CN103946314A - 具有改善的热稳定性的凝胶 - Google Patents

具有改善的热稳定性的凝胶 Download PDF

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Publication number
CN103946314A
CN103946314A CN201280056431.9A CN201280056431A CN103946314A CN 103946314 A CN103946314 A CN 103946314A CN 201280056431 A CN201280056431 A CN 201280056431A CN 103946314 A CN103946314 A CN 103946314A
Authority
CN
China
Prior art keywords
gel
phthalocyanine
hardness
grams
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280056431.9A
Other languages
English (en)
Chinese (zh)
Inventor
德瑞布·E·巴瓦格尔
玄大涉
凯利·J·梅辛
肯特·R·拉森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Corning Korea Ltd
Dow Silicones Corp
Original Assignee
Dow Corning Korea Ltd
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Korea Ltd, Dow Corning Corp filed Critical Dow Corning Korea Ltd
Publication of CN103946314A publication Critical patent/CN103946314A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2220/00—Compositions for preparing gels other than hydrogels, aerogels and xerogels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201280056431.9A 2011-10-06 2012-02-09 具有改善的热稳定性的凝胶 Pending CN103946314A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161543985P 2011-10-06 2011-10-06
US61/543,985 2011-10-06
PCT/US2012/024498 WO2013052147A1 (en) 2011-10-06 2012-02-09 Gel having improved thermal stability

Publications (1)

Publication Number Publication Date
CN103946314A true CN103946314A (zh) 2014-07-23

Family

ID=45757203

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280056431.9A Pending CN103946314A (zh) 2011-10-06 2012-02-09 具有改善的热稳定性的凝胶

Country Status (7)

Country Link
US (1) US20150130086A1 (enExample)
EP (1) EP2764051B1 (enExample)
JP (1) JP2014534292A (enExample)
KR (1) KR101994081B1 (enExample)
CN (1) CN103946314A (enExample)
TW (1) TWI605094B (enExample)
WO (1) WO2013052147A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109318116A (zh) * 2018-09-30 2019-02-12 深圳昊天龙邦复合材料有限公司 基于对位芳纶纸的复合材料晶圆载板及其制造方法
WO2020133374A1 (en) * 2018-12-29 2020-07-02 Dow Global Technologies Llc Thermally conductive composition containing mgo filler and methods and devices in which said composition is used

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017057386A (ja) * 2015-09-15 2017-03-23 国立大学法人信州大学 縮合硬化型オルガノポリシロキサン組成物、縮合硬化型オルガノポリシロキサン組成物キットおよびシリコーンゴム
JP6956697B2 (ja) * 2018-09-18 2021-11-02 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
EP3929240A4 (en) * 2020-02-13 2022-04-27 Fuji Polymer Industries Co., Ltd. HEAT RESISTANT SILICONE RESIN COMPOSITION AND HEAT RESISTANT SILICONE RESIN COMPOSITE
WO2025039204A1 (en) * 2023-08-23 2025-02-27 Dow Silicones Corporation High temperature stable thermally conductive materials

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0426137A1 (en) * 1989-10-31 1991-05-08 Dow Corning Toray Silicone Company, Limited Curable organosiloxane composition yielding elastomers exhibiting reduced compression set values
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB731166A (en) * 1952-05-27 1955-06-01 Midland Silicones Ltd Improvements in or relating to organosiloxane elastomers
US4374967A (en) 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
JP2002294076A (ja) * 2001-04-02 2002-10-09 Dow Corning Toray Silicone Co Ltd 金型成形用シリコーンゲル組成物
TWI242584B (en) * 2001-07-03 2005-11-01 Lord Corp High thermal conductivity spin castable potting compound
JP5538872B2 (ja) * 2009-12-24 2014-07-02 東レ・ダウコーニング株式会社 シリコーンエラストマー組成物
KR101866299B1 (ko) * 2011-01-26 2018-06-12 다우 실리콘즈 코포레이션 고온 안정성 열 전도성 재료

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0426137A1 (en) * 1989-10-31 1991-05-08 Dow Corning Toray Silicone Company, Limited Curable organosiloxane composition yielding elastomers exhibiting reduced compression set values
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109318116A (zh) * 2018-09-30 2019-02-12 深圳昊天龙邦复合材料有限公司 基于对位芳纶纸的复合材料晶圆载板及其制造方法
WO2020133374A1 (en) * 2018-12-29 2020-07-02 Dow Global Technologies Llc Thermally conductive composition containing mgo filler and methods and devices in which said composition is used

Also Published As

Publication number Publication date
KR20140094533A (ko) 2014-07-30
US20150130086A1 (en) 2015-05-14
KR101994081B1 (ko) 2019-07-01
TWI605094B (zh) 2017-11-11
EP2764051B1 (en) 2018-10-24
EP2764051A1 (en) 2014-08-13
TW201315775A (zh) 2013-04-16
JP2014534292A (ja) 2014-12-18
WO2013052147A1 (en) 2013-04-11

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20140723

RJ01 Rejection of invention patent application after publication