CN103934761A - Electroplated grinding wheel - Google Patents
Electroplated grinding wheel Download PDFInfo
- Publication number
- CN103934761A CN103934761A CN201410029366.1A CN201410029366A CN103934761A CN 103934761 A CN103934761 A CN 103934761A CN 201410029366 A CN201410029366 A CN 201410029366A CN 103934761 A CN103934761 A CN 103934761A
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- CN
- China
- Prior art keywords
- abrasion wheel
- grain layer
- electroplating abrasion
- grinding
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with cooling provisions, e.g. with radial slots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/08—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for close-grained structure, e.g. using metal with low melting point
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/16—Bushings; Mountings
Abstract
The invention provides an electroplated grinding wheel which can freely control the concentration ratio of grains by forming dimples and effectively provides a coolant to the grains. The electroplated grinding wheel having abrasive grains (13) such as diamond or CBN fixed by coating on at least one of both side surfaces of an outer peripheral portion of a disk-like support (11) so that it forms a ring-shaped abrasive grain layer (14) for grinding facing surfaces of a workpiece. On an inner peripheral side of the abrasive grain layer (14), a plurality of dimples (15) in the circumferential direction at intervals are provided, on which the abrasive grains (13) are not fixed, and the dimples (15) can only be opened to an inner peripheral portion of the abrasive grain layer (14 ).
Description
Technical field
The present invention relates to the surperficial electroplating abrasion wheel (electroplatedgrindingwheel) that diamond particle, CBN abrasive particle is fixed on to metallic matrix by electroplating.
Background technology
Due to by electroplating the abrasive particle of surperficial electroplating abrasion wheel that diamond particle, CBN abrasive particle are fixed on to metallic matrix to be dispersed in the surface of metallic matrix without the mode at dead angle, and the abrasive particle number that acts on grinding, finishing is a lot, so improve grinding resistance, chipping resistance.In addition, for example, in the electroplating abrasion wheel of using in the groove grinding of groove being carried out to grinding, exist and be difficult to supply with cooling agent to abrasive particle entirety, produce the Grain Falling Off being caused by grinding burn, grinding heat, thus the problem that wheel life shortens.
For this reason, in the past, in patent documentation 1, having recorded can be by using injection apparatus shelter to be formed to parent metal (metallic matrix) and to control the electroplating abrasion wheel of the concentration degree of abrasive particle.
Patent documentation 1: TOHKEMY 2007-38317 communique
But, in the electroplating abrasion wheel of the mode of sheltering the concentration degree of controlling abrasive particle of recording by patent documentation 1, exist the free degree of control abrasive particle concentration degree less, be difficult to supply with to abrasive particle the problem of cooling agent.
Summary of the invention
The present invention completes in view of above-mentioned existing issue, and the electroplating abrasion wheel that provides one to control the concentration degree of abrasive particle and can effectively carry out supplying with to abrasive particle cooling agent by forming pit (dimple) is provided its object.
In order to solve above-mentioned problem, the invention of technical scheme 1 is characterised in that, a kind of electroplating abrasion wheel is provided, periphery and the side of the abrasive particle such as diamond or CBN being fixed on to the circumference of discoideus matrix by plating form circular abrasive grain layer, the opposed faces of workpiece is carried out to grinding, in the inner circumferential side of above-mentioned abrasive grain layer, to be provided with multiple pits that are not fixed with above-mentioned abrasive particle along the spaced mode of circumferencial direction tool, make this pit only at the interior perimembranous opening of above-mentioned abrasive grain layer.
The invention of technical scheme 2 is characterised in that, a kind of electroplating abrasion wheel is provided, the side of the abrasive particle such as diamond or CBN being fixed on to the circumference of discoideus matrix by plating forms circular abrasive grain layer, the opposed faces of workpiece is carried out to grinding, in the inner circumferential side of above-mentioned abrasive grain layer, to be provided with multiple pits that are not fixed with above-mentioned abrasive particle along the spaced mode of circumferencial direction tool, make this pit only at the interior perimembranous opening of above-mentioned abrasive grain layer.
