CN1039499C - 耐热软钎料铅基合金 - Google Patents

耐热软钎料铅基合金 Download PDF

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CN1039499C
CN1039499C CN95105291A CN95105291A CN1039499C CN 1039499 C CN1039499 C CN 1039499C CN 95105291 A CN95105291 A CN 95105291A CN 95105291 A CN95105291 A CN 95105291A CN 1039499 C CN1039499 C CN 1039499C
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alloy
solder
temperature
soft solder
base alloy
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CN1120596A (zh
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李志平
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KUNMING NOBLE METAL INST CHINA NONFERROUS METAL INDUSTRY GENERAL Co
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KUNMING NOBLE METAL INST CHINA NONFERROUS METAL INDUSTRY GENERAL Co
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Abstract

一种耐热软钎料铅基合金,其特征是合金成分(重量%)为Sn2.0~9.0,Sb0.2~5.0,Cu0.3~2.0,P0.001~0.3,Pb余量。本发明合金不含有毒元素Cd和贵金属,成本低廉,具有钎焊温度低、耐热(工作)温度高等优点,用于铜,钢等金属母材的钎焊,特别是不锈钢等母材的钎焊。

Description

耐热软钎料铅基合金
本发明涉及软钎焊用铅基合金,特别涉及熔化温度315~345℃、钎接头工作温度高于250℃的软钎焊用铅基合金,用于铜,钢等金属母材的钎焊,特别是不锈钢等母材的钎焊,供军工、电子、纺织、化工和机械行业中的部件钎焊使用。
众所周知,熔化温度低于450℃的软钎料多由锡铅组成,例如,”铅基低熔点焊料综述”(铜加工,1989,(1),165-172)一文综述了铅基二元、三元及多元低熔点合金焊料的文献报道情况,涉及到Pb-Sn二元系、Pb-Sn-Ag。Pb-Sn-Sb、Pb-Ag-Bi、Pb-Sn-Cd三元系和Pb-Sn-Ag-Cd四元系等合金焊料。虽然这些合金焊料也属于低熔点焊料,但其所适用的温区较低,其钎焊温度均在300℃以下,工作(耐热)温度<150℃,而且,上述钎料还存在下述问题,(1)含贵金属元素,如Ag,因此成本较高;(2)含有毒元素,如镉。镉元素有毒,损害人体健康和造成环境污染。为此,许多国家相继开展了替代Ag5Cd等不含Ag、Cd的耐热软钎料的研究工作。例如,GB2174109公开了一种锌基耐热软钎料,但是钎料的熔熔化温度太高(400~500℃)。前苏联SU407689公开了一种耐热软钎料,其成分为(重量%)Ni0.1~0.3,Cu0.1~0.2,Zn0.5~2.0,Pb余量,其缺点是脆性较大,难以进行加工.特开昭5509445提出了一种Sn-Bi-Ti-Pb四元铅基耐热软钎料,但其耐热温度仅为210℃。特开平3-204194公开了一种热疲劳性能优良的铅锡基合金,其主成分为(重量%)Sn1~60,Sb0.01~10,Pb余量;另外,在上述合金成分基础上,还可添加Cu,Ni,Au,Ag,Pt,Pd,Mg,Ca,Li,La,Ce,Cd,Co,Cr,Fe,Mn,Se,Te,Zr元素中之一种或多种,含量0.07~7%。但是,该钎料主要是改善合金的耐热疲劳和抗蠕变性能,没有钎料的熔化温度、工作温度和抗拉强度等数据,而且,该钎料主要用于电子元件焊接。
本发明的目的在于克服现有技术存在的上述缺点,提出一种不含有毒元素Cd和贵金属Ag的耐热软钎料,其熔化温度低(315~345℃),而耐热温度高(250~280℃),用该钎料焊接的焊缝光亮、致密,润湿性好。
本发明的技术方案是,在传统Pb-Sn合金基础上改变合金成分,提出一种新的铅基合金钎料,本发明的特征是,合金成分(重量%)为Sn2.0~9.0,Sb0.2~5.0,Cu0.3~2.0,P0.001~0.3,Pb余量。
在Pb-Sn基体合金中加入Sb,可以降低钎料的表面张力,并在合金中形成金属互化物SnSb,呈分散状态析出,成为晶粒边界;加入易和锡形成化合物的Cu和P,可以沿SnSb组成的晶界分散析出Cu、P与Sn的化合物,从而提高合金钎料的耐热性,耐蚀性,润湿性及强度。
铜的加入能和锡形成白色针状金属互化物Cu6Sn5,它能防止SnSb的上浮,改善偏析,提高钎料熔化温度,增加耐热温度及硬度。如铜含量低于0.3%,金属互化物析出量少,达不到预定效果;如果铜含量高于2%,则达不到分散状态,产生偏析,使钎料合金脆化,难以进行加工。
P的加入对大多数金属氧化物起还原作用,从而提高钎料的抗氧化能力及流动性,可使加工表面光滑。如P含量小于0.001%,达不到抗氧化的效果,如大于0.3%,则产生偏析,钎料脆化。
同现有技术相比,本发明钎料合金有如下优点;
1.本发明合金不含有毒元素Cd;
2.本发明合金不含贵金属Ag,成本低廉;
3.本发明合金熔化温度低(315~345℃),耐热(工作)温度高(250~280℃)。
实施例1~5
按表1所示名义成分将各合金元素混合,熔铸成合金锭,通过挤压或轧制后制成直径1~3mm的钎焊丝和70×0.1×20(mm)的钎焊带,然后用上述钎料钎焊几种金属(铜、钢等),对焊缝断面进行金相观察,可见焊缝致密,无虚焊,无夹渣。
用实施例1~5的软钎料和对比例1(Ag3Pb97)和对比例2(Ag5Cd95)的软钎料分别钎焊接头,在不同温度下测定各钎接头的强度,其结果见表2。
表1
      合    金    成    分  (重量%)试样编号
      Sn    Cu    Sb    P     Pb实施例1   7.0   0.3   5     0.3   余量实施例2   4     2     0.2   0.02  余量实施例3   2     1     0.5   0.13  余量实施例4   9     0.9   0.8   0.001 余量实施例5   5     0.5   2.0   0.1   余量
表2 不同温度下钎焊接头强度(MPa)
          室温        150℃         200℃         250℃试样编号
     抗剪  抗拉    抗剪  抗拉    抗剪  抗拉    抗剪  抗拉实施例1  19.2  20.1    8.5   19.0    4.3   10.0    4.7   5.7实施例2  20.1  22.0    9.0   18.6    4.7   10.4    5.4   5.6实施例3  21.0  25.0    9.2   20.5    5.0   11.0    5.6   6.0实施例4  18.9  20.0    8.1   18.0    4.2   10.3    4.1   5.0实施例5  19.0  23.0    9.2   18.3    4.5   10.1    4.9   5.5对比例1  21.5  26.5    9.0   18.6    5.0   11.3    6.0   5.8对比例2  20.1  25.0    9.5   22.0    6.0   14.5    6.4   11.2

