide a kind of device of using the light cationic curing bonding polariscope film of type epoxide resin adhesive and protective film and/or optical compensating film that makes that is used for to shine for light cationic curing type epoxide resin adhesive is solidified fully the ultraviolet ray of strong illumination or heating after irradiation ultraviolet radiation (solidify the back).
The inventor etc. concentrate on studies in order to solve described problem, found that by using and before irradiation ultraviolet radiation, light cationic curing type epoxide resin adhesive to be heated to the device of specific temperature, can realize described problem, so that finish the present invention based on these opinions.
Utilize the present invention, following 1～8 invention is provided.
(1) a kind of film sticking apparatus, it comes bonding these films by light cationic curing type epoxide resin adhesive between polariscope film and protective film and/or optical compensating film, described film sticking apparatus is characterised in that, be provided with: the lamp of heating, it is used for and will heats in the light cationic curing type epoxide resin adhesive that exists between the described film to more than 40 ℃ and the temperature below the heat resisting temperature of described film; And ultraviolet lamp, thereby it is used to solidify the bonding described film of light cationic curing type epoxide resin adhesive.
(2) according to the film sticking apparatus of (1), wherein, the described lamp of heating is the near-infrared Halogen lamp LED.
(3) according to the film sticking apparatus of (1), wherein, the described lamp of heating is a far-infrared heater.
(4) according to any described film sticking apparatus in (1)～(3), wherein, the temperature of heating of described bonding agent is 40～120 ℃.
(5), wherein, be used for further being arranged at ultraviolet lamp and answering between the bonding described film by the optical filter of at least a portion of the following short wavelength's of 400nm light according to any one film sticking apparatus of (1)～(4).
(6) according to any described film sticking apparatus of (1)～(5), wherein, the described lamp of heating is set, made before utilizing described ultraviolet lamp irradiation ultraviolet radiation, can utilize the described lamp of the heating described bonding agent of heating.
(7) according to any described film sticking apparatus of (1)～(5), wherein, the described lamp of heating is set, makes before utilizing described ultraviolet lamp irradiation ultraviolet radiation and afterwards, can utilize the described lamp of the heating described bonding agent of heating respectively.
(8) a kind of manufacturing method of polaroid sheet; it is the device that is used to make polarizer; described polarizer is made of the layer of polariscope film and protective film and/or optical compensating film and the light cationic curing type epoxide resin adhesive that exists between these films; described manufacturing method of polaroid sheet is characterised in that, have (1)～(7) in any described film sticking apparatus.
Utilize adhering device of the present invention, needn't shine the ultraviolet ray of strong illumination or heating (back curing) irradiation ultraviolet radiation after for light cationic curing type epoxide resin adhesive is solidified fully, so can be easy and the good polariscope of workmanship effectively.
Description of drawings
Fig. 1 is the skeleton diagram of an example of expression film sticking apparatus of the present invention.
Fig. 2 is the skeleton diagram of an example of expression manufacturing method of polaroid sheet of the present invention, and this device comprises an example of film sticking apparatus of the present invention.
Among the figure, 1-film sticking apparatus, the 2-lamp of heating, 3-ultraviolet lamp, 4-conveyer belt, 5-bur film, 6-Cold Mirrors, 7-optical filter, 10-polariscope film, 11-protective film, 12-optical compensating film.
The specific embodiment
Below describe the present invention in detail.
The present invention is the device that is used for coming by light cationic curing type epoxide resin adhesive bonding these films between polariscope film and protective film and/or optical compensating film; thereby it is to be provided with to be used for and will to heat in the light cationic curing type epoxide resin adhesive that exists between the described film to more than 40 ℃ and the film sticking apparatus of heating lamp and solidifying the ultraviolet lamp of the bonding described film of light cationic curing type epoxide resin adhesive of the temperature below the heat resisting temperature of described film; this device is characterised in that, possess the lamp of heating and ultraviolet lamp the two.