The invention of technical scheme 3 is characterised in that, in the electroplating abrasion wheel of recording in technical scheme 1 or 2, above-mentioned dimple-shaped becomes round-shaped.
The invention of technical scheme 4 is characterised in that, in the electroplating abrasion wheel that arbitrary scheme is recorded in technical scheme 1～3, above-mentioned dimple-shaped becomes than large round-shaped of semicircle.
The invention of technical scheme 5 is characterised in that, in the electroplating abrasion wheel that arbitrary scheme is recorded in technical scheme 1～4, the area of above-mentioned pit is formed as the circumference side of above-mentioned matrix surface area 20%～60%.
The invention of technical scheme 6 is characterised in that, in the electroplating abrasion wheel that arbitrary scheme is recorded in technical scheme 1～5, above-mentioned opposed faces is formed at the groove at interior all openings of workpiece.
According to technical scheme 1 and 2 related inventions, due to the inner circumferential side of the abrasive grain layer at annulus, to be provided with multiple pits that are not fixed with abrasive particle along the spaced mode of circumferencial direction tool, and make pit only at the interior perimembranous opening of abrasive grain layer, so can freely control by the size of pit or number the concentration degree of abrasive particle.
In addition, because pit is only at the interior perimembranous opening of abrasive grain layer, so the cooling agent that is supplied to electroplating abrasion wheel can be remained in pit, and can cooling agent be supplied to abrasive particle entirety reliably via pit, thus cooling electroplating abrasion wheel effectively.Thus, can suppress the Grain Falling Off that caused by grinding burn, grinding heat, thereby can extend wheel life.
According to the invention of technical scheme 3, due to dimple-shaped become round-shaped, so manufacturing when electroplating abrasion wheel, by using distributor etc. that adhesive is lighted in the circumference two sides of matrix etc., can easily form round-shaped pit.
According to the invention of technical scheme 4, because dimple-shaped becomes than large round-shaped of semicircle, thus can form in the both sides of pit the cutting blade of acute angle shape, and can carry out grinding accurately to the groove forming in interior week at workpiece etc. by the cutting blade of acute angle shape.
According to the invention of technical scheme 5, due to the area of pit is formed as the circumference two sides of matrix surface area 20%～60%, so can reduce the abrasive particle concentration degree of interior Zhou Ren, and can improve the grinding accuracy based on interior Zhou Ren.
According to the invention of technical scheme 6, because opposed faces is formed at the groove at interior all openings of workpiece, even if so in the time that the groove in the interior week to workpiece by electroplating abrasion wheel carries out grinding, also can cooling agent be supplied to abrasive particle entirety reliably via pit, thereby cooling electroplating abrasion wheel effectively, and then can suppress the Grain Falling Off being caused by grinding burn, grinding heat.
Brief description of the drawings
Fig. 1 is the outside drawing that represents the electroplating abrasion wheel of embodiments of the present invention.
Fig. 2 is the amplification view of the abrasive grain layer that dissects along the 2-2 line of Fig. 1.
Fig. 3 is the enlarged drawing of observing from arrow 3 directions of Fig. 2.
Fig. 4 is the figure that represents the method for manufacturing the related electroplating abrasion wheel of present embodiment.
Fig. 5 is the figure that represents the electroplating abrasion wheel producing by the manufacture method shown in Fig. 4.
Fig. 6 is the cutaway view that the grinding attachment of the related electroplating abrasion wheel of present embodiment is installed.
Fig. 7 represents by grinding attachment carry out the figure of the state of grinding at the groove forming in interior week of workpiece.
Fig. 8 is the key diagram that represents groove to carry out the Grinding Cycle Command of grinding, and is the figure observing from the side of electroplating abrasion wheel.
Fig. 9 is the key diagram that represents groove to carry out the Grinding Cycle Command of grinding, and is the figure observing from the front of electroplating abrasion wheel.
