CN103959555B - 电容性盲插模块互连 - Google Patents
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Abstract
一种在主模块外壳和一个或多个子模块外壳之间的盲插电容性耦合互连,具有耦合表面和内部元件,每个耦合表面具有接地部分和孔,内部元件设置在孔中,与所述接地部分分隔开。所述耦合表面可以设置为例如在印刷电路板上的迹线。为了适应一定程度的未对准,其中一个内部元件可以设置为大于另一个。当所述耦合表面例如通过机械固定装置配合在一起,保持在合适的位置上时,产生所述耦合表面之间的电容性耦合。
Description
技术领域
本发明涉及电气互连。更具体地,本发明涉及在RF组件之间的盲插电容性耦合互连。
背景技术
在不同的RF组件之间(比如在主模块和一个或多个子模块之间)的互连可能需要针对阻抗配合、信号泄露和/或无源互调失真(PIM)的高性能。PIM为电气干扰/信号传输退化的形式,其可能作为随着时间的机电互连变化或者退化出现,例如由于机械应力、振动、热循环和/或材料降解造成。由于由单个低质量互连产生的PIM可能降低整个RF系统的电气性能,因此PIM是重要的互连质量特性。
用于在模块之间提供机电模块互连的传统技术(比如同轴电缆跳线)可能需要费时地连接和/或可能需要专业技能,比如焊接和操作具有高精度的构件的能力。这样的互连还可能是脆弱的并且如果处理不当的话容易损坏。这些问题可能存在于制造期间、最初的现场安装期间和/或在整个安装寿命上的持续维修期间。
电容性耦合的互连在电气领域是已知的,例如,在印刷电路板的元件之间的RF组件内或者同轴电缆的同轴连接器端子内。电容性耦合的互连可以消除(i)焊接,(ii)螺纹紧固件,(iii)从主体向外延伸并且因此在有害环境中受到损坏的脆弱部件,以及(iv)对于精确对准以实现高性能的需求。
在RF组件市场中的竞争已将注意力集中在改进组件互连性能和长期互连可靠性上。此外,包括材料、训练和安装成本的总成本的降低可以是对于商业成功的重要因素。
因此,本发明的目标是提供一种克服在现有技术中的缺陷的互连和互连的方法。
附图说明
并入并且构成该说明书的一部分的所附附图显示了本发明的实施方案,其中在附图中相同的附图标记指示相同的特征或者元件,并且可以不针对它们所出现的每个附图进行具体描述,并且所附附图连同以上给出的本发明的一般描述,以及以下给出的实施方案的具体描述,用于说明本发明的原理。
图1为附接有多个子模块的主模块的示例性实施方案的示意性等角视图,其中一个子模块显示为透明的以展示耦合表面。
图2为图1的组件的部分近视图。
图3为具有沿着箭头的方向放置以进行配合的根据图1的主模块的示意性的简化的切开侧视图。
图4为印刷电路板耦合表面实施方案的示意性的等距切开顶侧视图。
图5为尺寸设计为与图4的耦合表面配合的印刷电路板耦合表面实施例的示意性的等距切开底侧视图。注意内部元件与图4的内部元件相比被放大了。
图6为图1的组件的一部分的等距近视图,显示在互连之前子模块的配合的对准和方向。
图7为图6的互补角度的示意图,还显示子模块外壳的底部部分主模块机械固定装置就位。
图8为在锁定机构旋转之前机械固定装置的示意性的顶视图。
图9为机械固定装置的示意性的顶视图,锁定机构处于旋转位置和锁定位置。
具体实施方式
发明人已经意识到,通过在主模块和耦合到主模块的一个或多个子模块之间提供一般的平面电容性耦合互连表面,可以降低PIM并且能够实现盲插互连特性。