Claims (1)

1.一种耐热软钎料铅基合金,其特征是合金成分(重量%)为Sn2.0~9.0,Sb0.2~5.0,Cu0.3~2.0,P0.001~0.3,Pb余量。
CN95105291A 1995-05-16 1995-05-16 耐热软钎料铅基合金 Expired - Fee Related CN1039499C (zh)

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CN1039499C true CN1039499C (zh) 1998-08-12

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4608230A (en) * 1985-03-04 1986-08-26 Fry Metals, Inc. Pb-Sn-Sb-Ag solder alloy
US4869871A (en) * 1988-03-17 1989-09-26 Toyota Motor Corporation Pb-Sn-Sb-In solder alloy
JPH03204194A (ja) * 1989-12-29 1991-09-05 Tanaka Denshi Kogyo Kk 熱疲労特性に優れたPb合金ろう

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4608230A (en) * 1985-03-04 1986-08-26 Fry Metals, Inc. Pb-Sn-Sb-Ag solder alloy
US4869871A (en) * 1988-03-17 1989-09-26 Toyota Motor Corporation Pb-Sn-Sb-In solder alloy
JPH03204194A (ja) * 1989-12-29 1991-09-05 Tanaka Denshi Kogyo Kk 熱疲労特性に優れたPb合金ろう

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