The lamp of heating among the present invention is to be used for the light cationic curing type epoxide resin adhesive that is coated between film is heated to the lamp more than 40 ℃, the light cationic curing type epoxide resin adhesive that is coated between film must be heated to more than 40 ℃.As the lamp of heating, for example can enumerate near-infrared Halogen lamp LED and far-infrared heater.As the feature in the described source of heating, temperature is risen apace, especially effective to heating with swiftly flowing adhesive member.The upper limit of the temperature of heating depends on the hear resistance of bur film, so can not limit without exception, for example is 120 ℃.At this, the heat resisting temperature of film is meant film is positioned over certain temperature in the time of following 60 seconds, with compare before the heating, the highest temperature in the temperature of deterioration does not take place in the optical characteristics (transmitance, degree of polarization) that does not occur the distortion (warpage, distortion) of film and film actually.The temperature of heating of bonding agent is below 40 ℃ the time, utilizes the curing of light-struck smooth cationic curing type epoxy resin insufficient, can not reach effect of the present invention.The temperature of heating of bonding agent is preferably 50～100 ℃, more preferably 60～80 ℃.
Lamp can be heated bonding agent to the temperature of regulation as long as heat, and can use more than 1 or 2, in addition, also can dispose a single face, another single face or the two sides of the bur film of can heating.
As the near infrared ray Halogen lamp LED among the present invention, can use known in the past near infrared ray Halogen lamp LED, in addition, possess the near infrared ray Halogen lamp LED (light-focusing type irradiator, directional light syringe) that reflecting plate constitutes irradiator thereby also can use.And then, also can dispose a plurality of Halogen lamp LEDs side by side.
In the present invention, the lamp of heating can be arranged in and utilize before the ultraviolet lamp irradiation ultraviolet radiation, can utilize the lamp of the heating bonding agent of heating, perhaps, also can be arranged to respectively before utilizing the ultraviolet lamp irradiation ultraviolet radiation and can utilize the lamp of the heating bonding agent of heating afterwards.
As the far-infrared heater among the present invention, can use with tungsten, carbon etc. as heater element emitting far infrared ray.Can use known in the past far-infrared heater.
Ultraviolet lamp among the present invention is to be used to make the light cationic curing type epoxide resin adhesive that is coated between film and has been heated to more than 40 ℃ to solidify, thereby adhering film etc.As ultraviolet lamp, can enumerate high-pressure sodium lamp, low pressure mercury lamp, metal halide lamp, high-power metal halide lamp, gallium lamp, xenon lamp, xenon flash lamp, excimer lamp, ultraviolet LED, electrodeless lamp etc.
Device of the present invention preferably has the optical filter between ultraviolet lamp and bur film, described wave filter by (cut) wavelength below the 400nm, at least a portion of the light below 390nm particularly, preferably by all.As this optical filter, can enumerate quartz glass, hot line cut-off filter (IRCF), the following cut-off filter of 310nm, the following cut-off filter of 320nm, the following cut-off filter of 340nm, the following cut-off filter of 390nm, soda lime glass, 400～450nm bandpass filter etc.Utilize these optical filters, can suppress wavelength below the 400nm, particularly the film that causes of the light below 390nm distortion or from the iodine discharge of polariscope film.
Carry out when utilizing the temperature of the light cationic curing type that is radiated at epoxide resin adhesive of the ultraviolet light of device of the present invention to arrive more than 40 ℃.The exposure intensity of ultraviolet light is according to purpose bonding agent or resin film and difference is unqualified, and the exposure intensity of the effective wavelength region may of activation of Photoepolymerizationinitiater initiater is preferably 10～1000mW/cm
2, 50～300mW/cm more preferably
2The irradiation time of light is according to the material of the kind of the photo-curable epoxy resin that uses or film and difference is unqualified, and is 100～3000mJ/cm as the integration light quantity of the product representation of exposure intensity and irradiation time
2(wavelength 405nm) is preferably 700～2000mJ/cm
2(wavelength 405nm).
As long as ultraviolet lamp can curing adhesive, can use more than a kind or 2 kinds, in addition, also can be configured to shine one side, another side or the two sides of bur film.
The polariscope film that can use in film sticking apparatus of the present invention is known polariscope film, for example can enumerate on the polyvinyl alcohol resin of simple tension the film that absorption orientation iodine or dichroism pigment form.
