JP2014534292A - 改善された熱安定性を有するゲル - Google Patents

改善された熱安定性を有するゲル Download PDF

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Publication number
JP2014534292A
JP2014534292A JP2014534555A JP2014534555A JP2014534292A JP 2014534292 A JP2014534292 A JP 2014534292A JP 2014534555 A JP2014534555 A JP 2014534555A JP 2014534555 A JP2014534555 A JP 2014534555A JP 2014534292 A JP2014534292 A JP 2014534292A
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JP
Japan
Prior art keywords
gel
phthalocyanine
less
hardness
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014534555A
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English (en)
Japanese (ja)
Other versions
JP2014534292A5 (enExample
Inventor
イー バグウェイガー ドラブ
イー バグウェイガー ドラブ
デソプ ヒュン
デソプ ヒュン
ジェイ メッシング ケリー
ジェイ メッシング ケリー
アール ラーソン ケント
アール ラーソン ケント
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of JP2014534292A publication Critical patent/JP2014534292A/ja
Publication of JP2014534292A5 publication Critical patent/JP2014534292A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2220/00—Compositions for preparing gels other than hydrogels, aerogels and xerogels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP2014534555A 2011-10-06 2012-02-09 改善された熱安定性を有するゲル Pending JP2014534292A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161543985P 2011-10-06 2011-10-06
US61/543,985 2011-10-06
PCT/US2012/024498 WO2013052147A1 (en) 2011-10-06 2012-02-09 Gel having improved thermal stability

Publications (2)

Publication Number Publication Date
JP2014534292A true JP2014534292A (ja) 2014-12-18
JP2014534292A5 JP2014534292A5 (enExample) 2015-03-19

Family

ID=45757203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014534555A Pending JP2014534292A (ja) 2011-10-06 2012-02-09 改善された熱安定性を有するゲル

Country Status (7)

Country Link
US (1) US20150130086A1 (enExample)
EP (1) EP2764051B1 (enExample)
JP (1) JP2014534292A (enExample)
KR (1) KR101994081B1 (enExample)
CN (1) CN103946314A (enExample)
TW (1) TWI605094B (enExample)
WO (1) WO2013052147A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017057386A (ja) * 2015-09-15 2017-03-23 国立大学法人信州大学 縮合硬化型オルガノポリシロキサン組成物、縮合硬化型オルガノポリシロキサン組成物キットおよびシリコーンゴム
JP2020045395A (ja) * 2018-09-18 2020-03-26 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
WO2021161580A1 (ja) 2020-02-13 2021-08-19 富士高分子工業株式会社 耐熱性シリコーン樹脂組成物及び耐熱性シリコーン樹脂複合材料

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109318116B (zh) * 2018-09-30 2020-10-13 赣州龙邦材料科技有限公司 基于对位芳纶纸的复合材料晶圆载板及其制造方法
CN113166545B (zh) * 2018-12-29 2023-05-23 陶氏环球技术有限责任公司 包含mgo填料的导热组合物以及使用所述组合物的方法和装置
WO2025039204A1 (en) * 2023-08-23 2025-02-27 Dow Silicones Corporation High temperature stable thermally conductive materials

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03146560A (ja) * 1989-10-31 1991-06-21 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサンゴム組成物
JP2002294076A (ja) * 2001-04-02 2002-10-09 Dow Corning Toray Silicone Co Ltd 金型成形用シリコーンゲル組成物
JP2011132376A (ja) * 2009-12-24 2011-07-07 Dow Corning Toray Co Ltd シリコーンエラストマー組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB731166A (en) * 1952-05-27 1955-06-01 Midland Silicones Ltd Improvements in or relating to organosiloxane elastomers
US4374967A (en) 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
TWI242584B (en) * 2001-07-03 2005-11-01 Lord Corp High thermal conductivity spin castable potting compound
WO2012102852A1 (en) * 2011-01-26 2012-08-02 Dow Corning Corporation High temperature stable thermally conductive materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03146560A (ja) * 1989-10-31 1991-06-21 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサンゴム組成物
JP2002294076A (ja) * 2001-04-02 2002-10-09 Dow Corning Toray Silicone Co Ltd 金型成形用シリコーンゲル組成物
JP2011132376A (ja) * 2009-12-24 2011-07-07 Dow Corning Toray Co Ltd シリコーンエラストマー組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017057386A (ja) * 2015-09-15 2017-03-23 国立大学法人信州大学 縮合硬化型オルガノポリシロキサン組成物、縮合硬化型オルガノポリシロキサン組成物キットおよびシリコーンゴム
JP2020045395A (ja) * 2018-09-18 2020-03-26 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
WO2020059437A1 (ja) * 2018-09-18 2020-03-26 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
WO2021161580A1 (ja) 2020-02-13 2021-08-19 富士高分子工業株式会社 耐熱性シリコーン樹脂組成物及び耐熱性シリコーン樹脂複合材料

Also Published As

Publication number Publication date
KR20140094533A (ko) 2014-07-30
TWI605094B (zh) 2017-11-11
CN103946314A (zh) 2014-07-23
WO2013052147A1 (en) 2013-04-11
EP2764051A1 (en) 2014-08-13
EP2764051B1 (en) 2018-10-24
TW201315775A (zh) 2013-04-16
US20150130086A1 (en) 2015-05-14
KR101994081B1 (ko) 2019-07-01

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