Figure 10 is the figure that represents the wheel life of the related electroplating abrasion wheel of comparison present embodiment and the wheel life of existing product.
Figure 11 is the cutaway view that represents the grinding attachment of variation of the present invention.
Description of reference numerals:
10: electroplating abrasion wheel; 11: matrix; 12: electroplating surface; 13: abrasive particle; 14: abrasive grain layer; 14a: peripheral edge; 14b: interior Zhou Ren; 14b1: the cutting blade of acute angle shape; W: workpiece; W2: groove; W2a, W2b: opposed faces.
Detailed description of the invention
Based on accompanying drawing, embodiments of the present invention are described below.Fig. 1 is the overall figure that represents the electroplating abrasion wheel 10 of embodiments of the present invention, and this electroplating abrasion wheel 10 possesses the tabular metallic matrix of thin-wall circular 11, and is formed with at the central part of metallic matrix 11 the installing hole 11a installing for the rotating shaft of grinding attachment described later.In addition, as shown in Figure 2, in the two sides of metallic matrix 11 and be formed with the endless groove 11b of Rack near peripheral part, part or all that makes the circumference of outer circumferential side and outer peripheral face by this endless groove 11b becomes electroplating surface 12.Be fixed with the multiple abrasive particles 13 that formed by diamond or CBN at electroplating surface 12 by plating, be formed with circular abrasive grain layer 14 in the two sides of metallic matrix 11.
In addition, endless groove 11b is connected by rake with electroplating surface 12, in addition, is formed with the even surface 11c by hydrostatic bearing hydrostatic support described later in the two sides of the inner circumferential side of endless groove 11b.
As shown in Figure 3, being formed at the circular abrasive grain layer 14 of two sides of metallic matrix 11, be formed with multiple pits 15 that do not have abrasive particle 13 to separate the mode at equal angles interval on circumference, thereby reduce the concentration degree of abrasive particle 13.Pit 15 is formed as than the large circle of semicircle that has been short of a round part.The outer rim of the outer circumferential side by metallic matrix 11 of pit 15 is positioned at the periphery of comparing circular abrasive grain layer 14 by the position of radially inner side, and the outer rim of the inner circumferential side by metallic matrix 11 of pit 15 is at interior all openings of circular abrasive grain layer 14.
That is, as shown in Figure 3, pit 15Cheng Qi center O1 is positioned on abrasive grain layer 14, and closed and in the shape of inner circumferential side opening at the outer circumferential side of abrasive grain layer 14.Thus, be formed with the peripheral edge 14a continuous along circumferencial direction in the periphery of abrasive grain layer 14, and in the interior week of abrasive grain layer 14, and in the both sides of each pit 15, be formed with interior all sword 14b of the cutting blade 14b1 with acute angle shape disconnecting along circumferencial direction.
Here, the gross area of pit 15 is suitably formed as the circumference two sides of metallic matrix 11 surface area 20%～60%, therefore, can significantly reduce the abrasive particle concentration degree of interior all sword 14b, and can improve the grinding accuracy of interior all sword 14b.
Like this, because the electroplating abrasion wheel 10 of present embodiment can freely be controlled the concentration degree of abrasive particle 13 by forming the pit 15 of said structure, so the effect abrasive particle number can easily reduce grinding time, thereby can reduce grinding resistance and improve the sharpness of electroplating abrasion wheel 10.
And, because pit 15 is larger and only at the interior perimembranous opening of abrasive grain layer than semicircle, so be formed with along circumferential continuous peripheral edge 14a at the outer circumferential side of abrasive grain layer 14 as shown in Figure 3, and be formed with in the inner circumferential side of abrasive grain layer 14 along interior all sword 14b of the cutting blade 14b1 with acute angle shape circumferentially disconnecting.