Operable protective film is known protective film in adhering device of the present invention, for example can enumerate the low resin film of rate of perviousness such as amorphous polyolefins based resin film, polyester based resin film, acrylic resin film, Merlon based resin film, polysulfones based resin film, ester ring type polyimides based resin film etc.In addition, can also enumerate higher resin film of the rate of perviousness of acetate fiber prime system resins such as triacetylcellulose film or diacetyl cellulose film and so on etc.Under the situation of the bonding protective film in polariscopic two sides, the two can be protective film of the same race, also can be different types of protective film.
Amorphous polyolefins is that resin is generally ENB or has the resin of polymerized unit of the cyclic polyolefin of many ring norborneol alkene monomers and so on, also can be the copolymer of cyclic olefin and chain cyclic olefin.As commercially available amorphism polyolefin-based resins, comprise APO, ア ペ Le of ZEONEX, ZEONOR, the Mitsui Chemicals (strain) of trade name ア one ト Application, the Japanese ゼ オ Application (strain) of JSR (strain) etc.
The optical compensating film that can use in adhering device of the present invention is known optical compensating film.Optical compensating film material with birefringence for example can be enumerated the polyolefin of Merlon, polyvinyl alcohol, polystyrene, polymethyl methacrylate, polypropylene and so on, polyacrylate, polyamide etc.In addition, also can perhaps can be cyclic olefin and chain cyclic olefin for having ENB or encircling the material of polymerized unit of the cyclic polyolefin of norborneol alkene monomer and so on more.These are oriented film, the film of being handled by suitable mode such as unidirectional or two-way.In addition, also can be the combination more than 2 that is controlled to be purpose of optical characteristics such as broad in band.
The light cationic curing type epoxide resin adhesive that can use in the present invention comprises light cationic curing type photoreactive epoxy resin polymerization initiator or add the bonding agent etc. of sensitizer in them, also can contain habitual adding ingredient in addition.
Light cationic curing type epoxy resin for example comprises aromatic epoxy resin, aliphatic epoxy resin, alicyclic epoxy resin etc. so long as normally used smooth cationic curing type epoxy resin then is not particularly limited.
Light cationic curing type epoxy resin as using in the present invention can use described epoxy resin separately, also can mix with any cooperation ratio and use multiple epoxy resin.
The Photoepolymerizationinitiater initiater that can use in the present invention is not particularly limited so long as thereby the Photoepolymerizationinitiater initiater that utilizes ultraviolet irradiation to produce the polymerization of cation initiation epoxy radicals gets final product.As the example of Photoepolymerizationinitiater initiater, can enumerate sulfonium salt, salt compounded of iodine, diazol.
As the commercially available product of Photoepolymerizationinitiater initiater, can enumerate ア デ カ オ プ ト マ one SP-150 of rising sun electrochemical industry (strain) system and PI2074, the カ ヤ ラ Star De PCI-220 of Japanese chemical drug (strain) etc. of SP-170, ロ デ イ ア (strain) system.
These Photoepolymerizationinitiater initiaters are light cationic curing type epoxy resin 100 mass parts relatively, use 0.5～20 mass parts, preferred 1～10 mass parts.Photoepolymerizationinitiater initiater can be distinguished use separately, also can use two or more.
The light cationic curing type epoxide resin adhesive that can use in the present invention can contain oxetane compound as required.The oxetane compound that can use in the present invention is light cationic curing type epoxy resin 100 mass parts relatively, use with the amount below 50 mass parts.Oxetane compound can be distinguished use separately, also can use two or more.
The light cationic curing type epoxide resin adhesive that can use in the present invention can so that as required and use sensitising agent.By using sensitising agent, reactivity worth improves, and can improve the mechanical strength or the adhesive strength of solidfied material.As sensitising agent, can enumerate carbonyls, organosulfur compound, persulfide, redox based compound, azo and diazonium compound, halogen compounds, photo-reduction pigment etc.These sensitising agents can use separately, also can use two or more.The commercially available product of sensitising agent for example can be enumerated カ ヤ キ ユ ア DETX-S (Japanese chemical drug (strain) system) etc.The amount of sensitising agent is light cationic curing type epoxide resin adhesive 100 mass parts relatively, are 0.01～20 mass parts, are preferably 0.1～5 mass parts.
