CN103942351A - 增加电路板层数的设计系统及设计方法 - Google Patents
增加电路板层数的设计系统及设计方法 Download PDFInfo
- Publication number
- CN103942351A CN103942351A CN201310019768.9A CN201310019768A CN103942351A CN 103942351 A CN103942351 A CN 103942351A CN 201310019768 A CN201310019768 A CN 201310019768A CN 103942351 A CN103942351 A CN 103942351A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- designed
- hole
- emulation
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/327—Logic synthesis; Behaviour synthesis, e.g. mapping logic, HDL to netlist, high-level language to RTL or netlist
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
电路板 | 100 |
第一信号层 | 10 |
电源层 | 20 |
接地层 | 30 |
第二信号层 | 40 |
过孔 | 50 |
钻孔 | 500 |
焊盘 | 502 |
反焊盘 | 504 |
增加电路板层数的设计系统 | 200 |
仿真模块 | 201 |
过孔模型建立模块 | 202 |
判断模块 | 203 |
提醒模块 | 204 |
记录模块 | 205 |
计算模块 | 206 |
Claims (6)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310019768.9A CN103942351B (zh) | 2013-01-19 | 2013-01-19 | 增加电路板层数的设计系统及设计方法 |
TW102102734A TW201443676A (en) | 2013-01-19 | 2013-01-24 | Design system and design method for adding layers of PCB |
US13/967,349 US8806421B1 (en) | 2013-01-19 | 2013-08-15 | System and method for designing via of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310019768.9A CN103942351B (zh) | 2013-01-19 | 2013-01-19 | 增加电路板层数的设计系统及设计方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103942351A true CN103942351A (zh) | 2014-07-23 |
CN103942351B CN103942351B (zh) | 2017-08-04 |
Family
ID=51190019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310019768.9A Expired - Fee Related CN103942351B (zh) | 2013-01-19 | 2013-01-19 | 增加电路板层数的设计系统及设计方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8806421B1 (zh) |
CN (1) | CN103942351B (zh) |
TW (1) | TW201443676A (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104735913A (zh) * | 2015-03-23 | 2015-06-24 | 华进半导体封装先导技术研发中心有限公司 | 封装基板过孔的制作方法 |
CN105578714A (zh) * | 2015-12-11 | 2016-05-11 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | 一种多层高速pcb的新型叠层结构及信号过孔优化方法 |
CN107621859A (zh) * | 2017-08-28 | 2018-01-23 | 郑州云海信息技术有限公司 | 服务器及优化高速连接器与服务器连接阻抗不连续的方法 |
CN107729280A (zh) * | 2017-11-15 | 2018-02-23 | 无锡军安电子科技有限公司 | 一种高速差分信号端口阻抗与传输线阻抗一致性控制方法 |
CN110676174A (zh) * | 2019-09-12 | 2020-01-10 | 无锡江南计算技术研究所 | 一种封装高速信号过孔优化设计方法 |
CN114599159A (zh) * | 2022-03-15 | 2022-06-07 | 上海大学 | 一种用于设计光模块印刷电路板的方法及相关装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150082616A1 (en) * | 2013-09-26 | 2015-03-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method for selecting optimal manufacturing process for producing printed circuit boards |
JP6822100B2 (ja) * | 2016-11-28 | 2021-01-27 | 富士通株式会社 | ビアモデル生成プログラム、ビアモデル生成方法及び情報処理装置 |
US10154581B2 (en) * | 2017-02-09 | 2018-12-11 | Cray Inc. | Method for impedance compensation in printed circuit boards |
CN112747663B (zh) * | 2020-12-11 | 2023-06-02 | 浪潮电子信息产业股份有限公司 | 一种检测差分过孔反焊盘挖空尺寸的方法、装置及系统 |
CN113255286B (zh) * | 2021-04-25 | 2022-11-15 | 无锡江南计算技术研究所 | 一种孔线阻抗匹配的高速信号反盘设计方法 |