在图1和图2中显示示例性的电容性耦合的盲插互连,其中主模块1为具有多个现场可交换互连子组件3(比如收发器模块)的有源天线阵列。主模块1显示为具有典型的安装硬件,包括安装杆5和安装支架7。本领域技术人员应当理解,对于组装、安装和/或维修操作来说,有利的是能够在主模块1和每个子模块3之间实现盲插连接和断开,而不干扰相邻的子模块3、主模块支架7和/或附近结构,比如安装杆5或主模块可选地安装在其上的壁。
RF信号可以跨设置在主模块外壳13的主模块外表面11上的一个或多个主模块电容性耦合表面9而在主模块1和每个子模块3之间通过。每个主模块电容性耦合表面9分别与设置在子模块外壳19的子模块外表面17上的各子模块电容性耦合表面15配合。
例如如在图3-5中所示的,主模块和子模块电容性耦合表面9、15可以设置为大体平面的,具有围绕孔23的接地部分21。内部元件25设置在主模块电容性耦合表面9的孔23内,与接地部分21电隔离。相似地,内部元件25设置在子模块电容性耦合表面15的孔23内,与子模块电容性耦合表面15的接地部分21电隔离。
为了降低在主模块和子模块耦合表面对之间的配合精确度需求,主模块或子模块的内部元件25中的一个可以设置成大于另外一个。由此,只要两个内部元件25中较小的那个保持位于以较大的内部元件25为特征的耦合表面的范围内,则其之间的互连的电容性耦合特性可以具有减小的变化性,降低了在它们各自的外壳内和/或被应用于保持它们配合在一起的机械固定装置27内的耦合表面就位所需要的精确度。本领域技术人员应当理解,作为在较大的内部元件25可设置在任一耦合表面的上的等效结构中的对,形成主模块和子模块电容性耦合表面9、15的元件可容易地彼此交换。相似地,孔23和/或接地部分21的邻近区域不需要精确地对准,无需连接并且至少与内部元件25分隔开。
主模块电容性耦合表面9和/或子模块电容性耦合表面15可以成本高效地以高精度设置为大体平面的印刷电路板29,其中接地部分21为围绕孔23的印刷电路板29的外围迹线部分,在孔23内,内部元件25与作为其他迹线的接地部分21隔离。接地部分25可以通过直接接触耦合至各自的主模块和子模块的周围的外表面9,15,例如通过设置顶层接地迹线35的外围部分所抵靠的突出缘31。此外,围绕印刷电路板29的主模块和子模块外壳13、19可以在结构上加固耦合表面。
本领域技术人员应当理解,电容性耦合性能是RF信号频率、耦合表面面积以及耦合的表面之间的距离的函数。为了最小化在耦合的表面之间的距离,接地部分21和内部元件25可以设置在印刷电路板29的底层33上;接地部分21和内部元件25通过至少一个接地过孔和至少一个内部元件过孔分别电耦合到印刷电路板的顶层的顶层接地迹线和顶层内部元件迹线。由此,对于耦合表面的进一步的电连接可以整个位于它们各自的外壳之内。例如,具有耦合到顶层接地迹线35的外部导体45和耦合到顶层内部元件迹线37的内部导体47的同轴电缆43可以用于选路在耦合表面之间通过的RF信号以进一在外壳中分布。
为了抑制跨电容性耦合表面的主模块和子模块之间的任何直接金属到金属的电互连,印刷电路板29的底层33可以成本高效地设置有具有大体均匀厚度的介电间隔部49,比如非导电性保形涂层或者其他的介电层,比如焊料掩膜、涂料或者干膜。
主模块和子模块耦合表面9、15可以通过机械固定装置27保持相互抵靠。例如如图6和7中所示的,机械固定装置27可以被设置为从主模块外壳13突出的至少一个柱51,柱51的尺寸被设计为接合子模块外表面17的槽53。为了改善保持和/或长期对准,多个柱51和槽53可以被放置为邻接子模块3的底表面55的外围。可选地和/或附加地,柱51和槽53可以放置为与耦合表面分隔开,以最小化柱51和槽53的耦合可能产生的任何电气干扰。可选地,例如如图8和9中所示,锁定机构57可旋转以使得槽53能够插入并且之后使柱51固定在槽53内,该锁定机构57可以应用于将机械固定装置27保持在锁定或非锁定位置。