As long as in the scope of not destroying effect of the present invention, can and then in the light cationic curing type epoxide resin adhesive that can use in the present invention, cooperate described additive in addition, for example filler, antioxidant, silane coupling agent.
As the example of filler, can enumerate inorganic filler or resin fillers such as polypropylene, polyethylene such as talcum, silica, mica.
The light cationic curing type epoxide resin adhesive that can use in the present invention is preferably viscosity 200mPas following (25 ℃) and then is preferably 150mPas following (25 ℃).Low more easy more coating of viscosity in addition, can make the applied thickness of bond layer thin, for example is used for protective film or optical compensating film are attached under the situation of polarizer, and it is good that the outward appearance of polarizer also becomes.Also can use full-bodied bonding agent, but reduce coating amount in this case.
In the present invention; the method of subtend polariscope film or protective film or optical compensating film coating light cationic curing type epoxide resin adhesive; be not particularly limited, for example comprise the method for using scraper, foundry pig, chill coating machine, health agate coating machine (カ Application マ コ one one), intaglio coating machine etc.In addition, the lamination of the film among the present invention can use metallic roll, rubber-surfaced roll etc. to carry out, and the lamination pressure of this moment can be 0～5Mpa.
Adhering film that can enough device manufacturings of the present invention can have the stepped construction that is made of 2 layers, 3 layers or film more than it.
In the present invention, as film, also can use the film of implementing sided corona treatment, plasma treatment, excimer processing, UV processing etc. at the binding face of film.
The present invention also comprises the manufacturing method of polaroid sheet that is assembled with described film sticking apparatus.Manufacturing method of polaroid sheet of the present invention comprises by the device of bonding agent lamination polariscope film and protective film and/or optical compensating film and described film sticking apparatus.Laminater can have the mechanism of adhesive-applying on any kind of polariscope film and protective film and/or optical compensating film, the mechanism of each film of lamination and mechanism's (conveyer belt, roller etc.) of handle thin films, and can use the laminater in the manufacturing method of polaroid sheet in the past that utilizes rubber paste (water り).As mentioned above, film sticking apparatus comprises heat lamp and ultraviolet lamp, and then can comprise mechanism's (conveyer belt, roller etc.) of handle thin films.In the present invention, do not need to be used for the heating oven that solidify the back, but can be provided with yet.
Use description of drawings device of the present invention.
Fig. 1 represents an example of film sticking apparatus of the present invention.Film sticking apparatus 1 has lamp of heating 2 and ultraviolet lamp 3, and then has the conveyer belt 4 that is used for handle thin films.Heat to more than 40 ℃ at the bur film 5 that carries out from left to right on the conveyer belt 13 lamp 2 of being heated by bonding agent applying polariscope film and protective film and/or optical compensating film.In Fig. 1, the lamp 2 of heating disposes 2 above conveyer belt 4, as long as but bonding agent can be heated to the temperature of regulation, also can use more than 1 or 2, in addition, also can above the conveyer belt 4, below or two sides dispose.Utilize 3 pairs of quilts of ultraviolet lamp to heat, fully solidify to bur film 5 irradiation ultraviolet radiations more than 40 ℃, thereby between the adhering film.In Fig. 1,1 ultraviolet lamp 3 of configuration above conveyer belt 4, and if can finish the curing of bonding agent, can use more than 1 or 2, in addition, also can above the conveyer belt 4, below or its two side dispose.Ultraviolet lamp 3 preferably has Cold Mirrors 6.Film sticking apparatus 1 also can between ultraviolet lamp 3 and bur film 5, dispose cutoff wavelength below 390nm the optical filter 7 of light.
Fig. 2 represents an example of manufacturing method of polaroid sheet of the present invention, disposes film sticking apparatus 1 of the present invention in the part of this device.By bonding agent applying polariscope film 10 and protective film 11 and optical compensating film 12; make bur film 5; utilize the lamp 2 of heating in the film sticking apparatus 1 that bonding agent is heated to more than 40 ℃ to it; the ultraviolet ray irradiation of the ultraviolet lamp 3 of utilization from film sticking apparatus 1 is fully solidified the bonding agent of having heated, obtains polarizer.This device is owing to the back curing that does not need bonding agent, so essential heating oven.Wherein, ended the optical filter 7 of at least a portion in the light of wavelength below 390nm in configuration between bur film 5 and the ultraviolet lamp 3.