CN113486492B (zh) * | 2021-05-26 | 2024-03-19 | 深圳市信维通信股份有限公司 | 一种阻抗预测方法及终端 |
CN116702693B (zh) * | 2023-06-12 | 2024-02-09 | 上海韬润半导体有限公司 | 一种sma连接器模型信号完整性仿真方法和装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1916915A (zh) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业(深圳)有限公司 | 改良过孔阻抗的方法 |
CN1321436C (zh) * | 2003-10-02 | 2007-06-13 | 株式会社东芝 | 模拟电路图形评估方法和半导体集成电路的制造方法 |
WO2008072530A1 (ja) * | 2006-12-13 | 2008-06-19 | Nec Corporation | プリント回路基板解析システム、プリント回路基板設計支援システム、及びそれらの方法、並びにプログラム |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7249337B2 (en) * | 2003-03-06 | 2007-07-24 | Sanmina-Sci Corporation | Method for optimizing high frequency performance of via structures |
US7705695B2 (en) * | 2004-07-23 | 2010-04-27 | Nec Corporation | Composite via structures and filters in multilayer printed circuit boards |
US7409667B1 (en) * | 2005-12-15 | 2008-08-05 | Emc Corporation | Techniques for modeling a circuit board structure |
US8431834B2 (en) * | 2009-06-16 | 2013-04-30 | Ciena Corporation | Method for assuring counterbore depth of vias on printed circuit boards and printed circuit boards made accordingly |
-
2013
- 2013-01-19 CN CN201310019768.9A patent/CN103942351B/zh not_active Expired - Fee Related
- 2013-01-24 TW TW102102734A patent/TW201443676A/zh unknown
- 2013-08-15 US US13/967,349 patent/US8806421B1/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1321436C (zh) * | 2003-10-02 | 2007-06-13 | 株式会社东芝 | 模拟电路图形评估方法和半导体集成电路的制造方法 |
CN1916915A (zh) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业(深圳)有限公司 | 改良过孔阻抗的方法 |
WO2008072530A1 (ja) * | 2006-12-13 | 2008-06-19 | Nec Corporation | プリント回路基板解析システム、プリント回路基板設計支援システム、及びそれらの方法、並びにプログラム |
Non-Patent Citations (1)
Title |
---|
龙子夜 等: "印制电路板的设计", 《武汉工业学院学报》 * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104735913A (zh) * | 2015-03-23 | 2015-06-24 | 华进半导体封装先导技术研发中心有限公司 | 封装基板过孔的制作方法 |
CN104735913B (zh) * | 2015-03-23 | 2017-09-29 | 华进半导体封装先导技术研发中心有限公司 | 封装基板过孔的制作方法 |
CN105578714A (zh) * | 2015-12-11 | 2016-05-11 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | 一种多层高速pcb的新型叠层结构及信号过孔优化方法 |
CN107621859A (zh) * | 2017-08-28 | 2018-01-23 | 郑州云海信息技术有限公司 | 服务器及优化高速连接器与服务器连接阻抗不连续的方法 |
CN107729280A (zh) * | 2017-11-15 | 2018-02-23 | 无锡军安电子科技有限公司 | 一种高速差分信号端口阻抗与传输线阻抗一致性控制方法 |
CN110676174A (zh) * | 2019-09-12 | 2020-01-10 | 无锡江南计算技术研究所 | 一种封装高速信号过孔优化设计方法 |
CN114599159A (zh) * | 2022-03-15 | 2022-06-07 | 上海大学 | 一种用于设计光模块印刷电路板的方法及相关装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201443676A (en) | 2014-11-16 |
CN103942351B (zh) | 2017-08-04 |
US8806421B1 (en) | 2014-08-12 |
US20140208286A1 (en) | 2014-07-24 |
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C06 | Publication | ||
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180211 Address after: Haiyun street, Tianjin economic and Technological Development Zone No. 80 Patentee after: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Hon Hai Precision Industry Co., Ltd. Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170804 Termination date: 20180119 |