Next, the method for the electroplating abrasion wheel 10 of manufacturing said structure is described.First, metallic matrix 11 is processed as shown in Figure 2 to the shape of regulation.Next, as shown in Figure 4, except electroplating the electroplating surface 12 of abrasive particle 13, in the two sides of metallic matrix 11 (including endless groove 11b), coating insulating compound 31 is sheltered.Under this state, use and omit illustrated distributor, gluey adhesive 32 is lighted in the electroplating surface 12 of the two sides of metallic matrix 11 to separate the mode at equal angles interval on circumference, thereby formed the position of not electroplating abrasive particle 13.
In addition, for the electroplating abrasion wheel 10 that grinding is used for groove, because the central portion of the width of emery wheel peripheral part is actually the part irrelevant with grinding, so also can shelter at the central portion coating insulating compound 31 of the width of emery wheel peripheral part.
In addition, lighting of gluey adhesive 32, can be undertaken by handwork, also can utilize numerical control device automatically to carry out in preprogrammed position.Gluey sticker 32 instantaneous solidification of lighting, thus multiple roughly hemispheric projections formed in the side of metallic matrix 11.
Now, light in the following manner, light in the contact-making surface contacting with metallic matrix 11 of the gluey adhesive 32 of the electroplating surface 12 of metallic matrix 11 and be formed as shown in Figure 4 circle, and the outer rim of the outer circumferential side by metallic matrix 11 of circle is positioned at the outer peripheral face of comparing metallic matrix 11 and arrives insulating compound 31 by a part of outer rim of the inner circumferential side by metallic matrix 11 of radially inner side and circle.That is, light in the following manner, gluey adhesive 32 is positioned at above electroplating surface 12 with semicircle and semicircle is positioned on insulating compound 31 below.
Under this state, by electroplating the electroplating surface 12 that the multiple abrasive particles 13 that are made up of diamond or CBN is fixed on to metallic matrix 11.Now, be not electroplate with abrasive particle 13 in the part of sheltering by insulating compound 31 and the part of lighting gluey adhesive 32.
After this, the gluey adhesive 32 that a part is bonded in to this insulating compound 31 is peeled off from the side of metallic matrix 11 together with insulating compound 31, thereby completes as shown in Figure 5 electroplating abrasion wheel 10.The electroplating abrasion wheel 10 producing like this, as described above at the position of removing gluey adhesive 32, be formed with the multiple pits 15 that do not have abrasive particle 13, it is closed at the outer circumferential side of metallic matrix 11 and in the large shape of ratio semicircle of inner circumferential side opening that these pits 15 are formed as.
By forming this pit 15, can reduce the concentration degree of abrasive particle 13, thereby can reduce the abrasive particle number acting in the time of grinding, and then can reduce grinding resistance and improve the sharpness of electroplating abrasion wheel 10.In this case, can be by lighting in the size of the gluey adhesive 32 of the electroplating surface 12 of metallic matrix 11, the concentration degree that number is freely controlled abrasive particle 13.
In addition, because pit 15 is only formed as the shape at the interior perimembranous opening of abrasive grain layer, thus the cooling agent that is supplied to electroplating abrasion wheel 10 can be remained in pit 15, and can cooling agent be supplied to abrasive particle entirety via pit 15.Thus, the cooling effect of electroplating abrasion wheel 10 can be improved, grinding burn can be suppressed, and the coming off of the abrasive particle 13 that can suppress to be caused by grinding heat.
And, because pit 15 is larger and only at the interior perimembranous opening of abrasive grain layer than semicircle, so be formed with as shown in Figure 3 the interior all sword 14b with the cutting blade 14b1 of acute angle shape in the inner circumferential side of abrasive grain layer 14, thereby can improve the grinding accuracy in the time that the groove in the interior week that is formed at workpiece described later is carried out to grinding.
Next, the grinding attachment 20 of the electroplating abrasion wheel 10 that uses said structure is described.In Fig. 6, grinding attachment 20 possesses the grinding machine head 21 that is supported in the illustrated travelling carriage of omission that can move along XY direction, rotating shaft 24 via bearing 22,23 can rotate and can be supported in grinding machine head 21 along axial slightly mobile mode.On rotating shaft 24, be fixed with belt wheel 25, and belt wheel 25 is via being with 26 to link with the illustrated CD-ROM drive motor of omission.The installing hole 11a of electroplating abrasion wheel 10 is embedded on rotating shaft 24, and electroplating abrasion wheel 10 is fixed on belt wheel 25, and rotates with belt wheel 25 one.