[embodiment]
Below utilize embodiment to show the present invention, but the present invention is not limited by these embodiment.
The preparation of formulation example light cationic curing type epoxide resin adhesive
The raw material of record in metering and the adding table 1 mix, stir with mixer in the polyethylene container made, obtain the light cationic curing type epoxide resin adhesive A～C (viscosity: 150mPa/s (25 ℃)) of homogeneous.
[table 1]
100MF: trihydroxymethylpropanyltri diglycidyl ether, common prosperity company chemistry (strain)
エ ピ Network ロ Application EXA-850S:4,4 '-2-glycidyl oxygen base-2,2 '-diphenyl propane, big Japanese ink (イ Application キ) chemistry (strain)
エ ピ Network ロ Application N740: phenol phenolic varnish type epoxy oligomer, big Japanese ink chemistry (strain)
CEL2000:1,2-epoxy radicals-4-vinyl cyclohexane, ダ イ セ Le chemical industry (strain)
CEL3000:1,2:8,9 bicyclic oxygen citrenes, ダ イ セ Le chemical industry (strain)
CEL2021P:3,4-epoxy radicals cyclohexenyl group methyl-3 ', 4 '-epoxy radicals cyclohexene carboxylate ester, ダ イ セ Le chemical industry (strain)
The KBM403:3-glycidoxypropyltrime,hoxysilane, SHIN-ETSU HANTOTAI's chemical industry (strain)
CPI101A:4-diphenyl sulfonium base (ス Le ホ ニ オ) diphenyl sulfide hexafluoro antimonate サ Application ア プ ロ (strain)
DBA:1,9-dibutoxy anthracene, Kawasaki change into industry (strain)
The embodiment adhering device
The adhering device that uses in the Production Example of following polarizer possesses the practice of putting down in writing below as shown in Figure 1.
The 1st infrared ray (heating) lamp: the Halogen lamp LED that carries focus irradiation device or directional light irradiator
The 2nd infrared ray (heating) lamp: the Halogen lamp LED that carries focus irradiation device or directional light irradiator
In the heart distance in the 1st and the 2nd infrared lamp: 60～70mm
The distance of infrared lamp and bur: 25～50mm
Ultraviolet lamp: metal halide lamp
The distance of ultraviolet lamp and bur: 100～300mm
In the heart distance in the 2nd infrared lamp and the ultraviolet lamp: 200mm
Optical filter: nothing, hot line cut-off filter, the following cut-off filter of 320nm, the following cut-off filter of 340nm, the following cut-off filter of 370nm or the following cut-off filter of 390nm
Line speed: 0.1～25m/min
Production Example 1～6 and the relatively manufacturing of Production Example 1～3 polarizer
By the photo-curable epoxide resin adhesive A that in formulation example, prepares, single-sided lamination triacetylcellulose film at the polyvinyl alcohol polariscope film that simple tension and usefulness iodine staining are arranged, at another side applying amorphism film of polyolefin resin (the ゼ オ ノ ア film of Japanese ゼ オ Application (strain) system), obtain the film of 3-tier architecture.Use the 1st and the 2nd infrared lamp, the 3-tier architecture film that obtains is heated to room temperature (25 ℃), 30 ℃, 40 ℃, 50 ℃, 60 ℃, 70 ℃, 80 ℃, 100 ℃, 120 ℃ and 140 ℃, use metal halide lamp (ア イ グ ラ Off イ Star Network ス corporate system) then immediately, with exposure intensity 200mW/cm
2(405nm), accumulative total light quantity 1000mJ/cm
2(405nm), transporting velocity 1.5m/min, carry out illumination and penetrate, obtain polarizer.In addition, do not use optical filter.Bond layer between the polarizer film is the thickness about 1～3 μ m.Utilize electron microscope to confirm this value.