可以针对单个子模块3应用多对主模块和子模块耦合表面9、15,如图1、2、6和7中所示。例如,多个耦合表面可以应用于相互间共面的相同表面,比如侧壁59或子模块3的底表面55和相应的主模块外表面11。可选地,例如在一个耦合表面被设置在底表面55上以及一个耦合表面被设置在侧壁表面59上的情况下,耦合表面被设置为相互垂直。对应于侧壁的主模块表面例如可以是从主模块外表面11突出的管道61的侧壁。管道61例如可以是沿着主模块外表面11延伸的波导,将经由其传输的信号传递至多个子模块3中所需要的组。
根据耦合表面的对准,插入方向在配合期间可以或者平行于或者正交于相应的电容性耦合表面,由所选择的机械固定装置的接合进行引导,比如柱51接合至槽53中。
因此,在用于形成互连的方法中,安装者仅需要将子模块3滑入所需要的位置,例如以使得槽53接合柱51。当柱51到达槽53的底部时,耦合表面将被对准并且锁定装置57可以旋转至锁定位置,以使子模块3固定在主模块1的合适位置中,每一个电容性耦合表面对相互对准。
本领域技术人员应当理解,盲插的模块到模块的互连消除了对同轴跳线等等的需要,其可极大地简化互连的制造,提高电气性能和可靠性,并且降低了组件总体尺寸需求和制造成本。
构件的列表
1 主模块
3 子模块
5 安装杆
7 安装支架
9 主模块电容性耦合表面
11 主模块外表面
13 主模块外壳
15 子模块电容性耦合表面
17 子模块外表面
19 子模块外壳
21 接地部分
23 孔
25 内部元件
27 机械固定装置
29 印刷电路板
31 缘
33 底层
35 顶层接地迹线
37 顶层内部元件迹线
39 接地过孔
41 内部元件过孔
43 同轴电缆
45 外部导体
47 内部导体
49 介电间隔部
51 柱
53 槽
55 底表面
57 锁定机构
59 侧壁表面
61 通道
在前文描述参考中的材料、比率、整数或部件具有已知的等同物的情况下,如果单独设置的话,这样的等同物被并入到本文中。
虽然本发明通过其实施方案的描述进行显示,以及虽然实施方案已经进行了相当细节的描述,但申请人的意图不是将当前权利要求的范围限制或者以任何方式限定为这样的细节。额外的优点和修改对本领域技术人员来说将是相当明显的。因此,本发明在其扩展的方面中并不受限于具体细节、代表性的装置、方法,以及显示的和描述的说明性示例。因此,装置可以根据这样的细节制造,而不脱离申请人的一般发明概念的精神或范围。而且,应当理解,可以对其做出改进和/或修改而不脱离如所附的权利要求所限定的本发明的范围或精神。
Claims (20)
1.一种在主模块外壳和子模块外壳之间的盲插电容性耦合互连,包括:
第一主模块电容性耦合表面,所述第一主模块电容性耦合表面设置在所述主模块外壳的主模块外表面上;
第一子模块电容性耦合表面,所述第一子模块电容性耦合表面设置在所述子模块外壳的子模块外表面上;所述第一主模块电容性耦合表面和所述第一子模块电容性耦合表面各自设置有具有孔的接地部分;
主模块内部元件,所述主模块内部元件设置在所述第一主模块电容性耦合表面的孔内,与所述第一主模块电容性耦合表面的接地部分电隔离;
子模块内部元件,所述子模块内部元件设置在所述第一子模块电容性耦合表面的孔内,与所述第一子模块电容性耦合表面的接地部分电隔离;以及
机械固定装置,所述机械固定装置的尺寸被设计为保持所述第一子模块电容性耦合表面抵靠所述第一主模块电容性耦合表面。
2.根据权利要求1所述的互连,其中所述第一主模块电容性耦合表面和所述第一子模块电容性耦合表面是大体平面的。