Be formed with pair of bearings face 27 at grinding machine head 21, this is opposed with the even surface 11c of two sides that is formed at electroplating abrasion wheel 10 in the mode with small gap to bearing surface 27, is formed with the static pressure recess 27a of hydrostatic support even surface 11c at above-mentioned bearing surface 27.Via supplying with road 28, cooling agent is supplied to static pressure recess 27a, produces static pressure at static pressure recess 27a.By this static pressure, electroplating abrasion wheel 10 is supported in the center of pair of bearings face 27 all the time, and can suppress the generation swinging.
Following example is described, in this example, by above-mentioned grinding attachment 20, use the width electroplating abrasion wheel 10 less than the groove width of groove W2 to carry out grinding to groove W2, wherein, this groove W2 has opposed faces W2a, W2b, and above-mentioned opposed faces W2a, W2b form along central axis in the mode of the inner peripheral surface W1 opening of the workpiece W in the ring-type shown in Fig. 7.In addition, in Fig. 7, the illustrated travelling carriage of omission of the grinding machine head 21 of supporting grinding attachment 20 can be mobile along the direction orthogonal with respect to paper (along the directions X of the central axis of workpiece W) and above-below direction (with the orthogonal Y-direction of the central axial direction of workpiece W).
Via with 26 and belt wheel 25 make, under state that electroplating abrasion wheel 10 rotates, electroplating abrasion wheel 10 (grinding machine head 21) to be moved along arrow directions X from the position P1 of Fig. 8 and Fig. 9 by omitting illustrated CD-ROM drive motor.Thus, the peripheral edge 14a of the abrasive grain layer 14 of electroplating abrasion wheel 10 enters in the groove W2 of workpiece W, thereby the side of the peripheral edge 14a of the abrasive grain layer 14 by a side to groove W2 opposed faces W2a roughly grinds and cuts.
In this case, be attached with along the cooling agent (with reference to Fig. 6) in the static pressure recess 27a of rotating shaft direction hydrostatic support electroplating abrasion wheel 10 at the even surface 11c of electroplating abrasion wheel 10, by the effect of the centrifugal force that caused by the rotation of electroplating abrasion wheel 10, this cooling agent can be supplied in pit 15 and keep, and being supplied to abrasive particle 13 entirety via pit 15.Thus, can effectively suppress coming off of the abrasive particle 13 that caused by grinding burn, grinding heat.
If electroplating abrasion wheel 10 moves to position P2, as shown in Figure 8, the peripheral edge 14a of electroplating abrasion wheel 10 and interior all sword 14b are by groove W2.Under this state, electroplating abrasion wheel 10 (grinding machine head 21) is only cut to pettiness amount towards a side of groove W2 along arrow Y-direction (with reference to Fig. 9).Next, by electroplating abrasion wheel 10 (grinding machine head 21) is moved further along arrow directions X from the position P2 of Fig. 8 and Fig. 9, thereby by interior all sword 14b of abrasive grain layer 14, the opposed faces W2a of groove W2 is carried out to fine ginding.
In this case, owing to can significantly reduce by forming pit 15 the abrasive particle concentration degree of interior all sword 14b with respect to peripheral edge 14a, so can improve the sharpness of interior all sword 14b, thereby can carry out grinding accurately to groove W2 (opposed faces W2a) by interior all sword 14b.
In addition, because making the cutting blade 14b1 of interior all sword 14b of electroplating abrasion wheel 10, the pit 15 by forming above-mentioned shape is formed as acute angle shape, so can carry out grinding accurately to groove W2 by cutting blade 14b1.Like this, if interior all sword 14b of electroplating abrasion wheel 10 and peripheral edge 14a are moved to the position P3 by groove W2, the grinding of a side's of groove W2 opposed faces W2a finishes.