Table 2 expression material temperature, the state of the postradiation bonding agent of UV, the distortion of the postradiation polarizer film of UV, the wear properties of polarizer, the optical characteristics after the humidity test.
[table 2]
| Example | Material temperature (℃) | The state of the postradiation bonding agent of UV | The distortion of the postradiation film of UV | Wear properties after the humidity test | Optical characteristics after the humidity test |
| Compare Production Example 1 | 25 | Be liquid state, solidify insufficient | Do not have | × | - |
| Compare Production Example 2 | 30 | Be liquid state, solidify insufficient | Do not have | × | - |
| Production Example 1 | 40 | △ | Do not have | × | - |
| Production Example 2 | 50 | ○ | Do not have | × | - |
| Production Example 3 | 60 | ◎ | Do not have | △ | Some variation |
| Production Example 4 | 70 | ◎ | Do not have | △ | ○ |
| Production Example 5 | 80 | ○ | Warpage slightly | △ | ○ |
| Production Example 6 | 100 | ○ | Warpage greatly | × | - |
| Compare Production Example 7 | 140 | Strip off | Greatly distortion | × | - |
The temperature (temperature of heating) of the bonding agent before material temperature: the UV irradiation
The state of the postradiation bonding agent of UV:
Estimate according to following standard.
Be liquid state, solidify insufficient: be liquid condition, solidify insufficiently, do not have bonding
Strip off: film is stripped off
△: bonding, but intensity some is weak (～100g/25mm)
Zero: bonding, intensity is middle degree (100～200g/25mm)
◎: bonding, intensity is (200g/25mm～) fully
The distortion of the postradiation film of UV: detect by an unaided eye.
Wear properties after the humidity test:
According to following standard, estimate polarizer is positioned over the outward appearance (discharge or film sex change) after 500 hours in 60 ℃-90% the humidity test groove of condition.
*: seriously strip off or the discharge of distortion, polariscope part.
△: strip off or the discharge of distortion, polariscope part.
Zero: the discharge of polariscope part seldom takes place, but do not strip off or be out of shape.
◎: do not strip off or the discharge of distortion, polariscope part.
Optical characteristics after the humidity test:
To before the humidity test and after polarizer, measure degree of polarization and transmitance, estimate with their deterioration (reduction of the value of the polarizer before the humidity test).
※ is for the sex change (distortion, wear properties, optical characteristics) of polarizer, and not only deterioration also takes place under ultraviolet ray heat.
As known from Table 2, if heating after 40～70 ℃, carry out illumination and penetrate, solidify, then the light-cured type epoxide resin adhesive is solidified fully, demonstrates good cementability, does not also almost have the distortion of film simultaneously.On the other hand, be that although there is not the distortion of film, the light-cured type epoxide resin adhesive is solidified insufficient or uncured under 25 ℃, 30 ℃ the situation in the temperature of heating, cementability is very bad.In addition, solidification temperature is that the light-cured type epoxide resin adhesive is solidified fully, demonstrates good cementability under the situation more than 80～100 ℃, but film warpage slightly.In addition, surpass under 100 ℃ the situation, the light-cured type epoxide resin adhesive is solidified fully, demonstrates good cementability, but greatly sex change of film.
Light-cured resin B and C are carried out identical research,, all can obtain same result although cementability more or less there are differences.
Production Example 7～13 and the relatively manufacturing of Production Example 4～6 polarizers
In Production Example 1～6 and relatively in the manufacturing of the polarizer of Production Example 1～3, between metal halide lamp and bur film, dispose the optical filter (ア イ グ ラ Off イ Star Network ス corporate system) of the light of cutoff wavelength below 390nm and use adhering device, similarly carry out, thus the polarizer that obtains Production Example 7～13 respectively and compare Production Example 4～6.
