CN104022210A - 一种led料盒治具 - Google Patents
一种led料盒治具 Download PDFInfo
- Publication number
- CN104022210A CN104022210A CN201410274577.1A CN201410274577A CN104022210A CN 104022210 A CN104022210 A CN 104022210A CN 201410274577 A CN201410274577 A CN 201410274577A CN 104022210 A CN104022210 A CN 104022210A
- Authority
- CN
- China
- Prior art keywords
- plate
- clamping plate
- magazine
- led
- backing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004308 accommodation Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- IXSZQYVWNJNRAL-UHFFFAOYSA-N etoxazole Chemical compound CCOC1=CC(C(C)(C)C)=CC=C1C1N=C(C=2C(=CC=CC=2F)F)OC1 IXSZQYVWNJNRAL-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Details Of Spanners, Wrenches, And Screw Drivers And Accessories (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410274577.1A CN104022210B (zh) | 2014-06-19 | 2014-06-19 | 一种led料盒治具 |
CN201710181565.8A CN106876553B (zh) | 2014-06-19 | 2014-06-19 | 一种led料盒治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410274577.1A CN104022210B (zh) | 2014-06-19 | 2014-06-19 | 一种led料盒治具 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710181565.8A Division CN106876553B (zh) | 2014-06-19 | 2014-06-19 | 一种led料盒治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104022210A true CN104022210A (zh) | 2014-09-03 |
CN104022210B CN104022210B (zh) | 2018-02-16 |
Family
ID=51438867
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710181565.8A Active CN106876553B (zh) | 2014-06-19 | 2014-06-19 | 一种led料盒治具 |
CN201410274577.1A Active CN104022210B (zh) | 2014-06-19 | 2014-06-19 | 一种led料盒治具 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710181565.8A Active CN106876553B (zh) | 2014-06-19 | 2014-06-19 | 一种led料盒治具 |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN106876553B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106312643A (zh) * | 2016-10-21 | 2017-01-11 | 安徽大华半导体科技有限公司 | 料盒自动装夹机构 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001121370A (ja) * | 1999-10-28 | 2001-05-08 | Star Techno Kk | 成型品保持用チャック部材 |
CN102790142A (zh) * | 2012-07-13 | 2012-11-21 | 深圳市因沃客科技有限公司 | 一种全自动固晶机的夹紧定位机构 |
CN202622122U (zh) * | 2012-01-18 | 2012-12-26 | 苏州赛腾精密电子有限公司 | 一种过锡炉治具的锁压装置 |
CN202712246U (zh) * | 2012-08-08 | 2013-01-30 | 深圳市因沃客科技有限公司 | 可调式通用料盒 |
CN202749415U (zh) * | 2012-08-16 | 2013-02-20 | 深圳市斯迈得光电子有限公司 | 一种led固晶治具 |
CN202815024U (zh) * | 2012-09-11 | 2013-03-20 | 全天自动化能源科技(东莞)有限公司 | 一种压床式测试机的治具上板固定装置 |
CN203932104U (zh) * | 2014-06-19 | 2014-11-05 | 昆山英博尔电子科技有限公司 | 一种led料盒治具 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100989241B1 (ko) * | 2008-09-19 | 2010-10-20 | 로체 시스템즈(주) | 포스비 고정 장치 |
CN202405243U (zh) * | 2012-01-05 | 2012-08-29 | 深圳市高尚能源科技有限公司 | Led固晶机中用的料盒自动夹持装置 |
CN103093988B (zh) * | 2013-01-07 | 2015-05-27 | 深圳雷柏科技股份有限公司 | Fpc板的上料装置及键盘底板自动组装系统 |
CN203192772U (zh) * | 2013-02-04 | 2013-09-11 | 台湾暹劲股份有限公司 | 晶圆承载盒的启闭设备 |
-
2014
- 2014-06-19 CN CN201710181565.8A patent/CN106876553B/zh active Active
- 2014-06-19 CN CN201410274577.1A patent/CN104022210B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001121370A (ja) * | 1999-10-28 | 2001-05-08 | Star Techno Kk | 成型品保持用チャック部材 |
CN202622122U (zh) * | 2012-01-18 | 2012-12-26 | 苏州赛腾精密电子有限公司 | 一种过锡炉治具的锁压装置 |
CN102790142A (zh) * | 2012-07-13 | 2012-11-21 | 深圳市因沃客科技有限公司 | 一种全自动固晶机的夹紧定位机构 |
CN202712246U (zh) * | 2012-08-08 | 2013-01-30 | 深圳市因沃客科技有限公司 | 可调式通用料盒 |
CN202749415U (zh) * | 2012-08-16 | 2013-02-20 | 深圳市斯迈得光电子有限公司 | 一种led固晶治具 |
CN202815024U (zh) * | 2012-09-11 | 2013-03-20 | 全天自动化能源科技(东莞)有限公司 | 一种压床式测试机的治具上板固定装置 |
CN203932104U (zh) * | 2014-06-19 | 2014-11-05 | 昆山英博尔电子科技有限公司 | 一种led料盒治具 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106312643A (zh) * | 2016-10-21 | 2017-01-11 | 安徽大华半导体科技有限公司 | 料盒自动装夹机构 |
CN106312643B (zh) * | 2016-10-21 | 2018-07-24 | 安徽大华半导体科技有限公司 | 料盒自动装夹机构 |
Also Published As
Publication number | Publication date |
---|---|
CN106876553A (zh) | 2017-06-20 |
CN106876553B (zh) | 2019-03-22 |
CN104022210B (zh) | 2018-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170328 Address after: 215300 Jiangsu, Suzhou, Yushan, the town of Federal International Business Garden building, room 14, room 40, No. Applicant after: Kunshan Xinhaiyun Trading Co., Ltd. Address before: Kunshan city Suzhou Dianshan Lake town of Jiangsu province 215300 City Double Road No. 85 Applicant before: Kunshan Ying Boer Electronic Science and Technology Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191118 Address after: 313000 1-B, building 1, No. 656, Qixing Road, high tech Zone, Wuxing District, Huzhou City, Zhejiang Province Patentee after: Huzhou Qiqi Electromechanical Technology Co., Ltd Address before: 215300 Jiangsu, Suzhou, Yushan, the town of Federal International Business Garden building, room 14, room 40, No. Patentee before: Kunshan Xinhaiyun Trading Co., Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201110 Address after: 226100 Guangzhou road Jiangsu city Nantong Province Haimen Economic and Technological Development Zone No. 999 Patentee after: Nantong North Bund Construction Engineering Co.,Ltd. Address before: 313000 1-B, building 1, No. 656, Qixing Road, high tech Zone, Wuxing District, Huzhou City, Zhejiang Province Patentee before: Huzhou Qiqi Electromechanical Technology Co.,Ltd. |
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TR01 | Transfer of patent right |