Then, this time by electroplating abrasion wheel 10 (grinding machine head 21) towards the opposing party's of groove W2 opposed faces W2b along with arrow Y-direction rightabout incision ormal weight.After this, make electroplating abrasion wheel 10 (grinding machine head 21) along moving with arrow directions X rightabout, thereby the peripheral edge 14a of the another side side of the abrasive grain layer 14 by electroplating abrasion wheel 10 the opposing party's to groove W2 opposed faces W2b roughly grind and cut.
And, if the peripheral edge 14a of electroplating abrasion wheel 10 and interior all sword 14b are by groove W2, only cut small quantity with respect to the another side of electroplating abrasion wheel 10 groove W2, next, make electroplating abrasion wheel 10 along being moved further with arrow directions X rightabout, thereby the interior all sword 14b by abrasive grain layer 14 carry out fine ginding to the opposed faces W2b of groove W2, and electroplating abrasion wheel 10 departs from the groove W2 of workpiece W.
Figure 10 illustrates that existing electroplating abrasion wheel (A) electroplating mold 10 (B) related with present embodiment that is not provided with pit to using carries out to the groove W2 of workpiece W the experimental result that the wheel life (grinding radical) groove grinding compares under identical grinding condition.The electroplating mold 10 (B) related according to present embodiment, compared with existing electroplating mold (A), the inhibition of the Grain Falling Off that can be caused by grinding burn and grinding heat by inhibition etc. significantly extends wheel life.
In addition, the concentration degree of size that can be by pit 15, the abrasive particle 13 that number is freely controlled electroplating abrasion wheel 10, thus can suitably reduce grinding resistance.
According to above-mentioned embodiment, due to the inner circumferential side of the abrasive grain layer 14 circular, to be provided with multiple round-shaped pits 15 that do not have abrasive particle 13 along the spaced mode of circumferencial direction tool, and pit 15 is larger and only at the interior perimembranous opening of abrasive grain layer 14 than semicircle, be formed with the cutting blade 14b1 of acute angle shape in the both sides of pit 15, so can freely control by the size of pit 15 or number the concentration degree of abrasive particle 13.
In addition, because pit 15 is only at the interior perimembranous opening of abrasive grain layer 14, so the cooling agent that is supplied to electroplating abrasion wheel 10 can be remained in pit 15, and can cooling agent be supplied to abrasive particle entirety reliably via pit 15, thereby cooling electroplating abrasion wheel 10 effectively.And, because pit 15 is larger and only at the interior perimembranous opening of abrasive grain layer 14, so the cutting blade 14b1 of the acute angle shape that can form by the inner circumferential side at abrasive grain layer 14 carry out grinding accurately to the groove W2 forming in interior week at workpiece W than semicircle.
In addition, according to above-mentioned embodiment, due to the area of pit 15 is formed as the circumference two sides of metallic matrix 11 surface area 20%～60%, so can reduce the abrasive particle concentration degree of interior all sword 14b, thereby can improve the grinding accuracy of interior all sword 14b.
Figure 11 is the figure that represents variation of the present invention, be with the embodiment of narrating above (with reference to Fig. 6) difference, periphery at the metallic matrix 11 of electroplating abrasion wheel 10 forms V groove 125, the belt wheel 25 linking with CD-ROM drive motor is sticked in to this V groove 125, thereby can drives electroplating abrasion wheel 10 to rotate.
In this variation, abrasive particle 13 (with reference to Fig. 2) is mainly fixed on the circumference side of metallic matrix 11, and is only fixed on axial both ends in the periphery of metallic matrix 11.In addition,, to the structure identical with situation about narrating, mark identical reference marker, and description thereof is omitted in the embodiment shown in Fig. 6.