[table 3]
| Example | Material temperature (℃) | The state of the postradiation bonding agent of UV | The distortion of the postradiation film of UV | Wear properties after the humidity test | Optical characteristics after the humidity test |
| Compare Production Example 4 | 25 | Be liquid state, solidify insufficient | Do not have | × | - |
| Compare Production Example 5 | 30 | Be liquid state, solidify insufficient | Do not have | × | - |
| Production Example 7 | 40 | △ | Do not have | △ | Some variation |
| Production Example 8 | 50 | ○ | Do not have | ○ | Variation slightly |
| Production Example 9 | 60 | ◎ | Do not have | ◎ | No change |
| Production Example 10 | 70 | ◎ | Do not have | ◎ | No change |
| Production Example 11 | 80 | ◎ | Do not have | ◎ | No change |
| Production Example 12 | 100 | ◎ | Do not have | △ | Some variation |
| Production Example 13 | 120 | ○ | Warpage slightly | △ | Some variation |
| Compare Production Example 6 | 140 | ○ | Distortion | × | - |
As known from Table 3, if the optical filter of the light of configuration cutoff wavelength below 390nm between metal halide lamp and bur, then compare with situation about not disposing, the sex change of polariscope and film is few, can obtain having the good cementability and the polarizer of wear properties.In addition, even they replace the following wavelength cut-off wave filter of 390nm, and following following wavelength cut-off wave filter or the following wavelength cut-off wave filter of 370nm of wavelength cut-off wave filter, 340nm of use 320nm, also can obtain same result, and the use of the wavelength cut-off wave filter below the 390nm is minimum to the influence that constitutes film.By using optical filter, the distortion of the film in the time of can suppressing to heat to 120 ℃, and the distortion of the film can not suppress to heat to 140 ℃ the time.
The relatively manufacturing of Production Example 7～12 polarizers
Carry out similarly to Example 1, obtain the 3-tier architecture attaching film.The film of the 3-tier architecture that obtains of not heating, and use metal halide lamp (ア イ グ ラ Off イ Star Network ス corporate system), with exposure intensity 500mW/cm
2(405nm), accumulative total light quantity 500,1000,2000 and 3000mJ/cm
2(405nm), carry out illumination and penetrate, obtain polarizer.And then, be 2000 and 3000mJ/cm in the accumulative total light quantity
2Under the situation (405nm), use the optical filter (ア イ グ ラ Off イ Star Network ス corporate system) that is disposed at the light of cutoff wavelength below 390nm between metal halide lamp and the bur film, carry out illumination and penetrate, obtain polarizer.
[table 4]
| Example | Optical filter | Accumulative total light quantity (the mJ/cm of UV 2(405nm)) | The state of the postradiation bonding agent of UV | The distortion of the postradiation film of UV |
| Compare Production Example 7 | Do not have | 500 | Be liquid state, solidify insufficient | Do not have |
| Compare Production Example 8 | Do not have | 1000 | Be liquid state, solidify insufficient | Do not have |
| Compare Production Example 9 | Do not have | 2000 | ○ | Distortion |
| Compare Production Example 10 | Have | 2000 | ○ | Distortion |
| Compare Production Example 11 | Do not have | 3000 | ◎ | Distortion |
| Compare Production Example 12 | Have | 3000 | ◎ | Distortion |
As known from Table 4, under the situation of not heating before illumination is penetrated, even the irradiation light quantity of increase and decrease light, it is outstanding and do not have a polarizer of the distortion of film to obtain cementability.
Utilizability on the industry
Film sticking apparatus of the present invention can be used for being formed in film bonding of the polarizer that the industrial field that comprises electric electronic Instrument uses.
Claims (8)
1. film sticking apparatus, it comes bonding these films by light cationic curing type epoxide resin adhesive between polariscope film and protective film and/or optical compensating film, and described film sticking apparatus is characterised in that, is provided with:
The lamp of heating, it is used for and will heats in the light cationic curing type epoxide resin adhesive that exists between the described film to more than 40 ℃ and the temperature below the heat resisting temperature of described film, and
Ultraviolet lamp, thus it is used to solidify the bonding described film of light cationic curing type epoxide resin adhesive.
2. film sticking apparatus according to claim 1, wherein,
The described lamp of heating is the near-infrared Halogen lamp LED.
3. film sticking apparatus according to claim 1, wherein,
The described lamp of heating is a far-infrared heater.
4. according to any described film sticking apparatus in the claim 1～3, wherein,
The temperature of heating of described bonding agent is 40～120 ℃.