3.根据权利要求1所述的互连,其中所述主模块内部元件和所述子模块内部元件中的一个大于另一个。
4.根据权利要求1所述的互连,其中所述第一主模块电容性耦合表面和所述第一子模块电容性耦合表面中的至少一个为印刷电路板。
5.根据权利要求4所述的互连,其中所述印刷电路板的底层具有非导电保形涂层。
6.根据权利要求4所述的互连,其中所述第一主模块电容性耦合表面的所述接地部分和所述主模块内部元件设置在所述印刷电路板的底层上;所述第一主模块电容性耦合表面的所述接地部分和所述主模块内部元件通过至少一个接地过孔和至少一个内部元件过孔电耦合到所述印刷电路板的顶层的顶层接地迹线和顶层内部元件迹线。
7.根据权利要求6所述的互连,其中同轴电缆的外部导体耦合到所述顶层接地迹线并且所述同轴电缆的内部导体耦合到所述顶层内部元件迹线。
8.根据权利要求1所述的互连,其中所述机械固定装置包括从所述主模块外壳突出的至少一个柱,所述柱的尺寸被设计为接合子模块外表面的槽。
9.根据权利要求8所述的互连,其中所述槽设置有锁定机构,所述锁定机构能够旋转以使所述柱固定在所述槽内。
10.根据权利要求1所述的互连,进一步包括设置在主模块外表面上的第二主模块电容性耦合表面;以及设置在子模块外表面上的第二子模块电容性耦合表面。
11.根据权利要求10所述的互连,其中所述第一主模块电容性耦合表面和所述第二主模块电容性耦合表面是共面的。
12.根据权利要求10所述的互连,其中所述第一主模块电容性耦合表面和所述第二主模块电容性耦合表面设置为相互垂直。
13.根据权利要求1所述的互连,其中子模块外壳在平行于所述第一主模块电容性耦合表面和正交于所述第一主模块电容性耦合表面其中之一的方向上与主模块外壳配合。
14.根据权利要求1所述的互连,其中所述第一主模块电容性耦合表面设置在从主模块外表面突出的通道的侧壁上。
15.根据权利要求1所述的互连,其中所述第一主模块电容性耦合表面的接地部分电耦合到主模块外表面。
16.根据权利要求1所述的互连,其中所述第一子模块电容性耦合表面的接地部分电耦合到子模块外表面。
17.根据权利要求1所述的互连,其中主模块包括所述主模块外壳,并且子模块包括所述子模块外壳,其中所述主模块为有源天线并且所述子模块为收发器模块。
18.一种用于在主模块外壳和子模块外壳之间形成盲插电容性耦合互连的方法,包括以下步骤:
设置第一主模块电容性耦合表面,所述第一主模块电容性耦合表面设置在所述主模块外壳的主模块外表面上;
设置第一子模块电容性耦合表面,所述第一子模块电容性耦合表面设置在所述子模块外壳的子模块外表面上;所述第一主模块电容性耦合表面和所述第一子模块电容性耦合表面各自设置有具有孔的接地部分;
在所述第一主模块电容性耦合表面的孔内设置主模块内部元件,所述主模块内部元件与所述第一主模块电容性耦合表面的接地部分电隔离;
在所述第一子模块电容性耦合表面的孔内设置子模块内部元件,所述子模块内部元件与所述第一子模块电容性耦合表面的接地部分电隔离;
设置机械固定装置,所述机械固定装置的尺寸被设计为保持所述第一子模块电容性耦合表面抵靠所述第一主模块电容性耦合表面;以及
将所述第一子模块电容性耦合表面与所述第一主模块电容性耦合表面进行配合。
19.根据权利要求18所述的方法,还包括将子模块与主模块配合,其中将子模块与主模块的配合沿着平行于所述第一主模块电容性耦合表面和正交于所述第一主模块电容性耦合表面其中之一的方向。
20.根据权利要求18所述的方法,其中所述配合将所述第一子模块电容性耦合表面定位为平行于所述第一主模块电容性耦合表面。
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