In the above-described embodiment, although the electroplating abrasion wheel 10 of using at the slot grinding of opposed faces W2a, the W2b of the groove W2 of the inner peripheral surface W1 of workpiece W opening taking grinding is illustrated as example, but the present invention might not be defined in the emery wheel of grinding at the groove forming in interior week of workpiece, for example also can be used as the grinding work piece such as the opposed faces of impeller groove of vane pump or the opposed thrust face of the collar of grinding bent axle that the electric motor driven power steering machine of grinding fluid pressure type uses opposed faces electroplating abrasion wheel and be widely used.
In addition, in the above-described embodiment, although for by pit 15 being formed as than large round-shaped of semicircle and the example that is formed with the cutting blade 14b1 of acute angle shape in the inner circumferential side of abrasive grain layer 14 narrate, but pit 15 is not to be formed as circle, for example, also can be formed as square.In addition, cutting blade 14b1 must be formed as acute angle, also can be formed as right angle.
In addition, in the above-described embodiment, the example that the circumference two sides of the metallic matrix 11 discoideus is formed with to abrasive grain layer 14 and pit 15 is narrated, but the present invention also can be applied to the electroplating abrasion wheel that abrasive grain layer 14 and pit 15 is arranged at least one side of the circumference of metallic matrix 11.
Above, although describe the present invention in conjunction with embodiment, the present invention is not limited to the structure of narrating in embodiment, certainly can in the scope that does not depart from the purport of the present invention that claim records, take variety of way.
Claims (6)
1. an electroplating abrasion wheel, periphery and the side of the abrasive particle such as diamond or CBN being fixed on to the circumference of discoideus matrix by plating form circular abrasive grain layer, and the opposed faces of workpiece is carried out to grinding,
Described electroplating abrasion wheel is characterised in that,
In the inner circumferential side of described abrasive grain layer, to be provided with multiple pits that are not fixed with described abrasive particle along the spaced mode of circumferencial direction tool,
Make this pit only at the interior perimembranous opening of described abrasive grain layer.
2. an electroplating abrasion wheel, the side of the abrasive particle such as diamond or CBN being fixed on to the circumference of discoideus matrix by plating forms circular abrasive grain layer, and the opposed faces of workpiece is carried out to grinding,
Described electroplating abrasion wheel is characterised in that,
In the inner circumferential side of described abrasive grain layer, to be provided with multiple pits that are not fixed with described abrasive particle along the spaced mode of circumferencial direction tool,
Make this pit only at the interior perimembranous opening of described abrasive grain layer.
3. electroplating abrasion wheel according to claim 1 and 2, is characterized in that,
Described dimple-shaped becomes round-shaped.
4. according to the electroplating abrasion wheel described in any one in claim 1～3, it is characterized in that,
Described dimple-shaped becomes than large round-shaped of semicircle.
5. according to the electroplating abrasion wheel described in any one in claim 1～4, it is characterized in that,
The area of described pit is formed as the circumference side of described matrix surface area 20%～60%.
6. according to the electroplating abrasion wheel described in any one in claim 1～5, it is characterized in that,
Described opposed faces is formed at the groove at interior all openings of workpiece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013009986A JP6012486B2 (en) | 2013-01-23 | 2013-01-23 | Electroplated grinding wheel |
| JP2013-009986 | 2013-01-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103934761A true CN103934761A (en) | 2014-07-23 |
| CN103934761B CN103934761B (en) | 2018-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410029366.1A Active CN103934761B (en) | 2013-01-23 | 2014-01-22 | Electroplating abrasion wheel |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6012486B2 (en) |
| CN (1) | CN103934761B (en) |
| DE (1) | DE102014200880A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113941658A (en) * | 2020-07-15 | 2022-01-18 | 倍腾国际股份有限公司 | Punch manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114888729B (en) * | 2022-05-09 | 2023-08-11 | 安徽亚珠金刚石股份有限公司 | Single crystal diamond abrasive grain preparation facilities |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2014140922A (en) | 2014-08-07 |
| CN103934761B (en) | 2018-02-27 |
| JP6012486B2 (en) | 2016-10-25 |
| DE102014200880A1 (en) | 2014-07-24 |
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