CN103990612B - 一种二极管零部件清洗烘干装置及其操作方法 - Google Patents
一种二极管零部件清洗烘干装置及其操作方法 Download PDFInfo
- Publication number
- CN103990612B CN103990612B CN201410236252.4A CN201410236252A CN103990612B CN 103990612 B CN103990612 B CN 103990612B CN 201410236252 A CN201410236252 A CN 201410236252A CN 103990612 B CN103990612 B CN 103990612B
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- CN
- China
- Prior art keywords
- cleaning
- diode
- table surface
- ultrasonic cleaning
- operating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410236252.4A CN103990612B (zh) | 2014-05-30 | 2014-05-30 | 一种二极管零部件清洗烘干装置及其操作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410236252.4A CN103990612B (zh) | 2014-05-30 | 2014-05-30 | 一种二极管零部件清洗烘干装置及其操作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103990612A CN103990612A (zh) | 2014-08-20 |
CN103990612B true CN103990612B (zh) | 2016-05-11 |
Family
ID=51305088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410236252.4A Active CN103990612B (zh) | 2014-05-30 | 2014-05-30 | 一种二极管零部件清洗烘干装置及其操作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103990612B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105346236B (zh) * | 2015-12-10 | 2018-01-30 | 重庆凯西驿电子科技有限公司 | 二极管油墨烘干工装 |
CN111744870A (zh) * | 2020-06-24 | 2020-10-09 | 中国科学院苏州纳米技术与纳米仿生研究所广东(佛山)研究院 | 一种半导体器件金锡焊接后的清洗方法 |
CN111921976B (zh) * | 2020-07-15 | 2022-02-01 | 中国电子科技集团公司第二十四研究所 | 一种提高楔焊劈刀清洗质量的方法 |
CN111957665A (zh) * | 2020-08-10 | 2020-11-20 | 如皋市大昌电子有限公司 | 轴向二极管的超声波清洗工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101345185A (zh) * | 2008-08-26 | 2009-01-14 | 如皋市日鑫电子有限公司 | 一种二极管的酸洗工艺 |
CN102097293A (zh) * | 2010-11-19 | 2011-06-15 | 嘉盛半导体(苏州)有限公司 | 半导体封装产品的清洗机台及清洗工艺 |
CN102214570A (zh) * | 2010-04-04 | 2011-10-12 | 如皋市易达电子有限责任公司 | 一种高稳定触发二极管的制造方法 |
CN102244001A (zh) * | 2011-06-29 | 2011-11-16 | 常州佳讯光电产业发展有限公司 | 二极管酸洗脱水工艺及其设备 |
CN102709157A (zh) * | 2012-05-30 | 2012-10-03 | 常州佳讯光电产业发展有限公司 | 一种二极管清洗工艺及其清洗设备 |
CN203556618U (zh) * | 2013-11-06 | 2014-04-23 | 苏州工业园区职业技术学院 | 电子芯片转运盒清洗系统 |
CN203862608U (zh) * | 2014-05-30 | 2014-10-08 | 贵州雅光电子科技股份有限公司 | 一种二极管零部件清洗烘干装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3337895B2 (ja) * | 1996-02-29 | 2002-10-28 | 株式会社東芝 | 半導体基板洗浄方法 |
-
2014
- 2014-05-30 CN CN201410236252.4A patent/CN103990612B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101345185A (zh) * | 2008-08-26 | 2009-01-14 | 如皋市日鑫电子有限公司 | 一种二极管的酸洗工艺 |
CN102214570A (zh) * | 2010-04-04 | 2011-10-12 | 如皋市易达电子有限责任公司 | 一种高稳定触发二极管的制造方法 |
CN102097293A (zh) * | 2010-11-19 | 2011-06-15 | 嘉盛半导体(苏州)有限公司 | 半导体封装产品的清洗机台及清洗工艺 |
CN102244001A (zh) * | 2011-06-29 | 2011-11-16 | 常州佳讯光电产业发展有限公司 | 二极管酸洗脱水工艺及其设备 |
CN102709157A (zh) * | 2012-05-30 | 2012-10-03 | 常州佳讯光电产业发展有限公司 | 一种二极管清洗工艺及其清洗设备 |
CN203556618U (zh) * | 2013-11-06 | 2014-04-23 | 苏州工业园区职业技术学院 | 电子芯片转运盒清洗系统 |
CN203862608U (zh) * | 2014-05-30 | 2014-10-08 | 贵州雅光电子科技股份有限公司 | 一种二极管零部件清洗烘干装置 |
Also Published As
Publication number | Publication date |
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CN103990612A (zh) | 2014-08-20 |
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Diode part cleaning and drying device and operating method thereof Effective date of registration: 20170116 Granted publication date: 20160511 Pledgee: Bank of Guiyang Limited by Share Ltd high tech branch Pledgor: Guizhou Yaguang Electronic Technology Co.,Ltd. Registration number: 2017990000037 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200317 Granted publication date: 20160511 Pledgee: Bank of Guiyang Limited by Share Ltd high tech branch Pledgor: GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: 2017990000037 |