5. according to any described film sticking apparatus in the claim 1～4, wherein,
The optical filter of at least a portion that is used for terminating in the short wavelength's that 400nm is following light further is arranged at ultraviolet lamp and is answered between the bonding described film.
6. according to any described film sticking apparatus in the claim 1～5, wherein,
The described lamp of heating is set, made before utilizing described ultraviolet lamp irradiation ultraviolet radiation, can utilize the described lamp of the heating described bonding agent of heating.
7. according to any described film sticking apparatus in the claim 1～6, wherein,
The described lamp of heating is set, makes before utilizing described ultraviolet lamp irradiation ultraviolet radiation and afterwards, can utilize the described lamp of the heating described bonding agent of heating respectively.
8. manufacturing method of polaroid sheet; it is the device that is used to make polarizer; described polarizer is made of the layer of polariscope film and protective film and/or optical compensating film and the light cationic curing type epoxide resin adhesive that exists between these films; described manufacturing method of polaroid sheet is characterised in that
Has any described film sticking apparatus in the claim 1～7.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007122696A JP5046735B2 (en) | 2007-05-07 | 2007-05-07 | Film bonding apparatus and polarizing plate manufacturing apparatus |
| JP2007-122696 | 2007-05-07 |
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| Publication Number | Publication Date |
|---|---|
| CN101301806A true CN101301806A (en) | 2008-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100967103A Pending CN101301806A (en) | 2007-05-07 | 2008-05-05 | Film sticking apparatus and manufacturing method of polaroid sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5046735B2 (en) |
| KR (1) | KR101227357B1 (en) |
| CN (1) | CN101301806A (en) |
| TW (1) | TWI466974B (en) |
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| JP4391177B2 (en) * | 2003-09-17 | 2009-12-24 | 株式会社リコー | Sealant for photo-curable display element |
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- 2007-05-07 JP JP2007122696A patent/JP5046735B2/en active Active
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- 2008-04-21 TW TW97114447A patent/TWI466974B/en not_active IP Right Cessation
- 2008-05-05 CN CNA2008100967103A patent/CN101301806A/en active Pending
- 2008-05-06 KR KR1020080041980A patent/KR101227357B1/en not_active IP Right Cessation
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| CN103502851A (en) * | 2011-03-09 | 2014-01-08 | 株式会社三立 | Apparatus for manufacturing polarization plate, method for manufacturing polarization plate, polarization plate, and liquid crystal display device using polarization plate |
| CN103502851B (en) * | 2011-03-09 | 2016-04-27 | 株式会社三立 | The preparation facilities of Polarizer, the preparation method of Polarizer, Polarizer and use its liquid crystal indicator |
| CN104010818A (en) * | 2011-12-20 | 2014-08-27 | 第一毛织株式会社 | Method for manufacturing film laminate and film laminate formed by same |
| US9375906B2 (en) | 2011-12-20 | 2016-06-28 | Cheil Industries, Inc. | Method for manufacturing a film laminate, and film laminate formed by the method |
| CN104010818B (en) * | 2011-12-20 | 2016-12-14 | 第一毛织株式会社 | For the method manufacturing film laminates and the film laminates formed by the method |
| CN104395786A (en) * | 2012-07-02 | 2015-03-04 | 住友化学株式会社 | Polarizing plate fabrication method and fabrication device |
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| CN109661601A (en) * | 2016-09-06 | 2019-04-19 | 住友化学株式会社 | Polarization plates and its manufacturing method |
| CN109661601B (en) * | 2016-09-06 | 2022-02-01 | 住友化学株式会社 | Polarizing plate and method for manufacturing same |
| CN110462458A (en) * | 2017-03-31 | 2019-11-15 | Ａｇｃ株式会社 | The manufacturing method of optical element and optical element |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200900481A (en) | 2009-01-01 |
| KR101227357B1 (en) | 2013-01-28 |
| KR20080099168A (en) | 2008-11-12 |
| JP5046735B2 (en) | 2012-10-10 |
| JP2008276136A (en) | 2008-11-13 |
| TWI466974B (en) | 2015-01-01 |
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Application publication date: 20081112 |